Accelerating Fea

Best Practices in Accelerating FEA
in Abaqus, Ansys , ®
and NX Nastran
Dr. Gil Sharon
9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

© 2004 – 2010
Speaker Bio: Gil Sharon
o Senior Application Engineer. email: gsharon@dfrsolutions.com

o Research focus:
o Mechanical reliability of electronic systems and components
o Multidisciplinary reliability of complex electro mechanical systems
o Characterization and modeling of material behavior
o Physics of failure of electromechanical and MEMS system
o Mechanical performance of flip chip packages
o Doctoral research
o Solder reliability
o MEMS structures characterization
o Embedded components failure analysis
o Particle beam accelerator mechanical fatigue.
2 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

Agenda
o Overview
o Board and BGA model creation
o Inserting a board to an enclosure
o Abaqus/ANSYS WB
o Adding a stiffener
o ANSYS classic
o Nastran as the solver

o New feature
o Creating a model for BGA packages

o Via modeling

Overview
o Finite element analysis of can be used to simulate several issues in board design
o Vibration
o Random vibration
o Harmonic vibration
o Modal Frequency analysis
o Board bending
o In circuit test (Static structural)
o Mechanical shock (Transient dynamic)
o Thermo-mechanical induced issues
o Solder fatigue analysis
o Stresses in vias during reflow
o Warpage
o This webinar concentrates on how Sherlock can accelerate the analysis capabilities
of FEA solvers.
o Faster model creation
o Automated processing of FEA results to reliability predictions
o In some cases

Board and BGA Model Creation
o A PCB model consists of: o BGA models consist of:

o Components o Solder Balls
o Leads/BGA solder balls o Custom Patterns

o Component body o Laminate
o Board o Die
o Copper o Overmold/ Bare die
o Resin o Passives
o Laminate o Laminate models

o Stiffeners/mounts o Uniform properties
o Enclosure or chassis is not o Layer by layer
part of the board o Mosaic

PCB Model in Sherlock
o Import the board from eCAD files

o Verify the component placement
o Location
o Rotation
o Enter the component properties

o Verify the board properties
o Export the board to FEA

Open a Design File Directly From ODB++ “File.tgz”

Design Capture - Graphic Verification
o Files Viewable As PCB Layers

o Provides Feedback To The User
o Users can modify, delete and

add parts
o Users can modify mount points
o Boards can be stacked up and
assembled together
Verify Component Placement

Verify the Part Properties
o Enter the component

properties
o Loaded from part
library
o Entered by hand
o Sherlock will calculate

the reliability of
components even if they
are not exported to the
FEA
o Based on component
location

Verify the Board Properties
o From the material

properties of each
layer Sherlock
calculates:
o Thickness
o Density
o CTE x-y
o CTE z
o Modulus x-y
o Modulus z
o Using the built-in

laminate data
library

Exporting the Board from Sherlock
Geometry
o Right click and select o
o Selected components on the

“Export FEA Model” board
o Creates mount point, heat sink,
wire bond etc.
o PCB geometry including drill
holes and cutouts
o Assembly of all the parts in the
correct location
o Tied contacts for everything
o Merged mesh option
o Materials
o Select o Materials for each material
option defined in Sherlock
o Material for the board

Inserting a Board to an Enclosure (ANSYS WB)
o Export the model as a step file and import it to ANSYS

workbench
o Import the chassis file

Inserting a Board to an Enclosure (ANSYS WB)
o Use the Sherlock plugin to read the materials for each

part and the board
o Apply the material of the case
o Mesh the model

o Run the analysis

Inserting a Board to an Enclosure (ABAQUS)
o Export the model as an ABAQUS file and import it
o Import the enclosure, mesh and run

o Results in ABAQUS:
Board Inside Case
o After the analysis is completed we

can import the results to Sherlock for
reliability predictions
o Imported results in Sherlock:
Board In Abaqus Board In Sherlock
o After the analysis is completed

Sherlock can export the results with
the usual report
Adding a Stiffener (ANSYS Classic)
o Export model as ANSYS APDL
o Read input from…

Adding a Stiffener (ANSYS Classic)
o Model the additional

bracket
o Apply the loads
o Run the analysis
o Import the results to
Sherlock to produce a
reliability prediction

NX Nastran and Sherlock
o New feature
o Sherlock can now use NX Nastran as an FEA
solver
o Natural frequencies
o ICT
o Random vibration
o Harmonic vibration
o Mechanical Shock
o Sherlock can also export native NX Nastran

files (*.bdf) that can be opened and modified
in the GUI
o Results from NX Nastran can be imported for
analysis in Sherlock
o The *.pch result files are supported

Creating a Model for BGA Packages
o Example: overmold BGA with passives

o Sherlock can export a detailed mesh for all the layers of

the BGA
Detailed Mesh
Bottom Layer BGA Layout

o Option for using the Sherlock BGA Bottom

calculated material properties for each
layer
o Sherlock can also export the
Laminate/PCB as a uniform material
o If you have material properties
from test
o Simplification
PCB Layout PCB Top

o Example: PoP BGA

PoP Overmold PoP Substrate PoP Die PoP Solder
PCB
BGA Substrate BGA Die BGA Solder

o Each package has a die, substrate and BGA balls
o The PoP BGA is overmolded
o PoP BGA created in Sherlock
Sherlock Created Ball
Detailed Ball
o Sherlock will create all the BGA

balls with a simplified geometry
o It is up to the user to mesh the
model in the FEA tool

o Let’s take a closer look at a simpler PoP Package
PoP BGA
PoP BGA Main BGA
PoP BGA Assembly in Ansys

PoP BGA Assembly in Abaqus
PoP BGA Example

Via modeling
o Up until recently it was

prohibitively expensive to
model plated microvias
o Model creation time
o Solvers
o Current solvers have the

power necessary to
compute results for thermo-
Flange
mechanical issues
o Via modeling is performed
in Sherlock and exported Stacked Via
to Abaqus or Ansys
Buried Via Through Via

Via modeling – Scaling the Problem
o Mesh portions of the PCB Stacked Via

o Appropriate for many layers
o Mesh a complete board
o Low layer count
o A 10X10 [mm] area with a 50X50 [µm]

mesh size
o Each layer will have 40,000 elements
o 8 layers will have 600,000 elements!!

Via Modeling - Model Methodology
o Automate the extraction of accurate Sherlock Traces Original Layout

three-dimensional conductor
geometry from traditional electronic
CAD-to-CAM files formats
o Gerber, ODB, IPC 2581, GDS II
and MCM
o Interfaces between materials
o Identification of either vector
data or image representation.
o Circular features in positive
(copper) and negative
(laminate) space are configured
for mesh creation through
defeaturing and computation of
arc length segments.

Via Modeling – Closer Look
o Curved traces and other features are translated into

poly-lines using an advanced edge-detection algorithm
developed by DfR Solutions
o Segment-generating algorithm
o Users select four variables for Sherlock to smooth
out small features
Finer Features

Via Modeling – Abaqus Model import
o Sherlock creates a Python script for

ABAQUS
o The geometry is organized in
selectable geometry sets
Finer Features

Via Modeling – ANSYS Classic
o Sherlock creates an APDL script for Ansys

o The geometry is organized in selectable components

Extra: Combine Sherlock FEA Features
Trace modeling
PCB cutout
Lead modeling

Summary (If you remember nothing else…)
o Shorten model creation times for Abaqus, Ansys

Workbench, Ansys Classic and Nastran.
o Leverage Sherlock’s libraries and easy interface to
automate your analysis
o Import FEA results to Sherlock and produce a reliability
prediction
o Computing power is increasing and with it the model
complexity.
o Solving ~2M elements is not a problem
o Engineer time is more valuable than computer time

Questions?
o Presenter email: gsharon@dfrsolutions.com

o Sales contact: sales@dfrsolutions.com

Accelerating Fea

Caricato da

Informazioni sul documento

Titolo originale

Copyright

Formati disponibili

Condividi questo documento

Condividi o incorpora il documento

Opzioni di condivisione

Hai trovato utile questo documento?

Questo contenuto è inappropriato?

Copyright:

Formati disponibili

Accelerating Fea

Caricato da

Copyright:

Formati disponibili

Best Practices in Accelerating FEA

9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Senior Application Engineer. email: gsharon@dfrsolutions.com

o Multidisciplinary reliability of complex electro mechanical systems

o Characterization and modeling of material behavior

o Physics of failure of electromechanical and MEMS system

o Mechanical performance of flip chip packages

o MEMS structures characterization

o Embedded components failure analysis

o Particle beam accelerator mechanical fatigue.

2 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Nastran as the solver

o Creating a model for BGA packages

3 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

4 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o A PCB model consists of: o BGA models consist of:

o Leads/BGA solder balls o Custom Patterns

o Copper o Overmold/ Bare die

o Laminate o Laminate models

o Enclosure or chassis is not o Layer by layer

part of the board o Mosaic

5 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Import the board from eCAD files

o Enter the component properties

6 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

7 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Files Viewable As PCB Layers

o Users can modify, delete and

9 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Enter the component

o Sherlock will calculate

10 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o From the material

o Using the built-in

11 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Selected components on the

12 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Export the model as a step file and import it to ANSYS

o Import the chassis file

13 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Use the Sherlock plugin to read the materials for each

o Mesh the model

14 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Export the model as an ABAQUS file and import it

o Import the enclosure, mesh and run

15 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o After the analysis is completed we

o Imported results in Sherlock:

Board In Abaqus Board In Sherlock

o After the analysis is completed

o Export model as ANSYS APDL

o Read input from…

18 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Model the additional

19 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Sherlock can also export native NX Nastran

20 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Example: overmold BGA with passives

21 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Sherlock can export a detailed mesh for all the layers of

Bottom Layer BGA Layout

22 9000 Virginia Manor Rd Ste. 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

o Option for using the Sherlock BGA Bottom