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– Excellent Reliability –
● Excellent durability by using CsI:Tl screen direct vapor deposition method.
● The structure is highly reliable and protected from degradation due to the use of a unique
moisture-proof sealing method for the CsI:Tl screen
★ The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA ELECTRON TUBES & DEVICES CO., LTD. (TETD) for any infringements of patents or other rights of the
third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TETD or others.
★ The information contained herein may be changed without prior notice. It is therefore advisable to contact TETD before proceeding with the design of
equipment incorporating this product.
No.TE-FDX3543RP 2012-08-16
FDX3543RP
Interface Box:
Input........................................................................................................... AC100 to 240V, 50/60Hz
Output .................................................................................................................. DC15V 2.6A 30VA
Overall Dimensions................................................................ 115×185×85mm (W(H)×D(V)×(H))
Weight ......................................................................................................................... 1 kg (approx.)
Dimensional Outline:
Refer to pages 24 to 25.
Environmental:
Under delivery and stock
Temperature ............................................................................................................ -15 ~ 55 ℃
Humidity ........................................................................................ 10 ~ 90 %(Non-Condensing)
Pressure ................................................................................................................ 50 ~ 106 kPa
Under operating
Temperature ........................................................................................................... +10 ~ 35 ℃
Humidity ....................................................................................... 10 ~ 85 % (Non-Condensing)
Pressure ................................................................................................................ 70 ~ 106 kPa
ACCESSORIES
Cables:
AC Cable ............................................................................................................................ 1.8 m×1
GND Cable ............................................................................................................................ 3 m×1
CD:
CD(Defect map, SDK) ............................................................................................................. 1 pcs
OPTION ACCESSORIES
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FDX3543RP
MAIN CHARACTERISTICS
Image Format:
X-ray Conversion Layer ................... Cesium Iodide (Csl) with Amorphous Silicon (a-Si) Photodiode
Active Area ........................................................................................ 35(H)×43(V)cm (14×17 inch)
Pixel Matrix ........................................................................................................... 2448(H)×2984(V)
Pixel Pitch ............................................................................................................................ 143 μ m
Cycle Time ............................................................................................................. Shot to Shot 6sec
Performance:
Limiting Resolution .................................................................................................... 3.7 Lp/mm typ.
MTF (2.0 Lp/mm, 70 kVp, 1×1) ......................................................................................... 36 % typ.
DQE (DQE (0), Quantum - Limited) ........................................................................................ > 70 %
A/D Conversion......................................................................................................................... 16 bit
Ratings:
Energy Range ............................................................................................................... 40~150 kVp
Maximum Entrance Dose (low Gain)(Linear Output Range) ....................................... 4 mR / frame
Interface Box
Unit Interface ................................................................................................ Connect to Sensor Unit
Data Output ................................................................. 16 bit Digital Output Ethernet (1000BASE-T)
Command Control.......................................................................................... Ethernet (1000BASE-T)
X-ray Synchronization Control .............................................................................................. External
Power Input .............................................................................................. AC100 to 240V, 50/60 Hz
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FDX3543RP
Detector X-ray
Control Unit (User)
Control Board
X-ray Sync
Interface
DC15V
Box
Image Data
&Control
Ethernet
Gate Driver ROIC Unit
PC (User)
TFT Panel
NOTE:
Do not disconnect Ethernet connection while DC15V is operating and supplying to Sensor Unit.
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FDX3543RP
Sensor unit
Image Data
Digital Unit Panel Unit
Generator
Image Data
Communication Availability:
Ethernet Command Control D-Sub Signal Control
Signal Name Type
(PC) (X-ray Controller)
EXP_REQ INPUT OK OK
EXP_OK OUTPUT N.A OK
*EXP_REQ Command Response
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FDX3543RP
①
A
EXP_RE <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STRAGE Data
FPI ENABLED
A: EXP_REQ width
Minimum 1ms
B: Refresh period
For line drive (2984 Line scan), 80 ms
C: EXP period
Set value: see the Image acquisition mode table (500 to 2000 ms (by 500 ms step),
standard 500 ms).
D: Read period
For line drive (2984 Line Scan) 240 ms
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FDX3543RP
B C D C D
①
A
EXP_RE <IN>
C C
EXP_OK <OUT>
EXPOSURE
FPI ENABLED
A: EXP_REQ width
Minimum 1ms
B: Refresh period
For line drive (2984 Line scan) 80 ms
C: EXP period
Set value: see the Image Acquisition mode table (500 to 2000 ms (by 500 ms step),
standard 500 ms).
D: Read period
For line drive (2984 Line Scan) 240 ms
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FDX3543RP
EXP_RE <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STRAGE Data
FPI ENABLED
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FDX3543RP
EXP_RE <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STRAGE
FPI ENABLED
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FDX3543RP
1. Pins assign
Pin No Signal name I/O Contents
1 NC -
Not connected
Image acquisition (X-ray exposure)
2 EXP_REQ+ Input
Request signal +
Image acquisition (X-ray exposure)
3 0_TEXP_OK+ Output
Period signal +
4 0_EXP_OK+ (OC) Output Open Collector +
5 NC - Not connected
6 NC - Not connected
Image acquisition (X-ray exposure)
7 EXP_REQ- Input
Request signal -
Image acquisition (X-ray exposure)
8 0_TEXP_OK- Output
Period signal -
9 0_EXP_OK- (OC) Output Open Collector-
*1 Please put the protective resistance more than 1.4 kΩ in the series.
*2 Maximum sink current is 20 mA.
6 9
1 5
2-M2.6×0.45
2- №4-40UNC
3. Input Circuit
Pin 2
Pin 7
D-Sub 9 Pin
Connector
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FDX3543RP
4. Output Circuit
4.1 5V CMOS Level Type
FPI Side User System Side
5V
Pin 3
Pin 8
D-Sub 9 Pin
Connector
Protective
22Ω resistance
Pin 4
D-Sub 9 Pin
Connector
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FDX3543RP
IEC61000-3-2
Voltage fluctuations/ Not applicable
flicker emissions
IEC61000-3-3
Note The FPI is not allowed to use the cables or components differ from the
originally attached.
If the different cables or components are used, they may deteriorate the
performance of electromagnetic emissions.
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FDX3543RP
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FDX3543RP
Note:
(1) At 80 MHz and 800 MHz, the higher frequency range applies.
(2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by
absorption and reflection from structures, object and people.
(3) This FPI can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
electromagnetic immunity.
a
Field strengths from fixed transmitters, such as base stations for radio (cellular/cordless)
telephones and land mobile radios. Amateur radio, AM and FM radio broadcast and TV
broadcast cannot be predicted theoretically with accuracy. To assess the electromagnetic
environment due to fixed RF transmitters, an electromagnetic site survey should be considered. If
the measured field strength in the location in which the FPI is used exceeds the applicable RF
compliance level above, the FPI should be observed to verify normal operation. If abnormal
performance is observed, additional measures may be necessary, such as reorienting or
relocating the FPI.
b
Over the frequency range 150 kHz to 80 MHz, field strengths should be less than 3V/m.
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FDX3543RP
Note:
(1) At 80MHz and 800MHz, the separation distance for the higher frequency range applies.
(2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by
absorption by absorption and reflection from structures objects and people.
(3) The FPI can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
recommended separation distance between portable and mobile RF communications
equipment and this system.
CAUTION
CAUTION
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FDX3543RP
INSTALLATION
For installing the FPI in the apparatus, refer to the dimensional outlines.
2. It is necessary to clean both surface of FPI and the base plate of the apparatus before FPI is
installed.
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FDX3543RP
(1) Environment
- The environmental conditions for operation must be adequate.
(2) Appearance
- Wiring and appearance must be free from any abnormality.
(3) Operation
- The sensor unit must operate normally after power on.
(4) Others
- Any abnormalities such as unusual sound and strange odor are not permissible.
(1) Appearance
- The sensor unit must be free from errors in appearance.
- The outer mounting screws must be free from looseness and slip-off.
- The mounting screws to the equipment must be free from abnormalities such as looseness.
- Each cable must be free from cracks and damages.
- Each cable must be securely connected. Any looseness is not permissible.
(3) Cleaning
- Cleaning of the outer surface
(4) Functionality
- The sensor unit must operate normally under control.
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FDX3543RP
Find this document before using X-Ray FLAT PANEL IMAGER (FPI)
This document describes the attention of equipment manufactures and users to use safety X-Ray
FLAT PANEL IMAGER (hereafter called FPI). Please find the technical data sheet of each product and
this document “SAFETY PRECAUTIONS AND WARNING” and understand these contents before
using FPI. The FPI is used under X-ray exposures. Therefore engineers or service people who have
sufficient technical knowledge and experience shall handle the FPI with enough care. Moreover these
documents are always stored and can be seen in operating place. If you have any questions, please
contact our local sales representatives for further information.
The FPI present a certain number of potential risks by the very nature of the physical principles
included in their manufacture or operation and because of the materials used to make FPI. Therefore
equipment manufacturers and users shall take the responsibility by themselves to protect against
these risk and respect local safety laws and regulations.
1. Electric Shock
In operating, do not touch the lead wires and connectors of the X-Ray FLAT PANEL IMAGER
(FPI). If necessary to touch lead wires and connectors, please turn off the power supply and
confirm no residual voltage exist before connecting, disconnecting and handling them. The
housing of the FPI should always be connected to ground. All ground terminals and ground
wires shall be also done to ground.
2. Ground Connection
Connect all protective earth and cables of the FPI to ground. The housing with protective earth
should be connected to ground. The resistance between protective earth and ground cables
shall be less than 0.1 ohms. The sectional area of the conductor is required for 0.75mm2 or
more.
5. Processing of Housing
Do not process FPI housing because it leads to weakness of housing strength and the cause of
malfunctions.
6. Screws of Housing
As the screws of FPI housing are tightened by proper torque, do not loosen or remove them.
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FDX3543RP
7. Handling
Do not hold the FPI connector and sensor unite cable when lifting and/or moving the FPI.
Please be careful not to drop the FPI. If dropped, check appearance and do not use FPI if it
has abnormality.
9. Ingress of Liquid
Do not splash the FPI with any liquid. Occasionally that is a cause of damage.
Wipe of once when it get wet.
10. Cleaning
When cleaning the surface of FPI, please wipe the surface by the soft cloth soaked with water,
oxygenated water or dilution ethanol. Do not use other medicines.
11. Load
Please do not apply excessive load on the FPI.
Maximum load: 150 kg @In the whole
100 kg @φ40 mm of the center
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FDX3543RP
19. Condensation
Do not let FPI in condensation situation at any time. It may cause malfunctions of electronics
circuit and deterioration of images.
22. Adjustment
The FPI requires adjustment (ex. Gain and image processing calibrations) according to input
X-ray conditions. Be sure to start using the FPI with equipment after adjustment. In the case of
exchanging X-ray tube assembly or change of X-ray intensity distribution, adjustment of the FPI
is necessary.
23. Memory
A memory chip is mounted on this device. The memory contents may be cleared due to
electrical shock as ESD, Donot apply major stress such as ESD.
26. Cables
Users must use cables attached with the FPI.
Be sure to connect correctly and do not loosen cables.
The cable connector has a locking mechanism. Do not pull the cable, when pulling out the
connector.
27. Ethernet
Cross type Ethernet cable must be used. Also, do not connect Ethernet cable to common
networks, must be directly connected to PC.
Do not disconnect Ethernet connection while DC24V is operating and supplying to FPI.
Do not disconnect cable during operation. In the case of detecting network cable disconnection,
the system should have a protective function which manages not allowing exposures.
28. Fuses
Fuses (250V T4AL) are installed inside of Interface box.
Stop immediately using the FPI when fuse breaks.
29. Defects
It is natural due to characteristics of TFT that the FPI has defects. Please calibrates/corrects
defects upon usage of FPI. Defects can be corrected by using defect maps.
31. Maintenance
Maintenance should be carried out periodically according to the technical data sheet.
32. Shipment
FPI should be removed from equipment then put into polyethylene-type bag and pack in TETD
packing box to be protected. Keep FPI input plate faced upwards during shipment.
33. Scrap
Dispose the scrapped products according to the requirement of local regulation. If you have
any questions, please contact to our local sales representatives for further information.
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FDX3543RP
CAUTION LABEL
This label is a caution label to notify the user of the following point.
"These contents are quite important for safety"
Attachment position: Housing
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FDX3543RP
(3) MANUFACTURER
(7) WARNING,CAUTION
-23-
FDX3543RP
-24-
FDX3543RP
Unit: mm
-25-
FDX3543RP
EU REPRESENTATIVE
For Sales & Technical Services, please contact the following representative:
● Toshiba Electron Tubes & Devices Co., Ltd. meets the Environmental Management System Standard, ISO14001
● Toshiba Electron Tubes & Devices Co., Ltd. meets internationally recognized Standards for Quality Management System ISO9001, ISO13485.