micromachines

Article
PMMA Solution Assisted Room Temperature
Bonding for PMMA–PC Hybrid Devices
In-Hyouk Song 1, * and Taehyun Park 2, *
1 Department of Engineering Technology, Texas State University, San Marcos, TX 78666, USA
2 School of Mechanical Engineering, Kyungnam University, Changwon 51767, Korea
* Correspondence: in-hyouk.song@txstate.edu (I.-H.S.); taehyun@kyungnam.ac.kr (T.P.);
Tel.: +1-512-245-2137 (I.-H.S.); +82-55-249-2615 (T.P.)

Received: 29 August 2017; Accepted: 17 September 2017; Published: 20 September 2017

Abstract: Recently, thermoplastic polymers have become popular materials for microfluidic chips
due to their easy fabrication and low cost. A polymer based microfluidic device can be formed
in various fabrication techniques such as laser machining, injection molding, and hot embossing.
A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA)
solution as an adhesive layer to bond dissimilar polymers—PMMA to polycarbonate (PC)—to enclose
the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to
bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test
and a crack opening method in addition to the fluidic leakage inspection.

Keywords: polymethyl methacrylate (PMMA) spin coated polycarbonate (PC); microfluidic; hybrid
bonding; thermal bonding; PMMA–PC bonding

1. Introduction
Microfluidic systems for bio-/chemical analysis have become considerably attractive due to fast
analysis, small reagent consumption, on-chip sample treatment, and portability [1]. The microfluidic
devices have been demonstrated using not only glass or silicon wafer but also polymer, which
has superior disposability, ease of fabrication, and a lower cost [2]. In addition, polymer based
microdevices offer the advantages of biocompatibility, flexibility in manufacturing, and applicability in
mass production. The most popular thermoplastic polymers for microfluidic devices are polymethyl
methacrylate (PMMA), polycarbonate (PC), cyclic olefin copolymer (COC), and polystyrene (PS) [3–6].
Followed by microfluidic channel patterning on thermoplastic polymer, a sealing process is
required on the formed polymer to enclose microfluidic channels. The sealing process is one of crucial
but challenging steps to complete polymer-based microfluidic devices and needs to enclose the channel
tightly without deforming the microchannels. The bonding techniques for sealing microfluidic channels
or chambers require robust sealing but are faster and simpler without channel deformation and
clogging. Various bonding techniques have been reported using direct or indirect bonding techniques,
such as surface modification [7–11], chemical gluing [12–14], thermoplastic fusion bonding [7,11,15–17],
adhesive bonding [18–20], and ultrasonic bonding [21].
The proposed research presents a new technique for bonding dissimilar polymers—PMMA
and PC—for microfluidic devices. PMMA is one of the most popular materials in polymer based
microfluidic devices due to easy fabrication and PC is used in various applications for its outstanding
properties and especially high toughness, high impact strength, and high optical transparency [22].
However, it is impossible to bond PMMA to PC directly using a thermoplastic fusion bonding because
of the different glass transition temperatures. In this paper, PMMA solution is employed as an adhesive
layer to bond PMMA to PC. The former contains microfluidic channels and the latter is used for a
covering material of the microfluidic device. The proposed bonding process is performed at room

Micromachines 2017, 8, 284; doi:10.3390/mi8090284 www.mdpi.com/journal/micromachines

 Micromachines 2017, 8, 284 2 of 6
Micromachines 2017, 8, 284 2 of 6
used for a covering
Micromachines 2017, 8, 284material of the microfluidic device. The proposed bonding process is performed 2 of 6
used for a covering material of the microfluidic device. The proposed bonding
at room temperature and low compression force for bonding. The details of the fabrication process process is performed
atand
room
thetemperature
bonding strength and low testscompression
are presented force for paper.
in this bonding. The details of the fabrication process
temperature
and the bonding andstrength
low compression force forin
tests are presented bonding. The details of the fabrication process and the
this paper.
bonding strength tests are presented
2. Fabrication and Bonding of PMMA–PC in this paper.
2. Fabrication and Bonding of PMMA–PC
Hot embossing
2. Fabrication uses a micromachined
and Bonding of PMMA–PC mold insert to transfer microfluidic channels embedded
Hot embossing uses a micromachined
in mold onto polymer substrate. Figure 1a mold insert
shows thetodesign
transferof microfluidic
the master moldchannels embedded
containing four
Hot embossing uses a micromachined mold insert to transfer microfluidic channels embedded
inmicrofluidic
mold onto channels
polymer placed
substrate. Figure 1a
in parallel. Theshows thewidth
channel designandof height
the master mold containing
are designed of 200 µmfour and
in mold onto polymer substrate. Figure 1a shows the design of the master mold containing four
microfluidic channels placed
120 µm, respectively. Figure 1bin parallel.
illustrates The
3Dchannel
image ofwidth and height
the designed are mold.
master designed of 200 µm CNC
A commercial and
microfluidic channels placed in parallel. The channel width and height are designed of 200 µm and
120 µm, respectively.
machining center was Figure
used 1b illustrates
to form 3Dmold
a brass image of theMicrofluidic
insert. designed master mold.
channels areAreplicated
commercial onCNC
3 mm
120 µm, respectively. Figure 1b illustrates 3D image of the designed master mold. A commercial CNC
machining
thick planecenter
PMMA was usedwhich
sheet, to form is aannealed
brass mold insert.
in an ovenMicrofluidic
at 80 °C. Thechannels
embossing areisreplicated
accomplishedon 3 mm
with
machining center was used to form a brass mold insert. Microfluidic channels are replicated on 3 mm
thick
a hotplane
pressPMMA
(QM900M, sheet,QMESYS,
which is annealed
Gunpo-si,inGyeonggi-do,
an oven at 80Korea).
°C. The embossing
The PMMA is accomplished
sheet including with
mold
thick plane PMMA sheet, which is annealed in an oven at 80 ◦ C. The embossing is accomplished with
ainsert
hot press (QM900M,
is placed onto theQMESYS,
lower platenGunpo-si,of theGyeonggi-do, Korea).
hot press, which The PMMAtosheet
is configured including
maintain mold
160 °C and
a hot press (QM900M, QMESYS, Gunpo-si, Gyeonggi-do, Korea). The PMMA sheet including mold
insert
slowlyis fastened
placed ontowiththe lower platen
a pressure of 8 MPaof theforhot press,
8 min. Uponwhich is configured
completion of thetoholding
maintain time,160PMMA
°C and is
insert is placed onto the lower platen of the hot press, which is configured to maintain 160 ◦ C and
slowly fastened with a pressure of 8 MPa
cooled down and separated from the mold insert at 80 °C. for 8 min. Upon completion of the holding time, PMMA is
slowly fastened with a pressure of 8 MPa for 8 min. Upon completion of the holding time, PMMA is
cooled down and separated from the mold insert at 80 °C.
cooled down and separated from the mold insert at 80 ◦ C.

(a) (b)
(a) (b)
Figure 1. (a) Design of microfluidic channels. Channel width and height are 200 µm and 120 µm,
Figure
Figure1.1.(a)(a)Design
respectively. (b) 3D of
Design ofmicrofluidic
illustration channels.
of the
microfluidic Channel
master mold
channels. width
design
Channel and height
containing
width and fourare 200 µmµmand
microfluidic
height are 200 and120
120µm,
channels. µm,
respectively. (b) 3D illustration of the master mold design containing four microfluidic channels.
respectively. (b) 3D illustration of the master mold design containing four microfluidic channels.
After hot embossing, the microfluidic channels in PMMA microchips are enclosed with a 250
µm After
Afterhot
thick PC embossing,
hotfilm
embossing,
using an the
the microfluidic
adhesive channels
layer.channels
The adhesive inPMMA
in PMMA microchips
layermicrochips are
are
is, in this research, enclosed
enclosed used withwitha 250 250
a 2.5%µm
µm
(w/w)thick
thick PC
PMMAPCfilmfilm using
using
solution an adhesive
andissolved
adhesive layer.The
inlayer.
propyleneTheadhesive
adhesive
glycol layer is,
layer
monomethyl is, inether
this research,
this acetate
research, used
usedwith
(PGMEA, with
CAS#aa2.5%
2.5%
108-
(w/w)
65-6, PMMA
(w/w) PMMA solution
Sigma-Aldrich, solution dissolved
dissolved
Inc., in propylene
St. Louis, inMO,
propylene
USA).glycol monomethyl
glycol
The PMMA monomethyl
solutionetheris acetate
ether
made (PGMEA,
acetate (PGMEA,
by dissolving CAS# 108-
7.5CAS#
g of
65-6,
PMMA Sigma-Aldrich,
108-65-6, Sigma-Aldrich,
beads Inc., Inc.,
(molecular St.weight:
Louis, MO,
St. Louis, USA).
MO,
75,000, TheThe
USA). PMMA
Polysciences, PMMA solution
Inc., solution is made
Warrington, is made byby
PA, dissolving
dissolving
USA,) 7.5
in 300 7.5gggofof
PMMA
PMMAbeads
PGMEA. beads (molecular
Once(molecular
PMMA beads weight:
weight: 75,000,Polysciences,
are 75,000,
properly Polysciences,
dissolved inInc., Inc.,
the Warrington,
Warrington,
PGMEA, PMMA PA,
PA, USA) USA,)
in 300
solution isin of300
gfiltered gwith
PGMEA. of
PGMEA.
aOnce
0.2 µm Once
PMMA PMMA
beads are
membrane beads are
properly
syringe properly
filter dissolved dissolved in
in the PGMEA,
and spin-coated the PGMEA,
on a PC sheet.PMMA PMMA
solution
Three solution
stepsisoffiltered is filtered
with aangular
spin coating with
0.2 µm
avelocity
0.2 µm membrane
membrane aresyringe
used. The syringe
filter and
first filter
step and
is 500spin-coated
spin-coated rpm onfor
a PC on
5 s, a PC
sheet.
the sheet.step
Three
second Three
steps steps
isof4500 of
spinrpm spin
coating
for 25coating
s, andangular
angular velocity
the last
velocity
are used.
step areThe
is 1000 used.
rpm The
first
for 5 first
step is step
s. The500 is 500
rpm
thickness forrpm s,for
5 the
of the 5 second
s, the second
spin-coated step isstep
2.5% 4500
PMMA isrpm
4500 rpm
for 25 for
solution s, 25 s,than
is and
less and
the the
last
100 lastat
step
nm is
step
4500isrpm
1000 1000for
rpm. rpm5 s.for
Right The5 s.
after The thickness
thickness
taking of the
out of the spin-coated
thespin-coated
PMMA spin2.5% 2.5%
PMMA
coated PC PMMA
solution
called PSC-PC solution is less
is less than
film, 100
thethan
nmhotat100 nmrpm.
4500
embossed at
4500
Right
PMMA rpm.
after
chipRight
taking after
outtaking
is placed the PMMA
face-downout the spin
on PMMA
coatedspin
PSC-PC coated
PC and
film called PC using
PSC-PC
sealed called aPSC-PC
film, the hot
hand film, atthe
embossed
roller roomhottemperature
embossed
PMMA chip
PMMA
is placed
before chip is placed
theface-down
PMMA face-down
on
solutionPSC-PC on
filmPSC-PC
is completely film and
and sealed
dried. using sealed
Figure a 2handusing
shows athe
roller hand
at rollertemperature
room
bonded at roommicrochips
PMMA temperature
before the on
before
PMMA
PSC-PC thesolution
PMMAissolution
film. completely is completely
dried. Figure dried. Figure
2 shows the2 bonded
shows the PMMA bonded PMMA on
microchips microchips
PSC-PC film. on
PSC-PC film.

Figure 2. Bonded PMMA microchips on PSC-PC film.

Figure 2. Bonded PMMA microchips on PSC-PC film.
Figure 2. Bonded PMMA microchips on PSC-PC film.
Micromachines 2017, 8, 284 3 of 6
Micromachines 2017, 8, 284 3 of 6

3. Characterization
3. Characterization of
of Bonding
Bonding
Micromachines 2017, 8, 284 3 of 6
3.1. Microchannel Inspection
3. Characterization of Bonding
The aim of this study is to to demonstrate
demonstrate the usefulness of PMMA solution as an adhesive layer
for 3.1.
bonding microchip to PC film. The bonding quality of the fabricated microfluidic chips is
PMMAInspection
Microchannel
investigated by observation of leakage across the bonded interface. Red food dye is passed into the
fabricatedThemicrofluidic
aim of this study is to demonstrate
channels the usefulness of PMMA solution as an adhesive layerwith
fabricated microfluidic channels ofofFigure
Figure2.2.AsAsshown
shown in in Figure
Figure 3, all
3, all four
four channels
channels are are filled
filled with red
for bonding PMMA microchip to PC film. The bonding quality of the fabricated microfluidic chips is
red food
food dye dye
afterafter removing
removing capillary
capillary connection
connection at theatdrain
the drain reservoir
reservoir withoutwithout leakage
leakage at anyat any along
point point
investigated by observation of leakage across the bonded interface. Red food dye is passed into the
along the microchannels.
the microchannels.
fabricated microfluidic channels of Figure 2. As shown in Figure 3, all four channels are filled with
red food dye after removing capillary connection at the drain reservoir without leakage at any point
along the microchannels.

Figure 3. Leakage test of (PMMA)–PC microchip with red food dye.

Figure 3. Leakage test of (PMMA)–PC microchip with red food dye.
Figure 3. Leakage test of (PMMA)–PC microchip with red food dye.
Channel deformation is a common issue in using a thermoplastic fusion bonding technique since
Channel deformation is a common issue in using a thermoplastic fusion bonding technique since
the Young’s modulus of viscoelastic materials dramatically change with relatively small changes in
the Young’s modulus
Channel of viscoelastic
deformation is a common materials
issue in dramatically changefusion
using a thermoplastic with relatively small changes
bonding technique since in
temperature
the Young’s in the glass transition region. Besides, thermoplastic fusion bonding cannot guarantee
temperature inmodulus
the glassoftransition
viscoelastic materials
region. dramatically
Besides, change with
thermoplastic relatively
fusion bonding small changes
cannot in
guarantee
an even pressure distribution over the contact area or precise temperature control. In contrast, the
an temperature
even pressure in the glass transition
distribution region.
over the Besides,
contact areathermoplastic fusion bonding
or precise temperature cannot
control. Inguarantee
contrast, the
use ofeven
a 2.5% (w/w) PMMA solution
over can avoid channel or deformation since the process is carriedtheout at
usean of a 2.5%pressure
(w/w)distribution
PMMA solution the
cancontact
avoid areachannel precise temperature
deformation sincecontrol. In contrast,
the process is carried out
roomusetemperature.
a 2.5% (w/w)Figure
of temperature. PMMA 4 shows the cancross-sectional view of microfluidic chips along the lineatof A-
at room Figuresolution
4 shows avoid
the channel deformation
cross-sectional view ofsince the process
microfluidic is carried
chips alongout the line
A’ room
in Figure 3. TheFigure
temperature. boundary4 showsof the
thecross-sectional
microfluidic view channel
of walls arechips
microfluidic sufficiently
along theclear without
line of A-
of A-A’ in Figure 3. The boundary of the microfluidic channel walls are sufficiently clear without
deformation.
A’ in Figure In 3.contrast to PMMA,
The boundary of thePCmicrofluidic
is not dissolvedchannelbywalls
propylene glycol monomethyl
are sufficiently clear without ether
deformation. In contrast to PMMA, PC is not dissolved by propylene glycol monomethyl ether acetate
deformation.
acetate (PGMEA) Inimmediately.
contrast to PMMA,However, PC itis is
not dissolved
observed byPC
that propylene
tends to glycol
absorbmonomethyl
the solution,etherand this
(PGMEA) immediately. However, it is observed that PC tends to absorb the solution, and this induces
acetate
induces (PGMEA)inimmediately.
softening the surface of However,
PC. Theitsoftened
is observedPCthat
withPCthe
tends to absorb
dissolved the solution,
PMMA makesand the this
surface
softening in the surface of PC. The softened PC with the dissolved PMMA makes the surface sticky
induces softening in the surface of PC. The softened PC with the dissolved
sticky and improved the bonding strength between PC film and PMMA microchips. A dark band of PMMA makes the surface
andsticky
improved the bonding
and improved strengthstrength
the bonding between PC filmPC
between and PMMA microchips. A dark bandbandof PCoffilm
PC film surface contacting with the PMMA microchipfilm and PMMA
is seen in Figuremicrochips.
4c, which A results
dark from the
surface contacting with the PMMA microchip is seen in Figure 4c, which results
PC film surface contacting with the PMMA microchip is seen in Figure 4c, which results from the from the penetration
penetration of the dissolved PMMA solution into a PC film during spin coating and bonding.
of the dissolved
penetration of PMMA solution
the dissolved PMMAintosolution
a PC film during
into spinduring
a PC film coating and
spin bonding.
coating and bonding.

(a)(a) (b)
(b) (c) (c)
Figure (a)
Figure 4. 4. (a) Cross-sectionalmicrograph
Cross-sectional micrograph ofof the
the PMMA–PC
PMMA–PCmicrochip.
microchip.(b)(b)
Close-up
(b) view
Close-up
Close-up of Figure
view
view of 4a. 4a.
of Figure
Figure 4a.
(c) Closed-up viewofofthe
thecross-sectional
cross-sectional microchannel
microchannel ofofFigure 4b.
Figure 4b.
4b.
(c) Closed-up view of the cross-sectional microchannel of Figure

3.2. Bonding Strength

3.2. Bonding
3.2. Bonding Strength
Strength
The bonding strength is tested using two methods: (1) shear strength test and (2) crack opening
The bonding
The bonding strength
strength is
is tested
tested using
using two
two methods:
methods: (1)
(1)isshear
shear strength test
test and
and (2)
(2) crack
crack opening
opening
method. The shear strength of the bonded PMMA–PC chips testedstrength
with a universal testing machine
method.
method. The
(DR-100,Theshear strength
shear strength
DR-TECH, of the bonded
of the
Grantsburg, PMMA–PC
WI, bonded PMMA–PC
USA), which chips is tested
is useful chips with
is tested
for testing a universal testing
with a specimens.
thin bonded machine
universal For
testing
(DR-100,
each specimen, PMMA is bonded to 250 µm thick PSC-PC film with an overlapping bond area (20 For
DR-TECH, Grantsburg, WI, USA), which is useful for testing thin bonded specimens.
each specimen, PMMA is bonded to 250 µm thick PSC-PC film with an overlapping bond area (20
Micromachines 2017, 8, 284 4 of 6

machine (DR-100,
Micromachines 2017, 8,DR-TECH,
284 Grantsburg, WI, USA), which is useful for testing thin bonded specimens. 4 of 6
Micromachines
For 2017, 8, 284
each specimen, PMMA is bonded to 250 µm thick PSC-PC film with an overlapping bond 4area of 6
mm × 17.4 mm). Shear force is applied to the specimen through a wedge
(20 mm × 17.4 mm). Shear force is applied to the specimen through a wedge at the PMMA–PC at the PMMA–PC interface
mm
at a ×crosshead
interface17.4
at mm). Shearofforce
speed
a crosshead isof
applied
10 mm/min
speed to the
until
10 mm/min specimen
the until
bonded through
the chip a wedge
is delaminated.
bonded chip at Figure
the PMMA–PC
is delaminated. shows 5ainterface
5 Figure loadinga
shows
at a crosshead
cycle where
loading cycle the speed
where of
pulling 10 mm/min until
force increases
the pulling the bonded
with the
force increases with chip is
elongation delaminated.
of the of
the elongation bondedFigure 5
PMMA–PC
the bonded shows
PMMA–PC a loading
chip until
chip
cycle where
failure. Three the pulling are
specimens force increases
tested at room with the elongation
temperature and ofaverage
the the bonded
load PMMA–PC
at failure of chip
the until
bonding
until failure. Three specimens are tested at room temperature and the average load at failure of the
failure.
is 0.721Three
±is0.03 specimens
MPa. are tested at room temperature and the average load at failure of the bonding
bonding 0.721 ± 0.03 MPa.
is 0.721 ± 0.03 MPa.

Figure5.5. Loading
Figure Loading cycle
cycle of
of shear
shear strength
strength test
test of
of PMMA–PC
PMMA–PC microchips.
microchips.
Figure 5. Loading cycle of shear strength test of PMMA–PC microchips.
Afterthe
After thebonding
bondingprocess,
process, thethe bonding
bonding strength
strength is determined
is determined using
using a crack
a crack opening
opening methodmethod [23].
[23]. After
A the
blade isbonding
inserted process,
interface the
at bonding
the bonded strength
PMMA–PC is determined
polymers. using
The a crack
bonding opening
strength method
is then
A blade is inserted interface at the bonded PMMA–PC polymers. The bonding strength is then
[23]. A blade
calculated is inserted interface at the bonded PMMA–PC polymers. The bonding strength is then
using
calculated using
calculated using
33 t2b
γγ == 3 4 ∙ · (1)
11 11
!
γ = 16 ∙ ∙
16· L (1)
1∙ + + 1∙
16 ∙ E pc ·t3pc + E pmma ·t3pmma
(1)
∙ ∙
where γ (J/m22) is the bonding strength. Epc (=2–2.44 GPa) and Epmma (=2.24–3.8 GPa) are the Young’s
where
where γγ(J/m
(J/m 2)) is
isPC the
the bonding
bonding strength.
strength. EEpc (=2–2.44 GPa)
pc (=2–2.44
GPa) and and E Epmma (=2.24–3.8GPa)GPa)are are theYoung’s
Young’s
modulus of the and PMMA, respectively [24]. The thicknesses pmmaof(=2.24–3.8
the PC sheet, tpc, andthethe PMMA
modulus
modulus of
ofthe PC and PMMA,
PMMA,ofrespectively [24]. The thicknesses of
of the PC sheet, ttpc , and thePMMAPMMA
microchip, tthe
pmma,PC areand
measured respectively
220 µm and[24]. 2.122The mm,thicknesses
respectively. the
ThePC sheet,
blade pc, and the
thickness, tb, is of 353
microchip,
microchip, t
tpmma
pmma, of
, are
arethe measured
measured of 220 µm and 2.122 mm, respectively. The blade thickness,tb, istbof
, is of
µm. The length crack, L,ofis220 µm andas2.122
measured shown mm, inrespectively.
Figure 6. Four The blade thickness,
specimens are measured 353
and
353
µm. TheThe
µm. length
the bonding
lengthof the
strength
of crack, L, isL,
the crack,
is calculated
is measuredshown
measured
of 126 ± 19asJ/m
as shown
2 for E
in Figure
inpc Figure
(=2 GPa) 6. and6. Four
Four specimens
Especimens
are measured
are measured
pmma (=2.24 GPa), which shows and
and the bonding strength is calculated of 126 ± 19 J/m 2 for E (=2 GPa) and E (=2.24 GPa), which
the
morebonding
than 50 strength is calculated
times higher bonding of 126 ± 19 J/mthan
strength
2 for the
Epc (=2 GPa) and
pc
previous Epmma (=2.24
reported pmma
hybridGPa), which shows
thermoplastic to
shows
more more 50
than than times50 times
higherhigher
bondingbonding strength
strength than than
the the previous
previous reportedhybrid
reported hybridthermoplastic
thermoplastic to to
thermoplastic (PMMA–PS) bonding using a thermocompression method [25].
thermoplastic
thermoplastic (PMMA–PS)
(PMMA–PS) bonding bonding usingusing aa thermocompression
thermocompression method method [25].[25].

Figure 6. Crack opening method for measuring the bonding strength.

Figure 6. Crack opening method for measuring the bonding strength.
Figure 6. Crack opening method for measuring the bonding strength.
Additional bonding test is carried out by letting compressed air pass through the microfluidic
Additional
channels and thebonding testare
pressures is measured
carried outatby letting
inlet and compressed
at the outletair passmicrofluidic
of the through thechannels.
microfluidic
The
channels and the pressures are measured at inlet and at the outlet of the microfluidic channels.
channels are able to withhold 75 psi at outlet and 95 psi at inlet without delamination, which is the The
channels
maximum are able to pressure
supplied withholdfrom
75 psi atair
the outlet and 95 psi at inlet without delamination, which is the
compressor.
maximum supplied pressure from the air compressor.
Micromachines 2017, 8, 284 5 of 6

Additional bonding test is carried out by letting compressed air pass through the microfluidic
channels and the pressures are measured at inlet and at the outlet of the microfluidic channels.
The channels are able to withhold 75 psi at outlet and 95 psi at inlet without delamination, which is the
maximum supplied pressure from the air compressor.

4. Conclusions
In this study, a simple and fast bonding technique for fabrication of PMMA–PC hybrid devices is
developed using assistance of PMMA solution made by dissolving PMMA beads in PGMEA solution.
This technique uses only PMMA solution as an adhesive layer and all process are performed at room
temperature. PMMA–PC microfluidic chips are successfully bonded with high bonding strength and
low dimension loss using the proposed method. The values for the bonding strength are tested by a
shear strength test and a crack opening method of 0.721 ± 0.03 MPa and 126 ± 19 J/m2 , respectively.
According to a burst test, the channels withstand more than 75 psi without delamination. Moreover,
the proposed technique is feasible for bonding multiple devices on the same substrate.

Acknowledgments: This research was supported by Basic Science Research Program through the National
Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning
(NRF-2014R1A1A1038283 and NRF-2016R1C1B2014368) and by Brain Pool Program through the Korean
Federation of Science and Technology Societies (KOFST) funded by the Ministry of Science, ICT and Future
Planning (171S-2-3-1867).
Author Contributions: In-Hyouk Song and Taehyun Park conceived and designed the experiments;
In-Hyouk Song and Taehyun Park performed the experiments and analyzed the data; In-Hyouk Song wrote the
paper; Taehyun Park supervised the research.
Conflicts of Interest: The authors declare no conflict of interest.

References
1. Lafleur, J.P.; Jonsson, A.; Senkbeil, S.; Kutter, J.P. Recent advances in lab-on-a-chip for biosensing applications.
Biosens. Bioelectron. 2016, 76, 213–233. [CrossRef] [PubMed]
2. Becker, H.; Locascio, L.E. Polymer microfluidic devices. Talanta 2002, 56, 267–287. [CrossRef]
3. Hou, H.-H.; Wang, Y.-N.; Chang, C.-L.; Yang, R.-J.; Fu, L.-M. Rapid glucose concentration detection utilizing
disposable integrated microfluidic chip. Microfluid. Nanofluid. 2011, 11, 479–487. [CrossRef]
4. Ye, M.Y.; Yin, X.F.; Fang, Z.L. DNA separation with low-viscosity sieving matrix on microfabricated
polycarbonate microfluidic chips. Anal. Bioanal. Chem. 2005, 381, 820–827. [CrossRef] [PubMed]
5. Becker, H.; Gartner, C. Polymer microfabrication technologies for microfluidic systems. Anal. Bioanal. Chem.
2008, 390, 89–111. [CrossRef] [PubMed]
6. Ragsdale, V.; Li, H.; Sant, H.; Ameel, T.; Gale, B.K. A disposable, continuous-flow polymerase chain reaction
device: Design, fabrication and evaluation. Biomed. Microdev. 2016, 18, 62. [CrossRef] [PubMed]
7. Tennico, Y.H.; Koesdjojo, M.T.; Kondo, S.; Mandrell, D.T.; Remcho, V.T. Surface modification-assisted bonding
of polymer-based microfluidic devices. Sens. Actuators B Chem. 2010, 143, 799–804. [CrossRef]
8. Kim, K.; Park, S.W.; Yang, S.S. The optimization of PDMS-PMMA bonding process using silane primer.
BioChip J. 2010, 4, 148–154. [CrossRef]
9. Liu, J.; Qiao, H.; Liu, C.; Xu, Z.; Li, Y.; Wang, L. Plasma assisted thermal bonding for PMMA microfluidic
chips with integrated metal microelectrodes. Sens. Actuators B Chem. 2009, 141, 646–651. [CrossRef]
10. Nguyen, T.P.; Tran, B.M.; Lee, N.Y. Thermally robust and biomolecule-friendly room-temperature bonding
for the fabrication of elastomer-plastic hybrid microdevices. Lab Chip 2016, 16, 3251–3259. [CrossRef]
[PubMed]
11. Shinohara, H.; Mizuno, J.; Shoji, S. Low-temperature direct bonding of poly(methyl methacrylate) for
polymer microchips. IEEJ Trans. Electr. Electron. Eng. 2007, 2, 301–306. [CrossRef]
12. Kasahara, T.; Matsunami, S.; Edura, T.; Oshima, J.; Adachi, C.; Shoji, S.; Mizuno, J. Fabrication and
performance evaluation of microfluidic organic light emitting diode. Sens. Actuators A Phys. 2013, 195,
219–223. [CrossRef]
Micromachines 2017, 8, 284 6 of 6

13. Umbrecht, F.; Müller, D.; Gattiker, F.; Boutry, C.M.; Neuenschwander, J.; Sennhauser, U.; Hierold, C. Solvent
assisted bonding of polymethylmethacrylate: Characterization using the response surface methodology.
Sens. Actuators A Phys. 2009, 156, 121–128. [CrossRef]
14. Hsu, Y.C.; Chen, T.Y. Applying Taguchi methods for solvent-assisted PMMA bonding technique for static
and dynamic micro-TAS devices. Biomed. Microdev. 2007, 9, 513–522. [CrossRef] [PubMed]
15. Park, T.; Song, I.-H.; Park, D.S.; You, B.H.; Murphy, M.C. Thermoplastic fusion bonding using a
pressure-assisted boiling point control system. Lab Chip 2012, 12, 2799–2802. [CrossRef] [PubMed]
16. Nayak, N.C.; Yue, C.Y.; Lam, Y.C.; Tan, Y.L. Thermal bonding of PMMA: Effect of polymer molecular weight.
Microsyst. Technol. 2009, 16, 487–491. [CrossRef]
17. Yu, S.; Ng, S.P.; Wang, Z.; Tham, C.L.; Soh, Y.C. Thermal bonding of thermoplastic elastomer film to PMMA
for microfluidic applications. Surf. Coat. Technol. 2017, 320, 437–440. [CrossRef]
18. Chen, P.-C.; Liu, Y.-M.; Chou, H.-C. An adhesive bonding method with microfabricating micro pillars to
prevent clogging in a microchannel. J. Micromech. Microeng. 2016, 26, 045003. [CrossRef]
19. Tan, H.Y.; Loke, W.K.; Nguyen, N.-T. A reliable method for bonding polydimethylsiloxane (PDMS) to
polymethylmethacrylate (PMMA) and its application in micropumps. Sens. Actuators B Chem. 2010, 151,
133–139. [CrossRef]
20. Bilenberg, B.; Nielsen, T.; Clausen, B.; Kristensen, A. PMMA to SU-8 bonding for polymer based lab-on-a-chip
systems with integrated optics. J. Micromech. Microeng. 2004, 14, 814–818. [CrossRef]
21. Zhang, Z.; Wang, X.; Luo, Y.; He, S.; Wang, L. Thermal assisted ultrasonic bonding method for poly(methyl
methacrylate) (PMMA) microfluidic devices. Talanta 2010, 81, 1331–1338. [CrossRef] [PubMed]
22. Rouabah, F.; Fois, M.; Ibos, L.; Boudenne, A.; Picard, C.; Dadache, D.; Haddaoui, N. Mechanical and thermal
properties of polycarbonate, part 1: Influence of free quenching. J. Appl. Polym. Sci. 2008, 109, 1505–1514.
[CrossRef]
23. Martini, T.; Steinkirchner, J.; Gosele, U. The Crack Opening Method in Silicon Wafer Bonding: How Useful Is
It? J. Electrochem. Soc. 1997, 144, 354–357. [CrossRef]
24. Materials Data Book. Cambridge University Engineering Department: 2003. Available online: http://www-
mdp.eng.cam.ac.uk/web/library/enginfo/cueddatabooks/materials.pdf (accessed on 19 September 2017).
25. Fan, Y.; Li, H.; Yi, Y.; Foulds, I.G. PMMA to Polystyrene bonding for polymer based microfluidic systems.
Microsyst. Technol. 2014, 20, 59–64. [CrossRef]

© 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access
article distributed under the terms and conditions of the Creative Commons Attribution
(CC BY) license (http://creativecommons.org/licenses/by/4.0/).