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Pb e3
DS-CPC1135N-R08
www.ixysic.com 1
INTEGRATED CIRCUITS DIVISION CPC1135N
R08
2 www.ixysic.com
INTEGRATED CIRCUITS DIVISION CPC1135N
30
20 20
20 15 15
15 10 10
10
5 5
5
0 0 0
1.17 1.19 1.21 1.23 1.25 0.21 0.22 0.23 0.24 0.25 0.26 0.27 0.50 0.60 0.70 0.80 0.90 1.00 1.10
LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)
Typical IF for Switch Operation Typical IF for Switch Dropout Typical On-Resistance Distribution
(N=50, IL=120mA) (N=50, IL=120mA) (N=50, IL=120mA)
25 25 35
30
20 20
25
15 15 20
10 10 15
10
5 5
5
0 0 0
0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.45 0.50 0.55 0.60 0.65 0.70 0.75 28.5 29 29.5 30 30.5 31 31.5
LED Current (mA) LED Current (mA) On-Resistance (:)
30
Device Count (N)
25
20
15
10
0
365 370 375 380 385 390 395
Blocking Voltage (VP)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R08 www.ixysic.com 3
INTEGRATED CIRCUITS DIVISION CPC1135N
1.8
0.6
1.6 1.6
Typical IF for Switch Operation Typical Turn-On Time Typical Turn-Off Time
vs. Temperature vs. Temperature vs. Temperature
(IL=50mA) (IL=50mA) (IL=50mA)
3.0 1.0 5.0
0.9 4.5
2.5 4.0
0.8
Turn-On Time (ms)
0.7 3.5
2.0
0.6 3.0
1.5 0.5 2.5
0.4 2.0
1.0 IF=5mA
0.3 1.5
IF=10mA
0.5 0.2 1.0
0.1 0.5
IF=5mA IF=10mA
0 0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (ºC) Temperature (ºC) Temperature (ºC)
40 50 120
100
30 0
80
20 -50 60
40
10 -100
20
0 -150 0
-40 -20 0 20 40 60 80 100 -6 -4 -2 0 2 4 6 -40 -20 0 20 40 60 80 100 120
Temperature (ºC) Load Voltage (V) Temperature (ºC)
0.8
0.012
Load Current (A)
390 0.7
Leakage (µA)
0.010 0.6
385
0.008 0.5
380 0.4
0.006
375 0.3
0.004
0.2
370 0.002 0.1
365 0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 10μs 100μs 1ms 10ms 100ms 1s 10s 100s
Temperature (ºC) Temperature (ºC) Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R08
4 www.ixysic.com
INTEGRATED CIRCUITS DIVISION CPC1135N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R08 www.ixysic.com 5
INTEGRATED CIRCUITS DIVISION CPC1135N
Mechanical Dimensions
CPC1135N
4.089 ± 0.203 Recommended PCB Land Pattern
(0.161 ± 0.008)
0.200 ± 0.025
(0.008 ± 0.001) 0.60
(0.0217)
330.2 Dia
(13.00 Dia)
W=12.00
Top Cover B0=4.70 (0.472)
Tape Thickness (0.185)
0.102 Max
(0.004 Max)
Dimensions
Embossed mm
Carrier
(inches)
Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1135N-R08
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
6 12/14/2012
Mouser Electronics
Authorized Distributor
IXYS:
CPC1135N CPC1135NTR