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Phase leg
Part number
MDD26-08N1B
Backside: isolated
2 1 3
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222b
Rectifier Ratings
Symbol Definition Conditions min. typ. max. Unit
VRSM max. non-repetitive reverse blocking voltage TVJ = 25°C 900 V
VRRM max. repetitive reverse blocking voltage TVJ = 25°C 800 V
IR reverse current VR = 800 V TVJ = 25°C 100 µA
VR = 800 V TVJ = 150°C 1.5 mA
VF forward voltage drop IF = 40 A TVJ = 25°C 1.13 V
IF = 80 A 1.38 V
IF = 40 A TVJ = 125 °C 1.05 V
IF = 80 A 1.27 V
I FAV average forward current TC = 100 °C T VJ = 150 °C 36 A
I F(RMS) RMS forward current 180° sine 60 A
VF0 threshold voltage TVJ = 150 °C 0.80 V
for power loss calculation only
rF slope resistance 6.1 mΩ
R thJC thermal resistance junction to case 1 K/W
R thCH thermal resistance case to heatsink 0.20 K/W
Ptot total power dissipation TC = 25°C 125 W
I FSM max. forward surge current t = 10 ms; (50 Hz), sine TVJ = 45°C 650 A
t = 8,3 ms; (60 Hz), sine VR = 0 V 700 A
t = 10 ms; (50 Hz), sine TVJ = 150 °C 555 A
t = 8,3 ms; (60 Hz), sine VR = 0 V 595 A
I²t value for fusing t = 10 ms; (50 Hz), sine TVJ = 45°C 2.12 kA²s
t = 8,3 ms; (60 Hz), sine VR = 0 V 2.04 kA²s
t = 10 ms; (50 Hz), sine TVJ = 150 °C 1.54 kA²s
t = 8,3 ms; (60 Hz), sine VR = 0 V 1.48 kA²s
CJ junction capacitance VR = 400 V; f = 1 MHz TVJ = 25°C 27 pF
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222b
Date Code +
Assembly Line
Circuit
yywwAA
Part Number Data Matrix
Lot.No: xxxxxx
Ordering Ordering Number Marking on Product Delivery Mode Quantity Code No.
Standard MDD26-08N1B MDD26-08N1B Box 36 453013
I V0 R0 Rectifier
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222b
Outlines TO-240AA
2 1 3
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222b
Rectifier
800 104 60
VR = 0 V DC
50 HZ, 80% VRRM 180° sin
50
120°
60°
600 30°
40
TVJ = 45°C IFAVM
IFSM I2t
TVJ = 45°C
103 30
400 TVJ = 125°C
[A] [A]
[A2s]
TVJ = 125°C 20
200
10
0 102 0
10-3 10-2 10 -1 10 0 101 1 2 3 6 8 10 0 50 100 150 200
80 RthJA [KW]
1.5
60 2.5
3
PT
4
40 5
6
[W]
DC 8
180° sin
20 120°
60°
30°
0
0 10 20 30 40 50 60 0 50 100 150 200
250
RthJA [KW]
0.3
200 0.4
R L
0.5
Ptot
0.6
150
0.8
[W]
1.0
100 1.3
1.6
Circuit
50 B2
2x MDD26
0
0 20 40 60 80 0 50 100 150
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222b
Rectifier
400
RthJA [KW]
0.3
300 0.4
0.5
200
0.6
Ptot 0.7
150
0.8
[W] 1.0
100
1.5
Circuit
B3
50 3x MDD26
0
0 20 40 60 80 100 0 50 100 150 200
IRMS [A] TA [°C]
Fig. 6 Three phase rectifier bridge: Power dissipation versus
direct output current and ambient temperature
1.2 RthJC for various conduction angles d:
30° d RthJC [K/W]
1.0 60° DC 1.00
120°
180° 1.02
180°
0.8 120° 1.04
DC
ZthJC 60° 1.07
0.6 30° 1.10
[K/W]
Constants for ZthJC calculation:
0.4
i Rthi [K/W] ti [s]
1 0.01 0.0012
0.2
2 0.03 0.0950
3 0.96 0.4550
0
10-3 10 -2
10 -1
10 0
10 1
10 2
10 3
t [s]
Fig. 7 Transient thermal impedance junction to case (per diode)
1.5
RthJK for various conduction angles d:
30° d RthJK [K/W]
60° DC 1.20
120° 180° 1.22
180°
1.0 120° 1.24
DC
ZthJK 60° 1.27
30° 1.30
IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20161222b