NCP163

LDO Regulator - Ultra-Low

Noise, High PSRR, RF and
Analog Circuits
250 mA
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The NCP163 is a next generation of high PSRR, ultra−low noise
LDO capable of supplying 250 mA output current. Designed to meet
the requirements of RF and sensitive analog circuits, the NCP163 MARKING
device provides ultra−low noise, high PSRR and low quiescent DIAGRAMS
current. The device also offer excelent load/line transients. The
NCP163 is designed to work with a 1 mF input and a 1 mF output WLCSP4
A1 X
ceramic capacitor. It is available in two thickness ultra−small 0.35P, CASE 567JZ
WLCSP Packages, XDFN4 0.65P and industry standard SOT23−5L.

Features WLCSP4 X
A1
• Operating Input Voltage Range: 2.2 V to 5.5 V CASE 567KA

• Available in Fixed Voltage Option: 1.2 V to 5.3 V

• ±2% Accuracy Over Load/Temperature XDFN4
XX M
• Ultra Low Quiescent Current Typ. 12 mA 1
CASE 711AJ
1
• Standby Current: Typ. 0.1 mA
• Very Low Dropout: 80 mV at 250 mA
SOT23−5L
• Ultra High PSRR: Typ. 92 dB at 20 mA, f = 1 kHz CASE 527AH
XXX MG
G
• Ultra Low Noise: 6.5 mVRMS
• Stable with a 1 mF Small Case Size Ceramic Capacitors
• Available in − WLCSP4: 0.65 mm x 0.65 mm x 0.33 mm X, XXX = Specific Device Code
M = Date Code
− WLCSP4: 0.65 mm x 0.65 mm x 0.4 mm G = Pb−Free Package
− XDFN4: 1 mm x 1 mm x 0.4 mm
(Note: Microdot may be in either location)
− SOT23−5: 2.9 mm x 2.8 mm x 1.2 mm
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS PIN CONNECTIONS
Compliant
IN OUT
Typical Applications
• Battery−powered Equipment A1 A2
• Wireless LAN Devices
• Smartphones, Tablets B1 B2
• Cameras, DVRs, STB and Camcorders
EN GND
(Top View) (Top View)
VIN VOUT
IN OUT

NCP163 IN 1 5 OUT
CIN EN COUT
1 mF ON 1 mF GND 2
Ceramic Ceramic
OFF GND

EN 3 4 NC

(Top View)

Figure 1. Typical Application Schematics ORDERING INFORMATION

See detailed ordering, marking and shipping information on
page 17 of this data sheet.

© Semiconductor Components Industries, LLC, 2016 1 Publication Order Number:

September, 2019 − Rev. 9 NCP163/D
 NCP163

IN

ENABLE THERMAL
EN LOGIC SHUTDOWN

BANDGAP
REFERENCE MOSFET
INTEGRATED
DRIVER WITH
SOFT−START
CURRENT LIMIT

OUT

* ACTIVE DISCHARGE
Version A only

EN

GND

Figure 2. Simplified Schematic Block Diagram

PIN FUNCTION DESCRIPTION

Pin No. Pin No. Pin No. Pin
WLCSP4 SOT23−5L XDFN4 Name Description
A1 1 4 IN Input voltage supply pin
A2 5 1 OUT Regulated output voltage. The output should be bypassed with small 1 mF ceramic
capacitor.
B1 3 3 EN Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V
enables the LDO.

B2 2 2 GND Common ground connection

− 4 − NC Not connected. Can be tied to ground plane.
− − EPAD EPAD Exposed pad. Can be tied to ground plane for better power dissipation.

ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit
Input Voltage (Note 1) VIN −0.3 V to 6 V
Output Voltage VOUT −0.3 to VIN + 0.3, max. 6 V V
Chip Enable Input VCE −0.3 to 6 V V
Output Short Circuit Duration tSC unlimited s
Maximum Junction Temperature TJ 150 °C
Storage Temperature TSTG −55 to 150 °C
ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
ESD Capability, Charged Device Model (Note 2) ESDCDM 1000 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
ESD Charged Device Model tested per EIA/JESD22−C101, Field Induced Charge Model
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

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 NCP163

THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, WLCSP4 (Note 3), Thermal Resistance, Junction−to−Air 108
Thermal Characteristics, XDFN4 (Note 3), Thermal Resistance, Junction−to−Air RqJA 198.1 °C/W
Thermal Characteristics, SOT23−5 (Note 3), Thermal Resistance, Junction−to−Air 218
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7

ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise
noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).

Parameter Test Conditions Symbol Min Typ Max Unit

Operating Input Voltage VIN 2.2 5.5 V
Output Voltage Accuracy VIN = (VOUT(NOM) + 1 V) to 5.5 V
−2 +2
0 mA ≤ IOUT ≤ 250 mA

VIN = (VOUT(NOM) + 1 V) to 5.5 V

0 mA ≤ IOUT ≤ 250 mA VOUT −3 +3 %
(for VOUT < 1.8 V, XDFN4 package)
VIN = (VOUT(NOM) + 1 V) to 5.5 V
−2 +2
SOT23−5L Package Only

Line Regulation VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V LineReg 0.02 %/V

Load Regulation WLCSP, XDFN4 0.001
IOUT = 1mA to 250mA LoadReg %/mA
SOT23−5L 0.008 0.015
VOUT(NOM) = 1.8 V 180 250
VOUT(NOM) = 2.5 V 110 175
VOUT(NOM) = 2.8 V 95 160
VOUT(NOM) = 3.0 V 90 155
IOUT = 250 mA
Dropout Voltage (Note 5) (WLCSP, XDFN4 VOUT(NOM) = 3.2 V VDO 85 149 mV
Packages)
VOUT(NOM) = 3.3 V 80 145
VOUT(NOM) = 3.5 V 75 140
VOUT(NOM) = 4.5 V 65 120
VOUT(NOM) = 5.0 V 75 105
VOUT(NOM) = 1.8 V 205 280
IOUT = 250 mA VOUT(NOM) = 2.8 V 120 190
Dropout Voltage (Note 5) (SOT23−5L VDO mV
Package) VOUT(NOM) = 3.0 V 115 185
VOUT(NOM) = 3.3 V 105 175
Output Current Limit VOUT = 90% VOUT(NOM) ICL 250 700
mA
Short Circuit Current VOUT = 0 V ISC 690
Quiescent Current IOUT = 0 mA IQ 12 20 mA
Shutdown Current VEN ≤ 0.4 V, VIN = 4.8 V IDIS 0.01 1 mA
EN Pin Threshold Voltage EN Input Voltage “H” VENH 1.2
V
EN Input Voltage “L” VENL 0.4
EN Pull Down Current VEN = 4.8 V IEN 0.2 0.5 mA
Turn−On Time COUT = 1 mF, From assertion of VEN to
120 ms
VOUT = 95% VOUT(NOM)
Power Supply Rejection Ratio IOUT = 20 mA f = 100 Hz 91
f = 1 kHz 92
PSRR dB
f = 10 kHz 85
f = 100 kHz 60

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 NCP163

ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise
noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).

Parameter Test Conditions Symbol Min Typ Max Unit

Output Voltage Noise f = 10 Hz to 100 kHz IOUT = 1 mA 8.0
VN mVRMS
IOUT = 250 mA 6.5
Thermal Shutdown Threshold Temperature rising TSDH 160 °C
Temperature falling TSDL 140 °C
Active Output Discharge Resistance VEN < 0.4 V, Version A only RDIS 280 W
Line Transient (Note 6) VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) +
−1
1.6 V) in 30 ms, IOUT = 1 mA
TranLINE mV
VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) +
+1
1 V) in 30 ms, IOUT = 1 mA
Load Transient (Note 6) IOUT = 1 mA to 200 mA in 10 ms −40
TranLOAD mV
IOUT = 200 mA to 1mA in 10 ms +40
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).
6. Guaranteed by design.

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 NCP163

TYPICAL CHARACTERISTICS
1.830 3.335
1.825 3.330
VOUT, OUTPUT VOLTAGE (V)

VOUT, OUTPUT VOLTAGE (V)

1.820 3.325
1.815 3.320 IOUT = 10 mA
IOUT = 10 mA
1.810 3.315
1.805 3.310 IOUT = 250 mA
IOUT = 250 mA
1.800 3.305
1.795 VIN = 2.8 V 3.300 VIN = 4.3 V
1.790 VOUT = 1.8 V VOUT = 3.3 V
3.295
CIN = 1 mF CIN = 1 mF
1.785 COUT = 1 mF 3.290 COUT = 1 mF
1.780 3.285
−40 −20 0 20 40 60 80 100 120 140 −40 −20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature − Figure 4. Output Voltage vs. Temperature −
VOUT = 1.8 V − XDFN Package VOUT = 3.3 V − XDFN Package

5.040 0.05

REGLINE, LINE REGULATION (%/V)

5.035 0.04
VOUT, OUTPUT VOLTAGE (V)

5.030 0.03
5.025 IOUT = 10 mA 0.02
5.020 0.01
5.015 0
5.010 IOUT = 250 mA −0.01
5.005 VIN = 5.5 V −0.02 VIN = 2.8 V
VOUT = 5.0 V VOUT = 1.8 V
5.000 −0.03
CIN = 1 mF CIN = 1 mF
4.995 −0.04 COUT = 1 mF
COUT = 1 mF
4.990 −0.05
−40 −20 0 20 40 60 80 100 120 140 −40 −20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Output Voltage vs. Temperature − Figure 6. Line Regulation vs. Temperature −
VOUT = 5.0 V − XDFN Package VOUT = 1.8 V

0.050 20
REGLOAD, LOAD REGULATION (mV)
REGLINE, LINE REGULATION (%/V)

0.040 18 VIN = 2.8 V

VOUT = 1.8 V
0.030 16
CIN = 1 mF
0.020 14 COUT = 1 mF
0.010 12
0 10
−0.010 8
−0.020 6
VIN = 4.3 V
−0.030 VOUT = 3.3 V 4
CIN = 1 mF 2
−0.040
COUT = 1 mF
−0.050 0
−40 −20 0 20 40 60 80 100 120 140 −40 −20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Line Regulation vs. Temperature − Figure 8. Load Regulation vs. Temperature −
VOUT = 3.3 V VOUT = 1.8 V

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 NCP163

TYPICAL CHARACTERISTICS

20 20
REGLOAD, LOAD REGULATION (mV)

REGLOAD, LOAD REGULATION (mV)

18 VIN = 4.3 V 18
VOUT = 3.3 V
16 CIN = 1 mF 16
14 COUT = 1 mF 14
12 12
10 10
8 8
6 6 VIN = 5.5 V
4 4 VOUT = 5.0 V
CIN = 1 mF
2 2 COUT = 1 mF
0 0
−40 −20 0 20 40 60 80 100 120 140 −40 −20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 9. Load Regulation vs. Temperature − Figure 10. Load Regulation vs. Temperature −
VOUT = 3.3 V VOUT = 5.0 V

1500 1500
1350 1350
IGND, GROUND CURRENT (mA)

IGND, GROUND CURRENT (mA)

1200 TJ = 125°C 1200 TJ = 125°C
1050 TJ = 25°C 1050 TJ = 25°C
900 900
750 750
TJ = −40°C TJ = −40°C
600 600
450 450
VIN = 2.8 V VIN = 4.3 V
300 VOUT = 1.8 V 300 VOUT = 3.3 V
CIN = 1 mF CIN = 1 mF
150 150
COUT = 1 mF COUT = 1 mF
0 0
0 25 50 75 100 125 150 175 200 225 250 0 25 50 75 100 125 150 175 200 225 250
IOUT, OUTPUT CURRENT (mA) IOUT, OUTPUT CURRENT (mA)
Figure 11. Ground Current vs. Load Current − Figure 12. Ground Current vs. Load Current −
VOUT = 1.8 V VOUT = 3.3 V

1500 250
VOUT = 1.8 V
VDROP, DROPOUT VOLTAGE (mV)

1350 225
IGND, GROUND CURRENT (mA)

CIN = 1 mF TJ = 125°C
1200 200 COUT = 1 mF
TJ = 125°C
1050 TJ = 25°C 175 TJ = 25°C
900 150
750 125
TJ = −40°C
600 100 TJ = −40°C

450 75
VIN = 5.5 V
300 VOUT = 5.0 V 50
150 CIN = 1 mF
25
COUT = 1 mF
0 0
0 25 50 75 100 125 150 175 200 225 250 0 25 50 75 100 125 150 175 200 225 250
IOUT, OUTPUT CURRENT (mA) IOUT, OUTPUT CURRENT (mA)
Figure 13. Ground Current vs. Load Current − Figure 14. Dropout Voltage vs. Load Current −
VOUT = 5.0 V VOUT = 1.8 V

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 NCP163

TYPICAL CHARACTERISTICS
150 150
VDROP, DROPOUT VOLTAGE (mV)

VDROP, DROPOUT VOLTAGE (mV)

135 135
120 TJ = 125°C 120
105 105
90 TJ = 25°C 90 TJ = 125°C
75 75
TJ = 25°C
60 60
TJ = −40°C
45 45
TJ = −40°C
30 VOUT = 3.3 V 30 VOUT = 5.0 V
CIN = 1 mF CIN = 1 mF
15 COUT = 1 mF 15 COUT = 1 mF
0 0
0 25 50 75 100 125 150 175 200 225 250 0 25 50 75 100 125 150 175 200 225 250
IOUT, OUTPUT CURRENT (mA) IOUT, OUTPUT CURRENT (mA)
Figure 15. Dropout Voltage vs. Load Current − Figure 16. Dropout Voltage vs. Load Current −
VOUT = 3.3 V VOUT = 5.0 V

250 150
VOUT = 3.3 V
VDROP, DROPOUT VOLTAGE (mV)

VDROP, DROPOUT VOLTAGE (mV)

225 135
CIN = 1 mF IOUT = 250 mA
200 IOUT = 250 mA 120 COUT = 1 mF
175 105
150 90
VOUT = 1.8 V
125 75 IOUT = 100 mA
CIN = 1 mF
100 COUT = 1 mF IOUT = 100 mA 60
75 45 IOUT = 10 mA
50 30
IOUT = 10 mA
25 15
0 0
−40 −20 0 20 40 60 80 100 120 140 −40 −20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 17. Dropout Voltage vs. Temperature − Figure 18. Dropout Voltage vs. Temperature −
VOUT = 1.8 V VOUT = 3.3 V

100 720
IOUT = 250 mA
VDROP, DROPOUT VOLTAGE (mV)

90 700
80 680
ICL, CURRENT LIMIT (mA)

IOUT = 100 mA
70 660
60 640
50 IOUT = 10 mA 620
40 600
30 580 VIN = 4.3 V
VOUT = 5.0 V VOUT = 90% VOUT(nom)
20 560
CIN = 1 mF CIN = 1 mF
10 COUT = 1 mF 540 COUT = 1 mF
0 520
−40 −20 0 20 40 60 80 100 120 140 −40 −20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 19. Dropout Voltage vs. Temperature − Figure 20. Current Limit vs. Temperature
VOUT = 5.0 V

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 NCP163

TYPICAL CHARACTERISTICS

VEN, ENABLE VOLTAGE THRESHOLD (V)

700 1.0
ISC, SHORT CIRCUIT CURRENT (mA)

680 0.9
660 0.8
640 0.7 OFF −> ON
620 0.6
ON −> OFF
600 0.5
580 0.4
560 VIN = 4.3 V 0.3 VIN = 4.3 V
VOUT = 0 V (SHORT) VOUT = 3.3 V
540 CIN = 1 mF 0.2 CIN = 1 mF
520 COUT = 1 mF 0.1 COUT = 1 mF
500 0
−40 −20 0 20 40 60 80 100 120 140 −40 −20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 21. Short Circuit Current vs. Figure 22. Enable Thresholds Voltage
Temperature

0.50 100
0.45 90 VIN = 4.3 V
IEN, ENABLE PIN CURRENT (mA)

VOUT = 3.3 V
IDIS, DISABLE CURRENT (nA)
0.40 80 CIN = 1 mF
0.35 70 COUT = 1 mF
0.30 60
0.25 50
0.20 40
0.15 VIN = 4.3 V 30
VOUT = 3.3 V
0.10 20
CIN = 1 mF
0.05 COUT = 1 mF 10
0 0
−40 −20 0 20 40 60 80 100 120 140 −40 −20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 23. Current to Enable Pin vs. Figure 24. Disable Current vs. Temperature
Temperature

300 100
RDIS, DISCHARGE RESISTIVITY (W)

290 VIN = 4.3 V

VOUT = 3.3 V
280
CIN = 1 mF
270 COUT = 1 mF
10 Unstable Operation
260
ESR (W)

250
240
1 Stable Operation
230
220
210
200 0.1
−40 −20 0 20 40 60 80 100 120 140 0 50 100 150 200 250 300
TJ, JUNCTION TEMPERATURE (°C) IOUT, OUTPUT CURRENT (mA)
Figure 25. Discharge Resistance vs. Figure 26. Maximum COUT ESR Value vs. Load
Temperature Current

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 NCP163

TYPICAL CHARACTERISTICS
10K
1 mA
10 mA
250 mA
OUTPUT NOISE (nV/√Hz)

1K RMS Output Noise (mV)

IOUT 10 Hz − 100 kHz 100 Hz − 100 kHz
1 mA 7.73 6.99
100 10 mA 7.12 6.26
250 mA 7.11 6.33

VIN = 2.8 V
10
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
1
10 100 1K 10K 100K 1M
FREQUENCY (Hz)
Figure 27. Output Voltage Noise Spectral Density – VOUT = 1.8 V

10K
1 mA
10 mA
250 mA
OUTPUT NOISE (nV/√Hz)

1K RMS Output Noise (mV)

IOUT 10 Hz − 100 kHz 100 Hz − 100 kHz
1 mA 7.9 7.07
100 10 mA 7.19 6.25
250 mA 7.29 6.38

VIN = 3.8 V
10
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
1
10 100 1K 10K 100K 1M
FREQUENCY (Hz)
Figure 28. Output Voltage Noise Spectral Density – VOUT = 2.8 V

120 120
VIN = 2.8 V+100mVpp VIN = 4.3 V+100mVpp
VOUT = 1.8 V VOUT = 3.3 V
RR, RIPPLE REJECTION (dB)

RR, RIPPLE REJECTION (dB)

100 COUT = 1 mF MLCC 1206 100 COUT = 1 mF MLCC 1206

80 80

60 60

40 1 mA 40 1 mA
10 mA 10 mA
20 20 mA 20 20 mA
100 mA 100 mA
250 mA 250 mA
0 0
10 100 1K 10K 100K 1M 10M 10 100 1K 10K 100K 1M 10M
FREQUENCY (Hz) FREQUENCY (Hz)
Figure 29. Power Supply Rejection Ratio − Figure 30. Power Supply Rejection Ratio −
VOUT = 1.8 V VOUT = 3.3 V

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 NCP163

TYPICAL CHARACTERISTICS
120

RR, RIPPLE REJECTION (dB)

100

80

60

40 1 mA
10 mA
20 20 mA VIN = 5.5 V+100mVpp
100 mA VOUT = 5.0 V
250 mA COUT = 1 mF MLCC 1206
0
10 100 1K 10K 100K 1M 10M
FREQUENCY (Hz)
Figure 31. Power Supply Rejection Ratio −
VOUT = 5.0 V

500 mV/div
500 mV/div

VEN VEN

VOUT VIN = 4.3 V

1 V/div

1 V/div

VOUT = 3.3 V
VOUT VIN = 4.3 V
COUT = 1 mF (MLCC)
VOUT = 3.3 V
COUT = 4.7 mF (MLCC)
200 mA/div

200 mA/div

IINPUT
IINPUT

50 ms/div 50 ms/div
Figure 32. Enable Turn−on Response − Figure 33. Enable Turn−on Response −
COUT = 1 mF, IOUT = 10 mA COUT = 4.7 mF, IOUT = 10 mA
500 mV/div

500 mV/div

VEN VEN

VIN = 4.3 V
VOUT VOUT = 3.3 V
1 V/div

VIN = 4.3 V
1 V/div

COUT = 1 mF (MLCC) VOUT = 3.3 V

VOUT
COUT = 4.7 mF (MLCC)
200 mA/div

200 mA/div

IINPUT
IINPUT

50 ms/div 50 ms/div
Figure 34. Enable Turn−on Response − Figure 35. Enable Turn−on Response −
COUT = 1 mF, IOUT = 250 mA COUT = 4.7 mF, IOUT = 250 mA

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 NCP163

TYPICAL CHARACTERISTICS

3.3 V VIN 3.3 V

tFALL = 1 ms

500 mV/div
500 mV/div

VIN 2.3 V tRISE = 1 ms 2.3 V

VOUT = 1.8 V, IOUT = 10 mA

VOUT = 1.8 V, IOUT = 10 mA
CIN = 1 mF (MLCC)
10 mV/div

CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
COUT = 1 mF (MLCC)

10 mV/div
VOUT VOUT

2 ms/div 2 ms/div
Figure 36. Line Transient Response − Figure 37. Line Transient Response −
IOUT = 10 mA IOUT = 10 mA

3.3 V VIN 3.3 V

500 mV/div

500 mV/div
tFALL = 1 ms

VIN 2.3 V tRISE = 1 ms 2.3 V

VOUT = 1.8 V, IOUT = 250 mA VOUT = 1.8 V, IOUT = 250 mA

CIN = 1 mF (MLCC) CIN = 1 mF (MLCC)
10 mV/div

COUT = 1 mF (MLCC) COUT = 1 mF (MLCC)

10 mV/div

VOUT VOUT

2 ms/div 2 ms/div
Figure 38. Line Transient Response − Figure 39. Line Transient Response −
IOUT = 250 mA IOUT = 250 mA

IOUT
100 mA/div

100 mA/div

tFALL = 1 ms
tRISE = 1 ms
IOUT

VIN = 3.8 V, VOUT = 3.3 V

CIN = 1 mF (MLCC) COUT = 4.7 mF
20 mV/div

20 mV/div

VOUT
VOUT

COUT = 4.7 mF COUT = 1 mF VIN = 3.8 V, VOUT = 3.3 V

COUT = 1 mF CIN = 1 mF (MLCC)

5 ms/div 10 ms/div
Figure 40. Load Transient Response − Figure 41. Load Transient Response −
1 mA to 250 mA 250 mA to 1 mA

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 NCP163

TYPICAL CHARACTERISTICS

IOUT VIN = 3.8 V, VOUT = 3.3 V

CIN = 1 mF (MLCC)

100 mA/div
100 mA/div

COUT = 1 mF (MLCC)

IOUT
VIN = 3.8 V, VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC) tRISE = 500 ns

20 mV/div
VOUT
VOUT
20 mV/div

tRISE = 1 ms
tRISE = 1 ms
tRISE = 500 ns

5 ms/div 5 ms/div
Figure 42. Load Transient Response − Figure 43. Load Transient Response −
1 mA to 250 mA 250 mA to 1 mA

VOUT VIN

TSD On
1 V/div

VOUT

TSD Off

VIN = 5.5 V, VOUT = 1.2 V

CIN = 1 mF (MLCC), COUT = 1 mF (MLCC) VIN = 3.8 V
VOUT = 3.3 V
500 mV/div
100 mA/div

IOUT
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT = 10 mA

10 ms/div 2 ms/div
Figure 44. Overheating Protection − TSD Figure 45. Turn−on/off − Slow Rising VIN

VEN VIN = 3.8 V

VOUT = 2.8 V
500 mV/div

CIN = 1 mF (MLCC)

VOUT
COUT = 10 mF
1 V/div

COUT = 4.7 mF

COUT = 1 mF

400 ms/div
Figure 46. Enable Turn−off − Various Output
Capacitors

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 NCP163
APPLICATIONS INFORMATION
General
The NCP163 is an ultra−low noise 250 mA low dropout
regulator designed to meet the requirements of RF
applications and high performance analog circuits. The
NCP163 device provides very high PSRR and excellent
dynamic response. In connection with low quiescent current
this device is well suitable for battery powered application
such as cell phones, tablets and other. The NCP163 is fully
protected in case of current overload, output short circuit and
overheating.
Input Capacitor Selection (CIN)
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
Output Decoupling (COUT)
The NCP163 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP163 is designed to
remain stable with minimum effective capacitance of 0.7 mF
to account for changes with temperature, DC bias and
package size. Especially for small package size capacitors
such as 0201 the effective capacitance drops rapidly with the
applied DC bias. Please refer Figure 47.
Figure 47. Capacity vs DC Bias Voltage
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 2 W. Larger
output capacitors and lower ESR could improve the load
www.onsemi.com
13
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
Enable Operation
The NCP163 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
VOUT is pulled to GND through a 280 W resistor. In the
disable state the device consumes as low as typ. 10 nA from
the VIN.
If the EN pin voltage >1.2 V the device is guaranteed to
be enabled. The NCP163 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 200 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Output Current Limit
Output Current is internally limited within the IC to a
typical 700 mA. The NCP163 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 690 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD − 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP163 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
 NCP163

ambient temperature affect the rate of junction temperature The power dissipated by the NCP163 for given
rise for the part. application conditions can be calculated from the following
The maximum power dissipation the NCP163 can handle equations:
is given by: P D [ V IN @ I GND ) I OUTǒV IN * V OUTǓ (eq. 2)
ƪ125oC * T Aƫ
P D(MAX) + (eq. 1)
q JA

160 1.6
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)

PD(MAX), TA = 25°C, 2 oz Cu
150 1.4

PD(MAX), MAXIMUM POWER DISSIPATION (W)

140 PD(MAX), TA = 25°C, 1 oz Cu 1.2

130 1.0

120 0.8

qJA, 1 oz Cu
110 0.6

100 0.4

qJA, 2 oz Cu
90 0.2

80 0
0 100 200 300 400 500 600 700
PCB COPPER AREA (mm2)
Figure 48. qJA and PD (MAX) vs. Copper Area (CSP4)

220 1.0
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)

qJA, 1 oz Cu

210 0.9 PD(MAX), MAXIMUM POWER DISSIPATION (W)

200 0.8
qJA, 2 oz Cu

190 0.7
PD(MAX), TA = 25°C, 2 oz Cu

PD(MAX), TA = 25°C, 1 oz Cu
180 0.6

170 0.5

160 0.4

150 0.3
0 100 200 300 400 500 600 700
PCB COPPER AREA (mm2)
Figure 49. qJA and PD (MAX) vs. Copper Area (XDFN4)

www.onsemi.com
14
 NCP163

325 0.7

qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)

PD(MAX), TA = 25°C, 2 oz Cu
300 0.6

PD(MAX), MAXIMUM POWER DISSIPATION (W)

PD(MAX), TA = 25°C, 1 oz Cu
275 0.5

250 0.4

qJA, 1 oz Cu
225 0.3

qJA, 2 oz Cu
200 0.2

175 0.1

150 0
0 100 200 300 400 500 600 700
PCB COPPER AREA (mm2)
Figure 50. qJA and PD (MAX) vs. Copper Area (SOT23−5L)

www.onsemi.com
15
 NCP163
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
Power Supply Rejection Ratio
The NCP163 features very high Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
www.onsemi.com
16
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT, TA.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 or 0201 capacitors with
appropriate capacity. Larger copper area connected to the
pins will also improve the device thermal resistance. The
actual power dissipation can be calculated from the equation
above (Equation 2). Expose pad can be tied to the GND pin
for improvement power dissipation and lower device
temperature.
 NCP163

ORDERING INFORMATION (WLCSP4)

Voltage
Device Option Marking Rotation Description Package Shipping†
NCP163AFCS120T2G 1.2 V 2 0
NCP163AFCS180T2G 1.8 V Y 180
NCP163AFCS250T2G 2.5 V T 270
NCP163AFCS260T2G 2.6 V 4 180
NCP163AFCS270T2G 2.7 V V 270
250 mA, Active Discharge
NCP163AFCS280T2G 2.8 V 3 180 WLCSP4 5000 /
CASE 567KA Tape &
NCP163AFCS285T2G 2.85 V 5 180 (Pb-Free) Reel
NCP163AFCS290T2G 2.9 V 6 180
NCP163AFCS2925T2G 2.925 V 2 180
NCP163AFCS514T2G 5.14 V 3 270
NCP163BFCS180T2G 1.8 V Y 270
250 mA, Non−Active Discharge
NCP163BFCS2925T2G 2.925 V 2 270

NCP163AFCT120T2G 1.2 V A 0
NCP163AFCT180T2G 1.8 V Y 180
NCP163AFCT250T2G 2.5 V Y 90
NCP163AFCT260T2G 2.6 V 6 270
NCP163AFCT270T2G 2.7 V 5 180
NCP163AFCT280T2G 2.8 V 3 180
250 mA, Active Discharge
NCP163AFCT285T2G 2.85 V 5 270 WLCSP4 5000 /
CASE 567JZ Tape &
NCP163AFCT290T2G 2.9 V 4 270 (Pb-Free) Reel
NCP163AFCT2925T2G 2.925 V 2 180
NCP163AFCT300T2G 3.0 V 3 270
NCP163AFCT330T2G 3.3 V 6 90
NCP163AFCT514T2G 5.14 V T 0
NCP163BFCT180T2G 1.8 V Y 270
250 mA, Non−Active Discharge
NCP163BFCT2925T2G 2.925 V 2 270
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

www.onsemi.com
17
 NCP163

ORDERING INFORMATION (XDFN4)

Voltage
Device Option Marking Description Package Shipping†
NCP163AMX120TBG* 1.2 V ME
NCP163AMX130TBG* 1.3 V MG
NCP163AMX150TBG 1.5 V MV
NCP163AMX180TBG 1.8 V MA
NCP163AMX1825TBG 1.825 V MC
NCP163AMX190TBG 1.9 V MH
NCP163AMX250TBG 2.5 V MU
NCP163AMX260TBG 2.6 V MN
NCP163AMX270TBG 2.7 V MX
250 mA, Active Discharge
NCP163AMX275TBG 2.75 V MD
XDFN4 3000 /
NCP163AMX280TBG 2.8 V MM CASE 711AJ Tape &
(Pb-Free) Reel
NCP163AMX285TBG 2.85 V MQ
NCP163AMX290TBG 2.9 V MR
NCP163AMX300TBG 3.0 V MJ
NCP163AMX330TBG 3.3 V MK
NCP163AMX400TBG 4.0 V MY
NCP163AMX500TBG 5.0 V ML
NCP163AMX514TBG 5.14 V MW
NCP163BMX180TBG 1.8 V PA
NCP163BMX1825TBG 1.825 V PC 250 mA, Non−Active Discharge
NCP163BMX275TBG 2.75 V PD
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Contact sales office for availability information.

ORDERING INFORMATION (SOT23−5L)

Voltage
Device Option Marking Description Package Shipping†
NCP163ASN150T1G 1.5 V KAK
NCP163ASN180T1G 1.8 V KAA
NCP163ASN250T1G 2.5 V KAD
NCP163ASN270T1G 2.7 V KAL
SOT23−5L 3000 /
NCP163ASN280T1G 2.8 V KAE 250 mA, Active Discharge CASE 527AH Tape &
(Pb-Free) Reel
NCP163ASN300T1G 3.0 V KAF
NCP163ASN330T1G 3.3 V KAG
NCP163ASN350T1G 3.5 V KAH
NCP163ASN500T1G 5.0 V KAJ
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

www.onsemi.com
18
 NCP163

PACKAGE DIMENSIONS

WLCSP4, 0.64x0.64
CASE 567JZ
ISSUE A

NOTES:
E A B 1. DIMENSIONING AND TOLERANCING PER

ÈÈ
PIN A1 ASME Y14.5M, 1994.
REFERENCE 2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
D CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN NOM MAX
A −−− −−− 0.33
TOP VIEW A1 0.04 0.06 0.08
A2 0.23 REF
b 0.195 0.210 0.225
A2 D 0.610 0.640 0.670
0.05 C E 0.610 0.640 0.670
e 0.35 BSC
A
0.05 C RECOMMENDED
NOTE 3
A1 C SEATING SOLDERING FOOTPRINT*
SIDE VIEW PLANE
A1 PACKAGE
OUTLINE

e
4X b
e 0.35 4X
0.03 C A B
PITCH 0.20
B
0.35
A PITCH
1 2 DIMENSIONS: MILLIMETERS

BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

WLCSP4, 0.64x0.64
CASE 567KA
ISSUE A

NOTES:
E A B 1. DIMENSIONING AND TOLERANCING PER

ÈÈ
PIN A1 ASME Y14.5M, 1994.
REFERENCE 2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
D CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN NOM MAX
A 0.35 0.40 0.45
TOP VIEW A1 0.14 0.16 0.18
A2 0.25 REF
A2 b 0.185 0.200 0.215
D 0.610 0.640 0.670
0.05 C E 0.610 0.640 0.670
e 0.35 BSC
A
0.05 C RECOMMENDED
NOTE 3
A1 C SEATING SOLDERING FOOTPRINT*
SIDE VIEW PLANE
A1 PACKAGE
OUTLINE

e
4X b
e 0.35 4X
0.05 C A B
PITCH 0.20
B
0.35
0.03 C A PITCH
1 2 DIMENSIONS: MILLIMETERS

BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com
19
 NCP163

PACKAGE DIMENSIONS

XDFN4 1.0x1.0, 0.65P

CASE 711AJ
ISSUE A

4X L2 NOTES:
D A
1. DIMENSIONING AND TOLERANCING PER
B ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.

ÉÉ
3. DIMENSION b APPLIES TO PLATED TERMINAL
PIN ONE AND IS MEASURED BETWEEN 0.15 AND
REFERENCE 0.20 mm FROM THE TERMINAL TIPS.

ÉÉ
E 4. COPLANARITY APPLIES TO THE EXPOSED
4X b2 PAD AS WELL AS THE TERMINALS.
2X 0.05 C
DETAIL A MILLIMETERS
DIM MIN MAX
2X 0.05 C A 0.33 0.43
TOP VIEW A1 0.00 0.05
A3 0.10 REF
b 0.15 0.25
(A3) b2 0.02 0.12
0.05 C
D 1.00 BSC
A D2 0.43 0.53
E 1.00 BSC
0.05 C e 0.65 BSC
L 0.20 0.30
NOTE 4
SIDE VIEW A1 C SEATING
L2 0.07 0.17
PLANE

RECOMMENDED
e
MOUNTING FOOTPRINT*
e/2
DETAIL A 4X L 0.65 2X
1 2
PITCH 0.52
PACKAGE
OUTLINE
D2 D2 4X
4X 0.11 0.39
45 5 4 3 1.20

4X b
0.05 M C A B 4X
4X
NOTE 3 0.24
BOTTOM VIEW 0.26
DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com
20
 NCP163

PACKAGE DIMENSIONS

SOT−23, 5 Lead
CASE 527AH
ISSUE O

D
SYMBOL MIN NOM MAX
A 0.90 1.45
A1 0.00 0.15
A2 0.90 1.15 1.30
b 0.30 0.50
E1 E c 0.08 0.22
D 2.90 BSC
E 2.80 BSC
E1 1.60 BSC
e 0.95 BSC
e
L 0.30 0.45 0.60
L1 0.60 REF
PIN #1 IDENTIFICATION
L2 0.25 REF
TOP VIEW θ 0° 4° 8°
θ1 5° 10° 15°
θ2 5° 10° 15°
θ1

A2 A
θ

b
θ2 L1 L
A1 L2 c

SIDE VIEW END VIEW

Notes:
(1) All dimensions in millimeters. Angles in degrees.
(2) Complies with JEDEC standard MO-178.

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coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
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◊ www.onsemi.com NCP163/D
21
Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

ON Semiconductor:
NCP163AMX180TBG NCP163AMX300TBG NCP163AMX500TBG NCP163AMX285TBG NCP163AFCT180T2G
NCP163BFCT180T2G NCP163AMX260TBG NCP163AFCT285T2G NCP163AFCS280T2G NCP163BFCS2925T2G
NCP163AFCT300T2G NCP163AMX330TBG NCP163BMX180TBG NCP163AFCT280T2G NCP163AMX280TBG
NCP163AMX190TBG NCP163AFCS2925T2G NCP163AFCS260T2G NCP163AFCT2925T2G NCP163AMX1825TBG
NCP163AFCS290T2G NCP163AMX290TBG NCP163AFCS180T2G NCP163AMX275TBG NCP163AFCT290T2G
NCP163AFCS285T2G NCP163BFCT2925T2G NCP163BMX275TBG NCP163AFCT260T2G NCP163BMX1825TBG
NCP163BFCS180T2G NCP163AFCS270T2G NCP163AFCT270T2G NCP163AMX130TBG NCP163AMX250TBG
NCP163AMX120TBG NCP163AMX150TBG NCP163AFCS120T2G NCP163AFCT120T2G NCP163ASN180T1G
NCP163ASN250T1G NCP163ASN150T1G NCP163ASN300T1G NCP163ASN270T1G NCP163ASN330T1G
NCP163ASN500T1G NCP163ASN280T1G