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Photolithography
Raja Sellappan
Nanofabrication techniques
1. Top-down technique: Bulk material is etched until the
desired shape is achieved (removal of substance).
Examples: Lithography (photon, electron, focused ion-
beam)
2. Bottom-up technique: Adding atom by atom or molecules to
form nanostructures (addition of substance).
Examples: Self-assembly techniques, sol-gel, etc.
2
Top-down Fabrication methods
• Ball milling
• Micromachining
Lithography
Laser ablation
LIGA
Ball Milling
A process whereby powder particles are milled or grinded to a
smaller (nano) particles when they are subjected to high energy
collisions exerted by the balls in the rotating drum.
Ref: http://www.understandingnano.com/nanomaterial-synthesis-ball-
milling.html
Ball Milling
• Also called as Mechanical Attrition or mechanical
alloying.
• Mechanical alloying: ‘A solid-state powder
processing technique involving repeated cold Rotating drums
welding, fracturing, and re-welding of powder Tungsten carbide (WC)
particles in a high-energy ball mill’1. or steel (Fe)
• Cold Welding: A process where materials are
joined/fused together without the use of heat or Important
making molten state of materials (but under high parameters
pressure). • Size and density of
the balls being
• Repeated deformation can cause large reductions in used.
grain size via the formation and organization of grain • Speed or rotation
boundaries within the powder particles. of drums.
• The process is done in controllable environment to • Materials to be
prevent oxidation and other chemical reactions milled should be
between the powder and the ball/drum of rotating lighter than balls.
parts.
1: Wikipedia.org
Ball Milling
• ‘Different components can be mechanically alloyed together
by cold welding to produce nanostructured alloys.
• A nanometer dispersion of one phase in another can also be
achieved. Microstructures and phases produced in this way
can often be thermodynamically metastable.
• Generally any form of mechanical deformation under shear
conditions and high strain rates can lead to the formation of
nanostructures, since energy is being continuously pumped
into crystalline structures to create lattice defects.’
Moore’s Law
‘The number of transistors incorporated in an
integrated circuit will double approximately for every 2
years’
http://spie.org/x32391.xml
Photolithographic process
1. Substrate preparation: Aimed at improving adhesion of photoresists to the
substrate. Process includes substrate cleaning, adhesion promoters,
dehydration baking, etc.
2. Photoresist coating: Photoresist is spin coated on the substrate. Spin coating
results in a thin, uniform coating of photoresist with specific or controllable
thickness.
Resist Resist
Silicon Silicon
Positive resist: The resist that is exposed to light undergoes chemical reaction and
can be dissolved or removed easily by a developer (solution).
Negative resist: The resist that is exposed to light undergoes chemical reaction and
can not be dissolved or removed by a developer. But the rest of the non-exposed
resist can be removed easily by a developer.
Photoresist
• Photoresist is typically polymers, metal halide or oxide.
*http://en.wikipedia.org/wiki/Photolithography
PL Resolution
http://www.southalabama.edu/engineering/ece/faculty/akhan/Course
s/EE439-539-fall07/Lecture%208-Lithography-chapter5.pdf
Diffraction
• Diffraction is a phenomenon (exhibited by light as a wave) of bending of
light waves when they encounter an obstacle or slit that is comparable to
the size of the wavelength.
• After the waves pass through the slit(s), they undergo both constructive
and destructive interference resulting in bright and dark patterns.
Plane waves
https://www.dssc.ece.cmu.edu/news/seminars/lunch05/.../
041205.pdf
Diffraction-limited photolithographic
process