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TYPICAL APPLICATION
Basic Connection
LTC6655-2.5
Low Frequency 0.1Hz to 10Hz Noise (LTC6655-2.5)
3V < VIN ≤ 13.2V VIN VOUT_F VOUT
CIN SHDN VOUT_S
0.1µF COUT
GND 10µF
6655 TA01a
500nV/DIV
Basic Connection with Noise Reduction
LTC6655LN-2.5
3V < VIN ≤ 13.2V VIN VOUT VOUT
CIN SHDN NR COUT
0.1µF 10µF 6655 TA01b
GND CNR 1s/DIV
10µF 6655 TA01c
Rev. G
PIN CONFIGURATION
LTC6655 LTC6655LN
TOP VIEW TOP VIEW
SHDN 1 8 GND SHDN 1 8 GND
VIN 2 7 VOUT_F VIN 2 7 VOUT_F
GND 3 6 VOUT_S GND 3 6 NR
GND 4 5 GND GND 4 5 GND
MS8 PACKAGE MS8 PACKAGE
8-LEAD PLASTIC MSOP 8-LEAD PLASTIC MSOP
TJMAX = 150°C, θJA = 300°C/W TJMAX = 150°C, θJA = 300°C/W
STAR ALL GND CONNECTIONS AT PIN 4 STAR ALL GND CONNECTIONS AT PIN 4
LTC6655
TOP VIEW
GND
8
SHDN 1 7 VOUT_F
VIN 2 6 VOUT_S
GND 3 5 GND
4
GND
LS8 PACKAGE
8-PIN LEADLESS CHIP CARRIER (5mm × 5mm)
TJMAX = 150°C, θJA = 120°C/W
STAR ALL GND CONNECTIONS AT PIN 4
Rev. G
Rev. G
Rev. G
Rev. G
Note 1: Stresses beyond those listed under Absolute Maximum Ratings noise measurements will yield larger and smaller peak values in a given
may cause permanent damage to the device. Exposure to any Absolute measurement interval. By repeating the measurement for 1000 intervals,
Maximum Rating condition for extended periods may affect device each 10 seconds long, it is shown that there are time intervals during
reliability and lifetime. which the noise is higher than in a typical single interval, as predicted by
Note 2: Precision may be affected if the parts are stored outside of the statistical theory. In general, typical values are considered to be those for
specified temperature range. Large temperature changes may cause which at least 50% of the units may be expected to perform similarly or
changes in device performance due to thermal hysteresis. For best better. For the 1000 interval test, a typical unit will exhibit noise that is
performance, extreme temperatures should be avoided whenever possible. less than the typical value listed in the Electrical Characteristics table in
Note 3: The stated temperature is typical for soldering of the leads during more than 50% of its measurement intervals. See Application Note 124 for
manual rework. For detailed IR reflow recommendations, refer to the noise testing details. RMS noise is measured with a spectrum analyzer in a
Applications Information section. shielded environment.
Note 4: Temperature coefficient is measured by dividing the maximum Note 8: Long-term stability typically has a logarithmic characteristic and
change in output voltage by the specified temperature range. therefore, changes after 1000 hours tend to be much smaller than before
that time. Total drift in the second thousand hours is normally less than
Note 5: Load regulation is measured on a pulse basis from no load to
one-third that of the first thousand hours with a continuing trend toward
the specified load current. Load current does not include the 2mA sense
reduced drift with time. Long-term stability is also affected by differential
current. Output changes due to die temperature change must be taken into
stresses between the IC and the board material created during board
account separately.
assembly.
Note 6: Excludes load regulation errors. Minimum supply for the
Note 9: Hysteresis in output voltage is created by mechanical stress
LTC6655‑1.25, LTC6655-2.048 and LTC6655-2.5 is set by internal
that differs depending on whether the IC was previously at a higher or
circuitry supply requirements, regardless of load condition. Minimum
lower temperature. Output voltage is always measured at 25°C, but
supply for the LTC6655-3, LTC6655-3.3, LTC6655-4.096 and LTC6655-5
the IC is cycled to the hot or cold temperature limit before successive
is specified by load current.
measurements. Hysteresis is roughly proportional to the square of the
Note 7: Peak-to-peak noise is measured with a 2-pole highpass filter at temperature change. For instruments that are stored at well controlled
0.1Hz and 3-pole lowpass filter at 10Hz. The unit is enclosed in a still-air temperatures (within 20 or 30 degrees of operational temperature),
environment to eliminate thermocouple effects on the leads, and the hysteresis is usually not a significant error source. Typical hysteresis is the
test time is 10 seconds. Due to the statistical nature of noise, repeating worst case of 25°C to cold to 25°C or 25°C to hot to 25°C, preconditioned
by one thermal cycle.
Rev. G
–20
1.2498
–30
6655 G01
1.2496 –40
1s/DIV –50 –25 0 25 50 75 100 125 0.001 0.01 0.1 1 10
TEMPERATURE (°C) OUTPUT CURRENT (mA)
6655 G03
6655 G02
160 –40°C
5mA
30 IOUT
NOISE VOLTAGE (nV/√Hz)
0mA
120 25
20
VOUT
80 15 10mV/DIV
10
40
2.7µF COUT = 3.3µF 200µs/DIV 6655 G06
5 10µF
100µF
0 0
0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 1000
OUTPUT CURRENT (mA) FREQUENCY (kHz)
6655 G04 6655 G05
–5mA 10
NUMBER OF PARTS
40
8
30
VOUT 6
10mV/DIV
20
4
0 0
0 2 4 6 8 10 12 14 1.2495 1.2498 1.2500 1.2503 1.2505
INPUT VOLTAGE (V) VOUT (V)
6655 G08 6655 G09
Rev. G
–30
2.4995
–40 125°C
25°C
–40°C
6655 G10 2.4990 –50
1s/DIV –50 0 50 100 150 0.001 0.01 0.1 1 10
TEMPERATURE (°C) OUTPUT CURRENT (mA) 6655 G12
6655 G11
120
6
SUPPLY CURRENT (mA)
2.5V Minimum VIN – VOUT 2.5V Minimum VIN – VOUT 2.5V Output Voltage Noise
Differential (Sourcing) Differential (Sinking) Spectrum
10 120
10
COUT = 2.7µF
100
OUTPUT CURRENT (mA)
1 80 COUT = 10µF
1
COUT = 100µF
60
0.1 0.1 40
125°C 125°C 20
25°C 25°C
–40°C –40°C
0.01 0.01 0
0.01 0.1 1 –0.15 –0.05 0.05 0.15 0.01 0.1 1 10 100 1000
INPUT – OUTPUT VOLTAGE (V) INPUT – OUTPUT VOLTAGE (V) 6655 G17
FREQUENCY (kHz)
6655 G16 6655 F01
Rev. G
NUMBER OF PARTS
60 1.5
VTRIP (V)
8
50
VTH_DN
40 6 1.0
30 4
20 0.5
2
10
0 0 0.0
2.4992 2.4996 2.5000 2.5004 2.5008 0 0.4 0.8 1.2 1.6 2 2.4 2.8 2 4 6 8 10 12 14
VOUT (V) DRIFT (ppm/C) VIN (V) 6655 G21
6655 G19 6655 G20
COUT = 10µF
100 COUT = 100µF
2.501
OUTPUT IMPEDENCE (Ω)
80 1
60 2.500
40 0.1
2.499
20 COUT = 2.7µF 125°C
COUT = 10µF 25°C
COUT = 100µF –40°C
0 0.01 2.498
0.001 0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100 1000 0 2 4 6 8 10 12 14
FREQUENCY (kHz) 6655 G22
FREQUENCY (kHz) INPUT VOLTAGE (V)
6655 G23 6655 G24
Rev. G
4.9990
–40 125°C
25°C
–40°C
6655 G25
4.9985 –50
1s/DIV –50 –25 0 25 50 75 100 125 0.01 0.1 1 10
TEMPERATURE (°C) OUTPUT CURRENT (mA)
6655 G26 6655 G27
–40°C
160
NOISE VOLTAGE (nV/√Hz)
SUPPLY CURRENT (mA)
140
60 4
120
40 3 100
80
20 2 60
40
0 1 125°C 2.7µF
25°C 20 10µF
–40°C 100µF
–20 0 0
0.01 0.1 1 10 0 2 4 6 8 10 12 14 0.01 0.1 1 10 100 1000
OUTPUT CURRENT (mA) INPUT VOLTAGE (V) FREQUENCY (kHz)
6655 G28 6655 G29 6655 G30
VIN
2V/DIV
OUTPUT CURRENT (mA)
1 1
VOUT
2V/DIV
0.1 0.1
50 CNR = 0.1µF
CNR = 1µF
CNR = 0.1µF 3
40
CNR = 1µF
30
2
CNR = 10µF
20
1
10
CNR = 100µF
CNR = 100µF
0 0
0.01 0.1 1 10 100 1k 0.01 0.1 1 10
FREQUENCY (kHz) FREQUENCY (kHz)
6655 G34 6655 G35
400
200
0
–200
–400
–600
–800
–1000
–1000 –750 –500 –250 0 250 500 750 1000
CURRENT INJECTED INTO THE NR PIN (nA)
6655 G36
Rev. G
BLOCK DIAGRAM
LTC6655
VIN
2
+
SHDN VOUT_F
1 BANDGAP 7
–
VOUT_S
6
GND
4 6655 BD
GND
3,5,8
LTC6655LN
NR
6
VIN
2
+
SHDN VOUT_F
1 BANDGAP 7
GND
4 6655LN BD
GND
3,5,8
Rev. G
Rev. G
were produced with the test circuit shown in Figure 2 Figure 1. Output Voltage Noise Spectrum
unless otherwise indicated.
The turn-on time is slew limited and determined by the VOUT 100Ω
7
short-circuit current, the output capacitor, and output volt- VIN 1,2
LTC6655-2.5 6
age as shown in the equation: 3V
CIN COUT VGEN 0.5V
0.1µF 3.3µF
6655 F02
3,4,5,8
COUT
tON = VOUT •
ISC Figure 2. Transient Load Test Circuit
For example, the LTC6655-2.5V, with a 3.3µF output
capacitor and a typical short-circuit current of 20mA, the
start-up time would be approximately: VIN
2V/DIV
3.3 • 10 –6 F
2.5V • = 412µs
0.02A VOUT
1V/DIV
Shutdown Mode
The LTC6655 family of references can be shut down by
VOUT
tying the SHDN pin to ground. There is an internal pull-up 50mV/DIV
resistor tied to this pin. If left unconnected this pin rises to
VIN and the part is enabled. Due to the low internal pull-up 6655 F04
COUT = 3.3µF 400µs/DIV
current, it is recommended that the SHDN pin be pulled
high externally for normal operation to prevent accidental Figure 4. Output Response with a 500mV Step On VIN
Rev. G
6655 F09
2mA
IOUT Figure 9. Open-Drain Shutdown Circuit
–2mA
Long-Term Drift
VOUT
10mV/DIV
Long-term drift cannot be extrapolated from accelerated
high temperature testing. This erroneous technique gives
6655 F07
drift numbers that are wildly optimistic. The only way
COUT = 3.3µF 200µs/DIV
long-term drift can be determined is to measure it over
Figure 7. Output Response Showing a the time interval of interest.
Sinking to Sourcing Transition
The LTC6655 long-term drift data was collected on 80
parts that were soldered into printed circuit boards similar
to a real world application. The boards were then placed
SHDN
2V/DIV
into a constant temperature oven with a TA = 35°C, their
outputs were scanned regularly and measured with an
8.5 digit DVM. Typical long-term drift is illustrated in
VOUT Figure 10a. The hermetic LS8 package provides additional
1V/DIV
stability as shown in Figure 10b.
6655 F08
COUT = 3.3µF 1ms/DIV
NUMBER OF UNITS
20
40
15
0
10
–40
5
–80 0
0 500 1000 1500 2000 2500 –90 –70 –50 –30 –10 10 30 50 70 90 110
HOURS DISTRIBUTION (ppm)
6655 F11
6655 F10a
200
concern. However, PC board material may absorb water
LTC6655-2.5
160 LS8 PACKAGE
and apply mechanical stress to the LTC6655LS8. Proper
120 board materials and layout are essential.
LONG-TERM DRIFT (ppm)
80
For best stability, the PC board layout is critical. Change
40
in temperature and position of the PC board, as well as
0
aging, can alter the mechanical stress applied to compo-
–40
nents soldered to the board. FR4 and similar materials
–80
–120
also absorb water, causing the board to swell. Even con-
–160
formal coating or potting of the board does not always
–200
eliminate this effect, though it may delay the symptoms
0 600 1200 1800 2400 3000 by reducing the rate of absorption.
HOURS
6655 F10b
Power and ground planes should be omitted under the
Figure 10b. Long-Term Drift LS8 voltage reference IC for best stability. Figure 12a shows
a tab cut through the PC board on three sides of an
Hysteresis LTC6655, which significantly reduces stress on the IC,
Thermal hysteresis is a measure of change of output as described in Application Note 82. For even better per-
voltage as a result of temperature cycling. Figure 11 formance, Figure 12b shows slots cut through the PC
illustrates the typical hysteresis based on data taken from board on all four sides. The slots should be as long as
the LTC6655-2.5. A proprietary design technique mini- possible, and the corners just large enough to accom-
mizes thermal hysteresis. modate routing of traces. It has been shown that for PC
boards designed in this way, humidity sensitivity can
Humidity Sensitivity be reduced to less than 35ppm for a change in relative
humidity of approximately 60%. Mounting the reference
Plastic mould compounds absorb water. With changes in
near the center of the board, with slots on four sides, can
relative humidity, plastic packaging materials change the
further reduce the sensitivity to less than 10ppm.
amount of pressure they apply to the die inside, which
can cause slight changes in the output of a voltage refer- An additional advantage of slotting the PC board is that the
ence, usually on the order of 100ppm. The LS8 package is LTC6655 is thermally isolated from surrounding circuitry.
hermetic, so it is not affected by humidity, and is therefore This can help reduce thermocouple effects and improve
more stable in environments where humidity may be a accuracy.
Rev. G
0.12
5mA LOAD
0.10
POWER (W)
LS8 0.08
0.06
NO LOAD
0.04
0.02
6655 F12a
0
Figure 12a. 3-Sided PCB Tab Cutout 0 5 10 15
VIN (V)
6655 F13
125
115
NO LOAD
OPERATING TEMPERATURE (°C)
LS8 105
MAXIMUM AMBIENT
5mA LOAD
95
85
75
6655 F12b 65
Rev. G
Rev. G
20
15V 0.15µF 10V
+ A = 100 AND
1µF A1 10k 0.1Hz TO 10Hz FILTER
LT1012 0.1µF
– Q3 –
2N2907 15V 2k A4
A = 104 –15V
+ LT1012
–15V 1k* 200Ω* A3 124k* 124k*
LOW NOISE 1µF
LT1012 +
PRE-AMP
1µF 450Ω* 900Ω* 0.1µF
– 1M*
– 330µF
+
9V
100k 100k A2 16V
LT1097
1300µF T 10k*
SHIELD + 330µF
5 16V
S Q1 Q2 0.022µF
+
LTC6655
+
IN 100k* 330Ω* 100Ω*
2.5V F
SD **1.2k
IN OUT 10k
– INPUT
1µF 750Ω* 10Ω* +
330µF ROOT-SUM-SQUARE
LTC6655/LTC6655LN
16V CORRECTION
REFERENCE –15V SEE TEXT
UNDER TEST 330µF
16V
AC LINE GROUND SHIELDED CAN
+
APPLICATIONS INFORMATION
RESET PULSE
GENERATOR
0.22µF 10k
PEAK TO PEAK +15V
4.7k NOISE DETECTOR +15V
C2 RC2
RST = Q2 BAT-85
+V B2
– + 74C221
RST A5 + PEAK A7
1µF P BAT-85
1/4 LT1058 1/4 LT1058
+ –
1k
CLR2 A2 10k +15V
+15V
4.7k + 1k
– PEAK A8 * = 1% METAL FILM Q1, Q2 = THERMALLY MATED
1/4 LT1058 ** = 1% WIREWOUND, ULTRONIX105A 2SK369 (MATCH VGS 10%)
OR LSK389 DUAL T = TANTALUM,WET SLUG
– – = 1N4148 THERMALLY LAG ILEAK < 5nA
RST A6 SEE TEXT SEE TEXT/APPENDIX B
1µF P 100k
1/4 LT1058
= 2N4393 P = POLYPROPELENE
+
A4 330µF OUTPUT CAPACITORS = <200nA LEAKAGE
= 1/4 LTC202 AT 1VDC AT 25°C
10k
15V
SEE APPENDIX C FOR POWER, SHIELDING
0.005µF AND GROUNDING SCHEME 6655 F17
Rev. G
LTC6655/LTC6655LN
APPLICATIONS INFORMATION
35 the typical application circuit with a capacitor on the NR
30 pin. When a capacitor is placed between NR and ground,
a LPF is formed.
NUMBER OF OBSERVATIONS
25
20 2
VIN LTC6655LN
15
R3
VOUT
10 BANDGAP +
7
5
– R1 2.7µF
0
450 550 650 750 850 950 R2
PEAK-TO-PEAK NOISE (nV)
6655 F18
GND NR
6
Figure 18. LTC6655-2.5 Low Frequency Noise Histogram 3, 4, 5, 8 6655 F20
CNR
200
The LPF reduces the wide band noise from the bandgap
120
circuit before it reaches the output buffer. This is very
80
different from placing a LPF after the reference. A LPF
following the buffer would cause poor load regulation and
40
slow down the response affecting dynamic performance.
With the LPF internally placed before the low noise buffer,
0 the buffer response is not impeded by the LPF. Placing
0.1 1 10 100
FREQUENCY (Hz)
anything between the output buffer and the converter will
6655 F19 likely add noise or cause an error such as a load regulation
Figure 19. LTC6655-2.5 Low Frequency Noise Spectrum
error, or a dynamic response error.
The value of resistor R3 is slightly different depending
It should be noted from Figure 19 that the LTC6655 has on the voltage option. Tables 3 and 4 below list the resis-
not only a low wideband noise, but an exceptionally low tance values of R3 for the three available voltage options
flicker noise corner of 1Hz! This substantially reduces along with the 3dB cutoff frequencies for four decades of
low frequency noise, as well as long-term variation in capacitor values.
peak noise. Table 3. Resistance Value of R3 for the Three Voltage Options
2.500 4.096 5.000 V
Noise Reduction and the NR Pin
R3 ±15% 5305 4233 3969 Hz
The LTC6655LN provides access to an internal circuit
node preceding the output buffer so that dynamic per- Table 4. The 3dB Cutoff Frequencies for Different Values of CNR
formance is not affected. This facilitates the use of a low CNR 2.500 4.096 5.000 V
pass filter (LPF) to reduce wide band noise.
0.1µF 5305 4233 3969 Hz
The Block Diagram section illustrates the LTC6655LN 1µF 531 423 397 Hz
architectural differences. The Low Noise version trades 10µF 53 423 397 Hz
out the Kelvin sense pin for the NR pin. Figure 20 shows 100µF 5.3 4.2 4.0 Hz
Rev. G
50
CNR = 1µF
pin to settle to 0.025% of its final value. The output buffer
40 CNR = 0.1µF
will follow the NR pin signal with some delay depending
30 on the capacitive loading on the VOUT pin.
20 Example start-up measurements are shown in Figures 23a,
10 23b, and 23c. Figure 23a shows the difference between
CNR = 100µF
using no capacitor and a 1μF capacitor on the NR pin.
0
0.01 0.1 1 10 100 1k Figures 23b and 23c show the start-up with CNR = 10μF
FREQUENCY (kHz)
6655 F21 and 100μF, respectively.
Figure 21. The LTC6655LN-2.5 Output Voltage
Noise Spectrum Using the CNR Capacitor IR Reflow Shift
The mechanical stress of soldering a part to a board can
5
COUT = 2.7µF
cause the output voltage to shift. Moreover, the heat of
an IR reflow or convection soldering oven can also cause
4 the output voltage to shift. The materials that make up a
INTEGRATED NOISE (µVRMS)
CNR = 0.1µF
semiconductor device and its package have different rates
3
CNR = 1µF
of expansion and contraction. After a part undergoes the
extreme heat of a lead-free IR reflow profile, like the one
2
CNR = 10µF shown in Figure 24, the output voltage shifts. After the
1
device expands, due to the heat, and then contracts, the
stresses on the die have changed position. This shift is
0
CNR = 100µF similar, but more extreme than thermal hysteresis.
0.01 0.1 1 10
FREQUENCY (kHz) Experimental results of IR reflow shift are shown below
in Figure 25. These results show only shift due to reflow
6655 F22
Rev. G
TEMPERATURE (°C)
500mV/DIV tP
TS = 190°C 30s
150 T = 150°C
CNR = 1µF
VOUT tL
1V/DIV RAMP TO 130s
150°C
COUT = 2.7µF
75
6655 F23a 40s
1ms/DIV
120s
Figure 23a. CNR = Open and 10µF 0
0 2 4 6 8 10
MINUTES 6655 F24
VIN
5V/DIV
Figure 24. Lead-Free Reflow Profile
VNR
500mV/DIV 8
7
VOUT
1V/DIV 6
CNR = 10µF
NUMBER OF UNITS
COUT = 2.7µF 5
6655 F23b
10ms/DIV 4
VIN 1
5V/DIV
0
–0.029 –0.023 –0.017 –0.011 –0.005
VNR OUTPUT VOLTAGE SHIFT DUE TO IR REFLOW (%)
500mV/DIV 6655 F25
Rev. G
4V TO 30V 6V TO 80V
R1 R2
R1 100k 4.7k ON SEMI
LTC6655-2.5 MMBT5551
VIN VOUT_F VOUT C1
BZX84C12
0.1µF
C1 SHDN VOUT_S C2
BZX84C12 0.1µF
0.1µF 10µF
GND
6655 TA02 VIN SHDN
VOUT_F VOUT
LTC6655-2.5
VOUT_S C2
GND 10µF
6655 TA03
Rev. G
VIN VOUT
VIN VOUT_F
VOUT + 0.5V TO 13.2V 2.5V TO 4.5V
C1 LTC6655-2.5 R C2
1µF 10µF
SHDN VOUT_S
R = 0k to 1k
GND 6655 TA07
VIN VOUT
VIN VOUT_F
VOUT + 0.5V TO 13.2V VIN 5V
C1 LTC6655-2.5 C2
1µF LT1677 + + R1 10µF
SHDN VOUT_S 10k
RLOAD
GND
––
R2
10k
R3 6655 TA08
5k
VOUT = VOLTAGE OPTION • (1 + R1/R2) FOR R1, R2 AND R3 USE LT5400-1.
THIS EXAMPLE USES 2.5V AS THE WITH A PRECISION ARRAY THE
VOLTAGE OPTION MATCHING AND LOW TC WILL HELP
PRESERVE LOW DRIFT. R3 = R1||R2
R3 IS MADE WITH TWO PRALLEL 10k
RESISTORS, AVAILABLE IN THE
LT5400-1
IN LT3042
VIN
6V ±5%
4.7µF 100µA
–
EN/UV
+
PGFB OUT VOUT = 5V
1,2 IOUT(MAX)
6,7 200mA
PG OUTS
LTC6655-5
SET GND ILIM 4.7µF
3,4,5,8
1k
6655 TA08
Rev. G
LTC6655-2.5
3V TO SHDN VOUT_F
13.2V R1
32.4Ω VOUT
VIN VOUT_S
C1 GND C2 C9
0.1µF 2.7µF 4.7µF
LTC6655-2.5
SHDN VOUT_F R2
32.4Ω
VIN VOUT_S
C3 GND C4
0.1µF 2.7µF
LTC6655-2.5
SHDN VOUT_F R3
32.4Ω
VIN VOUT_S
C5 GND C6
0.1µF 2.7µF
LTC6655-2.5
SHDN VOUT_F R4
32.4Ω
VIN VOUT_S
6655 TA09a
C7 GND C8
0.1µF 2.7µF
200nV/
DIV
6655 TA09b
1s/DIV
320nVP-P
0.1Hz to 10Hz
Rev. G
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev G)
0.889 ±0.127
(.035 ±.005)
5.10
(.201) 3.20 – 3.45
MIN (.126 – .136)
3.00 ±0.102
0.42 ± 0.038 0.65 (.118 ±.004) 0.52
(.0165 ±.0015) (.0256) (NOTE 3) 8 7 6 5 (.0205)
TYP BSC REF
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
4.90 ±0.152
DETAIL “A” (.118 ±.004)
0.254 (.193 ±.006)
(NOTE 4)
(.010)
0° – 6° TYP
GAUGE PLANE
1 2 3 4
0.53 ±0.152
(.021 ±.006) 1.10 0.86
(.043) (.034)
DETAIL “A” MAX REF
0.18
(.007)
SEATING
PLANE 0.22 – 0.38 0.1016 ±0.0508
(.009 – .015) (.004 ±.002)
TYP 0.65 MSOP (MS8) 0213 REV G
(.0256)
NOTE:
BSC
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
Rev. G
7
1
2 0.5 6
2.54 ±0.15
1.4
1.50 ±0.15
XYY ZZ
4 ABCDEF
Q12345
e4
0.70 ±0.05 × 8 COMPONENT
PIN “A1”
5.00 SQ ±0.15
5.80 SQ ±0.15
TRAY PIN 1
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
5.00 SQ ±0.15
4.20 SQ ±0.10 1.45 ±0.10
5.00 SQ ±0.15
0.95 ±0.10 R0.20 REF
8 8
2.00 REF
PIN 1 1
1 TOP MARK 7 7
(SEE NOTE 5)
2 6 6 0.5 2
4.20 ±0.10 2.54 ±0.15
1.4
5 3
3 5 R0.20 REF
1.00 × 7 TYP
Rev. G
Rev. G
29
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Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For moreby
is granted information www.analog.com
implication or otherwise under any patent or patent rights of Analog Devices.
LTC6655/LTC6655LN
TYPICAL APPLICATION
Low Noise Precision 24-Bit Analog-to-Digital Converter Application
2.5k
VREF 5V
7.5V
RREF
1nF
VCC
5k 400Ω CH0
CH1
MUXOUTN –
50Ω 1/2
CH2 ADCINN LTC6241
CH3
RTD +
CH4
CH5 –2.5V
CH6 MUXOUTP
CH7 2.5k
CH8 ADCINP
GND
GND
3,5,8 4
6655 TA10
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
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Package
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LTC6652 Precision Low Drift Low Noise Reference 0.05% Max, 5ppm/°C Max, –40°C to 125°C, MSOP8
LT6660 Tiny Micropower Series Reference 0.2% Max, 20ppm/°C Max, 20mA Output Current, 2mm × 2mm DFN
LTC6652LS8 High Precision, Buffered Voltage Reference Family in 0.05% Max Initial Error, 5ppm/°C Max Drift, Shutdown Current <2µA,
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LT6654LS8 Precision, Low Noise, High Output Drive Voltage Reference 1.6ppm Peak-to-Peak Noise (0.1Hz to 10Hz, Sink/Source ±10mA,
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Rev. G
30
2/19
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