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Features
GDDR5 SGRAM
EDW4032BABG – 8 Meg x 32 I/O x 16 banks, 16 Meg x 16 I/O x 16 banks
09005aef858b7e92
4gb_gddr5_sgram_brief.pdf - Rev. E 6/17 EN 1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
4Gb: x16, x32 GDDR5 SGRAM
Features
E D W 40 32 B A BG - 70 - F - D
Micron Memory Packing Media
D = Dry pack (tray)
Type R = Reel
D = Packaged device
Environment Code
Product Family F = Lead-free (RoHS-compliant)
W = GDDR5 SGRAM and halogen-free
Density/Bank Speed
40 = 4Gb/16-bank -60 = 6.0 Gb/s
-70 = 7.0 Gb/s
Organization -80 = 8.0 Gb/s
32 = x32
Package
Power Supply, Interface BG = 170-ball FBGA, 12mm x 14mm
B = VDD = 1.6V/1.55V/1.5V
Revision
Note: 1. This Micron GDDR5 SGRAM is available in different speed bins. The operating range and AC timings of a
faster speed bin are a superset of all slower speed bins. Therefore it is safe to use a faster bin device as a
drop-in replacement of a slower bin device when operated within the supply voltage and frequency range
of the slower bin device.
09005aef858b7e92
4gb_gddr5_sgram_brief.pdf - Rev. E 6/17 EN 2 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
4Gb: x16, x32 GDDR5 SGRAM
Ball Assignments and Descriptions
B VDDQ DQ3 VDDQ DQ2 VSS VSS DQ10 VDDQ DQ11 VDDQ
C VSSQ EDC0 VSSQ VSSQ VDD VDD VSSQ VSSQ EDC1 VSSQ
D VDDQ DBI0_n VDDQ WCK01_t WCK01_c VSS VDD VDDQ DBI1_n VDDQ
E VSSQ DQ5 VSSQ DQ4 VDDQ VDDQ DQ12 VSSQ DQ13 VSSQ
F VDDQ DQ7 VDDQ DQ6 VSSQ VSSQ DQ14 VDDQ DQ15 VDDQ
G VDD VDDQ RAS_n VDD VSS VSS VDD CS_n VDDQ VDD
H VSS VSSQ VDDQ A10, A0 A9, A1 BA3, A3 BA0, A2 VDDQ VSSQ VSS
K VSS VSSQ VDDQ A8, A7 A11, A6 BA1, A5 BA2, A4 VDDQ VSSQ VSS
L VDD VDDQ CAS_n VDD VSS VSS VDD WE_n VDDQ VDD
M VDDQ DQ31 VDDQ DQ30 VSSQ VSSQ DQ22 VDDQ DQ23 VDDQ
N VSSQ DQ29 VSSQ DQ28 VDDQ VDDQ DQ20 VSSQ DQ21 VSSQ
P VDDQ DBI3_n VDDQ WCK23_t WCK23_c VSS VDD VDDQ DBI2_n VDDQ
R VSSQ EDC3 VSSQ VSSQ VDD VDD VSSQ VSSQ EDC2 VSSQ
T VDDQ DQ27 VDDQ DQ26 VSS VSS DQ18 VDDQ DQ19 VDDQ
(Top view)
Note: 1. Balls shown with a heavy, solid outline are off in x16 mode.
09005aef858b7e92
4gb_gddr5_sgram_brief.pdf - Rev. E 6/17 EN 3 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
4Gb: x16, x32 GDDR5 SGRAM
Ball Assignments and Descriptions
B VDDQ DQ27 VDDQ DQ26 VSS VSS DQ18 VDDQ DQ19 VDDQ
C VSSQ EDC3 VSSQ VSSQ VDD VDD VSSQ VSSQ EDC2 VSSQ
D VDDQ DBI3_n VDDQ WCK23_t WCK23_c VSS VDD VDDQ DBI2_n VDDQ
E VSSQ DQ29 VSSQ DQ28 VDDQ VDDQ DQ20 VSSQ DQ21 VSSQ
F VDDQ DQ31 VDDQ DQ30 VSSQ VSSQ DQ22 VDDQ DQ23 VDDQ
G VDD VDDQ CAS_n VDD VSS VSS VDD WE_n VDDQ VDD
H VSS VSSQ VDDQ A8, A7 A11, A6 BA1, A5 BA2, A4 VDDQ VSSQ VSS
K VSS VSSQ VDDQ A10, A0 A9, A1 BA3, A3 BA0, A2 VDDQ VSSQ VSS
L VDD VDDQ RAS_n VDD VSS VSS VDD CS_n VDDQ VDD
M VDDQ DQ7 VDDQ DQ6 VSSQ VSSQ DQ14 VDDQ DQ15 VDDQ
N VSSQ DQ5 VSSQ DQ4 VDDQ VDDQ DQ12 VSSQ DQ13 VSSQ
P VDDQ DBI0_n VDDQ WCK01_t WCK01_c VSS VDD VDDQ DBI1_n VDDQ
R VSSQ EDC0 VSSQ VSSQ VDD VDD VSSQ VSSQ EDC1 VSSQ
T VDDQ DQ3 VDDQ DQ2 VSS VSS DQ10 VDDQ DQ11 VDDQ
(Top view)
Note: 1. Balls shown with a heavy, solid outline are off in x16 mode.
09005aef858b7e92
4gb_gddr5_sgram_brief.pdf - Rev. E 6/17 EN 4 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
4Gb: x16, x32 GDDR5 SGRAM
Ball Assignments and Descriptions
09005aef858b7e92
4gb_gddr5_sgram_brief.pdf - Rev. E 6/17 EN 5 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
4Gb: x16, x32 GDDR5 SGRAM
Ball Assignments and Descriptions
09005aef858b7e92
4gb_gddr5_sgram_brief.pdf - Rev. E 6/17 EN 6 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
4Gb: x16, x32 GDDR5 SGRAM
Package Dimensions
Package Dimensions
Seating plane
A
0.1 A
2.2 CTR
nonconductive
overmold
170X Ø0.47
Dimensions apply
to solder balls post- Ball A1 ID Ball A1 ID
reflow on Ø0.42 SMD
ball pads.
14 13 12 11 10 5 4 3 2 1
A
B
C
D
E
F
G
14 ±0.1 H
12.8 CTR J
K
L
M
N
P
R
T
0.8 TYP U
12 ±0.1
09005aef858b7e92
4gb_gddr5_sgram_brief.pdf - Rev. E 6/17 EN 7 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.