FFAF30U60DN

FFAF30U60DN

Features
• High voltage and high reliability
• High speed switching
• Low forward voltage

Applications
• General purpose TO-3PF
• Switching mode power supply
1 2 3
• Free-wheeling diode for motor application
• Power switching circuits 1. Anode 2.Cathode 3. Anode

ULTRA FAST RECOVERY POWER RECTIFIER

Absolute Maximum Ratings (per diode) TC=25°°C unless otherwise noted
Symbol Parameter Value Units
VRRM Peak Repetitive Reverse Voltage 600 V
IF(AV) Average Rectified Forward Current @ TC = 100°C 30 A
IFSM Non-repetitive Peak Surge Current 180 A
60Hz Single Half-Sine Wave
TJ, TSTG Operating Junction and Storage Temperature - 65 to +150 °C

Thermal Characteristics
Symbol Parameter Value Units
RθJC Maximum Thermal Resistance, Junction to Case 0.8 °C/W

Electrical Characteristics (per diode) T C =25 °C unless otherwise noted

Symbol Parameter Min. Typ. Max. Units
V FM * Maximum Instantaneous Forward Voltage V
IF = 30A TC = 25 °C - - 2.3
IF = 30A TC = 100 °C - - 2.1
IRM * Maximum Instantaneous Reverse Current µA
@ rated VR TC = 25 °C - - 15
TC = 100 °C - - 150
trr Maximum Reverse Recovery Time - - 90 ns
Irr Maximum Reverse Recovery Current - - 8 A
Qrr Maximum Reverse Recovery Charge - - 360 nC
(IF =30A, di/dt = 200A/µs)
WAVL Avalanche Energy 1.0 - - mJ
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%

©2000 Fairchild Semiconductor International Rev. F, September 2000

www.DataSheet4U.net
 FFAF30U60DN
Typical Characteristics

60 1000

100 o
TC = 100 C

[µA]
Forward Current , IF [A]

o
10 TC = 100 C

R
10

Reverse Current , I
o 1
TC = 25 C TC = 25 C
o

1
0.1

0.01

0.1 1E-3
0.0 0.5 1.0 1.5 2.0 2.5 3.0 100 200 300 400 500 600

Forward Voltage , VF [V] Reverse Voltage , VR [V]

Figure 1. Typical Forward Voltage Drop Figure 2. Typical Reverse Current

vs. Forward Current vs. Reverse Voltage

300 100

Typical Capacitance IF = 30A

at 0V = 278 pF o
Reverse Recovery Time , trr [ns]

90 TC = 25 C
Capacitance , Cj [pF]

200 80

70

100 60

50

40
0.1 1 10 100 100 500

Reverse Voltage , V R [V] di/dt [A/µs]

Figure 3. Typical Junction Capacitance Figure 4. Typical Reverse Recovery Time

vs. di/dt

16 50
[A]

IF = 30A
F(AV)
Reverse Recovery Current , Irr [A]

14 o
TC = 25 C
40
Average Forward Current , I

12

10 30
D
C

20
6

4
10
2

0 0
100 500 60 80 100 120 140 160

di/dt [A/µs] Case Temperature , TC [ C]

o

Figure 5. Typical Reverse Recovery Current Figure 6. Forward Current Derating Curve
vs. di/dt

©2000 Fairchild Semiconductor International Rev. F, September 2000

 FFAF30U60DN
Package Dimensions

TO-3PF

5.50 ±0.20

3.00 ±0.20
4.50 ±0.20
15.50 ±0.20 ø3.60 ±0.20
(1.50)

10.00 ±0.20

°
10

23.00 ±0.20
26.50 ±0.20

22.00 ±0.20
0.85 ±0.03
14.50 ±0.20
16.50 ±0.20

16.50 ±0.20

1.50 ±0.20
2.00 ±0.20

2.50 ±0.20

2.00 ±0.20
2.00 ±0.20 2.00 ±0.20 2.00 ±0.20
14.80 ±0.20

4.00 ±0.20

+0.20
3.30 ±0.20
0.75 –0.10

5.45TYP 5.45TYP +0.20

[5.45 ±0.30] [5.45 ±0.30] 0.90 –0.10
5.50 ±0.20
3.30 ±0.20

2.00 ±0.20

Dimensions in Millimeters

©2000 Fairchild Semiconductor International Rev. F, September 2000

TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.

ACEx™ FASTr™ QFET™ VCX™

Bottomless™ GlobalOptoisolator™ QS™
CoolFET™ GTO™ QT Optoelectronics™
CROSSVOLT™ HiSeC™ Quiet Series™
DOME™ ISOPLANAR™ SuperSOT™-3
E2CMOSTM MICROWIRE™ SuperSOT™-6
EnSignaTM OPTOLOGIC™ SuperSOT™-8
FACT™ OPTOPLANAR™ SyncFET™
FACT Quiet Series™ POP™ TinyLogic™
FAST® PowerTrench® UHC™

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER

NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant into support device or system whose failure to perform can
the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be effectiveness.
reasonably expected to result in significant injury to the
user.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative or This datasheet contains the design specifications for
In Design product development. Specifications may change in
any manner without notice.

Preliminary First Production This datasheet contains preliminary data, and

supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

Obsolete Not In Production This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.

Rev. F1