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It helps to rip off the holes present in the upper part of the p-substrate,
expose the negative immobile ions creating a depletion layer,and then an
inversion layer which finally results in the creation of the n-channel.
Each immobile ion doesn’t actually contain one extra electron. A negative
immobile ion is seen as an atom which is in need of an electron. Therefore,as
it doesn’t necessarily contain an extra –ve charge it shouldn’t repel an
electron.
Also, the upcoming electrons are itself responsible for converting the atoms
into negative ions by filling up the holes present in the atoms.
Ans:A)
For 2 reasons:
1)There can be Ohmic Contact only between a heavily doped n-type
semiconductor and a metal,whereas the substrate is lightly doped p type
semiconductor
8)Why can’t the electrons go to the substrate from the source through
the wire which is used to short the source and substrate?
Also,the p-n junctions formed between the substrate and drain and between
source and substrate are reverse biased cutting off any chance of flow of
current.
The source substrate junction is unbiased as both the terminals are shorted.
The substrate drain p-n junction is reverse biased as the drain is maintained
at +ve potential and substrate at –ve potential.
11)What are constituents of the inversion layer and the depletion layer
in a MOSFET?
We see a diode forming between the n channel and the p-substrate.We don’t
want any current to flow through this diode and the only way to do this is to
keep it reverse biased at all times.So we make the p-type substrate the
most negative.
The number of electrons present in the n channel can be controlled using the
gate voltage. Thus we can control the resistance of this channel making
MOSFET a variable resistor.
16)Why is the substrate lightly doped when we can actually achieve a lower
threshold voltage if there are more minority carriers?
18)R should become infinity once MOS enters the saturation region.
20)Why does Vth increase with an increase in the Body Source Voltage?