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94 | Macromol. Symp. 2017, 371, 94–100 DOI: 10.1002/masy.

201600047

Preparation of Epoxy Composite Hollow


Microspheres (ECHM) Using Toluenesulfonyl
Hydrazide (TSH) as Blowing Agent
Nurul Ain Mohd Nayan, Anusha Leemsuthep, Zunaida Zakaria,
Du Ngoc Uy Lan*

Summary: The epoxy composite hollow microspheres (ECHM) was prepared by


single emulsion technique. Porofor Toluenesulfonyl hydrazide (TSH) 75 was used as
blowing agent. Carbon black was used as filler for polyamide-epoxy adduct matrix,
which was reverted ratio of 1:2 epoxy to polyamide. The epoxy mixture (internal
phase) was dropped and stirred into a heated corn oil (external phase) to form
spherical droplets. These epoxy droplets underwent two simultaneous mechanisms
of curing and foaming and became hollow microspheres. As expected, higher TSH
content produced lower density of ECHM because of more expansion in ECHM. This
fact was also evident from the size of hollow microspheres observed by using
scanning electron microscope. In addition, high TSH content of 16 phr induced higher
thermal properties of ECHM compared to those of ECHM using 8 phr and 12 phr TSH.

Keywords: epoxy; blowing agent; carbon black; hollow microspheres; emulsion technique

Introduction and 80 mm, but diameters in ranging from


5 mm to 300 mm are possible to prepare by
Hollow microspheres is often used as void- using typical manufacturing methods.[3]
template in order to produce syntactic Hollow microspheres (as micro-balloon)
foam for light weight structural application, are commonly prepared using the alkali
which exhibits isotropic physical properties swelling procedure (ASP), the dynamic
and low thermal expansion coefficient.[1–2] swelling method (DSM), the Shirasu po-
The common microsphere used are glass rous glass (SPG) membrane technique and
microspheres, cenospheres, carbon and the water in oil in water (W/O/W) emulsion
polymeric microsphere. Glass microbal- polymerization technique.[5] The latter
loons are strong while polymeric process involves the use of organic solvents
microspheres/hollow microspheres are or oil and is one of the effective method to
normally lighter and exhibit better adhe- produce polymeric microspheres with con-
sion to polymer matrices.[3] Polymeric trollable diameter. However, organic sol-
microspheres/hollow microspheres have vents normally raise a concern on
reported made from unsaturated polyester environment issue due to their volatile
resin, silicone resin, polyvinyl chloride, organic content (VOC). Besides, the selec-
polystyrene, polyvinyl alcohol, polypropyl- tion of oil should be taken the cost effect
ene and epoxy resin.[2,4] The average into consideration. Normally, silicone oil is
diameter of common microspheres/hollow quite costly compared to other regular oil
microspheres is generally between 30 mm such as corn oil. In addition, the choice of
blowing agent used is another important
factor that affects the production of micro-
School of Materials Engineering, University Malaysia
balloons. Porofor toluenesulfonyl hydra-
Perlis, Kompleks Pusat Pengajian Jejawi II, 02600 Arau,
Perlis, Malaysia zide (TSH 75) is an exothermic organic
Fax: (þ04) 979 8178; E-mail: uylan@unimap.edu.my blowing agent which has decomposition

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Macromol. Symp. 2017, 371, 94–100 | 95

temperature of approximately between content, and the improvement on composite


105 C. [2] It contains 75% toluene sulfonyl properties by preventing the problem of
hydrazide (solid content), 25% paraffinic filler’s sediment and obtaining the better
mineral oil, so it is suitable for mixing with filler’s dispersion.
epoxy and polyamide. TSH 75 generates
high volume of nitrogen of the hydrazide Materials
group in elementary form and has 0.3% Epoxy resin DER 331, polyamide A062 and
max.[6] The selection of blowing agent is polyamine are obtained from Euro Chemo-
based on its decomposition temperature Pharma Sdn. Bhd. Epoxy resin is a clear
and its releasing gases. Azodicarbonamide liquid with density and viscosity at 25 C of
(ADC) has thermal decomposition at 1.16 g/ml and 11–14 Pas, respectively. Poly-
200–210 C. Besides, diazoaminobenzene amide has density and viscosity at 25 C of
may cause dermatitis and dinitrosopenta- 0.96 g/ml and 35–45 Pas. Corn oil from Yee
methylenetetramine gives off unpleasant Lee Corporation Sdn. Bhd. has viscosity at
odor in some applications.[7] 25 C of 50 mPas and free of polyunsaturated
Recently, composite microspheres are fatty acids. Carbon black as conductive filler
interested to use as additives to prepare is supplied from Chemicals Inc.. Porofor
polymer composite for specific application Toluenesulfonyl hydrazide (TSH) 75 as
thanks to their advantages of reduction in blowing agent is purchased from Bayer
filler’s content, overcoming filler’s sediment Chemical with density at 25 C of 1.25 g/ml.
(high density filler) and improvement in
filler’s dispersion for the final composite.[8,9] Preparation of Epoxy Composite Hollow
Metal coated cenosphere is an effective Microspheres (ECHM)
example, which could be obtained by several The basic recipe for the preparation of
methods such as magnetron sputtering depo- ECHM can be seen in Table 1. Reversed
sition,[8] sol gel auto combustion,[9] heteroge- stoichiometric ratio of epoxy and polyam-
neous precipitation, electroless-plating and ide was used of 1:2 in weight. The Porofor
physical/chemical vapour deposition.[8,10,11] TSH75 used was 8 phr, 12 phr and 16 phr,
Though, production of metal coated ceno- while carbon black of 20 phr was main-
sphere was a complex process, which involved tained for all formulas. The carbon black
two stages by producing cenosphere at first was used as conductive fillers. At first,
and followed by coating them with metal. In epoxy was pre-mixed in sequence of
this research, single emulsion system method blowing agent, followed by carbon black
to carbon black-filled epoxy composite by using overhead stirrer with the speed of
microsphere/hollow microspheres (ECHM) 300 rpm for 3 minutes. After that, polyam-
is proposed. A free of polyunsaturated fatty ide was added and mixed at the same speed
acids corn oil is selected as the oil phase in for another 3 minutes. Epoxy mixtures was
single emulsion system because of its low cost dropped into a heated corn oil beaker by
and no VOC caution. Blowing agent  using a funnel with outer diameter (OD)
Porofor Toluenesulfonyl hydrazide (TSH)
75 is exploited to break initial droplets into
smaller droplets and expand them via its Table 1.
decomposition reaction. The simultaneously Basic recipe of epoxy composite hollow
curing process is to stabilize the droplet microspheres.
morphology; and epoxy composite micro- Materials Part per hundred resins
sphere and hollow microsphere (ECHM) are
Epoxy 33.3
obtained. Carbon black filler would be Polyamide 66.7
dispersed and located on the ECHM’s wall. Blowing agent 8, 12, 16
The ECHM is potential to use as an additive Carbon black 20
in preparation of conductive composites with phr: part per hundred resins of total content of epoxy
the cost effectiveness by using low filler’s and polyamide.

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96 | Macromol. Symp. 2017, 371, 94–100

Figure 1.
The schematic illustration of ECHM formation.

5 mm  20 mm length stem at 140 C under stirrer accelerated the emulsification by


stirring condition of 600 rpm for one hour. providing a shear force to breakdown large
The weight ratio of epoxy to oil was 10: 90. initial epoxy droplets into smaller epoxy
The mixture was then allowed to cool down droplets by dispersing in oil phase.[2]
to 80 C. The epoxy composite hollow Curing reaction between epoxy and poly-
microspheres were filtered and washed amide occurred, and the epoxy droplets
out the oil with detergent solution at started to gel and form a cured outer skin.
80 C. The detergent solution was changed Subsequently, Porofor TSH75 blowing
every 15 minutes until the oil was clean. agent decomposed and produced an
Drying and post-cure of hollow micro- expanding gas inside the gel epoxy droplet.
spheres was carried out at 80 C for two The decomposed gas was held inside the
hours in a conventional oven. epoxy by the cured wall leading to the
formation of epoxy composite hollow
Characterization microspheres (ECHM). Completely curing
The density of ECHM was measured by would stabilize the ECHM’s shape.
Density Pycnometer. The morphology was
observed under scanning electron micro- Density and Morphology of Epoxy
scope (SEM). Thermo-gravimetric ana- Composite Hollow Microspheres (ECHM)
lyzer (TGA) was analyzed using TA The relationship between density and size of
equipment under flowing oxygen heated ECHM is indicated in Figure 2. The density
from 25 C to 600 C at 20 C min1. Glass value for TSH8, TSH12 and TSH16 are
transition temperature was analyzed by found to be 1.1791, 1.1686 and 1.1396 g/cm3,
using Differential Scanning Calorimetry
(DSC) in nitrogen at the heating rate of
10 C/min in heat range of 30 C  200 C.
The basic recipe for the preparation of
ECHM is displayed in Table 1.

Formation of Epoxy Composite Hollow


Microspheres (ECHM)
The formation mechanism of epoxy com-
posite hollow microspheres could be sug-
gested as Figure 1. The epoxy mixture
formed spherical droplets dispersing in the Figure 2.
corn oil due to the immiscibility between The relationship of density and average diameter of
epoxy and oil phases. The mechanical ECHM at different Porofor TSH75 content.

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Macromol. Symp. 2017, 371, 94–100 | 97

Figure 3.
SEM micrograph of ECHM with different Porofor TSH75 content.

respectively. Higher Porofor TSH75 content features could interfere the curing of epoxy
decreased the density of ECHM whilst and weaken the cured skins of epoxy
increase the size of the ECHM. The fact of droplets so that they could expand to form
larger particles having lower density indi- the hollow microspheres. In addition, a
cated that more expansion in ECHM weak skin causing the blooming of epoxy
occurred. This fact is evident in SEM composite hollow microspheres, which
micrograph (Figure 3), where the higher generated smaller microspheres surround
content of Porofor TSH75 shows a larger size it. Similar observation was reported by
of generated hollow microspheres. Bakar et al.[2]
The SEM micrograph exhibited the
difference in size of hollow microspheres Glass Transition Temperature (Tg) of
due to the increase of Porofor TSH75 Epoxy Composite Hollow Microspheres
loading. Small microspheres and less (ECHM)
expanded microspheres are observed in Figure 4 showed the decomposition tem-
TSH8 (Figure 3(a)). This is because gas perature of Porofor TSH75 at 110.54 C,
nucleation at TSH8 was too low to expand
the epoxy droplets. More expanded micro-
spheres to form hollow microspheres are
presented in TSH12 and TSH16 due to
more gas formation (Figure 3(b) & (c)).
The hollow microspheres are confirmed in
cross section of an ECHM-TSH16 dis-
played in Figure 3(d), which shows the
hollow core and ECHM’s wall. Higher
blowing agent induces earlier and faster
foaming process as well as stronger expan- Figure 4.
sion pressure inside epoxy droplets. These DSC curve of Porofor TSH75.

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98 | Macromol. Symp. 2017, 371, 94–100

which indicates that TSH could fully


decompose at the preparation temperature
of 140 C. The result of the differential
scanning calorimetry for ECHM can be
observed in Figure 5. No decomposition
peak of Porofor TSH75 is detected
meaning that all blowing agent decom-
posed. Glass transition temperature (Tg)
of ECHM increases from TSH8 (at
80.5463 C) to TSH12 (105.067 C) and
Figure 5.
TSH16 (at 138.469 C). This behaviour
DSC curve of ECHM with different loading of Porofor
TSH75.
originates from the thermal conductivity

Figure 6.
(a) TGA curve of ECHM with different loading of Porofor TSH75. (b) DTG curve of ECHM with different loading of
Porofor TSH75.

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Macromol. Symp. 2017, 371, 94–100 | 99
Table 2.
TGA data of ECHM in air.
Decomposition ( C)
a
Samples T5% ( C) T10%b( C) T50%c( C) Peak Id Peak IIe Residues (%, 600 C)
TSH8 262.01 309.45 426.53 377.73 447.23 32.171
TSH12 270.87 321.01 431.94 379.50 450.63 26.830
TSH16 283.38 328.59 429.50 347.81 442.57 28.007
a
Temperature of 5 wt% of weight loss. bTemperature of 10 wt% of weight loss. cTemperature of 50 wt% of
weight loss. dFirst peak of decomposition temperature from DTG curves. eSecond peak of decomposition
temperature from DTG curves.

of ECHM responding to their size and and less expansion of TSH8 could conduct
hollow morphology. Solid epoxy particles better heat transfer and degraded at an
could have higher thermal conductivity, or earlier temperature and decomposed in a
in other words, more expanding hollow faster rate. As seen in Figure 6 (b), TSH8
microspheres would have lower thermal was found to degrade majority on the first
conductivity due to their hollow core. The stage and less in the second stage. The
results of Tg are well agreement with higher onset degradation temperature of
morphology results of ECHM. In details, TSH16 compared to that of THS12 also
TSH16 exhibits the highest Tg because of proved the high pore content in ECHM –
its highest expansion and low density. TSH16. More hollow microspheres in
TSH16 decrease the thermal conductivity
Thermal Properties of Epoxy Composite hence enhanced the thermal resistance of
Hollow Microspheres (ECHM) ECHM.
Figure 6(a) & (b) showed TGA and DTG
thermograms while the analysing data
was reported in Table 2. Similar to DSC
results, there is no decomposition of TSH
Conclusion
in TGA, which proved that blowing agent
A single emulsion technique to produce
decomposed completely during the foam-
ing process. Distinguished TGA curve of epoxy composite hollow microspheres is
TSH8 from that of TSH12 and TSH16 was reported. It is found that high blowing
observed. It is due to the difference agent content produces more expansion
morphology, density and particle size of and larger hollow microspheres, while low
agent content produces smaller solid
TSH8 compared to those of the others.
microspheres. Glass transition thermal
The degradation of ECHM displayed a
two-stage process. The first step degrada- characteristic and thermal properties are
tion occurred between 250 C – 425 C and well reflecting the morphology of epoxy
the second step degradation underwent composite hollow microspheres. In details,
between 425 C–500 C. First degradation larger hollow microspheres exhibited lower
thermal conductivity resulting in higher
stage could be due to the dehydration
glass transition and better thermal resis-
of –OH side groups, –C═O in amide
tance of ECHM.
groups of cured epoxy, which possess
oxygen in the structure. The second
degradation could be assigned to epoxy
Acknowledgement: We are sincerely grateful for
backbone. The remaining residue after the financial support from the Ministry of Higher
600 C belonged to carbon black filler. Education Malaysia for providing the Exploratory
TGA and DTG curves reflect well the Research Grant Scheme (ERGS) 9010-00030 that
morphology of ECHM. Smaller particles has made this work possible.

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100 | Macromol. Symp. 2017, 371, 94–100

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