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FlatChem 16 (2019) 100113

Contents lists available at ScienceDirect

FlatChem
journal homepage: www.elsevier.com/locate/flatc

Effect of graphene dispersion and interfacial bonding on the mechanical T


properties of metal matrix composites: An overview☆
Hanieh Ghodratia, Reza Ghomashchia,b,

a
School of Mechanical Engineering, The University of Adelaide, Adelaide, South Australia 5005, Australia
b
ARC Research Hub for Graphene Enabled Industry Transformation, University of Adelaide, Adelaide, SA 5005, Australia

ARTICLE INFO ABSTRACT

Keywords: The mechanical properties of metal matrix composites (MMCs) reinforced with graphene are very much de-
Metal matrix composites pendant on the uniform distribution of graphene in the matrix. The nature of bonding between the graphene
Graphene reinforcement and metallic matrices is also critical and influences the performance of the final composite. In
Dispersion spite of an abundance of information on graphene reinforced metal matrices, less attention has been made on the
Interfacial bonding
graphene dispersion and its interface bonding with the matrix. This is surprising as almost all reports cate-
Mechanical properties
gorically emphasize on their importance; however, specific attention to these issues is very scarce. This is the
main theme of this report to highlight the fundamentals of atomic structure of graphene as a contributing factor
on dispersion along with the bonding mechanism involved at the interface between graphene and the metallic
matrix. In the following sections, fabrication of metal-based composites reinforced with graphene through
powder metallurgy (PM) has been studied. In this respect, the challenges of dispersion and interfacial bonding
have been addressed in addition to their effects on the mechanical properties of composites. In this context,
recently developed novel methods including coating graphene with nano-metallic particles, vacuum filtration,
matrix-alloying, and defect engineering via plasma treatment along with their influence on mechanical prop-
erties have been discussed.

1. Introduction to decompose or fall apart (the same type of force that cause melting ice
and losing its crystal structure above 0 °C) [2–4]. However, the synth-
In recent years, the incorporation of newly developed carbonaceous esis of thermodynamically stable graphene by Geim and co-workers at
nanomaterials such as carbon nanotubes (CNTs) and nano-graphite or Manchester University in 2004, introduced a new dimension of research
graphene (Gr) into metal matrices has introduced an important class of in physics, chemistry and materials science [5,6].
advanced materials with superior mechanical and physical character- Graphene (Gr) is a two-dimensional (2D) building block of graphite
istics [1]. These carbonaceous nano-sized materials with extraordinary composed of a single atomic layer of sp2 hybridized carbon atoms
high elastic modulus and mechanical strength in addition to excellent (Fig. 1) [7]. The -stacking (an attractive, noncovalent interaction be-
electrical and thermal conductivities are used for structural engineering tween aromatic rings) of graphene sheets holds the lamellar graphite
and functional device applications [1]. The unique mechanical prop- structure strongly in place [7]. Graphene with a honeycomb/hexagonal
erties of graphene and CNTs along with their large aspect ratio (i.e. lattice structure of the sp2-bonded structure has unique properties of
length to diameter, or length to thickness ratio), make them the most large surface area (2630 m2/g) [8], excellent mechanical strength
effective reinforcing fillers in fabricating advanced composite materials (Young’s modulus of 1 TPa) [9], high level of thermal conductivity
[1]. (above 3000 Wm−1K−1) [10] and electrical conductivity (2.5 × 105
It was long believed that 2D crystals such as graphene to be ther- cm2 V−1 s−1) [11]. Owing to such key features, graphene has become a
modynamically unstable and could not exist [2]. The reason was related versatile carbon material promising for a wide range of applications
to thermal fluctuations leading to displacement of atoms in low di- including high-performance nanocomposites [12,13], transparent con-
mensional crystals at finite temperature [2–4]. These fluctuations be- ducting films [5,14], sensors [15], nanoelectronics [16], and energy
come as large as the force binding atoms together, causing the structure storage devices [17].


Conflicts of interest: The authors declare no conflicts of interest.

Corresponding author at: School of Mechanical Engineering, The University of Adelaide, Adelaide, South Australia 5005, Australia.
E-mail address: reza.ghomashchi@adelaide.edu.au (R. Ghomashchi).

https://doi.org/10.1016/j.flatc.2019.100113
Received 6 February 2019; Received in revised form 2 May 2019; Accepted 14 May 2019
Available online 20 May 2019
2452-2627/ © 2019 Elsevier B.V. All rights reserved.
H. Ghodrati and R. Ghomashchi FlatChem 16 (2019) 100113

Fig. 1. Graphene sheet (a) wrapped into 0D bulky-balls, (b) rolled into 1D nanotubes, or (c) stacked into 3D graphite [2].

Fig. 2. Single walled carbon nanotubes (SWCNTs), double and multi walled CNTs [18].

In addition to its planar structure (Fig. 1), graphene can also be incorporating graphene and CNTs in metal matrices and fabrication of
‘wrapped’ into zero-dimensional bulky-balls (Fig. 1a), or rolled into a nanocomposites, there are no such reports to specifically address the
single wall tube of carbon with a diameter of 1–2 nm (Fig. 1a) [2]. The importance relevant to distribution of graphene and CNTs in nano-
seamless cylindrical forms of graphene sheets are known as carbon composites. In this article the significance of graphene regarding its
nanotubes (single and multi -walled carbon nanotubes Fig. 2) [18]. The electronic structure, the nature of bonding between graphene and metal
2D structure of graphene with large aspect ratio provides more area to matrices as well as the bonding mechanism will be discussed in details.
interact (from both sides of faces) with the matrix component com- In the following, the effect of dispersion and interfacial bonding on
paring to CNTs [19,20]. Furthermore, the flat morphology of graphene mechanical properties of the final composite will be highlighted. We
enables mechanical interlocking with matrix [21,22]. In addition to its will then look at the solid state processing i.e. powder metallurgy (PM),
geometry, the availability and cost-effectiveness of graphene with high and its challenges to disperse graphene into the matrix. In this regard,
quality are other important factors to be taken into account for re- the recent novel approaches will be discussed to overcome difficulties
inforced structural composites [18,19]. Graphene can also be stacked associated with distribution of graphene into the metallic matrices as
into three-dimensional graphite containing more than ten graphene well as interfacial bonding.
layers (Fig. 1c) [2]. Graphene can also become as nanoflakes and na-
nosheets in terms of few layers of sheets held together in thickness 2. Synthesis of graphene
direction. This is referred as graphene platelets (GPLs)/graphene na-
noplatelets (GNPs) or graphene nanosheets (GNS) with average thick- There are different fabrication methods to produce graphene in-
ness of 5–100 nm [18]. cluding exfoliation (physical/mechanical or chemical), epitaxial growth
In spite of many reports in open literature on the importance of via chemical vapour deposition (CVD), and the unzipping of CNTs [23].

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H. Ghodrati and R. Ghomashchi FlatChem 16 (2019) 100113

Fig. 3. Schematic representation of the mechanism for CVD Graphene growth on Ni [33].

Fig. 4. Producing Graphene from unzipping MWCT [32].

a) b) c)
2px 2py 2pz 2pz
2p
sp3 sp2
Energy

2s
Hybridisation

1s 1s 1s

Fig. 5. Energy level diagram for carbon atom. The four valance electrons in the doubly occupied spherical 2 s orbital and the half occupied dumbbell-shaped 2p-
orbitals take part in the formation of the chemical bond. a) Ground-state diagram, b) sp3 hybrid orbitals in diamond, c) sp2 hybrid orbitals in graphite and graphene
[35].

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H. Ghodrati and R. Ghomashchi FlatChem 16 (2019) 100113

Side view Top view

Fig. 6. The orientation of three sp2 hybrid orbitals in carbon with three coplanar hybrid orbitals at angle of 1200 to each other. The one unchanged p orbital is
perpendicular to the plane of the hybrid orbitals [36].

Fig. 7. Hexagonal lattice of graphene (left) where a1 and a2 are the lattice vectors and i, i = 1, 2, 3 are the nearest-neighbor vectors. Corresponding Brillouin zone
(right) where K and K ' are the Dirac points [37].

a)

Fig. 8. a) and bonds in graphene [39], b) Electronic dispersion and bands in the honeycomb lattice obtained from tight-binding approach. These bands have
linear dispersion in the vicinity of the K points of the Brillouin zone of graphene. [35].

Since fully detailed discussions on the synthesis of graphene can be an intercalation1 between graphite sheets and afterwards ethanol ap-
found in a number of reviews [23–27], we briefly referred to such plied for exfoliation to produce graphene sheets [29] or the mechanical
methods and stay focused on metal-based composites reinforced with method used by the Noble laureates Andre Geim and Konstantin No-
graphene. voselov of University of Manchester (2004), using a Scotch tape to pull
off graphite sheet, graphene.

2.1. Exfoliation

Exfoliation is a peeling process where breaking van der Waals bonds


between layers of graphite occurs either chemically or mechanically
[28]. This means graphene can be produced through breaking stacked 1
Intercalation may be defined as the inclusion or insertion of a molecule
layers of several graphite sheets [26]. For instance, potassium used as between the layers of a lamellar material such as graphite

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H. Ghodrati and R. Ghomashchi FlatChem 16 (2019) 100113

2.3. Unzipping CNTs

This technique has been developed recently to produce graphene


from multiwall carbon nanotubes (MWCNT). The MWCNT as precursor
can be opened longitudinally by intercalation of Li, Na and ammonia.
This follows by acid exfoliation and annealing at high temperature
(Fig. 4) [32].

3. Metal-graphene interface

The integrity of composites is very much dependent on the re-


inforcement-matrix interface characteristics as the structure, crystal-
lographic, physical and chemical nature of the interface affect the bond
strength and thus the final properties of the composite. Once the matrix
and reinforcing agent are selected, the interface needs to be engineered
to achieve the desired properties. The interface which is defined as “a
surface across which a discontinuity occurs in one or more materials para-
meters or properties, e.g. atomic lattice, density, mechanical characteristics
(E, KIC, etc.)” has two distinct features;

1. Occupies a large area in composites


2. The reinforcement/matrix interface forms a system that is not in
thermodynamic equilibrium [34]. This may act as the driving force
for diffusion to induce dissolution and/or chemical reaction if op-
Fig. 9. The metal-graphene contact and corresponding charge transfer (n-doped timum kinetics condition (i.e. a high enough temperature or long
graphene) through physisorption. “Before” and “after” charge transfers are two enough time) is given [34]. A state of thermodynamic equilibrium at
sequential steps taking place in real interface interactions. Here, they have been the interface is preferential.
shown as separated steps to have a better physical illustration [48].

It is well established that, upon a strong interfacial bonding between


2.2. Chemical vapour deposition (CVD) components a more efficient load transfer occurs from the matrix to the
reinforcement. The nature and characteristics of the interface between
Chemical vapour deposition (CVD) is a heterogeneous reaction the reinforcement and matrix significantly affect the mechanical
where graphene is deposited on a substrate (usually transition metals properties of composites [34]. The nature of interface may be coherent
e.g. Ni or Cu) through exposure to volatile precursors (precursor gases/ (crystal lattice at the interface is oriented in similar directions as the
carrier gases) at a high temperature [30]. As illustrated in Fig. 3, the composite constituents – highly strained structure), semi-coherent
substrate is exposed to the hydrocarbon vapour in the presence of argon (dislocations at interface) and in-coherent (disorder). Regarding the
as the carrier gas followed by pyrolysis at 700–850 °C [30]. The gas nature of bonding at the interface, basically, there are two types of
diffuses in the substrate and upon cooling of the substrate, the carbon chemical and physical (mechanical) bonding. For physical bonding, the
precipitates out on the surface to form graphene sheets on the surface of bond energy is low and independent of temperature. It is weak van der
the substrate [31]. Waals and hydrogen bonds, while the chemical bonding is strong (bond
energy is one order of magnitude greater than physical bond). In con-
trast to physical bonding, chemical bonding is irreversible and tem-
perature dependant. It requires the transport of atoms across the

Fig. 10. Optical micrographs displaying the effect of the addition of GNP on the grain size of pure Cu (a) reduced the grain size (b) with 8 vol-% GNP/Cu [66].

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Table 1
Effect of dispersion and processing techniques (Powder Metallurgy) on mechanical properties of graphene reinforced metal matrices (Al, Cu, Mg).
Composition Dispersion and Fabrication Process Mechanical Properties References

Al–0.1 vol-% GNP Blending the Al powder and GNP, ball milling, hot isostatic Reduction in hardness and tensile strength. 63
pressing at 375 °C and then hot extrusion at 550 °C.
Al2024–xvol.-% GNP (x = 0, Ball milling Al powder and GNP for 1, 3 and 5 h – compacted at Improvement in hardness ∼138% with 1.0 vol-% GNP for 67
0.25, 0.5, 1.0) 950 MPa – sintered in Ar atmosphere for 0.5, 1, 2, 3, 4 and 5 h at 5 h milling and 2 h sintering.
500 °C.
Al alloy xvol.-% GNP (x = 0, Ball milling Al powder and GNFs dispersed in ethyl alcohol at Improvement in YS ∼49% with 0.5 vol-% GNP. 61
0.15, 0.5) 75 rpm for 12 h, drying the mixture slurry – Hot isostatic pressing
at 480 °C and 110 MPa for 2 h- Hot extrusion at 450 °C for 1 h.
Al6061 1.0 vol-% GNP Mixing the Al powder and GNP by Ball milling at various times 10, Improvement in flexural strength by 47% and 34% for the 78
30, 60, and 90 min – pre-compaction at 50 MPa at room 60-min and 90-min times.
temperature – hot pressed at 100 MPa for 10 min at 630 °C.
Al2024–xvol.-% GNP (x = 0, Mixing graphene in the Al2024 powder by planetary ball milling Improvement in tensile strength by 50% with 0.7 vol-% GNP 64
0.3, 0.5, 0.7) at 100 rpm for 3 h following by the high-energy ball-milling in an and 4% elongation.
attritor at 500 rpm for 9 h – hot rolling at 450 °C.
Al–xvol.-% GNP (x = 0, 0.5, 1.0, The Al powder and GNP were mechanically mixed in blender at a Improvement in yield strength by 8.8% and ultimate tensile 86
1.5, 2.0) speed of 17 rpm for 24 h – blended powder was cryomilled at a strength by 17.7% with 0.5 vol-% GNP.
rate of 180 rpm for 2 h, and finally hot vacuum degassed – hot Reduction in elongation by 8% with 0.5 vol-% GNP The
extruded at 300 °C – annealed at 300 °C for 2 h. strength of Al/Gr with 1.0 wt% GNFs did not decrease
relative to 0.5 wt% GNFs.
Al–xvol.-% GNP (x = 0, 0.25, GNPs dispersion by ultrasonication in ethanol added to Al slurry Before extrusion, Improvement in UTS ∼13.5% and failure 87
0.5, 1.0) in ethanol, stirring by mechanical agitator at 2000 rpm for 1 h, strain ∼50%, with 0.25 vol-% GNP.
filtering and vacuum dried – pressing and sintering at 600 °C – hot After extrusion, reduction in UTS ∼10.8%, and
extrusion at 470 °C. improvement in failure strain ∼46%
Al alloy xvol.-% GNP (x = 0, 0.3, Al powder and GNP ball milled at 200 rpm for 1 h, 100 rpm for 3 h Improvement in YS ∼71.8% with 0.7 vol-% GNP. 65
0.5, 0.7) and 500 rpm for 6 h – milled powder was containerised in Cu tube
–compacted – hot rolled at 500 °C.
Al xvol.-% GNP (x = 0, 0.5, 1.0, GNPs dispersed uniformly in Al matrix using ultrasonication – Improvement in hardness by 21.4%, YS by 84.5%,and tensile 56
3.0, 5.0) dried powder sintered in spark plasma sintering furnace (SPS) at strength by 54.8% with 1 vol-% GNP
maximum pressure and temperature of 50 MPa and 550 °C.
Cu xvol.-% GNP (x = 3.0, 5.0, Ball milling and mixing GNPs with Cu powder at 1200 rpm for Improvement in Young’s modulus by 37% and yield strength 66
8.0, 12.0) 3 h–hot pressing and sintering at 800 °C for 15 min and 40 MPa. by 114% with 8.0 vol-% GNPs.
Cu xvol.-% GNP (x = 0.5, 1.0) Ultrasonication of Cu and GNP in ethanol for 1 h – dried and ball Improvement in UTS ∼10.7% by and YS ∼14.7% by 62
milled for 400 rpm for 4 h– high-ratio differential speed rolling with 1.0 vol-% GNPs.
(HRDSR).
Cu xvol.-% GNP (x = 1.0, 2.0) Ball milling for 5 h – hot pressing of 550 MPa at 510 °C. Improvement in hardness by 50% with 2.0 vol-% GNPs. 68
Cu xvol.-% GNP (x = 0.5, 1.0, Ball milling of Cu powder and GO at 400 rpm for 1, 3, 5, and 7 h – Improvement in UTS ∼28% by and YS ∼14.7% by 69
2.0) hot pressing at 850 °C for 1 h with 25 MPa. with 0.5 vol-% GNPs.
Cu 2 vol-% GNP Ball milling Cu and RGO for 8 h and 16 h – pressing and sintering Improvement in hardness by 20%. 70
at 750 °C.
Mg–x vol.-% GNP (1, 2, 5) Ball milling at 350 rpm for 15 min – pre-pressed at 5 MPa – Improvement in hardness ∼ 37% reduction in compressive 79
sintered at 450 °C, 50 MPa. strength ∼8.6% with 2 vol-% GNP.
Mg–1%Al–1%Sn 18.0 vol-% GNP Ultrasonication for 1 h, mechanical agitation for 1 h- Compaction Improvement in UTS by ∼14% and yield strength by 76
under 580 MPa and sintering at 630 °C for 2 h – Hot extrusion at ∼29.2%.
350 °C.
Mg–0.64Al–x vol.-% GNP Mixing of Mg–0.64Al powder with GNP in ethanol and Improvement in hardness ∼34% 77
(x = 0.07, 0.15, 0.30) mechanically agitating – the mixture is filtered and vacuum dried Young’s modulus ∼ 131%
overnight at 70 °C – the powder is compacted, sintered at 630 °C YS ∼50%, failure strain ∼ 74.2% with 0.3 vol-% GNP.
and hot extruded at 350 °C.
Mg–1Cu–xGNPs (x = 0.18, 0.36, Mixing Mg and Cu (wt-1%) powders in ethanol by high speed Improvement in hardness by ∼42%, elastic modulus by 75
0.54) mechanical agitator (2000 rpm), mixing GNPs with the Mg-1Cu 89%, yield strength by 117%, ultimate tensile strength by
and mechanical agitation for 1.5 h, then filtered and dried – 58%, and failure strain by 96% with 0.54 vol-% GNP.
compaction (600 MPa) and sintering at 630 °C for 3 h.
Mg alloy (AZ91) xvol.-% GNP Ultra sonication of GNS and AZ91 in ethanol for 1 h, filtered and Improvement in yield strength by 76.2% and elongation by 80
(x = 0.1, 0.3, 0.5, 0.8, 1.2) dried – presses, sintered, and hot extrusion. 24.3% with 0.5 vol-% GNPs.

interface and is diffusion controlled. The reaction zone thickness ( X ) is an allotrope of carbon, and to gain deeper insight into the metal-gra-
time (t ) dependants as; phene interfacial bonding, it is helpful to examine the electron con-
(1) figuration of carbon, and the atomic structure of graphene.
X 2 = Dt
where D , the diffusion coefficient is temperature dependent expressing
as; 3.1. Atomic and electronic structure of carbon and graphene
Q
D = D0 exp Carbon has the atomic number 6 with ground-state electron con-
RT (2)
figuration (the lowest energy distribution/arrangement of electrons in
D0 = pre-exponential factor (m2/s), Q = activation energy (J/mol), atomic orbitals) of (1 s)2(2 s)2(2p)4 [35]. The 2 electrons in 1 s orbital
R = gas constant (8.31 J/mol.K) and T = temperature (K). are core electrons remaining more or less inert, but the valance elec-
In the next part, the fundamentals of electronic properties of the trons in 2 s orbital and three 2p orbitals can hybridize through com-
graphene/metal interface will be discussed in addition to the me- bination of these atomic orbitals (hybridization) [35]. Fig. 5 shows the
chanism of the interfacial reaction with the metal matrix. Graphene is energy level diagram (electrons occupy discrete/quantized values of

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orbitals of other carbon atoms. The strong binding energy of the C–C
bonds (345 kJ/mol) in diamond results in high hardness [35].
In graphite and graphene, hybridisation of one s orbital and two p
orbitals gives three sp2 hybrid orbitals leaving one p orbital (by con-
vention 2pz) unhybridised [35,36]. The three sp2 hybrid orbitals lie in
the same plane separated by 1200 angel, and the unchanged/un-
hybridized p orbital is perpendicular to the plane of the hybrid orbitals
(Fig. 6) [35]. Thus, sp2 hybrid orbitals of each carbon in graphite and
graphene form three covalent in-plane -bonds with three carbon
neighbours and one covalent bond by out of plane (parallel) or-
ientation of unhybrized p orbital [35,36]. This form of C bonding in
graphite and graphene results in the planar hexagonal “honeycomb”
structure of graphite [35]. Comparing the strength of bonding between
graphite and diamond, the in-plane -bonds within the graphene layers
(615 kJ/mol) are stronger than C–C bonds in sp3 orbital hybrids in
diamond (345 kJ/mol) [35]. However, the bonds formed by the un-
hybradised p orbitals in graphite have a significantly lower energy
comparing to -bonds due to parallel orientation of p orbitals (less
Fig. 11. Raman spectra for as-milled Al-GNPs (1.0 wt%) for 1, 3 5 h of milling
time [67]. overlap between the component p orbitals). This leads to graphite
layers to be easily sheared along the plane [35,36].
The hexagonal structure of graphene can be viewed as triangular
energy) for the C in ground state, sp3 hybrid orbitals, and sp2 hybrid lattice containing a basis of two atoms per unit cell (Fig. 7) [37]. The
orbitals [35]. Bonding of C with other C atoms occurs through pro- lattice vectors are given by
motion of one of the 2 s electrons into the empty 2pz orbital [35]. Thus,
the general interest of carbon arises from this electron configuration of a a
a1 = (3, 3 ), a2 = (3, 3)
C forming different ways of bonding in the solid state through atomic 2 2 (3)
orbital hybridization [35]. In diamond, for instance, hybridisation of where a = 1.42 Å is the shortest distance between two carbon atoms i.e.
one s orbital and three p orbitals gives four energetically equivalent sp3 C–C distance [37]. The reciprocal lattice vectors b1 and b2 can be
hybrid orbitals. The four sp3 hybrid orbitals are arranged in the tetra- written as (Fig. 7)
hedral arrangement so that electrons undergo the minimum repulsion
[35]. The three-dimensional structure of diamond forms by the overlap 2 2
b1 = (1, 3 ), b2 = (1, 3)
between sp3 hybrid orbitals of one carbon atoms with the sp3 hybrid 3a 3a (4)

Fig. 12. SEM micrograph for ball-milled Al–1 wt-% GNP powders showing the morphology for (a) Al – 1 h, (b) Al – 5 h, (c) Al–1 wt-% GNP – 1 h, and (d) Al–1 wt-%
GNP – 5 h [67].

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Fig. 13. a) Composite powder (Al-1wt% GNP) and Fracture surface analysis (FE-SEM micrographs) of SPS consolidated composite powder (b) Al, (c) Al-GNP (0.5 wt
%), (d) Al-GNP (1 wt%), (e) Al-GNP (3 wt%), and (f) Al-GNP (5 wt%) [56].

The two points K and K ' at the corners of the graphene Brillouin These orbitals disperse to form two bands as bonding (the lower energy
zone (the primitive cell in the reciprocal space) are called Dirac points valance band) and anti-bonding (the higher energy conduction band)
[37]. Their positions in the momentum space (reciprocal space; Fourier (Fig. 8) [35]. Thus, the three-dimensional energy band structure of
transform of “real space” to reciprocal space) are given by [37] graphene is displayed in Fig. 8. It can be seen that the valance and
conduction bands do not separate but meet each other at Dirac points
2 2 2 2
K= , , K' = , (K or K ' point in the BZ) [35].
3a 3 3 a 3a 3 3a (5) Therefore, graphene has a unique electronic structure in which the
As can be seen from Fig. 8, each carbon atom in the graphene and bands meet in a single point at the Fermi energy (it is situated
honeycomb structure is connected to the three neighbour atoms at the energy level where the valance and conduction bands meet [35])
through strong covalent sp2 or bond [35]. The remaining electron in at the corner of Brillouin zone (Dirac point). The bands show a linear
2pz orbital ( orbital) which is perpendicular to the plane of graphene, dispersion at the K and K’ zone [40]. However, the electronic structure
determine the low-energy electronic structure of graphene [35,36]. The of graphene can be significantly distorted upon the interaction of gra-
dispersion of the electrons in graphite building layer, now referred phene with metallic particles [40]. Based on the nature of bonding at
graphene, was calculated by the tight-binding approximation in 1947 the interface, it can be either strongly chemical bond or weakly physical
considering the unit cell of graphene contains two orbitals [38]. bond. In the following section, the mechanism of such bindings at the

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Fig. 14. Optical micrographs of cross section of SPS sintered pellets for a) Al, b) Al – 0.5 wt% GNP, c) Al – 1 wt% GNP, d) Al – 3 wt% GNP and e) Al – 5 wt% GNP [56].

Fig. 15. Yield strength and Young’s modulus of GNP/Cu composites as a


function of GNP volume fraction [66]. Increasing from 8 vol% GNP to 12 vol% Fig. 16. Raman spectra of pristine GNPs, Cu–GNP powder, and sintered com-
GNP caused significant reduction in yield strength from 114% to 46% due to posites. The increase in defect (ID/IG) on milling of Cu–GNP powder as com-
agglomeration of GNP in the Cu matrix [66]. pared to pristine GNP, while sintering showed no significant change [66].

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Fig. 17. Optical micrographs of a) pure Mg, b) Mg–1Cu–0.18GNPs, c) Mg–1Cu–0.36GNPs and d) Mg–1Cu–0.54GNP composites [75]. The grain size reduces with the
increase in the GNP contents [75].

interface discussed. discrepancy, a charge transfer (self-compensation mechanism) occurs at


the interface from metal to graphene or vice versa depending on the
relative shift of WFs [48]. When charge transfer happens, the gra-
3.2. Mechanism of interfacial bonding phene’s energy-levels (Fermi levels) shifts up (n-doped graphene) or
shift down (p-doped graphene) with respect to conical points [48]
In recent years, there have been intensive studies on the sorption of (Fig. 9).
transition metals on graphene based materials [41]. These types of For chemisorption interface between graphene and metal, orbital
graphene hybrids can have device applications in microelectronic de- hybridization has the major role in band gap opening of graphene along
vices for catalysis or energy storage [41]. with contributions from Pauli exclusion interactions [48]. Due to Pauli-
The graphene and metal can form a physisorption interface with exclusion interaction at interfacial distance the energy-levels of gra-
mechanism of charge transfer [42–44] or a chemisorption interface phene shift down further relative to that of metals [48]. The -electron
through orbital hybridization [43–47]. In the work by Gong et al. [48], states of graphene starts to overlap with d-electron states of metal
ab initio method was undertaken to provide the fundamentals of elec- leading to the hybridization interaction [48]. Thus, a strong hy-
tronic properties at such interfaces. In the physisorption (weak inter- bridization of metal’s d-orbital and graphene’s π-orbital perturbs gra-
action) interface, the graphene’s -band structure with linear band phene’s electronic structure in chemisorbed graphene, and as a result of
crossing at Dirac point (K and K’) is maintained, but the Fermi level this chemical interaction at chemisorption interfaces the electronic
moves corresponding to the Dirac point [48]. For the weak physisorp- structure is much more complicated [48].
tion interfaces, the primary effect is due to Pauli exclusion interaction Thus, the strong hybridization of graphene and metal’s orbitals at
between graphene -electrons and the metal s-electrons [48]. The Pauli the interface will cause the strong covalent chemical bonding where the
exclusion will be induced by approaching the metal surface atoms to mixing of those orbitals is absent for the weak physical bonding as
graphene. So the metal’s s-electrons in the outermost occupied shell will discussed earlier. The strong interfacial bonding at the interface is
overlap with graphene’s -electrons [48].This repulsive interaction highly desirable to fabricate metal matrix composites reinforced with
pushes the electron density back into both metal’s and graphene’s graphene. The strength of physical and chemical interfacial bonding is
subsurface away from the interface [48]. The change in the relative discussed in the following section, along with the importance of
shift down of graphene’s energy-levels is negligible, and so the work strength on the mechanical properties.
function (WF) decrease in graphene is negligible [48]. This is due to the
fact that graphene is a surface-like material without accumulation of a
large number of electrons, and also redistribution of π-electrons needs 3.3. Strength of interfacial bonding
hybridization with s-electrons which is not energetically favourable
[48]. On the contrary, redistribution of the electron density at the metal As mentioned above, the most widely used approach to study gra-
surface occurs through rehybridization of the surface electronic orbitals phene/metal interface strength is based on theoretical approach ap-
resulting in a larger WF decrease [48]. Therefore, there is a new “dis- plying the first-principles density functional theory (DFT) calculations
crepancy” between metal-graphene complex’s Fermi level and gra- [42,48–51]. In order to measure the strength of interaction between
phene’s charge neutrality level (Dirac point) [48]. To reduce this graphene and metallic surfaces, the bonding energy per carbon atom,

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Fig. 18. SEM images for (a) pure Mg showing large grains with very clear grain boundaries; (b–d) Mg–1Cu–0.36 GNPs, showing presence of the second phase due to
limited solubility of Cu in Mg, which prevented grain growth [75].

the state of the Dirac cone or the doping level (defined by the position by the composite creates an interfacial shear stress, and the stronger
of the Fermi level with respect to the Dirac point) can be used [48–51]. interfacial bonding can facilitate better stress transfer from metal ma-
Considering DFT calculations for weakly physisorbed interfaces be- trix to the graphene upon approaching the interface [56,60]. This can
tween graphene and metals such as Al, Ag, Cu, Cd, Ir, Pt, and Au, ad- prevent graphene from being broken or pulled out [56,60]. The in-
sorption energies are around 0.03–0.05 eV per carbon atom, with creased yield strength calculated from shear lag model is expressed in
equilibrium interfacial distances > 3.0 Å [42,48–51]. In contrast, for the following equation;
chemisorption interfaces (strong interaction) between graphene and
metals formed including Ni, Co, Ru, Pd, and Ti, adsorption energies are S
SL = m + fv m
larger at around 0.09–0.4 eV per carbon atom, with smaller equilibrium 2 (6)
interfacial distances < 2.5 Å [42,48–51]. The values reported by
[42,48–51] are in agreement with previous calculations and experi- where SL , fv , m , , and S are yield strength of composite, volume
fraction of GNP, yield strength of matrix, and aspect ratio of GNP, re-
mental data [46,52–55]. Comparing calculated values of energies,
chemical bonding at the interface is much stronger than physical spectively. However, reinforcing efficiency is proportional to interface
strength and the size of graphene nano-platelets play a role on the
bonding as expected.
Considering the importance of interfacial strength on mechanical strength of the composite. In addition to the strong interfacial bonding,
it is well established that uniform distribution of graphene in the me-
properties, it is the key parameter in facilitating the stress transfer from
the metallic matrix to the reinforcement (load transfer) in metal-gra- tallic matrix also plays a key role in improving the mechanical prop-
erties of composites. However, it is quite difficult to achieve uniform
phene nano-composites [56,57]. The effect of interfacial bonding can
be explained by shear lag model that explains the load transfer in dispersion of GNPs in a metal matrix with strong interfacial bonding
due to their high specific area and van der Waals interaction between
metals reinforced with graphene [58,59]. The tensile stress experienced
graphene nanosheets [1,22].

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Fig. 19. TEM images, SAD pattern and EDS spectrum for Mg–1Cu–0.36 GNPs composite displaying formation of Mg2Cu intermetallic phase [75].

spark plasma sintering [56] or performed conventionally in controlled


environment furnaces or in microwave ovens.
In various PM processes, the only step to produce uniform disper-
sion is the initial powders mixing stage, and so the next steps of com-
paction, sintering and other processes do not generate homogeneous
dispersion [1]. Thus, the initial powder mixing has great impact on the
final performance of the MMCs. The reason is that well-distributed
graphene leads to strengthening the composite through grain refine-
ment (pinning effect). The uniformly distributed GNPs on grain
boundaries and inside of grains lead to pinning the grains boundaries by
GNPs and restricting grain growth during sintering [19,56]. Thus,
uniform mechanical behaviour throughout the structure obtains by
homogeneous grain size dispersion in the composite structure [56]. The
following well-known Hall-Petch relationship presented in equation
(10) explains the strengthening achieved by grain refinement [61].

ky
y = 0 +
Fig 20. Comparison between experimental values and theoretical calculations d (7)
of Young’s modulus from equation Halpin–Tsai equation for GNP/Cu compo-
where, d is the mean grain size, y is the yield strength (YS), and 0 and
sites as a function of GNP volume fraction (Eq. (1) and (2) are in ref. 73) [66].
k y are constants specific for a material. For example, the yield strength
of GNP/Cu with respect to pure Cu increased by 114%. This was
4. Graphene dispersion achieved by a 60% reduction in the grain size of Cu (Fig. 10) through
addition of 8 vol.% GNP [66].
As mentioned before graphene dispersion plays an important role in Nevertheless, uniform incorporation of GNPs into metal matrix has
fabrication and integrity of advanced graphene reinforced nano-com- remained a difficult task. One reason is attributed to the agglomeration
posites. The dispersion however can only be expressed in the context of or clustering of GNPs in the metal matrix due to their large surface area.
the fabrication route. To reduce surface energy, clustering of GNPs occurs upon the process of
To date, the conventional process of powder metallurgy (PM) ex- mixing in a metal matrix [1]. Another reason for such tendency of ag-
hibited important role in fabrication graphene reinforcing metal matrix glomeration is the presence of van der Waals forces which is 2 eV/nm2
composites. The initial stage of PM is grinding and blending graphene between graphene sheets [1,22]. The final obstacle of uniform dis-
reinforcing component with metal powders via milling processes either tribution is because of partial remelting during sintering (liquid phase
in wet [61] or dry [62] conditions. It is then followed by consolidation sintering). This may result in altering the uniform distribution of GNPs
and sintering processes as combined or separated steps such as hot obtained during powder mixing due to; a) poor wetting of carbonaceous
extrusion [61,63], hot isostatic pressing [61,63], hot rolling [64,65], materials with most metallic melts (large contact angles > 90°) [1]

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Table 2
Recent novel methods to improve dispersion and interfacial bonding between GNPs and metal matrix.
Composition Dispersion and Fabrication Process Mechanical Properties References

Cu–4.7 vol-% RGO Hummers method to oxidize graphite to GO Improvement in tensile strength 107% and 90
Electroless Cu plating to decorate GO with CuPowders reduced at 400 °C Young’s modulus 21%.
for 5 h in a H2 atmosphere
Spark plasma sintering.
Cu–0.8 vol-% RGO-Ni Hummers method to oxidize graphite to GO Improvement in UTS by 42% with 0.8 vol-% 89
Electroless Ni plating to decorate RGO with Ni RGO-Ni.
Mixing RGO-Ni powder with Cu under sonication for 1 h
Spark plasma sintering.
Cu–xvol.-% RGO-Ni (x = 0.94,1.88) Hummers method to oxidize graphite to GO Improvement in yield strength by 94% and 91
In situ chemical reduction method to decorate RGO with Ni Young’s modulus by 61% with 1.88 vol-%
Mixing RGO-Ni with Cu powder under sonication for 3 h RGO-Ni.
Spark plasma sintering.
Cu–0.5 vol-% GNP-Ni Electroless Cu plating to decorate GNP with Ni Improvement in yield strength by 64.5% 94
Cu–0.5 vol-% GNP-Cu Electroless Ni plating to decorate GNP with Cu with 0.5 vol-% GNP-Ni
Mixing GNP-Ni and GNP-Cu powders with Cu powder with mechanical Improvement in yield strength by 49.1%
stirring for 2 h with 0.5 vol-% GNP-Cu.
Spark plasma sintering.
xvol%Mo2C-RGO/Cu (x = 1) Thermal annealing to produce Mo2C-RGO Improvement of yield strength by 127% 93
Mixing Cu and Mo2C-RGO powders with low-energy ball milling
Spark plasma sintering.
Al–xvol.-% RGO-Cu (x = 3,5) Hummers method to oxidize graphite to GO Improvement in tensile strength by 77.5% 92
Molecular level mixing to decorate RGO-Cu and hardness by 29.1% with 3 vol-% GNP-
Clad rolling at 500 °C. Cu.
6061Al–xvol.-% GNP-Ni(x = 0.5,0.7,1.0) in situ chemical vapour deposition to decorate graphene with Ni Improvement in yield strength 75% and 60
nanoparticles ball milling for 90 min to mix GNP-Ni and 6061 Al powders tensile strength 30% with 0.7 vol-% GNP-Ni.
hot pressing at 580 °C and 45 MPa for 1 h.

and/or b) segregation of molten phase due to capillary effect of the (Fig. 12) [67]. However, there is no explanation on how amorphous
powder preform. structure forms as a result of breaking the graphene particles. It is be-
The ultimate goal of fabrication is to uniformly incorporate GNPs – lieved this is mainly due to reduction of graphene sheets size and there
achieving greater reinforcing efficiency, ultrahigh reinforcement are no changes in the crystallinity of graphene. Besides that, the for-
strength- within different metal matrices to improve the mechanical mation of Al3C4 as a hard phase (observed by XRD results) could con-
properties of composites for potential engineering applications. tribute to increasing the composite hardness. This can be a consequence
Graphene nanoplatelets have been incorporated as reinforcement by of composite process and higher sintering temperature [63,67]. Al-
PM in different metal matrices such as Al, Cu, and Mg to enhance their though it has been suggested that the increase of milling time effec-
mechanical properties. The performance of these composites as well as tively reduced the size of graphene sheets, promoting defects and da-
fabrication process have been summarised in Table 1 by evaluation of mages to the surface of graphene is the drawback of longer milling
their mechanical properties in terms of hardness, compressive strength, times.
Young’s modulus, failure strain, flexural strength (a measure of mate- From Table 1, the highest improvement of yield strength (84.5%)
rial’s resistance to deformation under bending moment), yield strength, and tensile strength (54.8%) of Al-GNP composites obtained by SPS
and tensile strength/ultimate tensile strength. route [56]. One reason can be explained by applying ultrasonication
As can be seen from Table 1 a large number of experiments focused technique instead of ball milling for dispersion of powders. Although
on the incorporation of graphene into metal matrices using PM ap- ball milling has been an effective approach to reduce the problem of
proach, and it is not possible to discuss them all in details. For this agglomeration in metal matrices, milling conditions may cause struc-
reason and taking into account that the ultimate goal is enhancement of tural defects, and loss of structural integrity [62,66,68–70]. These de-
the mechanical properties of the final composite, the methods with the fects can trigger carbide formation during subsequent fabrication steps
highest improvement of mechanical properties among each metal ma- which may be in favour or unfavourably affect the final nanocomposite
trix will be discussed critically. In this regard, advantages and drawback properties [56]. In the study by Bisht et al. [56] GNPs dispersed uni-
of such methods will be highlighted. Considering Al/GNPs from formly in aluminum matrix by ultrasonication, and without damages on
Table 1, the highest improvement of 138% in hardness over pure Al GNP surfaces. The second reason for enhanced mechanical properties of
achieved with addition of 1.0 vol-% GNP to Al matrix and 5 h milling Al/GNPs composite can be attributed to the consolidation process i.e.
time followed with 2 h sintering time [67]. Increment in hardness of the SPS [56]. The advantages of this technique over conventional hot
Al/GNPs composite was due to proper dispersion, good mechanical pressing is applying relatively lower temperature and shorter sintering
bonding, and formation of Al3C4 [67]. It was also reported that the time for densification and heating [71–73]. SPS induces greater density
milling time plays an important role in hardness of the composite [67]. solely due to its mode of heating and joining the powder particles (still
As indicated by the Raman spectra of the composite (Fig. 11), the in- not fully understood as how the plasma works in powder preforms), the
tensity of the peaks is reduced with increase of milling time – indication shorter heating time and lower temperatures countering any possible
of particle size reduction [67]. The Scanning electron microscopy grain growth during sintering [73]. SEM images (Fig. 13) confirmed no
(SEM) micrographs in Fig. 12 confirm the Raman results where more sign of damages on GNP surfaces during high power sonication and SPS
uniform and smaller particles are resulted after 5 h milling. It was re- process [56].
ported by the authors that reduction in Raman intensity was attributed Finally, the strength of composite was dependant on the percentage
to amorphization (disorder) of GNPs as a function of milling time of GNPs where the highest yield strength and tensile strength obtained

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H. Ghodrati and R. Ghomashchi FlatChem 16 (2019) 100113

highest increase of yield strength by 114% and Young’s modulus by


37% over pure Cu [66]. This is attributed to the uniform distribution of
GNPs and grain refinement [66]. In this study, there was no detectable
amount of carbide formation based on XRD results. Similar to Al-GNP
composites, GNPs tend to agglomerate at higher concentrations ( 8 vol-
% GNP) [66]. Thus, such yield strength and Young’s modulus obtained
with GNP contents less than 8 vol-% GNP (Fig. 15) [66]. However,
according to Raman spectra in Fig. 16, the ID/IG ratio of milled GNPs
increased comparing to the pristine GNPs [66]. The increase of ID/IG
ratio is indicative of promoting defects in GNPs arising from the re-
peated deformation, cold welding and fracturing actions of the ball
milling process [66,74]. This may lead to some damage of the surfaces
and edges of the GNPs and reduction of the mechanical properties of
final composite [66].
As for Mg/GNP composites obtained by PM route (Table 1), the
highest improvement in hardness (∼42%), elastic modulus (89%),
yield strength (117%), ultimate tensile strength (58%), and failure
strain (96%) achieved with 0.54 vol-% GNP over monolithic Mg [75].
Due to heat production during ball milling, Mg powder may be burnt
easily. Thus, Rashad et al. [75], mixed powders in a solvent by me-
chanical agitator instead of ball milling. Besides that, mechanical
properties of Mg in this experiment improved with hybrid Cu–GNPs
reinforcement [75]. As can be seen from optical micrographs in Fig. 17,
the grain size reduced with increase of the GNPs content. It was con-
firmed by microstructural analysis in Fig. 18 that presence of the second
phase (Mg2Cu intermetallic phase) observed due to limited solubility of
Cu in Mg [75]. The intermetallic phases precipitated during sintering
process pinned down the grain boundaries and inhibited grain growth
[75]. Also, the SEM images in Fig. 18 confirm the GNPs are well em-
bedded within the Mg matrix ensuring the absence of defects [75]. The
good interfacial bonding between Cu-GNP reinforcement and Mg was
confirmed by TEM images in Fig. 19. As can be seen, the intermetallic
phase of Mg2Cu is well-bonded with the Mg matrix ensuring efficient
load transfer [75] in confirmation with previous reports [76,77]. Si-
Fig. 21. Schematic representation for synthesis of GNPs-Ni reinforcement phase milar to Al/Gr interface, Mg may form weakly physisorbed interface,
via in situ chemical reduction and GNPs-Ni/Cu composite; a) flake graphite, b) and in order to improve interfacial bonding and so as dispersion, gra-
Hummer’s method to produce Graphene Oxide (GO) nano sheets, c) Addition of phene can be decorated with strongly chemisorbed metallic particles
NiSO4·6H2O into GO suspension to synthesize GO nanosheets-Ni2+, d) GNPs-Ni
(i.e. Ni, Co, and Ti) before mixing with Mg. Such novel methods have
reinforcement phase by reduction of GO nanosheets-Ni2+ with N2H4·H2O, e and
been discussed in the next section.
f) mixing GNPs-Ni and Cu powders by ultrasonication technique (wet mixing),
g) bulk GNPs–Ni/Cu composites consolidated by SPS [91]. As discussed milling time [62,67,69,78], GNP concentration
[56,61,64,66,67,69,75,77,79,80], and sintering conditions [67] are
critical to mechanical properties of the composites reinforced with
for 1% wt GNPs content [56]. As can be seen from Fig. 13, 3 and 5 wt% graphene nanosheets. In this regard, it has been shown that GNPs form
GNP led to agglomeration and non-uniform grain size distribution with clusters as a consequence of short milling time, or promote disordering
similar average grain size to the larger grains of Al [56]. A uniform and defects with further increase of milling time [62,67,69,78]. Hence,
grain size distribution and restricted grain growth achieved by GNPs up during ball milling the surface and edges of GNPs can be damaged
to 1% wt during sintering [56]. In addition to homogeneous grain size leading to decline of mechanical properties of the composite
distribution, the microstructure analysis of Al/Gr composite (Fig. 14) [67,69,70,76]. The defect formation during milling can promote for-
revealed clear interfaces devoid of carbide formation and impurities mation of carbides at higher sintering temperature as reported for
[56]. Therefore, well-distributed GNP in the Al matrix along with good carbon nano-tubes [81–85]. The defects are expected to increase dif-
interfacial bonding increased mechanical properties of the Al/GNP fusion rate, a pre-requisite for the formation of carbides in Al-C (Al4C3)
composite [56]. On the other hand, as discussed earlier, graphene and composites. Apart from milling effect, uniform dispersion of GNPs be-
Al form a weak physisorption interface, and thus the mechanical comes more difficult by increasing its concentration in the metal matrix
properties may not improve significantly. In order to increase inter- [65,66,86,87]. The increased amount of GNP cause agglomeration, and
facial bonding and so as the mechanical properties, graphene can be degrading the strength of composites [65–67,69,86,87]. As for sintering
coated by metals such as Ni, Co, and Ti prior to mixing with Al matrix. conditions, higher sintering temperatures result in higher diffusion
As such chemisorption interfaces form stronger bonding than physi- rates which may cause better consolidation and interfacial bonding
sorption ones, and this might be a promising strategy of strongly between GNP and matrix. On the other hand, it may lead to the for-
bonded interfaces. The novel approaches in regards to coating graphene mation of brittle carbide at the interface, and decreasing hardness and
with metallic particles will be discussed later. strength of the composite [63]. Thus, to achieve a high performance
For Cu/GNPs composites reported in Table 1, homogeneous dis- composite, it is extremely important to uniformly distribute graphene in
persion of 8 vol% GNP content within the Cu matrix resulted in the the metal matrix having clean and strong interface, without

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Fig. 22. SEM images of a)Cu and b)1.0 vol%


GNPs–Ni/Cu composites showing the GNPs (white
phase) are uniformly dispersed in the matrix (grey
phase) without agglomeration, and fracture surfaces
of c) Cu and d) 1.0 vol% GNPs–Ni/Cu composites
showing GNPs are tightly embedded in the Cu matrix
(marked by arrows) [91].

agglomeration and defect sites. Despite improvement in mechanical deposition on the surface of the RGO or pristine GNPs occurred by
properties of composites through powder metallurgy, it is still re- electroless plating [89,90,94], in situ chemical reduction [91], mole-
markably lower than predicted values for GNPs having tensile strength cular level mixing [92], thermal annealing [93], and chemical vapour
of ∼125 GPa and elastic modulus of ∼1.0 TPa [66]. As such, there has deposition [60]. In such studies listed in Table 2, mechanical properties
been a comparison between experimental and theoretical calculations enhanced due to well dispersed and strongly bonded GNPs with the
of Young’s moduli for GNP/Cu (Fig. 20). As can be seen from Fig. 20, metal matrix [60,89–94]. The uniform distribution of GNPs in the
there is a gap between predicted and experimental results. This suggests matrix achieved through the attached nanoparticles on the surface and
optimization of processing, improving distribution of GNP in metal embedded between neighbouring graphene nanosheets which acted as
matrix, and enhancing interfacial bonding at the interface are essential spacers to restrict graphene from agglomeration [60,89–94]. Also, a
[66]. stronger interfacial bonding at the interface achieved through chemi-
Overall, uniform dispersion of graphene reinforcement in the metal sorbed metallic particles. In addition to either phsysisorbed or chemi-
matrix is necessary, and conventional processing methods have not sorbed metallic particles, strong covalent interaction between oxygen
been able to effectively incorporate graphene into metal matrix [88]. mediated graphene and Cu or Ni at the interface facilitated better
This difficulty is associated with high specific area and van der Waals bonding and thus effective stress transfer from metal matrix to the re-
interactions between graphene sheets which promote agglomeration inforcement [60,89–94].
[88]. In addition to clusters, relatively high processing temperature Considering Cu matrix in Table 2, metallic particles of Ni and Cu
techniques (general sintering and melting process) are not applicable have been used to coat RGO by electroless plating [89,90] and in situ
because graphene is easily decomposed and damaged or bulk amount of chemical reduction [91]. Moreover, in-situ growth of Mo2C nano-
unfavourable interfacial reaction product might form during sintering particles on RGO through thermal annealing applied to produce Mo2C@
(e.g. Al4C3) [88]. Therefore new approaches are required to improve RGO/Cu composite where yield strength increased largely by 127%
uniform dispersion of graphene into metal matrix as well as enhancing comparing to pure Cu [93]. Likewise, in situ chemical reduction ap-
interfacial bonding. proach has shown significantly improved Young’s modulus by 61% and
yield strength by 94% through addition of only 1.0 vol% GNSs (1.88 vol
5. Novel methods % GNSs-Ni) [91]. The advantage of this approach is its simplicity and
using less chemicals comparing to electroless plating method. A sche-
5.1. Coating graphene matic representation of this approach has been demonstrated in Fig. 21.
SEM images in Fig. 22, revealed homogeneous distribution of GNPs in
Recently, there has been interest in coating graphene reinforcement the Cu matrix due to decoration of the GNPs with Ni nanoparticles.
with metallic nanoparticles prior to consolidation. This alternative ap- Besides that, good interfacial bonding without pores and cracks ob-
proach provides uniform dispersion and efficient graphene-metal in- served in the fracture surface of the composite (Fig. 22(d)).
terfacial bonding by increasing the adhesion contact points on the Regarding the surface treatment of reduced graphene oxide by
surface of graphene [89]. In this concept, decoration or coating the electroless plating and in situ chemical reduction methods, the strong
surface of either reduced graphene oxide (RGO) [89–93] or pristine interfacial bonding between the GNPs and Cu matrix occurred due to
GNPs [60,94] has been obtained by metallic nanoparticles. This the oxygen-mediated bonding [89–91]. For instance, the presence of

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Fig. 23. a) TEM image of the GNP/Cu composites, and corresponding EDS analysis for the element distribution at b) region A (interface), c) region B (Cu), d) C
(GNPs); e) schematic representation of oxygen mediated bonding at the interface of the GNP and the Cu matrix [90].

such bonding has been confirmed in Fig. 23 through TEM images and much as previous methods (Table 1), new approaches benefit from
corresponding EDS analysis [90]. As can be seen from Fig. 23, the GNP/ overcoming problems of structural defects and damages during redu-
Cu interface (region A) has highly concentrated oxygen element as cing graphene oxide and ball milling.
compared to the Cu matrix (region B) and GNP (region C) [90]. On the Furthermore, new methods including molecular level mixing [92]
other hand, there are some disadvantages of using reduced graphene and in situ chemical vapour deposition (CVD) [60] have been used to
oxide as reinforcement phase. Production of RGO not only consumes anchor the surface of graphene nanosheets with metallic nanoparticles
large amount of chemicals but also introduces structural defects as a prior to mixing with Al matrix. Decoration of GNPs with metallic par-
consequence of reducing graphene oxide (GO) [93]. The structural ticles resulted in uniform dispersion by preventing clustering of GNPs
defects of RGO and GO degrade the strengthening efficiency of gra- and also strong interfacial bonding through forming intermetallic
phene [60]. Therefore, coating pristine graphene can be an alternative compounds at the interface [60,92]. Thus, synergistic effect of disper-
approach in terms of cost-effectiveness and preservation of structural sion strengthening and better stress transfer led to improvement in
strength of GNPs. In this regard, electroless Cu and Ni plating applied to tensile strength and hardness by 77.5% and 29.1%, respectively, which
deposit these metallic nanoparticles on the surface of GNPs before obtained by molecular level mixing [92]. As for CVD method, the same
consolidation process [93]. The yield strength of the GNP/Cu compo- mechanisms increased tensile strength by 30% and yield strength by
sites improved by 64.5% with addition of 0.5 vol-% GNP-Ni and 49.1% 75% [60]. As mentioned above, reducing graphene oxide and ball
with 0.5 vol-% GNP-Cu [93]. Although these improvements are not as milling cause defects and damages to the surface of GNPs. This might be

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Fig. 24. Schematic representation of producing GNS/Cu composite [97].

Fig. 25. SEM images of the fracture surface of composite GNS/Cu prepared by SPS. GNP contents with a) 10 vol% b) 20 vol% and c) and d) 30 vol% [97].

two main reasons that mechanical properties of composites have not systematic study. Finally, sintering conditions including time, tem-
significantly improved through these methods [60,92]. perature, and pressure should be studied to reach the ultimate goal of
Decoration of graphene nanosheets with metallic nanoparticles is at well distributed graphene and increased interfacial bonding.
its early stage of development and there still remain rooms for im-
provement. Damage of GNPs during milling time is inevitable and thus
5.2. Vacuum filtration
alternative methods should be developed to efficiently eliminate ball
milling from fabrication process of composite. For instance, functio-
Vacuum filtration applied to overcome the difficulties of dispersion
nalizing Al matrix with Cu nanoparticles prior to consolidation sig-
in graphene-reinforced metals by [96–98]. As demonstrated in Fig. 24,
nificantly improved tensile strength by ∼200% compared to un-
two steps of vacuum filtration and spark plasma sintering (SPS) em-
reinforced Al [95]. This was achieved by in situ CVD [95]. Furthermore,
ployed to fabricate well-aligned graphene in the GNS/Cu composite
the optimal concentration of metallic nanoparticles decorating gra-
[98].
phene nanosheets, as well as GNPs can be obtained through a
The novelty of this approach is that graphene is not randomly

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Fig. 26. a) Tensile stress–strain curves for different content of GNPs, and b) tensile strength (σb) and elongation (δ) for pure Cu and different amount of graphene in
GNP/Cu composite with the load parallel and perpendicular to the alignment direction [98].

Fig. 27. a) TEM image of the interface for RGO/CuCr composite, b) HAADF-STEM image (high angle annular dark field -scanning transmission electron microscopy)
at the interface, and c) corresponding analysis of the CuCr-RGO interface. The presence of Cr at the interface is clear from the Cr signal, which intensified in the
interface region due to carbide formation [100].

distributed in the composite in contrast to the previous studies. For composite obtained regardless of the content of graphene. In conven-
instance, it is clear from Fig. 25 that GNSs are almost aligned hor- tional methods, the concentration of graphene in the metal matrix
izontally and the GNSs contents have no effect on the orientation [97]. cannot increase due to the formation of agglomeration. Therefore, va-
However, the incorporation of well-aligned GNPs resulted in aniso- cuum filtration paves the way to fabricate graphene-reinforced metal
tropic mechanical properties [98]. The anisotropic mechanical prop- matrices with higher content of graphene and with lower risk of ag-
erties of the composite investigated along the in-plane and through glomeration.
plane directions [98]. Although the tensile strength moderately in-
creased with in-plane direction (26% at 10 vol% GNPs), they were 5.3. Matrix-alloying
considerably higher than those of through plane [98]. Likewise, the
elongation along the in-plane direction was significantly higher than In this novel approach the interface of RGO (reduced graphene
that of the through-plane (Fig. 26). oxide)/metal matrix optimized by in-situ formation of Ti carbide
The advantage of this method is that highly aligned GNSs in the (Ti8C5) [99] and Cr carbide (Cr7C3) [100]. The composites generated

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Fig. 28. Schematic representation of plasma treatment to create defects on the surface of GO (P-GO) following by thermal reduction and SPS to fabricate P-RGO/Cu
composite [102].

via flake powder metallurgy and followed by SPS [99,100]. Considering enhance interfacial bonding [102,103]. This method as illustrated in
the weak interaction between Cu and graphene, the interfacial bonding Fig. 28 involves the plasma treatment to create limited number of de-
improved by the formation of such carbides. This interfacial design fects on the surface of GO [102]. The defective sites were ideal platform
resulted in considerable increase of the mechanical properties of final for the in situ formation of CuxOy during the sintering process of plasma
composites [99,100]. For instance, the tensile strength of RGO/CuTi treaded graphene (P-RGO/Cu) composite [102].
increased by 20.2% compared to the RGO/Cu [99]. Comparing the As illustrated in Fig. 29, the TEM images show a good interfacial
yield strength and tensile strength of CuTi alloy with those of RGO/ bonding between plasma treated graphene (P-RGO) and Cu matrix
CuTi composite, they enhanced considerably to 106.2% and 57.7%, without cracks and voids [102]. Furthermore, according to the HRTEM
respectively [99]. Similarly, the yield strength and ultimate tensile images in Fig. 29 CuO, Cu2O, and Cu4O3 coordinated at the interface
strength of RGO/CuCr composite increased significantly by 222% [102]. The coordinated CuxOy oxides at the interface, therefore, led to
(82%) and 28% (19%) than those of CuCr (RGO/Cu) [100]. This was the higher strength of composite compared to that of untreated GO
due to the dual role of Cr7C3 layers/nanoparticles at the interface (RGO/Cu) [102]. For example, the tensile strength and yield strength of
(Fig. 27) to improve the load transfer efficiency and promoting the 1 vol% P-RGO/Cu increased nearly 10% and 23% respectively com-
dislocation strengthening [100]. The advantage of this approach over pared to the 1 vol% RGO/Cu composite [102].
coating is that matrix-alloying is less complex and also does not require The defect engineering also used for the graphene/CuCr composite
harmful additives or solvents [99]. However, it is important to point out [103]. The treated graphene (P-GO) from plasma treatment reinforced
that the formation of hard and brittle phases at the interface is expected the matrix-alloy of CuCr [103]. Without such treatment, the Cr7C3
to affect the composites susceptibility to crack initiation at the interface carbide formed only at the edge of interface in RGO/CuCr composite.
and thus reducing the composite toughness. Plasma treatment led to the formation of carbide on the basal-plane as
well [103]. Therefore, yield strength of 1 vol% P-RGO/CuCr composite
increased 37% in comparison with the 1 vol% RGO/CuCr composite
5.4. Graphene defect engineering via plasma treatment [103]. Regarding the unreinforced alloy of CuCr, the yield strength
increased by 180% [103]. A schematic representation of defect sites
It is well known that the number of defects at edges of dangling and interface for both plasma treated and untreated GO displayed in
bonds is considerably higher than those of graphene basal-plane [101]. Fig. 30.
As we know, the basal-plane occupies larger interface area in the
composite comparing to the edges. Therefore, creating defects on the
surface of graphene by plasma treatment is a novel and efficient way to

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H. Ghodrati and R. Ghomashchi FlatChem 16 (2019) 100113

Fig. 29. Interface analysis of 1 vol% P-RGO/Cu composite. a) and b) TEM images of well-bonded interface without cracks and voids, c) HRTEM image of the selected
area in red square of b. c) HRTEM image of the selected area in red square of a and relevant Fast Fourier transform (FFT) pattern recorded in d1. e) HRTEM image of
composite interfacial area and related FFT patterns recorded in e1, e2, e3 and Inverse Fast Fourier transform (IFFT) image recorded in e4 with high dislocation density
[102].

Fig. 30. a) P-RGO/CuCr interface, and b) RGO/CuCr interface [103].

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H. Ghodrati and R. Ghomashchi FlatChem 16 (2019) 100113

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