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1
1990 – The Mainframe is dead – or so they said
S/390 is dead or terminally ill
ƒthe aging user base is deserting the MVS ship and moving to UNIX or NT
S/390 is expensive to buy and expensive to run
ƒUNIX or Wintel is many times cheaper
S/390 requires a huge Datacenter/Glasshouse
ƒbig machines, water cooling and huge electricity bills
S/390 cannot run new eBusiness or ERP workloads
ƒit only runs Batch or Green-screen type work
2
IBM System z9 and eServer zSeries
The incorporation of classical mainframe strengths
Reliability, Availability, Serviceability
Security (cryptographic HW and more ...)
Scalability:
Scale up on demand
Scale out on demand
Based on:
ƒ Architecture
64bit, QDIO, ...
ƒ Technology, Packaging
MultiChipModule, ...
ƒ Implementation
Internal and external bandwidth
'Storage Hierarchy': L1, L2,...
ƒ Virtualization: 'sharing physical resources'
CPU, memory, ...
I/O, network, (LAN)
► Most advanced On Demand Technologies
Redundant resources, hot-pluggable IO, …, OOCoD
Short history
1998-06-23 9672-nn6 G5
1999-05-03 9672-nn7 G6
2000-10-03 2064-1nn z900
2002-02-19 2066 z800
(Linux only model 2002-01-29)
2002-04-30 2064-2Cn z900 Turbo
2003-05-13 2084 z990
2004-04-07 2086 z890
2005-07-26 2094 System z9 EC
2006-04-27 2096 System z9 BC
3
IBM System z9
IBM System z family IBM System z9
(z9 BC) (2096)
(z9 EC) (2094)
20 engines
16-way
4
z9 BC – Delivering increased capacity and performance
Greater granularity and scalability
► Two models with one machine type (2096)
Improved I/O Performance
● 1 to 4-way high performance server standard engines ► 40% more FICON channels – up to 112
● Entry model with 1 to 3-way standard engines ► Up to 170% more bandwidth than z890
● Up to a 7-way with specialty engines
► Can improve FICON performance with
► 73 capacity settings for a 260% increase in flexibility over
Modified Indirect Data Address Word
z890
► Delivers up to 34% more capacity with the same low entry
(MIDAW) facility
point as the z890 ► Double the FICON concurrent I/O
► Up to 34% hardware performance improvement for Linux operations from 32 to 64 on FICON channel
(IFLs), Java (zAAPs) and Internal Coupling Facilities (ICFs) ► Multiple Subchannel Sets (MSS) for an
► New zIIP for data serving workloads increased number of logical volumes
► Double the memory – up to 64 GB per server
Processor Units
z9 BC
75% more
z800 z890
34% improvement
Capacity
9 IBM System z Hardware 08/11/2007 IBM Systems
z9 EC Product Positioning
z9 EC
z990
z900
5
z9 BC Model R07
Machine Type
► 2096
Model
► R07
Processor Units (PUs)
►8 PUs per System
►1 SAP per book, standard
► No dedicated spares
► 7 PUs available for characterization
● 1 to 3 Central Processors (CPs)
● Integrated Facility for Linux (IFLs), Internal Coupling
Facility (ICFs), System z Application Assist
Processors (zAAPs), System z9 Integrated
Information Processors (zIIPs), optional System
Assist Processors (SAPs)
► Up to 15 LPARs
Memory
► Minimum of 8 GB
► Up to 64 GB per System
● 8 GB increments
I/O
► Up to 16 STIs per System @ 2.7 GB/s each
► Total system I/O bandwidth capability of 43.2 GB
► Up to 2 Logical Channel Subsystem (LCSS)
► Up to a maximum of 4 I/O Domains
● Up to 240 channels – dependent on Channel types
z9 BC Model S07
Machine Type
► 2097
Model
► S07
Processor Units (PUs)
►8 PUs per System
►1 SAP per book, standard
► No dedicated spares
► 7 PUs available for characterization
● 0 to 4 Central Processors (CPs)
● Integrated Facility for Linux (IFLs), Internal Coupling Facility
(ICFs), System z Application Assist Processors (zAAPs),
System z9 Integrated Information Processor (zIIP), optional
System Assist Processors (SAPs)
● Can have an IFL-only System
► Up to 30 LPARs
Memory
► Minimum of 8 GB
► Up to 64 GB per System
● 8 GB increments
I/O
► Up to 16 STIs per System @ 2.7 GB/s each
► Totalsystem I/O bandwidth capability of 43.2 GB
► Up to 2 Logical Channel Subsystems (LCSSs)
► Up to a maximum of 7 I/O Domains
● Up to 420 channels – dependent on Channel types
6
z9 EC Overview
Machine Type
► 2094
5 Models
► S08, S18, S28, S38 and S54
Processor Units (PUs)
► 12 (16 for Model S54) PUs per book
►2 SAPs per book, standard
► 2 spares per server
► 8, 18, 28, 38 or 54 PUs available for characterization
● Central Processors (CPs), Integrated Facility for Linux
(IFLs), Internal Coupling Facility (ICFs), System z
Application Assist Processors (zAAPs), System z9
Integrated Information Processor (zIIP), optional System
Assist Processors (SAPs)
Memory
► Minimum of 16 GB
► Up to 128 GB per book
► Up to 512 GB for System
● 16 GB increments
I/O
► Up to 16 STIs per book @ 2.7 GB/s each
► Total system I/O bandwidth capability of 172.8 GB*
► Up to 4 Logical Channel Subsystems (LCSSs)
A Frame
Internal
Batteries Single Processor
(optional) Book and Memory
Power
Supplies CEC Cage
STI Connectors
I/O Cage
Support Elements
(gate with Laptops
Fiber Quick swung open)
Connect Feature
(optional)
Front View
7
z9 EC – Under the covers (Model S38 or S54)
Internal
Batteries
(optional)
Hybrid
Cooling
Power
Processor Books
Supplies
and Memory
CEC Cage
Support
Fiber Quick Elements
Connect Feature
(optional) Front View
8
CMOS 10Ks0 chip Technology
z9 EC 12-way MCM ► PU, SC, SD and MSC chips
► Copper interconnections, 10 copper layers
► 8 PU chips/MCM
Advanced 95mm x 95mm MCM ●121 million transistors/chip
► 102 Glass Ceramic layers ●L1 cache/PU
► 16 chip sites, 217 capacitors ●15.78 mm x 11.84 mm
► 0.545 km of internal wire – 256 KB I-cache
– 256 KB D-cache
●0.58 ns Cycle Time
► 4 System Data (SD) cache chips/MCM
●15.66 mm x 15.40mm
●L2 cache per Book
MSC PU PU MSC – 660 million transistors/chip
– 40 MB
► One Storage Control (SC) chip
PU SD SD PU ●16.41mm x 16.41mm
●162 million transistors
●L2 cache crosspoint switch
PU SD SD PU ●L2 access rings to/from other MCMs
► Two Memory Storage Control (MSC) chips
●14.31 mm x 14.31 mm
CLK PU SC PU ●24 million transistors/chip
●Memory cards (L3) interface to L2
●L2 access to/from MBAs (off MCM)
► One Clock (CLK) chip - CMOS 8S
●Clock and ETR Receiver
Up to 8 MCM
Hot pluggable MBA/STI
fanout cards
MSC CP
Hitac hi CP
Hitac hi
SD CP 2
SD
MSC CP CP
9
z9 BC 8 PU Logical Structure
PU 4 always is SAP,
each PU is single core
PU0 PU1 PU2 PU3 PU4 PU5 PU6 PU7 and Crypto Assist
L1 L1 L1 L1 L1 L1 L1 L1
L2 contains Storage
Controller and Storage
Data Chips
1 Cache Control Chip + 2 Cache Data Chips
(40 MB Shared L2 Cache)
Book Package
contains PU, Storage
Controllers, L2 and L3
MBA MBA MBA MBA MBA MBA MBA MBA MSC 0 MSC 1 Caches, 2.7 GB/sec
Self-Timed Interfaces
P
r MCM MCM MCM MCM
P P P
o Book 3
r r r
Book 1
c o o o
c c c
e e e e
s
s
s
s
s
s
s
s The ring structure consists of two rings (one
Memory
Memory
Memory
Memory
o
o
r
o
r
o
r running clockwise, the other counterclockwise)
r C
a
C
a
C
a
In a two or three Book configuration, Jumper
C
r r r Book(s) (installed in the CEC cage) complete the
a
d d d
ring
r
► Jumper Books are not needed for a single-Book
Fanout
MBA
Fanout
MBA
Fanout
MBA
Fanout
MBA
d
configuration
Books may be able to be inserted into or removed
from the ring nondisruptively*
Slot 1 Slot 2 Slot 3 Slot 4 ► May allow Concurrent book add for model
Book 3 Book 0 Book 1 Book 2 upgrade
► Enhanced book availability to return a book after
removal for upgrade or repair
* Customer pre-planning required, may require acquisition of additional hardware resources
10
Technology evolution with specialty engines
Designed to help
IBM System z
improve resource
Application Assist
Processor (zAAP) optimization for
2004 eligible data
workloads within
Integrated Designed to help the enterprise
Facility for Linux improve resource
(IFL) 2001 optimization for
z/OS Java™
Internal Coupling Support for
technology-based
Facility (ICF) 1997 new workloads
workloads
and open
Centralized data standards
sharing across
mainframes
21 IBM System z Hardware 08/11/2007 IBM Systems
System z9 PU Characterization
Processor Units (PUs) that can be ordered on System z9
11
Input/Output hardware
Device
I/O Device
ESCON Control Device
Channel Unit Device
I/O Device
Control
ESCON Unit
I/O
zSeries/z9 processor
Device
FICON Express2 I/O
Channel Control
I/O
FICON Device
Unit
Control
switch I/O Device
FICON Express2 Unit
Control Device
Channel Unit Device
FCP (FICON FCP
Storage Ctrl Unit SCSI Device
channel) switch
SAN Fabric SCSI Device
OSA
Express2
Adapter
LAN Up to 1024 channels, total
Hipersocket bandwidth > 170GB/sec
► Hardware/software combination 9
8
7
6
5
3
4
9
8
7
6
5
4
3
12
Hardware management/maintenance - Support Element and HMC
Two Support Elements (SE) are connected to two internal Ethernet LANs
There is a crossover capability between the LANs, so that both SEs have access to
both internal LANs
With a second Ethernet adapter, the SEs are also connected to an external Ethernet
LAN
The Hardware Management Console (HMC) is connected to the external LAN
Ethernet “hub” 2
Alternate
Support
Element FSP FSP FSP
FSP FSP FSP FSP
FSP
DCA DCA DCA DCA
DCA DCA DCA DCA
HMC
Operating System
z/OS
► The flagship zSeries/z9 operating system
► Ultra-high reliability – over 50% of the OS is dedicated to error recovery!
z/VM
► Run any zSeries/z9 operating system as a “guest” – Large scale virtualization
► Sometimes used for application development
z/VSE
► Small- to mid-size 390 customers
► Most often used on very small 390 hardware
z/TPF
► Primarily for very high transaction rate, specialized applications (airline scheduling)
13
Mixed workload - Virtualization - Consolidation
even beyond a single footprint, when using clustering
Legacy WebSphere
Database & Business Logic,
Transaction Web Serving, ... Native Linux
Processing DB, Business Logic
ERP Java Appl Web Serving, ...
Java Linux
CRM Appl. Java Virtual
Business Java Appl
Appl.
CICS Objects
Servers
SAPDB2 Business Objects
DB2MQ c++
UnixIMS CICS DB
IMS IMS Java
System Linux for
JVM
services zSeries Linux
Unix System Services
Linux Linux
Linux
for for
z/OS
z/OS z/VM z/VM zSeries zSeries
HiperSockets
PR/SM up to 60 partitions
for integration
100’s and 100’s !! of virtual linux servers – “virtual blades”
IBM System z9
Responsive - Variable - Resilient – Focused
Autonomic - Virtualized - Open - Integrated
Summary
14
29 IBM System z Hardware 08/11/2007 IBM Systems
15