Philips Semiconductors Product Specification

Octal buffer/line driver; 3-state 74LVC244

FEATURES QUICK REFERENCE DATA

GND = 0 V; Tamb = 25 °C; tr = t f ≤ 2.5 ns
• Wide supply voltage range of SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
1.2 V to 3.6 V
• In accordance with JEDEC propagation delay CL = 50 pF
standard no. 8-1A. tPHL/tPLH 1An to 1Yn; V CC = 3.3 V 4.9 ns
• Inputs accept voltages up to 2An to 2Yn
5.5 V CI input capacitance 5.0 pF
• CMOS low power consumption power dissipation
• Direct interface with TTL levels CPD notes 1 and 2 30 pF
capacitance per buffer
• Output drive capability 50 Ω
transmission lines @ 85 °C
Notes to the quick reference data
DESCRIPTION 1. CPD is used to determine the dynamic power dissipation (PD in µW)
PD = CPD x VCC2 x fi + Σ (CL x VCC2 x fo) where:
The 74LVC244 is a fi = input frequency in MHz; CL = output load capacity in pF;
high-performance, low-power, fo = output frequency in MHz; V CC = supply voltage in V;
low-voltage, Si-gate CMOS device Σ (CL x VCC2 x fo) = sum of the outputs.
and superior to most advanced 2. The condition is VI = GND to V CC
CMOS compatible TTL families.
ORDERING INFORMATION
Inputs can be driven from either PACKAGES
3.3 V or 5 V devices. This feature TYPE NUMBER
allows the use of these devices as PINS PACKAGE MATERIAL CODE
translators in a mixed 3.3 V/5 V 74LVC244D 20 SO plastic SO20/SOT163A
environment 74LVC244DB 20 SSOP plastic SSOP20/SOT339
The 74LVC244 is an octal 74LVC244PW 20 TSSOP plastic SSOP20/SOT360
non-inverting buffer/line driver with
3-state outputs. The 3-state outputs PINNING
are controlled by the output enable PIN NO. SYMBOL NAME AND FUNCTION
inputs 1OE and 2OE. A HIGH on
nOE causes the outputs to assume 1 1OE output enable input (active LOW)
a high impedance OFF-state. 2, 4, 6, 8 1A0 to 1A3 data inputs
Schmitt-trigger action at all inputs 3, 5, 7, 9 2Y0 to 2Y3 bus outputs
makes the circuit highly tolerant for
slower input rise and fall times. 10 GND ground (0 V)
The ’244’ is identical to the ’240’ but 17, 15, 13, 11 2A0 to 2A3 data inputs
has non-inverting outputs. 18, 16, 14, 12 1Y0 to 1Y3 bus outputs

FUNCTION TABLE 19 2OE output enable input (active LOW)

INPUTS OUTPUT 20 V CC positive power supply

nOE nAn nYn

L L L
L H H
H X Z
H = HIGH voltage level
L = LOW voltage level
X = don’t care
Z = high impedance OFF-state

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 Philips Semiconductors Product Specification

Octal buffer/line driver; 3-state 74LVC244

1OE 1 20 VCC
2 1A0 1Y0 18
1A0 2 19 2OE 17 2A0 2Y0 3

2Y0 3 18 1Y0 4 1A1 1Y1 16

15 2A1 2Y1 5
1A1 4 17 2A0
6 1A2 1Y2 14
2Y1 5 16 1Y1
13 2A2 2Y2 7
244
1A2 6 15 2A1
8 1A3 1Y3 12
2Y2 7 14 1Y2 11 2A3 2Y3 9

1A3 8 13 2A2 1 1OE

2Y3 9 12 1Y3 19 2OE

GND 10 11 2A3

Fig.1 Pin configuration. Fig.2 Logic symbol.

2 1A0 1Y0 18

1 4 1A1 1Y1 16
EN

2 18 6 1A2 1Y2 14

4 16
8 1A3 1Y3 12
6 14

8 12
1 1OE

19 17 2A0 2Y0 3
EN

11 9 15 2A1 2Y1 5

13 7
13 2A2 2Y2 7
15 5

17 3
11 2A3 2Y3 9

19 2OE

Fig.3 IEC logic symbol. Fig.4 Functional diagram.

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 Philips Semiconductors Product Specification

Octal buffer/line driver; 3-state 74LVC244

FAMILY DESCRIPTION

The LVC family comprises very fast
low-power logic ICs fabricated in a
sub-micron CMOS process.
LVC ICs with 3.3 V ±0.3 V supply
operate at the same speed as FAST
bipolar logic and consumes only
a fraction of the power. The LVC
family functions with supply
voltages down to 2.7 V. The
reduction from the conventional
5.0 V to 3.3 V reduces the output
swing leading to a much lower
dynamic power dissipation. Pin and
function compatibility with FAST
ensures an easy transfer of
existing systems into new 3.3 V
systems.

RECOMMENDED OPERATING CONDITIONS FOR THE LVC FAMILY

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
DC supply voltage (for max. speed
V CC 2.7 3.6 V
performance)
DC supply voltage (for low-voltage
V CC 1.2 3.6 V
applications)
VI DC input voltage range 0 5.5 V
V I/O DC input voltage range for I/Os 0 VCC V
VO DC output voltage range 0 VCC V
see DC and AC
operating ambient temperature range in
T amb −40 +85 °C characteristics per
free air
device
0 20 VCC = 1.2 to 2.7 V
t r, t f input rise and fall times ns/V
0 10 VCC = 2.7 to 3.6 V

LIMITING VALUES FOR THE LVC FAMILY (Note 1)

In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to GND (ground = 0 V)
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
V CC DC supply voltage −0.5 +4.6 V
IIK DC input diode current − −50 mA VI < 0
VI DC input voltage −0.5 +5.5 V note 2
V I/O DC input voltage range for I/Os −0.5 V CC + 0.5 V
IOK DC output diode current − ±50 mA VO > VCC or VO < 0
VO DC output voltage −0.5 V CC + 0.5 V note 2
IO DC output source or sink current − ±50 mA VO = 0 to VCC
IGND, ICC DC VCC or GND current − ±100 mA
Tstg storage temperature range −60 +150 °C
power dissipation per package
- plastic mini-pack (SO) − 500 mW above + 70°C derate linearly with 8 mW/K
P tot
- plastic shrink mini-pack − 500 mW above + 60°C derate linearly with 5.5 mW/K
(SSOP and TSSOP)
Notes to the limiting values
1. Stresses beyond those listed those under ’recommended 2. The input and output voltage
may cause permanent damage to operating conditions’ is not implied. ratings may be exceeded if the
the device. These are stress Exposure to absolute maximum input and output current ratings
ratings only and functional rated conditions for extended are observed.
operation of the device at these periods may affect device reliability.
or any other conditions beyond

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 Philips Semiconductors Product Specification

Octal buffer/line driver; 3-state 74LVC244

DC CHARACTERISTICS FOR THE LVC FAMILY

Over recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Tamb (°C) TEST CONDITIONS
SYMBOL PARAMETER −40 to +85 UNIT VCC
VI OTHER
MIN. TYP. MAX. (V)
HIGH level input V CC − − 1.2
VIH V
voltage 2.0 − − 2.7 to 3.6
LOW level input − − GND 1.2
VIL V
voltage − − 0.8 2.7 to 3.6
VCC − 0.5 − − 2.7 IO = −12 mA
HIGH level output VCC − 0.2 VCC − 3.0 IO = −100 µA
VOH V V IH or VIL
voltage VCC − 0.6 − − 3.0 IO = −12 mA
VCC − 1.0 − − 3.0 IO = −24 mA
− − 0.40 2.7 IO = 12 mA
LOW level output
VOL − − 0.20 V 3.0 V IH or VIL IO = 100 µA
voltage
− − 0.55 3.0 IO = 24 mA
input leakage
Il − ±0.1 ±5 µA 3.6 5.5 V or GND not for I/O pins
current
input current for
IIHZ/IILZ − ±0.1 ±15 µA 3.6 V CC or GND
common I/O pins
3-state output
IOZ − 0.1 ±10 µA 3.6 V IH or VIL VO = VCC or GND
OFF-state current
quiescent supply
ICC − 0.1 20 µA 3.6 V CC or GND IO = 0
current
additional quiescent
∆ICC supply current given − 5 500 µA 2.7 to 3.6 V CC − 0.6 V IO = 0
per input pin
Note: All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.

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 Philips Semiconductors Product Specification

Octal buffer/line driver; 3-state 74LVC244

DC CHARACTERISTICS FOR 74LVC244

For the DC characteristics see chapter "LVC family characteristics", section "Family specifications".
ICC category: MSI

AC CHARACTERISTICS FOR 74LVC244

GND = 0 V; tr = t f ≤ 2.5 ns; CL = 50 pF
Tamb (°C) TEST CONDITIONS
SYMBOL PARAMETER -40 to +85 UNIT VCC
WAVEFORMS
MIN. TYP. MAX. (V)
propagation delay − 21 − 1.2
tPHL /tPLH 1An to 1Yn; 1.5 5.2 8.0 ns 2.7 Figs 5, 7
2An to 2Yn 1.5 4.9* 7.0 3.0 to 3.6
3-state output enable time − 45 − 1.2
tPZH/t PZL 1OE to 1Y n; 1.5 6.1 10.0 ns 2.7 Figs 6, 7
2OE to 2Y n 1.5 5.8* 8.0 3.0 to 3.6
3-state output disable time − 5.8 − 1.2
tPHZ/t PLZ 1OE to 1Y n; 1.5 3.5 8.5 ns 2.7 Figs 6, 7
2OE to 2Y n 1.5 3.3* 7.5 3.0 to 3.6
Notes: All typical values are measured at Tamb = 25 °C.
* Typical values are measured at VCC = 3.3 V.

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 Philips Semiconductors Product Specification

Octal buffer/line driver; 3-state 74LVC244

AC WAVEFORMS

VI VI

INPUTS VM(1) nOE INPUT VM(1)

GND GND
tPHL tPLH tPLZ tPZL
VOH(4) VCC
OUTPUT
OUTPUTS VM(1) LOW-to-OFF VM(1)
OFF-to-LOW VX(2)
VOL(4) VOL(4)

tPHZ tPZH

VOH(4)
OUTPUT VY(3)
HIGH-to-OFF VM(1)
OFF-to-HIGH
GND
outputs outputs outputs
enabled disabled enabled
Fig.5 Waveforms showing the input (1An,
2An) to output (1Yn, 2Yn) propagation Fig.6 Waveforms showing the 3-state
delays. enable and disable times.

Notes: (1) V M = 0.5 · VCC at VCC < 2.7 V

V M = 1.5 V at VCC ≥ 2.7 V
S1 (2) V X = VOL + 0.3 V at V CC ≥ 2.7 V
2 • VCC
VCC Open V X = VOL + 0.1 · VCC at VCC < 2.7 V
500 Ω
GND (3) V Y = VOH − 0.3 V at VCC ≥ 2.7 V
VI VO
PULSE D.U.T. V Y = VOH − 0.1 · VCC at V CC < 2.7 V
GENERATOR
CL 50 pF 500 Ω (4) V OL and VOH are the typical output
RT
voltage drop that occur with the output
load.
Test S1
VCC VI tPLH/tPHL Open
< 2.7 V VCC tPLZ/tPZL 2 • VCC
2.7 - 3.6 V 2.7 V tPHZ/tPZH GND

Fig.7 Load circuitry for switching times.

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 Philips Semiconductors Product Specification

Octal buffer/line driver; 3-state 74LVC244

13.0 7.6
12.6 7.4
A

0.1 S 10.65
S 10.00
0.9 (4x)
0.4

1.1
2.45 1.0
20 11 2.65
2.25 0.3 0.32
0.1 2.35
0.23

1.1
pin 1 0.5 0 to 8o
index
detail A MBC234

1 10

0.49
0.36 0.25 M
1.27 (20x)

Fig.8 20-lead mini-pack; plastic (SO20; SOT163A).

7.4 5.4
7.0 5.2
A

0.1 S 7.9
S 7.6

0.9

0.9
0.7
20 11
1.80 2.0
1.65 1.7
0.20 0.22
0.05 0.13

pin 1
index
0 to 8 o
1 10 0.50

detail A MSA322

0.38
0.13 M
0.25
0.65

Fig.9 20-lead plastic medium-shrink SO (SSOP II 20; SOT339).

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 Philips Semiconductors Product Specification

Octal buffer/line driver; 3-state 74LVC244

SOLDERING

Plastic mini-packs

BY WAVE BY SOLDER PASTE REFLOW REPAIRING SOLDERED JOINTS (BY

During placement and before
soldering, the component must be
fixed with a droplet of adhesive.
After curing the adhesive, the
component can be soldered. The
adhesive can be applied by screen
printing, pin transfer or syringe
dispensing.
Maximum permissible solder
temperature is 260 °C, and
maximum duration of package
immersion in solder bath is 10 s, if
allowed to cool to less than 150 °C
within 6 s. Typical dwell time is 4 s
at 250 °C.
A modified wave soldering
technique is recommended using
two solder waves (dual-wave), in
which a turbulent wave with high
upward pressure is followed by a
smooth laminar wave. Using a
mildly-activated flux eliminates the
need for removal of corrosive
residues in most applications.
HAND-HELD SOLDERING OR
Reflow soldering requires the PULSE-HEATED SOLDER TOOL)
solder paste (a suspension of fine
solder particles, flux and binding Fix the component by first
agent) to be applied to the soldering two diagonally opposite,
substrate by screen printing, end pins. Apply the heating tool to
stencilling or pressure-syringe the flat part of the pin only. Contact
dispensing before device time must be limited to 10 s at up
placement. to 300 °C. When using proper
tools, all other pins can be
Several techniques exist for soldered in one operation within 2
reflowing; for example, thermal to 5 s between 270 and 320 °C.
conduction by heated belt, infrared, (Pulse-heated soldering is not
and vapour-phase reflow. Dwell recommended for SO packages.
times vary between 50 and 300 s
according to method. Typical
reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the
paste and evaporate the binding
agent. Preheating duration: 45 min
at 45 °C.

DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above
one or more of the limiting values may cause permanent damage to the device. These are stress ratings only
and operating of the device at these or any other conditions above those given in the Characteristics sections
of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of
these products can reasonably be expected to result in personal injury. Philips customers using or selling these
products for use in such applications do so at their own risk and agree to fully indemnify Philips for any
damages resulting from such improper use or sale.

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