CG5151LA

Data Sheet
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Type Description: Ambient Light Sensor

Product Name: CG5151LA

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Reversion: 1.04

Reversion Date: November 25, 2015

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Page: 10 Pages
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Issue Date: 2015/12/07

November 25, 2015 – Rev. 1.04

CG5151LA
Ambient Light Sensor

CG5151LA Ambient Light Sensor

Descriptions Pin Configuration

CG5151LA Ambient Light Sensor, consisting of a photo diode and a current

amplification circuit, is a good solution to the power saving application.
CG5151LA is a chip with human eye’s response and high infrared immunity.
The application can be used in the Security, Vehicle and so on.
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Features
z Spectral response close to the human eye’s response
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z Excellent infrared immunity
z Operation voltage from 3.0V to 3.6V
z Light threshold adjustable function
z Good output linearity across light intensity
z RoHS compliant and lead-free package
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Applications
z Detection of ambient light to control IR LED
-- Vehicle, Security, Camcorder auto night mode control, TFT LCD
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z Automatic contrast enhancement for light change

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Ordering Information

Order Number Package Type MOQ

CG5151LA LAMP 500

This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 -1- Datasheet
CG5151LA
Ambient Light Sensor

Pin Descriptions
Pin Symbol Function
1 K Cathode
2 A Anode

Recommended Operating Conditions (VDD = 3.3V, Ta = 25oC)

Parameter Symbol Test Conditions Min. Typ. Max. Units
Temperatures
Operating Temperature Ta -30 - 85 ℃
Storage Temperature Tstg -30 - 85 ℃
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VDD
Supply Voltage VDD 3.0 - 3.6 V
Response
Light source 6500oK, 5LUX - 2.18 - uA/Lux
Output Current Sensitivity Iphs
Light source 6500oK, 10LUX - 1.86 - uA/Lux
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Light source 6500oK, 5LUX - 10.9 - uA

Output Current Iph
Light source 6500oK, 10LUX - 18.6 - uA
Peak Sensitivity Wavelength Λp 540 nm
Sensitivity Wavelength Range Λ 320 - 750 nm
Saturation Output Voltage VL - VDD – 1.5 - V

Function Block Diagram

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Current Amplifier
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This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 -2- Datasheet
CG5151LA
Ambient Light Sensor

Example of Application Circuit

VDD_3.3V VDD_3.3V

2
2 U1 R1
U1

A
100K
A

OUTPUT

D
K

CG5151LA

1
CG5151LA Q2
1

G 2N7002(NMOS)
VL
VL

S
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G
+ Q1

S
RL CL 2N7002(NMOS)
+

RL1 CL RL2
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Basic Circuit Simple Application Circuit

Output ON/OFF Hysteresis Voltage RC Delay Circuit

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Adjust Circuit 1. VOP is low when VL> 1.3V (Delay time is 4sec)
VDD_3.3V 2. VOP is high when VL< 0.6V

R5
2

U1
1K
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A

R6 400K
K

R7 U2
CG5151LA
1

40K 2 A-- VCC 8

1
3 A++ AO
5

U3
R8 100K 5 B+
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+BO 7 VOP R9 470K 2 4

OUTPUT
6 B- - GND 4
VL
ELM7S14
D

Q1 LM393 + C1
3

2N7002(NMOS)
G 10uF
S

+ R10

12K
RL1 CL RL2
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Typical Application Circuit

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This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 -3- Datasheet
CG5151LA
Ambient Light Sensor

Spectral Response vs. Wavelength

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Light Response Linearity

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Test condition: Day Light (6500 oK) RL=30K
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Dark Leakage
RL = 10K ohm
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12

10
Voltage(mV)

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On

0
0 10 20 30 40 50 60 70 80 90 100
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Temperature ( C )

View Angle
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This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 -4- Datasheet
CG5151LA
Ambient Light Sensor

Bin and Resistor

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RL Recommend
Bin 01 Bin 02
RL (Ohm) 1.0 * R 0.5 * R
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This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 -5- Datasheet
CG5151LA
Ambient Light Sensor

Package Outlines (Unit: mm)

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This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 -6- Datasheet
CG5151LA
Ambient Light Sensor

Package Appearance
Package S (Silver-plated on Pin): Package L (Tin-plated on Pin):
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This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 -7- Datasheet
CG5151LA
Ambient Light Sensor

Packing Information

Box Type A Box Type B

1. 500EA / BAG 1. 500EA / BAG

2. 10 BAGS / INNER BOX
INNER BOX SIZE : L X W X H 2. 8 BAGS / INNER BOX
27.5cm X 23cm X 16.5cm INNER BOX SIZE : L X W X H
33.5cm X 19cm X 7.5cm
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3. 4 INNER BOXES / CARTON 3. 12 INNER BOXES / CARTON

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CARTON SIZE : L X W X H CARTON SIZE : L X W X H

49cm X 29.5cm X 36.5cm 58.5cm X 34cm X 34cm
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Label Explanation

This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 -8- Datasheet
CG5151LA
Ambient Light Sensor

Recommended Condition for Soldering

Mounting Method

z Do not apply any stress to the lead, particularly when heated.

z The LAMP must not be repositioned after soldering.

z After soldering the LAMP, the epoxy bulb should be protected from mechanical shock or vibration until the LAMP
return to room temperature.

z Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused by the PC
board warping or from the clinching and cutting of the lead frames. When it is absolutely necessary, the LAMP
may be mounted in this fashion, but, the User will assume responsibility for any problems. Direct soldering should
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only be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will
occur. ChipGoal’s LAMP should not be soldered directly to double sided PC boards because the heat will
deteriorate the epoxy resin.

z When it is necessary to clamp the LAMP to prevent soldering failure, it is important to minimize the mechanical
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stress on the LAMP.

z Cut the LAMP lead frames at room temperature. Cutting the lead frames at high temperatures may cause LAMP
failure.

z Solder the LAMP no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar is
recommended.
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( O ) Correct Mounting Method ( X ) Incorrect Mounting Method

This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 -9- Datasheet
CG5151LA
Ambient Light Sensor
z Recommended Soldering Conditions
Dip Soldering
Pre-Heat 100℃ (Max.)
Pre-Heat Time 60 second (Max.)
Ramp-up 2℃/second (Max.)
Ramp-Down -5℃/second (Max.)
Solder Bath Temperature 260℃ (Max.)
Dipping Time 3 second (Max.)
Dipping Position No lower than 3mm from the base of the epoxy bulb.
Hand Soldering
Soldering Iron 30W (Max.)
Temperature 350℃ (Max.)
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Soldering time 3 second (Max.)
Position No closer than 3mm from the base of the epoxy bulb.

Wave Soldering Profile

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Update History
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Revision Date Update

1.00 January 13, 2015 Preliminary version
1.01 February 09, 2015 Recommended Condition for Soldering
Recommended Operating Conditions
1.02 September 21, 2015
Package Outlines
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Package Outlines
1.03 October 21, 2015
Packing Information
Bin and Resistor
1.04 November 25, 2015
Package Outlines

This document is the property of ChipGoal and shall not be reproduced, copied or transformed to any other forms without permission.
November 25, 2015 – Rev. 1.04 - 10 - Datasheet