Datasheet s3245sg

NUR460
Ultrafast power diode

Rev. 2 — 20 July 2011 Product data sheet
1. Product profile
1.1 General description

Ultrafast epitaxial power diode in a SOD141 (DO-201AD) axial lead plastic package.
1.2 Features and benefits

 Axial leaded plastic package  Low forward voltage drop
 Fast switching  Low thermal resistance
 High voltage capability  Soft recovery characteristic
1.3 Applications
 Discontinuous Current Mode (DCM)  High frequency switched-mode power
Power Factor Correction (PFC) supplies
1.4 Quick reference data

Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VRRM repetitive peak reverse - - 600 V
voltage
IF(AV) average forward square-wave pulse; δ = 0.5; - - 4 A
current see Figure 1; see Figure 2
Static characteristics
VF forward voltage IF = 4 A; Tj = 25 °C; - - 1.28 V
see Figure 4
Dynamic characteristics
trr reverse recovery time IF = 1 A; VR = 30 V; - 33 65 ns
dIF/dt = 50 A/µs; Tj 25 °C;
Ramp Recovery;
see Figure 5
IR = 1 A; IF = 0.5 A; - 25 50 ns
IR(meas) = 0.25 A; Tj = 25 °C;
Step Recovery; see Figure 6
NXP Semiconductors NUR460
2. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K cathode
k a K A
2 A anode 001aaa020
SOD141 (DO-201AD)
3. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
NUR460 DO-201AD Hermetically sealed plastic package; axial leaded; 2 leads SOD141
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse voltage - 600 V
VRWM crest working reverse voltage - 600 V
VR reverse voltage DC - 600 V
IF(AV) average forward current square-wave pulse; δ = 0.5 ; - 4 A
see Figure 1;
see Figure 2
IFRM repetitive peak forward current square-wave pulse; δ = 0.5 - 8 A
IFSM non-repetitive peak forward tp = 8.3 ms; sine-wave pulse; - 110 A
current Tj(init) = 25 °C; see Figure 3
tp = 10 ms; sine-wave pulse; - 100 A
Tj(init) = 25 °C; see Figure 3
Tstg storage temperature -40 150 °C
Tj junction temperature - 150 °C
NUR460 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 20 July 2011 2 of 10

003aag297 003aag298
7 5
Ptot δ=1 a = 1.57
Ptot
(W)
6 (W)
1.9
4
0.5 2.2
5
2.8
3
4 0.2 4.0
0.1
3
2
2
1
1
0 0
0 2 4 6 8 0 1 2 3 4 5
IF(AV) (A) IF(AV) (A)
Fig 1. Forward power dissipation as a function of Fig 2. Forward power dissipation as a function of
average forward current; square waveform; average forward current; sinusoidal waveform;
maximum values maximum values
003aag299
103
IFSM
(A)
102
tp t
101
10-5 10-4 10-3 10-2
tp (s)
Fig 3. Non-repetitive peak forward current as a function of pulse width; square waveform; maximum values

5. Thermal characteristics
Table 5. Thermal characteristics
Rth(j-a) thermal resistance from in free air - 55 - K/W
junction to ambient
6. Characteristics
Table 6. Characteristics
Static characteristics
VF forward voltage IF = 4 A; Tj = 25 °C; see Figure 4 - - 1.28 V
IF = 4 A; Tj = 150 °C; see Figure 4 - 0.88 1.05 V
IR reverse current VR = 600 V; Tj = 25 °C - - 50 µA
Dynamic characteristics
trr reverse recovery time IF = 1 A; VR = 30 V; dIF/dt = 50 A/µs; - 33 65 ns
Ramp Recovery; Tj 25 °C; see Figure 5
IF = 0.5 A; IR = 1 A; Step Recovery; - 25 50 ns
IR(meas) = 0.25 A; Tj = 25 °C; see Figure 6
003aag296
20
IF dlF
IF
(A) dt
16
trr
12
time
8
25 %
Qr 100 %
4
(1) (2) (3)
IR IRM
0
0 1 2 3 003aac562
VF (V)
Fig 4. Forward current as a function of forward Fig 5. Reverse recovery definitions; ramp recovery
voltage

IF
IF
trr
time
0.25 x IR
Qr
IR
IR 003aac563
Fig 6. Reverse recovery definitions; step recovery

7. Package outline
Hermetically sealed plastic package; axial leaded; 2 leads SOD141
(1)
k a
b
D L G L
Dimensions
Unit b D G L
max 1.30 5.3 9.6

mm nom
min 1.18 4.8 7.2 25.4
max 0.052 0.21 0.375
inches nom
min 0.046 0.19 0.285 1.00 0 2.5 5 mm
Note scale
1. The marking band indicates the cathode. sod141_po
Outline References European

Issue date
version IEC JEDEC JEITA projection
10-05-18
SOD141 DO-201AD
11-06-22
Fig 7. Package outline SOD141 (DO-201AD)

8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
NUR460 v.2 20110720 Product data sheet - NUR460 v.1
Modifications: • Various changes to content.
NUR460 v.1 20110704 Product data sheet - -

9. Legal information
9.1 Data sheet status

Document status [1] [2] Product status [3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
Preview — The document is a preview version only. The document is still limitation specifications and product descriptions, at any time and without
subject to formal approval, which may result in modifications or additions. notice. This document supersedes and replaces all information supplied prior
NXP Semiconductors does not give any representations or warranties as to to the publication hereof.
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information. Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
Draft — The document is a draft version only. The content is still under safety-critical systems or equipment, nor in applications where failure or
internal review and subject to formal approval, which may result in malfunction of an NXP Semiconductors product can reasonably be expected
modifications or additions. NXP Semiconductors does not give any to result in personal injury, death or severe property or environmental
representations or warranties as to the accuracy or completeness of damage. NXP Semiconductors accepts no liability for inclusion and/or use of
information included herein and shall have no liability for the consequences of NXP Semiconductors products in such equipment or applications and
use of such information. therefore such inclusion and/or use is at the customer’s own risk.
Short data sheet — A short data sheet is an extract from a full data sheet Quick reference data — The Quick reference data is an extract of the
with the same product type number(s) and title. A short data sheet is intended product data given in the Limiting values and Characteristics sections of this
for quick reference only and should not be relied upon to contain detailed and document, and as such is not complete, exhaustive or legally binding.
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales Applications — Applications that are described herein for any of these
office. In case of any inconsistency or conflict with the short data sheet, the products are for illustrative purposes only. NXP Semiconductors makes no
full data sheet shall prevail. representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between Customers are responsible for the design and operation of their applications
NXP Semiconductors and its customer, unless NXP Semiconductors and and products using NXP Semiconductors products, and NXP Semiconductors
customer have explicitly agreed otherwise in writing. In no event however, accepts no liability for any assistance with applications or customer product
shall an agreement be valid in which the NXP Semiconductors product is design. It is customer’s sole responsibility to determine whether the NXP
deemed to offer functions and qualities beyond those described in the Semiconductors product is suitable and fit for the customer’s applications and
Product data sheet. products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
9.3 Disclaimers applications and products.
Limited warranty and liability — Information in this document is believed to NXP Semiconductors does not accept any liability related to any default,
be accurate and reliable. However, NXP Semiconductors does not give any damage, costs or problem which is based on any weakness or default in the
representations or warranties, expressed or implied, as to the accuracy or customer’s applications or products, or the application or use by customer’s
completeness of such information and shall have no liability for the third party customer(s). Customer is responsible for doing all necessary
consequences of use of such information. testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
In no event shall NXP Semiconductors be liable for any indirect, incidental, the products or of the application or use by customer’s third party
punitive, special or consequential damages (including - without limitation - lost customer(s). NXP does not accept any liability in this respect.
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such Limiting values — Stress above one or more limiting values (as defined in
damages are based on tort (including negligence), warranty, breach of the Absolute Maximum Ratings System of IEC 60134) will cause permanent
contract or any other legal theory. damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
Notwithstanding any damages that customer might incur for any reason the Recommended operating conditions section (if present) or the
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards Characteristics sections of this document is not warranted. Constant or
customer for the products described herein shall be limited in accordance repeated exposure to limiting values will permanently and irreversibly affect
with the Terms and conditions of commercial sale of NXP Semiconductors. the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors In the event that customer uses the product for design-in and use in
products are sold subject to the general terms and conditions of commercial automotive applications to automotive specifications and standards, customer
sale, as published at http://www.nxp.com/profile/terms, unless otherwise (a) shall use the product without NXP Semiconductors’ warranty of the
agreed in a valid written individual agreement. In case an individual product for such automotive applications, use and specifications, and (b)
agreement is concluded only the terms and conditions of the respective whenever customer uses the product for automotive applications beyond
agreement shall apply. NXP Semiconductors hereby expressly objects to NXP Semiconductors’ specifications such use shall be solely at customer’s
applying the customer’s general terms and conditions with regard to the own risk, and (c) customer fully indemnifies NXP Semiconductors for any
purchase of NXP Semiconductors products by customer. liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
No offer to sell or license — Nothing in this document may be interpreted or standard warranty and NXP Semiconductors’ product specifications.
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights. 9.4 Trademarks
Export control — This document as well as the item(s) described herein may Notice: All referenced brands, product names, service names and trademarks
be subject to export control regulations. Export might require a prior are the property of their respective owners.
authorization from national authorities.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
Non-automotive qualified products — Unless this data sheet expressly FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
states that this specific NXP Semiconductors product is automotive qualified, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
the product is not suitable for automotive use. It is neither qualified nor tested QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
in accordance with automotive testing or application requirements. NXP TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications. HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
10. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com

11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .4
6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .4
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .6
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .7
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . . .8
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .8
9.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
10 Contact information. . . . . . . . . . . . . . . . . . . . . . .9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 July 2011
Document identifier: NUR460

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NUR460

Ultrafast power diode

1.1 General description

1.2 Features and benefits

1.4 Quick reference data

Product data sheet Rev. 2 — 20 July 2011 2 of 10

Product data sheet Rev. 2 — 20 July 2011 3 of 10

Product data sheet Rev. 2 — 20 July 2011 4 of 10

Fig 6. Reverse recovery definitions; step recovery

Product data sheet Rev. 2 — 20 July 2011 5 of 10

Hermetically sealed plastic package; axial leaded; 2 leads SOD141

max 1.30 5.3 9.6

Outline References European

Fig 7. Package outline SOD141 (DO-201AD)

Product data sheet Rev. 2 — 20 July 2011 6 of 10

Product data sheet Rev. 2 — 20 July 2011 7 of 10

9.1 Data sheet status

Product data sheet Rev. 2 — 20 July 2011 8 of 10

10. Contact information

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 2 — 20 July 2011 9 of 10

© NXP B.V. 2011. All rights reserved.

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