International Communications in Heat and Mass Transfer 36 (2009) 39–44

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International Communications in Heat and Mass Transfer

j o u r n a l h o m e p a g e : w w w. e l s ev i e r. c o m / l o c a t e / i c h m t

Study on the convective heat transfer and pressure drop in the micro-channel heat sink ☆
Paisarn Naphon ⁎, Osod Khonseur
Thermo-Fluid and Heat Transfer Enhancement Laboratory (TFHT), Department of Mechanical Engineering, Faculty of Engineering, Srinakharinwirot University,
63 Rangsit-Nakhornnayok Rd., Ongkharak, Nakhorn-Nayok, 26120, Thailand

a r t i c l e i n f o a b s t r a c t

Available online 7 October 2008 Experiments have been performed to investigate the heat transfer characteristics and pressure drop in the
micro-channel heat sinks under constant heat flux conditions. The experiments are performed for the Reynolds
Keywords: number and heat flux in the ranges of 200–1000 and 1.80–5.40 kW/m2, respectively. The micro-channel heat
Convective heat transfer sink with two different channel heights and two different channel widths are accomplished by wire electrical
Micro-channel
discharge machine. Effects of different geometrical configurations parameters of the micro-channel and heat
Heat sink
flux on the heat transfer characteristics and pressure drop are considered. The micro-channel geometry
configuration has significant effect on the enhancement heat transfer and pressure drop. The results of this
study are expected to lead to guidelines that will allow the design of the micro-channel heat exchangers with
improved heat transfer performance of the electronic devices.
© 2008 Elsevier Ltd. All rights reserved.

1. Introduction numerical model to analyze the phase-change flow in micro-channels.

Increasing demand for higher performance of the electronic devices
and the level reliability of the heat rejection largely requires for these
devices. At the conventional scale, heat sinks with various geometrical
configurations have been used in various industries. However, the
studies and applications on the micro-scale heat transfer devices are
still limited. Kayehpour et al. [1] studied the effects of compressibility
and rarefaction on the gas flows in micro-channels. Chen [2] numerically
analyzed the flow characteristics in micro-channels. Gao and Rowe [3]
developed a theoretical model for calculating the cooling performance
of an integrated thermoelectric micro-cooler. Ambatirudi and Rahman
[4] analyzed the heat transfer in micro-channel heat sinks. Ng and Poh
[5] applied the CFD for analysis the liquid flow in the double-layer micro-
channel. Guglielmini et al. [6] experimentally studied the pool boiling
heat transfer from finned copper surfaces immersed in a saturated
dielectric fluid. Zhao and Lu [7] presented the analytical and numerical
study effect of porosity on the thermal performance a micro-channel
heat sink. Honda and Wei [8,12] reviewed the researches concerning the
boiling heat transfer enhancement for the micro-channel heat sink
immersed in dielectric liquids. Choi et al. [9] numerically analyzed the
slip flow in micro-channels using Langmuir slip condition. Luo [10]
applied the theory of finite time thermodynamics to analyze and
optimize the performance of a thermoelectric refrigerator. Xuan [11]
investigated the effect of the thermal and contact resistances of ceramic
plate in thermoelectric micro-coolers. Hao and Tao [13] applied a
☆ Communicated by W.J. Minkowycz.
⁎ Corresponding author.
E-mail address: paisarnn@swu.ac.th (P. Naphon).
Chein et al. [14,22,36] studied the micro-channel heat sink performance
with and without thermoelectric using nanofluids as coolants. Feng
and Xu [15] developed a three-dimensional analytical solution using
the method of Fourier expansion for determination of the spreading
thermal resistance of a cubic heat spreader for electronic cooling
applications. Kobus and Oshio [16] theoretically and experimentally
studied on the thermal performance of a pin-fin heat sink with various
geometrical. Haddad and Abuzaid [17] studied on the developing free-
convection flow in a vertical open-ended micro-channel with porous
media. Bhowmil [18] studied on the steady-state convective heat trans-
fer of water from an in-line four electronic chips in a vertical rectangular
channel. Li et al. [19] determined the thermal performance of heat sinks
with confined impingement cooling. Zhang et al. [20] reported the
study of a single-phase heat transfer of micro-channel heat sink for
electronic packages. Dogruoz et al. [21] experimentally and numerically
studied on the hydraulic resistance and heat transfer of in-line square
pin-fin heat sinks. Yu [23] studied on the thermal performance of a
plate-pin fin heat sink and a plate fin heat sink. Kosar and Peles [24–26].
experimentally studied on the single-phase heat transfer, boiling heat
transfer and pressure drop of R-123 over a bank of shrouded micro-pin
fins. Tan and Ng [27] numerically analyzed the effect of EDL on heat
transfer characteristic of 3-D developing flow in a micro-channel. Yakut
[28] considered effects of the heights, widths of the hexagonal fins on
thermal resistance and pressure drop characteristics. Chiang and Chang
[29] developed an effective procedure of response surface methodology
for designing parameters of a pin-fin type heat sink. Mohamed [30]
investigated on air-cooling characteristics of an electronic devices heat
sink with various square modules array. Launay [31] experimentally
studied the boiling heat transfer from hybrid micro-nano structure.
Didarul [32] investigated on the heat transfer and fluid flow

0735-1933/$ – see front matter © 2008 Elsevier Ltd. All rights reserved.
doi:10.1016/j.icheatmasstransfer.2008.09.001
40 P. Naphon, O. Khonseur / International Communications in Heat and Mass Transfer 36 (2009) 39–44

2. Experimental apparatus and method

Nomenclature

A area 2.1. Test loop

Cp specific heat, kJ/(kg °C)
Dh hydraulic diameter, m A schematic diagram of the experimental apparatus is shown in Fig. 1.
h heat transfer coefficient, kW/(m2 °C) The test loop consists of a test section, chilled air loop and data acquisition
k thermal conductivity, kW/(m °C) system. Air is used as working fluid. The loop wind tunnel is rectangular
m mass flow rate, kg/s air duct fabricated from acrylic, having dimensions of 4⁎ 4 cm and the
Nu Nusselt number length of 148 cm. The duct is insulated with 5 mm thick Aeroflex standard
ΔP pressure drop, kPa sheet. Air in the wind tunnel is discharged by an air compressor into the
Pr Prandtl number channel and is passed through a mixing device, straightener, test section
P wet perimeter, m and then discharged to the atmosphere. The flow rate of air is measured
Q heat transfer rate, kW by a flow meter with an accuracy of 0.2% of full scale. The pressure drops
Re Reynolds number across the test section are measured by the differential pressure
T temperature, °C transducer with an accuracy of 0.02% of full scale. There are four pressure
u velocity, m/s taps on each wall upstream and downstream of the test section. The
ρ density, kg/m3 type-T copper–constantan thermocouples with an accuracy of 0.1% of
full scale are employed to measure air temperatures. The inlet and outlet
Subscripts temperatures of air are measured by two and four thermocouples with
a air 1 mm diameter probes extending into the duct in which the air flows,
ave average respectively. All the thermocouples probes are precalibrated by dry-box
in inlet temperature calibrator with 0.01 °C precision.
out outlet
2.2. Test sections

The schematic diagram of the test section is shown in Fig. 2. The

characteristics of finned surfaces. Zhen et al. [33] compared the 3-D and
2-D DSMC heat transfer of flow-speed short micro-channel flows. Yang
et al. [34] experimentally studied on the heat transfer coefficient of pin
fin heat sinks with different cross sections. Hong et al. [35,38] studied
on the heat transfer characteristics of gaseous flows in a micro-channel
and a microtube. Chen [37] applied the reduced Navier–Strokes equa-
tion to simulate the incompressible micro-channel flows. Lineykin and
Yaakov [39] proposed a user-friendly graphical method for calcula-
ting the steady-state operational point of a thermoelectric cooler. Jeng
and Tzeng [40] experimentally studied the pressure drop and heat
transfer of a square pin-fin array in a rectangular channel. Lie [41]
investigated the flow boiling heat transfer of FC-72 on a heated micro-
pin-fin silicon chip. Lee and Son [42,43] studied the bubble dynamics
and nucleate and flow boiling heat transfer in a micro-channel.
Recently, Wang et al. [44,45] numerically studied the gas flow and
heat transfer in a micro-channel using DSMC with uniform heat flux
boundary condition.
As mentioned above, the numerous works have been reported
concerning the heat transfer and pressure drop in the heat sink with
various geometrical configurations, however, there still remains room
to discuss on the heat transfer characteristics and pressure drop in the
micro-channel heat sink. In the present paper, the main concern is
to study the convective heat transfer characteristics and pressure
drop in the micro-channel heat sinks. Effects of various relevant
parameters on the heat transfer and pressure drop characteristics are
also considered.
width and length of the heat sink are 28 and 40 mm, respectively. The
micro-channel heat sinks are accomplished by the wire electrical
discharge machine (WEDM). The details of the micro-channel are listed
in Table 1. An AC power supply is the source of power for the plate type
heaters. Rear face of the test section is insulated with a 10 mm thick heat-
resistant Mica standard sheet, 5 mm thick Aeroflex standard sheet, and
then 5 mm thick Acrylic standard sheet, respectively. Two type-Tcopper–
constantan thermocouples with 1 mm diameter probes are used to
measure the micro-channel heat sink wall temperature. The thermo-
couple was installed by mounting on the wall (drilled holes from the rear
face) and fixed with special glue applied to the rear face of the wall.
2.3. Operating conditions
Experiments were conducted with various heat flux and flow rates of
air entering the test section. In the experiments, air flow rate was increased
in small increments while the supplied heat at the micro-channel heat
sink was kept constant. The supplied heat into the micro-channel heat sink
walls was adjusted to achieve the desired level by using electric heaters.
The supplied power was calculated using the measured voltage and
current supplied to the heaters. The supplied voltage and current to the
heaters were measured by the digital clamp meter. The steady-state
sensible heat gain by the air flow can be determined from an energy
balance. In the present study, only the data that satisfy the energy balance
conditions; |Q heater −Q a|/Q ave is less than 10%, are used in the analysis. The
average heat transfer, Q ave, is averaged from the supplied heat transfer to

Fig. 1. Schematic diagram of experimental apparatus.

 P. Naphon, O. Khonseur / International Communications in Heat and Mass Transfer 36 (2009) 39–44 41

Fig. 2. Schematic diagram of the test section and micro-channel heat sink.

the heater and the removal heat transfer by cooling air. The temperature at The average heat transfer coefficient is presented in terms of
each position and pressure drop across the test section were recorded average Nusselt number as follows:
three times. Data collection was carried out using a data acquisition system.
The uncertainty and accuracy of the measurement are given in Table 2. hm Dh
Nu ¼ ð6Þ
k
3. Data reduction
where k is the thermal conductivity of air, Dh is the hydraulic diameter
The data reduction of the measured data is summarized in the fol- of the channel before entering the test section.
lowing procedures: Reynolds number based on the hydraulic diameter, Dh, of the
Heat transferred to the cooling air in the test section, Qa, can be channel as follows:
calculated from
ud Dh

 Re ¼ ð7Þ
Qa ¼ ma Cp;a Ta;ave;out −Ta;ave;in ð1Þ m

where ma is the air mass flow rate, Cp,a is the specific heat of air, Ta,ave,in and 4d Across
Dh ¼ ð8Þ
Ta,ave,out are the average inlet and outlet air temperatures, respectively. P
Heat added to the micro-channel heat sink can be calculated from where u is the air velocity, ν is the viscous of air, Across is the cross
measuring voltage and current supplied the test section as follows: section area of the channel before entering the test section, and P is
Qheater ¼ Vd I ð2Þ the wet perimeter of the channel.

The average heat transfer rate, Qave, used in the calculation is deter- 4. Results and discussion
mined from the heat removal my cooling air and the heat supplied to the
heat sink as follows: Fig. 3 shows the variation of the outlet air temperature with air
Reynolds number for different channel widths. Higher heat transfer
Qa þ Qheater
Qave ¼ ð3Þ rate as air mass flow rate increases. However, increase of heat transfer
2
rate is less than that of air mass flow rate. Therefore, outlet air
The average heat transfer coefficient of the micro-channel heat sink, temperature tends to decrease as air mass flow rate increases. Higher
hm, can be calculated from the average heat transfer rate obtained from surface area and surface roughness result in increase heat transfer
rate, therefore, the outlet air temperatures of channel with of
Qave ¼ hm Am ðΔTLMTD Þ ð4Þ
w = 0.2 mm are higher than those of w = 0.3 mm.
2

3 Fig. 4 shows the variation of the average heat sink temperature
T −T − T −T with air Reynolds number for different channel widths and different
¼4 5
s;ave a;ave;in s;ave a;ave;out
ΔTLMTD   ð5Þ
Ts;ave −Ta;ave;in
ln Ts;ave −Ta;ave;out
channel heights. As expected, the heat transfer rate depends on the
cooling capacity rate of air. Therefore, the average heat sink
where Ts,ave is the average surface temperature, and Am is the surface temperature decreases as air Reynolds number increases. As seen in
area of the micro-channel heat sink. Fig. 3, due to the higher surface heat transfer area, the lower channel

Table 1 Table 2
Dimensions of the micro-channel heat sink Accuracy and uncertainty of measurements

Channel Channel height Fin and base thickness Channel width Size of heat Instruments Accuracy (%) Uncertainty
h (mm) s (mm) w (mm) sink (mm) Voltage supplied by power source, V 0.2 ±0.5
#1 1.00 0.20 0.20 40 ⁎ 28 Current supplied by power source, I 0.2 ±0.5
#2 1.00 0.20 0.30 40 ⁎ 28 Air flow meter 0.2 ±0.5
#3 1.50 0.20 0.20 40 ⁎ 28 Thermocouple type-T, data logger, (°C) 0.1 ±0.1
#4 1.50 0.20 0.30 40 ⁎ 28 Differential pressure transducer 0.02 ±0.02
42 P. Naphon, O. Khonseur / International Communications in Heat and Mass Transfer 36 (2009) 39–44

widths are close in the present study. In addition, average heat sink
temperatures at higher channel height are lower than those from
lower ones. Due to higher surface area and surface roughness, the heat
transfer rate from the heat sink surface to the cooling air increases.
Therefore, the increase channel height results in lower heat sink
temperatures.

Fig. 3. Variation of outlet air temperature with air Reynolds number for different
channel widths.

width heat sink gives average heat sink temperature lower than that
higher one. However, this parameter has slightly effect on average
heat sink temperature. The reason for this is that the micro-channel

Fig. 4. Variation of heat sink temperature with air Reynolds number for (a) different Fig. 5. Variation of average heat transfer coefficient with air Reynolds number for
channel widths (b) different channel heights. (a) different heat fluxes (b) different channel widths (c) different channel heights.
 P. Naphon, O. Khonseur / International Communications in Heat and Mass Transfer 36 (2009) 39–44 43

Fig. 5 shows the variation of the average heat transfer coefficient

with air Reynolds number. As expected, the heat transfer coefficient
increases with increasing heat flux. Due to higher temperature
difference between inlet air temperature and heat sink temperature,
higher heat flux gives heat transfer coefficient higher than those lower
ones. Fig. 5 also shows the variation of the average heat transfer

Fig. 7. Variation of pressure drop with air Reynolds number for different channel
geometrical configurations.

coefficient calculated from the present experiment with air Reynolds

number of various geometrical configurations. It can be clearly seen
from both figures that the heat transfer coefficients significant
increase with increasing air Reynolds number. This is because the
heat transfer coefficient depends on the heat transfer rate. For a given
air Reynolds number, the heat transfer coefficients at w = 0.2 mm
are higher than those of w = 0.3 mm as shown in Fig. 5(b). Effect
of channel height on the enhancement of average heat transfer
coefficient is shown in Fig. 6(c). Due to higher heat transfer area and
higher surface roughness, the average heat transfer coefficients of the
heat sink with h = 1.5 mm are higher than those with h = 1.0 mm. In
addition, the results can be shown in another form as shown in Fig. 6
and the same explanation as for Fig. 5 can be given.
Fig. 7 shows the variation of pressure drop per unit length for
different geometrical configurations. Due to the higher surface force
and higher surface roughness, the flow characteristics through the
micro-channel is quite high and complex as compare to the conven-
tional scale. Usually, the surface roughness is represented in terms of
the average surface roughness. For the conventional tubes, the
roughness can be obtained from tables given by Moody [46] according
to the tube machining techniques and materials. For the micro-scale,
however, these values still require to be verified. It can be clearly seen
from the figure that the pressure drop continues to increase with
Reynolds number. In addition, the shape and the size of roughness
irregularities of the micro-channel surface have significant effect on
the pressure drop variations as shown in Fig. 7.

5. Conclusions

With the research and development of the miniaturized technologies,

mini and micro-channel cooling systems have been widely used in the
electronic devices. However, the heat transfer performance and friction
factor for the micro-channel are still to be validated. The heat transfer
characteristics and pressure drop in the micro-channel heat sinks with
various geometrical configurations are investigated experimentally. It is
found that the shape and the size of roughness irregularities of the micro-
channel surface have significant effect on enhancement of heat transfer
performance and the pressure drop variations.

Acknowledgements

The authors would like to express their appreciation to the Thailand

Fig. 6. Variation of Nusselt number with air Reynolds number for (a) different heat Research Fund (TRF) and the Srinakharinwirot University (SWU) for
fluxes (b) different channel widths (c) different channel heights. providing financial support for this study.
44 P. Naphon, O. Khonseur / International Communications in Heat and Mass Transfer 36 (2009) 39–44

References [25] A. Kosar, Y. Peles, Convective flow of refrigerant (R123) across a bank of micro pin
fins, International Journal of Heat and Mass Transfer 49 (2006) 3142–3155.
[26] A. Kosar, Y. Peles, Boiling heat transfer in a hydrofoil-based micro pin fin heat sink,
[1] H.P. Kayehpour, M. Faghri, Y. Asako, Effects of compressibility and rarefaction on
International Journal of Heat and Mass Transfer 50 (2007) 1018–1034.
gaseous flows in microchannels, Numerical Heat Transfer 32 (1997) 677–696.
[27] S.T. Tan, E.Y.K. Ng, Numerical analysis of EDL effect on heat transfer characteristic
[2] C.S. Chen, Numerical analysis of gas flow in microchannels, Numerical Heat
of 3-D developing flow in a microchannel, Numerical Heat Transfer 49 (2006)
Transfer 33 (1998) 749–762.
991–1007.
[3] M. Gao, D.M. Rowe, Cooling performance of integrated thermoelectric microcooler,
[28] K. Yukut, Experimental investigation of thermal resistance of a heat sink with
Solid - State Electronics 43 (1999) 923–929.
hexagonal fins, Applied Thermal Engineering 26 (2006) 2262–2271.
[4] K.H. Ambatirudi, M.M. Rahman, Analysis of conjugate heat transfer in micro-
[29] K.T. Chiang, F.P. Chang, Application of response surface methodology in the
channel heat sinks, Numerical Heat Transfer 37 (2000) 711–731.
parametric optimization of a pin fin type heat sink, International Communication
[5] E.Y.K. Ng, S.T. Poh, CFD analysis of double-layer microchannel conjugate parallel
in Heat and Mass Transfer 33 (2006) 836–845.
liquid flows with electric double-layer effects, Numerical Heat Transfer 40 (2001)
[30] M.M. Mohamed, Air cooling characteristics of a uniform square modules array for
735–749.
electronic device heat sink, Applied Thermal Engineering 26 (2006) 486–493.
[6] G. Guglielmini, M. Misale, C. Schenone, Boiling of saturated FC-72 on square pin fin
[31] S. Launay, Hybrid micro-nano structured thermal interfaces for pool boiling heat
arrays, International Journal of Thermal Sciences 41 (2002) 599–608.
transfer enhancement, Microelectronics Journal 37 (2006) 1158–1164.
[7] C.Y. Zhao, T.J. Lu, Analysis of microchannel heat sink for electronics cooling,
[32] I.M. Didarul, Study on heat transfer and fluid flow characteristics with short
International Journal of Heat and Mass Transfer 45 (2002) 4857–4869.
rectangular plate fin of different pattern, Experimental Thermal and Fluid Science
[8] J.J. Wei, H. Honda, Effects of fin geometry on boiling heat transfer from silicon chips
31 (2007) 367–379.
with micro-pin-fins immersed in FC-72, International Journal of Heat and Mass
[33] C.E. Zhen, Z.C. Hong, Y.J. Lin, N.T. Hong, Comparison of 3-D and 2-D DSMC heat
Transfer 46 (2003) 4059–4070.
transfer calculations of flow-speed short microchannel flows, Numerical Heat
[9] H.I. Choi, D. Lee, J.S. Maeng, Computation of slip flow in microchannels using
Transfer 52 (2007) 239–250.
Langmuir slip condition, Numerical Heat Transfer 44 (2003) 59–71.
[34] K.S. Yang, W.H. Chu, I.Y. Chen, C.C. Wang, A comparative study of the airside
[10] J. Luo, Optimum allocation of heat transfer surface area for cooling load and COP
performance of heat sinks having pin fin configurations, International Journal of
optimization of a thermoelectric refrigerator, Energy Conservation and Manage-
Heat and Mass Transfer 50 (2007) 4607–4613.
ment 44 (2003) 3197–3206.
[35] C. Hong, Y. Asako, Heat transfer characteristics of gaseous flows in a microchannel
[11] X.C. Xuan, Investigation of thermal contact effect on thermoelectric coolers,
and a microtube with constant wall temperature, Numerical Heat Transfer 52
Energy Conservation and Management 44 (2003) 399–410.
(2007) 219–238.
[12] H. Honda, J.J. Wei, Enhanced boiling heat transfer from electronic components by
[36] R. Chein, J. Chuang, Experimental microchannel heat sink performance studies
use of surface microstructures, Experimental Thermal and Fluid Science 28 (2004)
using nanofluids, International Journal of Thermal Sciences 46 (2007) 57–66.
159–169.
[37] C.S. Chen, Reduced Navier–Strokes simulation of incompressible microchannel
[13] Y.L. Hao, Y.X. Tao, A numerical model for phase-change suspension flow in
flows, Numerical Heat Transfer, 53 (2007) 71–87.
microchannels, Numerical Heat Transfer 46 (2004) 55–77.
[38] Z.C. Hong, C.E. Zhen, C.Y. Yang, Fluid dynamics and heat transfer analysis of three
[14] R. Chein, G. Huang, Thermoelectric cooler application in electric in electric cooling,
dimensional microchannel flows with microstructures, Numerical Heat Transfer
Applied Thermal Engineering 24 (2004) 2207–2217.
54 (2007) 293–314.
[15] T.Q. Feng, J.L. Xu, An analytical solution of thermal resistance of cubic heat
[39] S. Lineykin, S.B. Yaakov, User-friendly and intuitive graphical approach to the
spreaders of electronic cooling, Applied Thermal Engineering 24 (2004) 323–337.
design of thermoelectric cooling systems, International Journal of Refrigeration 30
[16] C.J. Kobus, T. Oshio, Development of a theoretical model for predicting the thermal
(2007) 798–804.
performance characteristics of a vertical pin-fin array heat sink under combined
[40] T.M. Jeng, S.C. Tzeng, Pressure drop and heat transfer of square pin-fin arrays in in-
forced and natural convection with impinging flow, International Journal of Heat
line and staggered arrangements, International Journal of Heat and Mass Transfer
and Mass Transfer 48 (2005) 1053–1063.
50 (2007) 2364–2375.
[17] O.M. Haddad, M.M. Abuzaid, Developing free-convection gas flow in a vertical
[41] Y.M. Lie, Saturated flow boiling heat transfer and associated bubble characteristics
open-ended microchannel filled with porous media, Numerical Heat Transfer 48
of FC-72 on a heated micro-pin-fined silicon chip, International Journal of Heat and
(2005) 693–710.
Mass Transfer 50 (2007) 3862–3876.
[18] H. Bhowmil, Convection heat transfer from discrete heat sourced in a liquid cooled
[42] W. Lee, G. Son, Bubble dynamics and heat transfer during nucleate boiling in a
rectangular channel, Applied Thermal Engineering 25 (2005) 2532–2542.
microchannel, Numerical Heat Transfer 53 (2008) 1074–1090.
[19] H.Y. Li, S.M. Chao, G.L. Tsai, Thermal performance measurement of Heat sinks with
[43] W. Lee, Y. Suh, G. Son, Bubble dynamics, flow, and heat transfer during flow boiling
confined impinging jet by infrared thermography, International Journal of Heat
in parallel microchannels, Numerical Heat Transfer 54 (2008) 390–405.
and Mass Transfer 48 (2005) 5386–5394.
[44] Q.W. Wang, C.L. Zhao, M. Zeng, Y.N. Wu, Numerical investigation of rarefied
[20] H.Y. Zhang, Single-phase liquid cooled micro channel heat sink for electronic
diatomic gas flow and heat transfer in a microchannel using DSMC with uniform
packages, Applied Thermal Engineering 25 (2005) 1472–1487.
heat flux boundary condition—Part I: numerical method and validation, Numerical
[21] M.B. Dogruoz, M. Urdanet, A. Ortega, Experiments and modeling of hydraulic
Heat Transfer 53 (2008) 160–173.
resistance and heat transfer of in-line square pin-fin heat sinks with top by-pass
[45] Q.W. Wang, C.L. Zhao, M. Zeng, Y.N. Wu, Numerical investigation of rarefied
flow, International Journal of Heat and Mass Transfer 48 (2005) 5058–5071.
diatomic gas flow and heat transfer in a microchannel using DSMC with uniform
[22] R. Chein, Y. Chen, Performance of thermoelectric cooler integrated with
heat flux boundary condition—Part II: applications, Numerical Heat Transfer 53
microchannel heat sinks, International Journal of Refrigeration 28 (2005)
(2008) 174–187.
828–839.
[46] L.F. Moody, Friction factors for pipe flow, Trans. ASME 66 (1944) 671–683.
[23] X. Yu, Development of a plate-pin fin heat sink and its performance comparisons
with a plate fin heat sink, Applied Thermal Engineering 25 (2005) 173–182.
[24] Y. Peles, Forced convective heat transfer across a pin fin micro heat sink,
International Journal of Heat and Mass Transfer 48 (2005) 3615–3627.