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Uni-directional Description
The 1KSMB series is designed specifically to protect
Bi-directional sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
• 1000W peak pulse power • Excellent clamping
capability at 10/1000μs capability
waveform, repetition rate • Low incremental surge
(duty cycles):0.01% resistance
• For surface mounted • Typical IR less than 1μA
applications to optimize when VBR max>12V
Agency Approvals
board space • High temperature
AGENCY AGENCY FILE NUMBER • Low profile package to reflow soldering
• Typical failure mode is guaranteed: 260°C/40sec
E230531 short from over-specified • Plastic package is
voltage or current flammability rated V-0 per
Maximum Ratings and Thermal Characteristics • Whisker test is conducted Underwriters Laboratories
(TA=25OC unless otherwise noted) based on JEDEC • Meet MSL level1, per
JESD201A per its table 4a J-STD-020, LF maximun
and 4c peak of 260°C
Parameter Symbol Value Unit
• IEC-61000-4-2 ESD • Matte tin lead–free Plated
Peak Pulse Power Dissipation at
TA=25ºC by 10/1000µs Waveform PPPM 1000 W 30kV(Air), 30kV (Contact) • Available in breakdown
(Fig.2)(Note 1), (Note 2) • ESD protection of data Voltage from 6.8V to 180V
Power Dissipation on Infinite Heat lines in accordance with specially designed for
PD 5.0 W
Sink at TL=50OC IEC 61000-4-2 automotive applications
Peak Forward Surge Current, 8.3ms
IFSM 120 A
• EFT protection of data • Offers high-surge rating in
Single Half Sine Wave (Note 3) lines in accordance with compact package: bridges
Maximum Instantaneous Forward IEC 61000-4-4 the gap between 600W
Voltage at 50A for Unidirectional VF 3.5 V
Only
• Built-in strain relief and 1.5KW
Operating Temperature Range TJ -65 to 150 °C • VBR @ TJ= VBR@25°C • Halogen free and RoHS
x (1+αT x (TJ - 25)) compliant
Storage Temperature Range TSTG -65 to 175 °C
(αT:Temperature • Pb-free E3 means 2nd
Typical Thermal Resistance Junction Coefficient, typical value
RθJL 20 °C/W level interconnect is
to Lead
is 0.1%) Pb-free and the terminal
Typical Thermal Resistance Junction • Glass passivated chip
RθJA 100 °C/W finish material is tin(Sn)
to Ambient
junction (IPC/JEDEC J-STD-
Notes:
• Fast response time: 609A.01)
1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3.
typically less than 1.0ps
2. Mounted on copper pad area of 0.2x0.2” (5.0 x 5.0mm) to each terminal.
from 0V to BV min
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
Applications
Functional Diagram TVS devices are ideal for the protection of I/O Interfaces,
VCC bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic
applications.
Cathode Anode
For bidirectional type having VR of 10 volts and less, the IR limit is double.
For parts without A VBR is ± 10% and VC is 5% higher than with A parts.
Bi-directional
Uni-directional Ipp
IT
Vc VBR VR IR
V
IR VR VBR Vc
Vc VBR VR IT
V
IR VF
IT
Ipp
Ipp
Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Curve
0.2x0.2" (5.0x5.0mm)
Copper Pad Area
1
0.001 0.01 0.1 1
100 150
Peak Pulse Power (PPP) or Current (IPP)
tr=10µsec TJ=25°C
Peak Value
100 IPPM
60
Half Value
40
IPPM IPPM( )
2
50 10/1000µsec. Waveform
as defined by R.E.A
20
td
0 0
0 25 50 75 100 125 150 175 0 1.0 2.0 3.0 4.0
TJ - Initial Junction Temperature (ºC) t-Time (ms)
10000 1000
Transient Thermal Impedance (°C/W)
Bi-directional V=0V
Uni-directional V=0V
1000 100
Uni-directional @VR
Cj (pF)
10
100
Bi-directional @VR
1
10
Tj=25C
f=1.0MHz
Vsig=50mVp-p 0.1
1 0.001 0.01 0.1 1 10 100 1000
1.0 10.0 100.0 1000.0
TP - Pulse Duration (s)
VBR - Reverse Breakdown Voltage (V)
Figure 7 - Maximum Non-Repetitive Peak Forward Figure 8 - Peak Forward Voltage Drop vs Peak Forward
Surge Current Uni-Directional Only Current (Typical Values)
120 100
IFSM - Peak Forward Surge Current
100
I F - Peak Forward Current(A)
10
80
60
(A)
40
0.1
20
0 0.01
1 10 100 0 1 2 3 4 5 6
Number of Cycles at 60 Hz VF - Peak Forward Voltage(V)
Soldering Parameters
Lead–free
Reflow Condition
assembly tp
TP
Temperature (T)
- Time (min to max) (ts) 60 – 180 secs Ts(max)
Dimensions
DO-214AA (SMB J-Bend)
Cathode Band Inches Millimeters
(for Uni-directional products only) Dimensions
Min Max Min Max
A 0.077 0.086 1.950 2.200
A C
B 0.160 0.180 4.060 4.570
C 0.130 0.155 3.300 3.940
B D 0.084 0.096 2.130 2.440
E 0.030 0.060 0.760 1.520
H
F - 0.008 - 0.203
D
G 0.205 0.220 5.210 5.590
F H 0.006 0.012 0.152 0.305
E G I 0.089 - 2.260 -
J K L J 0.085 - 2.160 -
K - 0.107 - 2.740
I L 0.085 - 2.160 -
Solder Pads
(all dimensions in mm)
1KSMB XXX C A
Cathode Band
(for Uni-directional products only)
F
5% VBR VOLTAGE TOLERANCE
Littelfuse Logo
BI-DIRECTIONAL
VBR VOLTAGE XX
YMXXX
Marking Code
SERIES
Trace Code Marking
Y:Year Code
M: Month Code
XXX: Lot Code
Packaging
1KSMBxxxXX DO-214AA 3000 Tape & Reel - 12mm tape/13” reel EIA STD RS-481
0.157
(4.0)
0.47
(12.0) Cathode
13.0 (330)
Dimensions are in inches
0.80 (20.2) (and millimeters).
Arbor Hole Dia.
Direction of Feed
0.49
(12.5)