Blaine Troubleshooting Guide (ODM Service Manual) - 20180205

Blaine Service Manual

V1.0
1
Table of Contents
Service Manua
1. MB illustration.......................................................................................................................................................4
2. Power on failure....................................................................................................................................................5
3. Blank screen.........................................................................................................................................................6
4. Screen display abnormality..................................................................................................................................7
5. Touch screen failure.............................................................................................................................................8
6. Optical/distance sensor error...............................................................................................................................9
7. G-sensor and gyroscope failure.........................................................................................................................10
8. Key failure...........................................................................................................................................................11
9. No charging........................................................................................................................................................12
10. SIM card or SD card identification failure.........................................................................................................13
11. Main camera function failure............................................................................................................................14
12. Slave camera function failure...........................................................................................................................15
13. Black spots on photos taken by Front Camera................................................................................................16
14. Black spots on photos taken by Rear Camera.................................................................................................16
15. Flashlight failure...............................................................................................................................................16
16. Motor error........................................................................................................................................................18
17. GSM network failure.........................................................................................................................................19
18. WCDMA and LTE network failure.....................................................................................................................20
19. WIFI/Bluetooth/FM............................................................................................................................................21
20. GPS failure.......................................................................................................................................................22
21. Self-calibration (SELF_CAL) and XO calibration failure:.........................................................................23
22. Headset identification failure/headset MIC errors....................................................................................23
23. MIC silent/low volume......................................................................................................................................24
25. Speaker silent...................................................................................................................................................26
26. IF station FASTBOOT_FLASH_01...................................................................................................................27
27. IF station WAIT_FOR_ALL_INTERFACE_ARRIVAL_01.................................................................................27
28. MIC_1_LEVEL_SPEC + frequency point (meaning: primary MIC frequency response / sensitivity curve).....27
29. MIC_2_LEVEL_SPEC + frequency point (meaning: sub MIC frequency response / sensitivity curve)...........28
30. MIC_A_LEVEL_SPEC + frequency point (meaning: secondary MIC collects the sound from receiver,
loopback test).........................................................................................................................................................29
31. AUDIO_OUTPUT_ALERT_STATUS (meaning: the signal is not detected in the speaker test)......................29
32. AUDIO_OUTPUT_ALERT_HOHD + frequency point (meaning: speaker noise / higher harmonic distortion
test).........................................................................................................................................................................29
33. AUDIO_OUTPUT_EARPIECE_STATUS (meaning: the signal is not detected in the receiver test)...............29
34. AUDIO_OUTPUT_EARPIECE_THD + frequency point (meaning: receiver distortion test)............................30
35. AUDIO_OUTPUT_EARPIECE_HOHD + frequency point (meaning: receiver noise / higher harmonic
distortion test).........................................................................................................................................................30
36. Speaker calibration exception..........................................................................................................................31
1. AUDIO_INTERNAL_CAL_RAW_IMPEDANCE_DEVICE_ZERO (speaker impedance calibration test)...........31
2. AUDIO_INTERNAL_CAL_RESONANCE_FREQUENCY_DEVICE_ZERO (speaker f0 calibration test)..........31
3. AUDIO_INTERNAL_CAL_RESONANCE_DIFF_DEVICE_ZERO (speaker ref_diff calibration test)................31
4. AUDIO_INTERNAL_CAL_TEMPERATURE_DEVICE_ZERO (speaker temperature calibration test)..............31
2
1. MB illustration
3
2. Power on failure
Solution:
1 Check battery connector for soldering errors and its body for oxidation or damage;
2 Check each power supply in the power sequence for short circuits with GND or for any voltage errors;
3 Check power on circuit for any errors;
4 For power on current around 20MA, check crystal for soldering errors;
5 For power on current errors above 1A, check VBAT circuit for short circuits to ground, troubleshoot ground
diode at individual locations;
6 For power-on current errors above 100MA, check for hot point on MB and troubleshoot;
7 Check soldering of each main chip with X-ray, including CPU/Flash/PMIC/TR IC;
8 Add-solder or re-solder main chip, validate soldering conditions;
9 Replace CPU/Flash/PMIC/LDO/TR IC;
4
3. Blank screen
Solution:
1 Check LCD connector for dirt, PIN continuous tin, cold solder joint, PIN collapse, etc. Check the connector
for proper connection and re-install it.
2 LCD backlight power that is provided by PMI8952 measures PMI8952 output voltage and check whether it
is about 15V.
3 If the voltage at backlight power exceeds the above range, check R1331, R1332, R1334, L1301, L1302 and
L1303 for conduction and check components for soldering error or damage;
4 Try replacing L1301;
5 Try replacing PMI8952;
5
4. Screen display abnormality
Solution:
1 Re-install LCD display screen or replace it before powering on the phone and check again;
2 Check LCD connector for dirt, PIN continuous tin, cold solder joint, PIN collapse, etc.;
3 Check LCD filter (U2616、U2617、U2618、U2619、U2620) for soldering error or damage;
4 Check LCD peripheral components. Compare them with those on normal board to check for missing parts.
Test supply voltages and check whether it is normal;
5 Check CPU for over-gluing, in case an X-ray equipment is available, check the IC solder ball with it;
6 Add-solder or re-solder CPU or replace it;
6
5. Touch screen failure
Solution:
1 Check TP connector on FPC for proper connection, Re-install CTP or replace it before powering on and
testing it again;
2 Check LCD connector (J2602) for dirt, PIN continuous tin, cold solder joint, PIN collapse, etc.;
3 Measure TP VDD supply voltage and check whether it is normal. Measure earth impedance of RST, INT, I2C
information and check whether it is normal;
4 Check the CPU soldering status with an X-ray, add-solder or re-solder it before testing it again;
5 Replace CPU;
7
6. Optical/distance sensor error
Solution:
1 Check optical chip surface for dirt or blockage; check rubber sleeve for installation in place;
2 Check optical/distance sensor for damage or soldering error;
3 Measure the voltage VREG_L22_3P3 across L2509 and check whether it is normal;
4 Measure the voltage VREG_L6_1P8 across L2510 and check whether it is normal;
5 Replace optical/distance sensor and front flashlight FPC;
6 Add-solder or re-solder CPU or replace it;
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7. G-sensor and gyroscope failure
Solution:
1 Check the sensor module circuit components for soldering errors or damage;
2 Determine whether there is no 0p function or if it is a performance anomaly;
3 Examine peripheral components and access components;
4 Re-solder or re-place sensor U2503;
5 Re-solder or re-place the CPU;
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8. Key failure
Solution:
1 Check whether the dome falls off or is collapsed, or test the side key FPC after replacing it;
2 Check Volume UP/Volume down/Power On voltage signal validity;
3 Check components on key circuit for damage or soldering errors;
4 Re-solder or replace the CPU or PMIC;
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9. No charging
Solution:
1 Check USB connector on the motherboard for dirt, damage, cold solder joint or other phenomena;
2 Check battery connector J3201 for dirt, damage, cold solder joint;
3 Re-place battery before testing again;
4 Check whether the voltage at B3201 circuit is normal;
5 Check the power management chip U1201 for soldering errors;
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10. SIM card or SD card identification failure
Solution:
1 Visually check SIM/SD tray for soldering offset, float or body damage;
2 Remove J2903 and check whether the DETECT dome is in the correct position (it is connected to the metal
shell by default).
3 Check SIM/SD tray on the motherboard for float, dome plate contact, spring plate deformation and other
errors;
4 Measure the SIM supply voltage VREG_L14_UIM1 and VREG_L15_UIM2 and check whether they have
power-on process;
5 Measure the earth impedance of SIM/SD signal cables and check whether they are normal; if not, disconnect
the series resistance and measure the earth impedance at CPU side.
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6 Re-solder or re-place U401 CPU;
11. Main camera function failure
Solution:
1 Check camera installation for any abnormalities, re-install it or replace it before testing again;
2 Check the connector of the main camera J2712 for damage or soldering errors, re-solder or re-place the
connector;
3 Check the voltage VREG_L17_2P8 / VREG_L2_1P2 / VREG_L6_1P8;
4 Check U2713/U2714/U2716/U2718/U2719 EMI filter for damage or soldering error;
5 Add-solder or re-solder PMIC or re-place it;
6 Add-solder or re-solder CPU or re-place it;
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12. Slave camera function failure
Solution:
1 Check camera installation for any abnormalities, re-install it or replace it before testing again;
2 Check slave camera J2701 connector for damage or soldering errors, re-solder or re-place the connector;
3 Check whether the voltage CAM_FRT_AVDD / FCAM_DVDD / VREG_L6_1P8 are normal. If not, check
whether it is caused by a short or breakage of peripheral circuit or PMIC output error;
4 Check U2703/U2706/U2707/U2720/U2721 EMI filter for damage or soldering error;
5 Check whether the LDO chip U2701, U2702, U2704 or its soldering is normal;
6 Add-solder or re-solder CPU;
Front camera connector
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13. Black spots on photos taken by Front Camera
Service method
1. Test it again and see whether it can pass the test to rule out the possibility of measurement errors. If it fails the test,
continue with the following steps
2. Wipe the camera hole in TP surface and test it. If it fails, continue with the following steps
3. Disassemble the unit, wipe the camera hole in the internal surface of TP and the outside surface of the camera
before testing again. If it fails in the test, continue with the following steps
4. Enter CQA test on the phone and then the camera interface. Take a photo of white paper to confirm whether there
are black spots. If they still exist, there is a problem on the camera
14. Black spots on photos taken by Rear Camera

Service method:
1. Test it again and see whether it can pass the test to rule out the possibility of measurement errors. If it fails the test,
continue with the following steps
2. Wipe the protection glass of rear camera before testing again. If it fails, continue with the following steps
3. Dis-assemble the unit, the internal surface of the protection glass on rear camera and the outside surface of the
camera before testing again. If it fails the test, continue with the following steps
4. Enter CQA test on the phone and then the camera interface. Take a photo of white paper to confirm whether there
are black spots. If they still exist, there is a problem on the camera
15. Flashlight failure
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Solution:
1 Add some 3.0V voltage to soldering tray at both ends of LED to test it for lighting up;
2 Re-assemble or replace flashlight plate;
3 Check whether the voltage at the flashlight dome and its impedance are normal;
4 Re-solder or re-place U1201;
Flashlight plate on back shell
Negative electrode of flashlight dome
Positive electrode of flashlight dome
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16. Motor error
Solution:
1 Check whether R2801 and R2803 are normal;
2 Check whether MOTOR2801 and MOTOR2802 are normal;
3 Replace the motor;
4 Re-solder power management chip U1201 or re-place it;
Motor dome
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17. GSM network failure
Solution:
1 Check PCBA board’s antenna for soldering errors, its contact with phone casing antenna, and body damage;
2 Check the connection of RF connector and circuit components, Inductors, resistors for soldering errors after
collision;
3 Check front RF switch FEM3301 and relevant components for soldering errors and body damage;
4 Re-calibrate motherboard RF indicators. If it fails, troubleshoot and repair it for failed bands;
5 Add-solder or re-place the U3301 RF transceiver chip;
6 Add-solder or re-place the U4401 RF component;
6 Add-solder or replace U1401 power management chip;
7 Add-solder or re-place U401 main chip;
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Motor dome
3-in-1 chip
High-frequency
cable
Mid- and low- Mid- and low-

High-frequency frequency frequency cable
primary test stand primary test Mid- and low-
stand frequency diversity test
stand
High-frequency
diversity test stand
18. WCDMA and LTE network failure
Solution:
1 Check the primary and diversity test stands for false solder joints;
2 Re-calibrate the phone, pinpoint cause of error, determine receiving or transmitting errors according to bands
with errors, troubleshoot relevant circuit components;
3 Add-solder or replace FM3301, PA3401, PA3402, duplexer DU, filter FL, RF transceiver U3301;
4 According to RF indicators, check components in the circuit at the corresponding band for soldering errors or
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body damage;
5 Troubleshoot relevant band of diversity filter module according to source drawing;
6 Re-solder or replace U401 CPU.
19. WIFI/Bluetooth/FM
20
Solution:
1 Check MB’s WIFI/BT antenna channel components or their soldering for damage;
2 Check the RF test stand for false solder joints;
3 Check headset channel connection, FM antenna circuit in headset;
4 Check filter FL4401, FL4402, DI4401 for soldering offset or body damage;
5 Add-solder or re-solder FEM4401 WLAN/BT/FM 3-in-1 chip or replace it before testing again;
6 Add-solder or re-solder CPU U401, or re-place it before testing it again;
3-in-1 chip
High-frequency
cable
Mid- and low- Mid- and low-

High-frequency frequency frequency cable
Mid- and low-
primary test standprimary test
stand frequency diversity
test stand
High-frequency
diversity test stand
20. GPS failure
Solution:
1 Check GPS channel components for soldering or body errors;
2 Check the RF test stand for false solder joints;
3 Check DI4401 for soldering offset or body damage;
4 Check filter FL4501, FL4502 for soldering or body errors;
5 Check LNA chip LNA4501 for soldering or body errors;
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6 Add-solder or re-solder U3301 RF chip or replace it before testing again;
7 Add-solder or re-solder CPU U401, or re-place it before testing it again;
21. Self-calibration (SELF_CAL) and XO calibration failure:
Solution:
1 Check PA3401 for false solder joints, continuous tin or body defects; add-solder or replace PA3401;
2 Check PA3402 for false solder joints, continuous tin or body defects; add-solder or re-place PA3402;
3 Check FEM3301 for false solder joints, continuous tin or body defects; add-solder or re-place FEM3301;
4 Check U4001 for false solder joints, continuous tin or body defects; add-solder or re-place U4001;
5 Check SW3301 for false solder joints, continuous tin or body defects; add-solder or re-place SW3301;
6 Check SW3701 for false solder joints, continuous tin or body defects; add-solder or re-place SW3701;
7 Check U3401 for false solder joints, continuous tin or body defects; add-solder or re-place U3401;
8 Check components around the five mipi components (the ones mentioned in above 5 items) for false solder
joints, tombstoning, continuous tin and other poor process problems;
22. Headset identification failure/headset MIC errors
Solution:
9 Re-test headset function after replacing headset;
10 Check headset jack for damage or soldering for skews or over height, re-solder or replace headset jack;
11 Check headset circuit components for damage or soldering for errors, repair before testing it again;
12 Re-solder or re-place codec U1801;
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23. MIC silent/low volume
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Solution:
1 Visually check components related with primary, secondary, AOU MIC for soldering errors or body damage;
2 Re-place primary, secondary, AOU MIC before testing it again. Pay attention to high temperature during MIC
replacement as it may damage it;
3 Add-solder or re-solder U1801 codec IC, or re-place it before testing again;
Auxiliary MIC
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25. Speaker silent
Solution:
1 Visual check relevant components for damage or soldering error;
2 Check the MB dome and speaker FPC for poor soldering including skew and continuous tin;
3 Add-solder or replace smart PA U2302.
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26. IF station FASTBOOT_FLASH_01

Solution:
1. Check whether the earth voltage of VREF_LPDDR3 is normal (0.6V or so).
2. X-ray U401 to check for continuous tin
3. Check the resistances around CPU and check R408, R410 for soldering errors
27. IF station WAIT_FOR_ALL_INTERFACE_ARRIVAL_01

Solution:
1. Power on the USB and check whether the current of the motherboard is too large. If more than 100mA, find the
power supply that is short-circuited
2. Measure the resistance of USB_HS_DP, USB_HS_DM to check whether the earth impedance is abnormal;
3. Check FL2100 for soldering errors;
28. MIC_1_LEVEL_SPEC + frequency point (meaning: primary MIC frequency response / sensitivity
curve)
Problem confirmation:
1. According to track ID of the defective machine, call up the test results of this machine at AR station;
2. Check the frequency points where the machine fails to work. If at single frequency point, the problem is not caused by
the phone; if at multi-frequency points, it needs to troubleshoot the phone;
Re-test:
1. Set the AR station into off-line mode for re-test. Generally, for single frequency point, the machine will pass the re-test.
Once the machine fails in the re-test, it will need a technician to adjust the station.
2 For multi-frequency points, if the machine fails in the re-test, it needs to analyze the phone.
Troubleshooting:
1. Check the primary MIC for rubber sleeve missing.
2. Check whether the hole in the rubber sleeve is blocked and check whether the rubber sleeve is squeezed and deformed by
the shell.
Inspection method:
1. Subjective examination: select CQA test on the phone -> Audio-> Record and Playback-> MIC (select PRIMARY MIC)
-> click on START TO RECORD, record for 2~3s with the primary MIC hole unblocked, and then continue recording for
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2~3s with the primary MIC hole blocked -> Click on STOP RECORDING to end the recording -> click on PLAY BACK
RECORD to start playing the recording
Play the recording with the MIC hole blocked and unblocked. If they can be heard as normal, it indicates that there is a
problem with the MIC rubber sleeve assembly;
If they cannot be heard, it indicates that the MIC hole is blocked or MIC is defective;
2. Rubber sleeve inspection: disassemble to check whether the rubber sleeve is missing, whether the rib near the sound hole
at the bottom of the rubber sleeve is squeezed and deformed, whether the hole in the rubber sleeve is blocked.
3. Dust screen inspection: observe the dust screen in the MIC hole under the light to check whether it is reflective. Or
disassemble to check whether the light can pass the MIC hole.
Service method:
1. Install the MIC rubber sleeve onto the motherboard. The rubber sleeve near the sound hole must be flat against the
motherboard, without curling. Then install speaker BOX. Push the BOX horizontally and buckle with the rear shell.
2. For rubber sleeve problems, re-place the rubber sleeve. For dust screen problem, replace the dust screen.
29. MIC_2_LEVEL_SPEC + frequency point (meaning: sub MIC frequency response / sensitivity
curve)
Re-test:
1. Set the AR station into off-line mode for re-test. Generally, for single frequency point, the machine will pass the re-test.
Once the machine fails in the re-test, it will need a technician to adjust the station.
Troubleshooting:
1. Check the primary MIC for rubber sleeve missing.
2. Check whether the hole in the rubber sleeve is blocked and check whether the rubber sleeve is squeezed and deformed by
the shell.
3. Check whether there is an RF hole in the rear shell of the phone that failed the test.
Inspection method:
1. Subjective examination: select CQA test on the phone -> Audio-> Record and Playback-> MIC (select SECONDARY
MIC) -> click START TO RECORD, record for 2~3s with the primary MIC hole unblocked, and then continue recording
for 2~3s with the primary MIC hole blocked -> Click on STOP RECORDING to end recording -> click on PLAY BACK
RECORD to start playing the recording
Play the recording with the MIC hole blocked and unblocked. If they can be heard as normal, it indicates that there is a
problem with the MIC rubber sleeve assembly;
If they cannot be heard, it indicates that the MIC hole is blocked or MIC is defective;
2 Rubber sleeve inspection: dis-assemble to check whether the rubber sleeve is missing, and whether it falls off and blocks
the hole
3. Dust screen inspection: observe the dust screen in the MIC hole under the light to check whether it is reflective. Or
disassemble to check whether the light can pass the MIC hole.
Service method:
1. For rubber sleeve problems, re-place the rubber sleeve. For dust screen problem, replace the dust screen.
2. If there is still a problem after all troubleshooting for other causes, it may be caused by the RF hole in some rear shell.
The leakage of the rear cavity of the hole will lead to an MIC2 or MICA test failure. It is not a problem.
27
30. MIC_A_LEVEL_SPEC + frequency point (meaning: secondary MIC collects the sound from
receiver, loopback test)
Test item analysis:
This test item is testing the loopback mode, that is, the secondary MIC collects the sound from the receiver. If there is a
problem with the receiver or MIC2, it will fail in this test.
Analysis method:
For problem analysis and troubleshooting, refer to MIC2 and AUDIO_OUTPUT_EARPIECE_AMP
31. AUDIO_OUTPUT_ALERT_STATUS (meaning: the signal is not detected in the speaker test)
Defect confirmation:
1. Subjectively listen to the speaker and check whether it sounds normal;
2. If the volume is too low or there is no sound, it needs to check the phone;
Re-test:
If there are no abnormalities, it is basically not caused by the phone. If the machine fails in the re-test at the AR station, it
needs a station technician to check the station.
Troubleshooting:
1. Check whether the sound hole of the speaker is blocked;
2. Dis-assemble and check whether the release film pasted over the sound hole of the speaker has been torn off;
3. Dis-assemble and check whether the dome of SPK BOX that is used to contact the motherboard is deformed or missing;
4. Check whether the dust screen over the sound hole of the speaker is blocked;
5. If there is no abnormality as above, cross validate whether the BOX is OK and whether the motherboard is OK;
Inspection method:
1. Select CQA test on the phone -> Audio-> Loudspeaker, and subjectively listen to the sound and check whether it is
normal.
2. When the station test is carried on to this item, open the test box to listen to the sound and check whether there is a
sweeping sound. If so, it indicates that there is sound from the phone, and the problem is not caused by the phone.
32. AUDIO_OUTPUT_ALERT_HOHD + frequency point (meaning: speaker noise / higher harmonic

distortion test)
Re-test:
1. Set the AR station into the off-line mode for re-test. Generally, for single frequency point, the machine will pass the re-
test. Once the machine fails in the re-test, it will need a technician to check the results at this frequency point on other
machines or at other stations. If the difference between them is large, it may be phone error; if the difference is small, it
needs to check whether the station is OK.
Inspection method:
1. Refer to AUDIO_OUTPUT_ALERT_STATUS troubleshooting;
3. Make a cross-validation of SPK BOX to check whether it is related to the component;
33. AUDIO_OUTPUT_EARPIECE_STATUS (meaning: the signal is not detected in the receiver test)
Defect confirmation:
28
1. Subjectively listen to the receiver and check whether it sounds normal;
2. If the volume is too low or there is no sound, it needs to check the phone;
Re-test:
If there are no abnormalities, it is basically not caused by the phone. If the machine fails in the re-test at the AR station, it
needs a station technician to check the station.
Troubleshooting:
1. Check whether the sound hole of the receiver is blocked;
2. Dis-assemble and check whether the release film pasted over the sound hole of the receiver is torn off;
4. Check whether the dust screen over the sound hole of the receiver is blocked;
5. If there is no abnormality as above, make a cross-validation of the middle frame (do not remove the receiver from the
middle frame for repetition) whether the BOX is OK and whether the motherboard is OK;
Inspection method:
1. Select CQA test on the phone -> Audio-> Ear Speaker->BUZZ TEST (this audio source is default), and subjectively listen
to the sound and check whether it is normal.
34. AUDIO_OUTPUT_EARPIECE_THD + frequency point (meaning: receiver distortion test)

Re-test:
1.Set the AR station into the off-line mode for re-test. Generally, for single frequency point, the machine will pass the re-
Inspection method:
1. Refer to AUDIO_OUTPUT_EARPIECE_STATUS troubleshooting;
2. Make a cross-validation of the middle frame (do not remove the receiver from the middle frame for repetition) whether
the BOX is OK and whether the motherboard is OK;
35. AUDIO_OUTPUT_EARPIECE_HOHD + frequency point (meaning: receiver noise / higher

harmonic distortion test)
Re-test:
1.Set the AR station into the off-line mode for re-test. Generally, for single frequency point, the machine will pass the re-
Inspection method:
1. Refer to AUDIO_OUTPUT_EARPIECE_STATUS troubleshooting;
3. Make a cross-validation of the middle frame (do not remove the receiver from the middle frame for repetition) whether
29
the BOX is OK and whether the motherboard is OK;
36. Speaker calibration exception

1. AUDIO_INTERNAL_CAL_RAW_IMPEDANCE_DEVICE_ZERO (speaker impedance calibration test)
2. AUDIO_INTERNAL_CAL_RESONANCE_FREQUENCY_DEVICE_ZERO (speaker f0 calibration test)
3. AUDIO_INTERNAL_CAL_RESONANCE_DIFF_DEVICE_ZERO (speaker ref_diff calibration test)
4. AUDIO_INTERNAL_CAL_TEMPERATURE_DEVICE_ZERO (speaker temperature calibration test)
1. According to track ID of the defective machine, call up this test results of this machine at the AR station;
2. Check whether the values of failed items are all 0;
Troubleshooting:
1. If the test values are all 0, select CQA test on the phone -> Audio-> Loudspeaker, and subjectively listen to the sound and
check whether it is normal. If normal, the problem is not caused by the phone. It needs a station technician to adjust the
station;
2. If there is no sound or the volume is too low in the CQA test, it should be caused by the phone. It needs to dis-assembled
for analysis;
3. If the test result is not 0, it needs to analyze the BOX.
Inspection method:
1. Refer to AUDIO_OUTPUT_ALERT_STATUS troubleshooting;
2.3. Make a cross-validation of SPK BOX to check whether it is related to the component;
30

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10. SIM card or SD card identification failure

11. Main camera function failure

continue with the following steps

14. Black spots on photos taken by Rear Camera

continue with the following steps

15. Flashlight failure

Flashlight plate on back shell

Negative electrode of flashlight dome

Positive electrode of flashlight dome

Mid- and low- Mid- and low-

18. WCDMA and LTE network failure

Mid- and low- Mid- and low-

20. GPS failure

21. Self-calibration (SELF_CAL) and XO calibration failure:

22. Headset identification failure/headset MIC errors

23. MIC silent/low volume

25. Speaker silent

26. IF station FASTBOOT_FLASH_01

27. IF station WAIT_FOR_ALL_INTERFACE_ARRIVAL_01

32. AUDIO_OUTPUT_ALERT_HOHD + frequency point (meaning: speaker noise / higher harmonic

34. AUDIO_OUTPUT_EARPIECE_THD + frequency point (meaning: receiver distortion test)

35. AUDIO_OUTPUT_EARPIECE_HOHD + frequency point (meaning: receiver noise / higher

36. Speaker calibration exception

2. AUDIO_INTERNAL_CAL_RESONANCE_FREQUENCY_DEVICE_ZERO (speaker f0 calibration test)

3. AUDIO_INTERNAL_CAL_RESONANCE_DIFF_DEVICE_ZERO (speaker ref_diff calibration test)

4. AUDIO_INTERNAL_CAL_TEMPERATURE_DEVICE_ZERO (speaker temperature calibration test)

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