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Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Dynamic dV/dt rating
VDS (V) 200
• Repetitive avalanche rated Available
RDS(on) () VGS = 10 V 0.18
• Fast switching
Qg (Max.) (nC) 70 Available
• Ease of paralleling
Qgs (nC) 13
• Simple drive requirements
Qgd (nC) 39
• Material categorization: for definitions of compliance
Configuration Single
please see www.vishay.com/doc?99912
D Note
* This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
TO-220AB
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details.
G
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
S
D S ruggedized device design, low on-resistance and
G cost-effectiveness.
N-Channel MOSFET The TO-220AB package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 W. The low thermal resistance
and low package cost of the TO-220AB contribute to its
wide acceptance throughout the industry.
ORDERING INFORMATION
Package TO-220AB
IRF640PbF
Lead (Pb)-free
SiHF640-E3
IRF640
SnPb
SiHF640
- 4.5 -
6 mm (0.25") from
package and center of G
nH
Internal Source Inductance LS die contact - 7.5 -
S
7.0 V
6.0 V
2.0
(Normalized)
101 5.5 V
5.0 V
Bottom 4.5 V
1.5
1.0
100
4.5 V
0.5
20 µs Pulse Width
TC = 25 °C
0.0
10-1 100 101 - 60 - 40 - 20 0 20 40 60 80 100 120 140 160
91036_01 VDS, Drain-to-Source Voltage (V) 91036_04 TJ, Junction Temperature (°C)
VGS 3000
VGS = 0 V, f = 1 MHz
Top 15 V Ciss = Cgs + Cgd, Cds Shorted
10 V 2500 Crss = Cgd
8.0 V Coss = Cds + Cgd
ID, Drain Current (A)
7.0 V
Capacitance (pF)
1000 Coss
100
500 Crss
20 µs Pulse Width
TC = 150 °C
0
10-1 100 101 100 101
91036_02 VDS, Drain-to-Source Voltage (V) 91036_05 VDS, Drain-to-Source Voltage (V)
Fig. 2 - Typical Output Characteristics, TC = 150 °C Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
20
ID = 18 A
VGS, Gate-to-Source Voltage (V)
VDS = 160 V
150 °C 16
ID, Drain Current (A)
VDS = 40 V
12
25 °C
100 8
4
20 µs Pulse Width For test circuit
10-1 VDS = 50 V see figure 13
0
4 5 6 7 8 9 10 0 15 30 45 60 75
91036_03 VGS, Gate-to-Source Voltage (V) 91036_06 QG, Total Gate Charge (nC)
Fig. 3 - Typical Transfer Characteristics Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
20
ISD, Reverse Drain Current (A)
150 °C
16
4
100
VGS = 0 V
0
0.50 0.70 0.90 1.10 1.30 1.50 25 50 75 100 125 150
91036_07 VSD, Source-to-Drain Voltage (V) 91036_09 TC, Case Temperature (°C)
Fig. 7 - Typical Source-Drain Diode Forward Voltage Fig. 9 - Maximum Drain Current vs. Case Temperature
RD
103 VDS
5
Operation in this area limited
by RDS(on)
VGS
2
D.U.T.
RG
ID, Drain Current (A)
102 +
10 µs
5 - VDD
2 100 µs
10 V
10 Pulse width ≤ 1 µs
5 1 ms
Duty factor ≤ 0.1 %
2 10 ms
1 Fig. 10a - Switching Time Test Circuit
5 TC = 25 °C
2
TJ = 150 °C VDS
Single Pulse
0.1 90 %
2 5 2 5 2 5 2 5
0.1 1 10 102 103
10
Thermal Response (ZthJC)
1
0 − 0.5
0.2
0.1 0.1 PDM
0.05
0.02
0.01 Single Pulse t1
10-2 (Thermal Response) t2
Notes:
1. Duty Factor, D = t1/t2
2. Peak Tj = PDM x ZthJC + TC
10-3
10-5 10-4 10-3 10-2 0.1 1 10
L
VDS
Vary tp to obtain QG
required IAS 10 V
Charge
Fig. 12a - Unclamped Inductive Test Circuit Fig. 13a - Basic Gate Charge Waveform
12 V 0.2 µF
0.3 µF
VDS
+
VDS
D.U.T. -
IAS VGS
3 mA
800
600
400
200
VDD = 50 V
0
25 50 75 100 125 150
- +
-
Rg • dV/dt controlled by Rg +
• Driver same type as D.U.T. VDD
-
• ISD controlled by duty factor "D"
• D.U.T. - device under test
VGS = 10 V*
Reverse
recovery Body diode forward
current current
dI/dt
D.U.T. VDS waveform
Diode recovery
dV/dt
VDD
Re-applied
voltage Body diode forward drop
Inductor current
Ripple ≤ 5 % ISD
DWG: 6031
Note
• M* = 0.052 inches to 0.064 inches (dimension including
protrusion), heatsink hole for HVM
C
b
e
J(1)
e(1)
Package Picture
ASE Xi’an
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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