SECTION 7 - HEAT SINKS AND THERMAL ANALYSIS

Objectives

1. The need for a heat sinking.

2. Typical power transistor packages

3. The thermal - electrical analogy

4. The thermal circuit for a typical power amplifier

5. Calculations using the thermal circuit

6. Definition of the derating factor

7. Data sheets for heat sink material

Introduction
When we considered the efficiency of power amplifiers we found that the maximum
efficiency of an “ideal” Class B push-pull amplifier was 78.5%. The actual efficiency
of a practical push-pull amplifier is often less than 50%. Consequently, the output
devices in a power amplifier must be able to dissipate large amounts of power. This
power is dissipated as heat, and unless we take steps to remove this heat from the active
output devices, the performance of the amplifier will be degraded or may even be
permanently damaged. Power dissipation within a transistor causes a rise in the
temperature at the junction of the collector-base pn junction (Tjc). Typically the
maximum junction temperature permitted for a power transistor is 125 to 200 degrees
Celsius.

To keep the transistor junction temperature below the maximum value, we use heat
sinks. Heat sinks are available in a number of styles, but they are generally designed to
maximise the available surface area to allow cooling to take place.

Typical heat-sink configurations are shown on the next page. In the example showing
the transistor with a TO3 style case, an electrical insulator (mica washer) has been
included. The case of the TO3 package is also the collector of the transistor. The heat
sink is usually connected to the equipment chassis, which has an electrical potential of
0V. The mica washer provides good electrical insulation with moderate thermal
conduction to provide good thermal transfer from the transistor case to the heat sink.
Note also that the nuts and bolts required to mount the transistor to the heat sink also
require nylon insulating bushes.

To improve the thermal contact between a transistor case and a heat sink, silicon grease
is often applied between the heat sink and the transistor case.

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Chapter 7 - Heat Sinks and Thermal Analysis
 The Thermal/Electrical Analogy

Heat is a form of energy and is measured in joules (J)

Three heat transfers are generally required :
1) From the transistor c-b junction and the transistor case.
2) From the transistor case and the heat-sink.
3) From the heat sink to the surrounding air (ambient).

The temperature difference between two points in a “thermal circuit” depend on the
power dissipation (PD-Watts or Joules/sec) and the thermal resistance (Rth o C/Watt).

∆t = PD x Rth

You will notice that this equation has the same form as Ohm’s Law :

Thus: ∆V = I x R

Thermal Quantity Electrical Analogy

Temperature Difference (∆t) Voltage Difference (∆V)

Power Dissipation (PD) Current (I)
Thermal Resistance (Rth) Resistance (R)

The Thermal Circuit

A thermal circuit can be drawn in the same way that we draw electrical circuits using
the above electrical analogies.

The Power Amplifier Thermal Circuit

Power Dissipation PD is ( )
analogous to a current source
Tj
Rth(j-c)
Temperature Drops ∆T are ( )
equivalent to voltage drops
Rth(j-a) Rth(c-s) PD
Tc
Thermal Resistance (Rth ) is
Rth(s-a) the opposition to the thermal
Ths
energy (heat flux) flowing
+ between two points. Analogous to
electrical resistance

Ta
∆T = PD × Rth

0 degrees C
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Chapter 7 - Heat Sinks and Thermal Analysis
where……

• Tj = temperature of the transistor junction - most important - this is the

temp we are trying to control. Rth(j-a) must be low enough to keep the transistor
cool.
• Tc = temperature of the case of the transistor
• Ths = temperature of the heat sink
• Ta = ambient temperature
• PD = power dissipation of the transistor - the transistor produces heat energy
which must overcome the thermal resistance of the transistor junction to case
(influenced by construction of the transistor), the transistor case to heat sink
(influenced by transistor construction).

Power Derating and Determining Rth j-c

The maximum power dissipation of a transistor is given for a particular case

temperature. If the case temperature exceeds the case temperature at which PD is
quoted, the transistor power dissipation must be “derated”, as shown below so that the
junction temperature is not exceeded.

PD

PDmax

Case temp
Ta Tjmax

The slope of the derating curve gives the derating factor (DF)

PD ( MAX )
DF = W / °C
T J ( MAX ) − Ta

The thermal resistance from junction to case is is found from 1/DF

(T j ( MAX ) − Ta )
Rth ( J − C ) = °C / W
PD ( MAX )

Examples:

1. A 2N3055 power transistor has a maximum power dissipation of 117W at an

ambient temperature of 25 oC and has Tjmax = 200 oC. Sketch the derating curve
and determine Rth(j-c) for the transistor.

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Chapter 7 - Heat Sinks and Thermal Analysis
2. A transistor has a maximum junction temperature of 150oC and a thermal resistance
from junction to case Rth (j-c) of 1.5 oC/W. The thermal resistance from case to heat
sink Rth (c-s) of 0.6 oC/W. The thermal resistance of the heat-sink Rth (s-a) is 3
o
C/W. If the power dissipated by the output transistor is 20W and the ambient
temperature is 40 oC determine the temperature of the heat sink, the transistor case
and the c-b junction.

3. A silicon power transistor has a heat sink with a thermal resistance of 1.5 degrees
C/W. The transistor is rated at 120W (25 degrees C) and has a thermal resistance of
1.25 degrees C/W. A mounting insulator is used which has a thermal resistance of
0.4 degrees C/W. What is the maximum power the transistor can dissipate if the
maximum ambient temperature is 40 degrees C and max. junction temp for the
transistor is 175 degrees C?

4. A TIP120 npn power transistor is rated at 65W (25 degrees C). The transistor has a
maximum junction temp of 150 degrees C and a thermal resistance of 1.92 degrees
C/W. It has to dissipate 10W in a power amp and the maximum ambient temperature
is 60 degrees C. Determine the thermal resistance of the heat sink required assuming
that the transistor is mounted on the heat sink with a mica insulator using silicon
grease.

Heat Sink Data Sheets

Locate the data sheets for 45D heat sink extrusion at the rear of this book.

a) What is the thermal resistance for a 6 inch length of blackened 45D heatsink
extrusion at a room temperature of 50 degrees C?
b) What is the thermal resistance for a 6 inch length of unblackened 45D heatsink
extrusion at a room temperature of 50 degrees C?
c) A 2 inch piece of blackened 45D heatsink extrusion dissipates 30W of power. If the
room temperature is 30 degrees C, how hot will the heatsink get?
d) A heatsink using 45D blackened extruded heatsink material is required to dissipate
40W. Its temperature cannot be allowed to rise above 60 degrees C at an ambient
temperature of 30 degrees C. What is the thermal resistanec of the material?

NOTE: Before next weeks lesson, please download the data sheets for the
TAS5010, TAS5100, LM1875, LM1877 from
www.acay.com.au/~mstacey/ae4_index.htm

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Chapter 7 - Heat Sinks and Thermal Analysis
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Chapter 7 - Heat Sinks and Thermal Analysis
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Chapter 7 - Heat Sinks and Thermal Analysis