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Procedia CIRP 6 (2013) 609 – 614

The Seventeenth CIRP Conference on Electro Physical and Chemical Machining (ISEM)

A study to improve drilling quality of electrochemical discharge


machining (ECDM) process
Y.S. Laioa, L.C. Wua, W.Y. Pengb*
a
Department of Mechanical Engineering, National Taiwan University, No.1, Sec. 4, Roosevelt Rd.,. Taipei, 106, Taiwan, R.O.C.
b
Industrial Technology Research Institute, No. 195, Sec. 4, ChunShin Rd., Chutung, Hsinchu, 310, Taiwan, R.o.C.
* Corresponding author. Tel.: +886-3-5916485; fax: +886-3-5826564.E-mail address: peng0146@itri.org.tw.

Abstract

The effects of Sodium Dodecyl Sulfate (SDS) surfactant added electrolyte on machining quartz in electrochemical discharge
machining (ECDM) are investigated. Experimental results show that the current density is increased, and there is more bubble
release around the electrode as compared with that when machining in the electrolyte without SDS. The sparks become brighter and
take place in a larger area, and a more stable pulse current is obtained. As a result, a less taper and a better quality but a little over
size hole can be drilled with a higher engraving speed. Based on the observation of sparking process together with the experimental
results, a new bubble forming mechanism during ECDM in the SDS added electrolyte is inferred.

© 2013 The Authors. Published by Elsevier B.V.


© 2013 The Authors. Published by Elsevier B.V. Selection and/or peer-review under responsibility of Professor Bert Lauwers
Selection and/or peer-review under responsibility of Professor Bert Lauwers
Keywords: ECDM, surfactant, SDS, hole quality

Subsequent experiments founded that the machining


1. Introduction was faster when KOH was used as the electrolyte instead
of NaOH. The machining results were better with higher
In, 1968, Kurafuji and Suda[1] adopted a novel concentrations of the electrolytes. The electrode should
method to apply in the high strength non-conductive revolve when processing [7]. The average current
brittle materials, which are resistant to abrasion, through the end surface were much larger than that
corrosion and high temperature. There are different through the side one. Four ms is the proper range for
terminologies for the phenomena or machining better current pulse release when applying voltage. The
application about the micro arcs which occur in the applied voltage should be 20% above the critical
electrolyte, like ECAM[2], ECSM[3], ECDM [4], and voltage.
SACE[5]. The spark plays a key role in the process. The Wuthrich et al. (2005) show that adding surfactants
heat produced by the sparks facilitates the etching effect in the electrolytic solution can not only moisturize the
by the electrolyte on the non-conductive brittle materials electrode surface, but also decrease the surface tension,
such as glass. Preliminary observations revealed that and increase the contact surface area between the gas
critical voltage can be determined from the changes of bubbles and the electrode. This improves the gas film
the spark modes and the differences of current release wrapping, thins the gas film, effectively lowers the
during the rising process of the applied voltages. The critical voltage, and facilitates the flows of the
critical voltage is the point when the discharging spark electrolytes to decrease the concentration differences
occurs after the gas bubbles in the electrolytic solution between areas and to increase the reaction rates.
form a gas film, wherein the enfolded water molecules, Although the machining scale reaches the order of tens
conductive ions, and hydrogen collide with each other of micrometer, the basic properties of such a small
and increase the probability of discharge, as resulting in electrode are not understood well. There is still plenty of
the unstable spark discharging state[6]. room for researches about the observation of formation

2212-8271 © 2013 The Authors. Published by Elsevier B.V.


Selection and/or peer-review under responsibility of Professor Bert Lauwers
doi:10.1016/j.procir.2013.03.105
610 Y.S. Laio et al. / Procedia CIRP 6 (2013) 609 – 614

of the gas film, the change of critical voltage, and the production density. In this density of surfactants, several
size limitations of the machining processes. To promote dozens members alkyl (hydrophobic group) congregated
the machining speed and its quality simultaneously is into the inner part, excluding the hydrophilic group, to
currently the most essential goal. According to the form a micelle as shown in. Fig. 3(B). Micelle internal
experimental results of Wuthrich et al. [8], it mentions part is constituted by alkane, therefore, the oil , which
not only to reduce the thickness of gas film by putting does not dissolve in the water oil or the organic liquid
the soapy water in the electrolyte, but also to cause the the may dissolve inside the micelle, this phenomenon is
air bubble to be closely packed, increasing the contact so called the solubilization. The surfactant which was
area of the air bubble and electrode as shown in Fig. 1. constituted by the same hydrophilic group, the molecular
This article focuses on besides discussing the adding of weight is bigger, the intermolecular attraction is bigger,
the surfactant may effectively promote the machining the micelle density is smaller. For instance, micelle of
speed, whether it can possess the stable machining production density SDS is about 0.2%, the surface
condition, or the machining product quality does have tension has great reduction.
the effect of promotion.

Fig. 2. The framework of the anion surfactant SDS. [10]

Fig. 1. the air bubble linking modus with and without the surfactant

2. About the Surfactant

The chemical formula of SDS is


CH3(CH2)11OSO3Na[9], the molecular weight is
288.38, the neutral meta-acid material, and the pH value
is situated between 6.0-7.5. The appearance is the white
powdery pellet. Fig. 2 shows the structure of the
surfactant, we may see the long chain alkyl (like fatty
acid, etc.) on the right side, is lipophilic group, whose
name due to dissolve after the hydrophobic part to be
able to dissociate the anion; left side is hydrophilic
group, most of it is the basic salt, like potassium, the Fig. 3. (A)characteristic of SDS water fluid (B)Micelle schematic
sodium and so on various kind of ethanolamine, which drawing.[11]
can make the oil part distribute or dissolve into the
water. 3. Experimental Results
In 25 the solubility is 0.0082 M, around 0.236%.
Some micro dissolved materials merge in the water SDS, 3.1. The influence of surfactant
which is gradually adsorbed in the liquid surface.
Hence, the surface tension gradually reduces along with Firstly, we compare the conditions with and without
the time. SDS is one kind of surfactant, commonly used the adding surfactant SDS in electrolyte. To observe the
causes the protein denaturizing after the DNA extraction difference of the discharging sparks, about the
process to separate with DNA, which is the detergent machining voltage 50V, the condition of the machining
principal constituent as well. In Fig. 3(A), when density is not very flashing, the colors of sparks have no obvious
of SDS water-soluble fluid changes, the clean strength, difference. But from the amount of the sparks, we can
the density, the surface tension, the osmotic pressure, the tell the adding surfactant SDS will cause a lot of bubbles
proper transmit electricity degree of water-soluble fluid, obviously. When the voltage is around 70V, the sparks
some physical characteristics. While the density are brighter after adding surfactant SDS. If it does not
suddenly changes the situation, it so called the micelle indicate bright in the machining voltage, now the sparks
Y.S. Laio et al. / Procedia CIRP 6 (2013) 609 – 614 611

present umber as shown in Fig. 4 and 5, and the current density. Fig. 7 shows obvious difference of
difference between dark or bright is obvious, which average current density under the same parameter of
means, the difference of electric current is less bigger power source. The horizontal axis represents the voltage
than using pure voltage. It is assumed that due to the applied and the vertical axis means the current density.
great amount of bubbles, which make the gas film enfold For the power source of frequency 0.25 kHz, duty factor
more entire. The discharging sparks are much bigger, of 0.75, from 45V to 70V under same voltage, adding
and stable, so that we can conclude that adding more SDS the current density in the electrolyte is obviously
SDS in the voltage can produce more machining energy higher. By the way, the energy for the electric current
from the sparking. During the process of machining, and the voltage and the time integral, may prove the
there is few SDS in the electrolyte, and during the consistent situation in voltage and other power source
process of discharging, SDS will attach to each other and parameter, will add SDS to gain bigger energy in
become granulated attaching to the electrode to produce electrolyte. Therefore, it can conclude the cause of
the hydrogen on the bubble films. The discharging time reducing of critical voltage, this phenomenon may occur
is longer when the cloud type bubble cluster and after adding SDS. From the interpretation of critical
electrolyte mixture could be resembled around the voltage, the judgment is based on the electric current
electrode (Fig. 6). After machining complete and stop graph. It may discover Fig. 8(A) graph that in the
providing voltage, the pellet slowly once again dissolve situation of discharging each time, it can deliver the
into the electrolyte. bigger electric current to flush, the response of the
electric current which occurs is namely, electric current
of from the electrolysis water release. Afterwards,
machining electric current is the slow climb to an
average value, and this average value namely for the
fixed resistance situation satisfies the Ohm's law in this
fixed voltage and the electric tank. In Fig. 8(A), the
electric current precisely presents the exerting voltage
not surpass yet before critical voltage, some due to the
Fig. 4. voltage 50V (A) without surfactant (B) with surfactant, time lack of voltage, it produces bubbles, but insufficient to
scale =>from left to right
become the chart of discharging in gas film. However, in
Fig. 8(B), it produces the bigger electric current from the
same electrolysis water and the left over is the smaller
pulse electric current of the peak value. And the value
gradually reduces. To connect with the peak is
extremely close to inverse current figure shape. This
figure shape is the real electric current of discharging.
The searching method of critical voltage is under the
condition of controlling other parameter of electricity.
Fig. 5. voltage 70V (A) without surfactant (B) with surfactant, time The critical voltage is defined as the voltage is increased
scale =>from left to right gradually until the current inflection point appears
according to the corresponding current waveforms by 10
times experiments. If the tungsten electrode is immersed
in the 6M KOH electrolyte by 1mm without surfactant,
the critical voltage is approximately equal. But as the
surfactant is added, the critical voltage drops. This
reveals that with the same power source parameters the
electrolyte with surfactant could induce more machining
spark energy.

Fig. 6. (A) SDS pellet accumulation in the bubble films surface (B) $
w/o SDS
after the electric discharge completes, SDS dissipates to the electrolyte PP
with SDS
surface

Afterwards, we will find out the machining difference


9
of electric current from the waveform, under the same
parameter of power source and the accurate value of the
612 Y.S. Laio et al. / Procedia CIRP 6 (2013) 609 – 614

Fig. 7. the current density vs. voltage with and without SDS discharging frequency and the duty factor size regarding
machining surfactant factors and so on. But these two
The following procedure is to practically test SDS by qualities have non-negative value of which the value to
quartz which is harder than glass in order to attain extra be smaller reveals a better characteristic which is so
working effect. The power source parameters are set at called The-Smaller-The-Better (Lower is better, LB).
65V, frequency 250Hz, duty factor 0.75 and the quartz In view of machining, many kinds of energy are input
workpiece is put under the liquid surface by 2mm. The to the glass which perform as the etched extent and the
electrode is kept at 0.1mm from the workpiece surface. bore diameter reaming rate. This time, the micro crack
The same set-up is conducted but with minor surfactant production regarding the glass opening wall should be
SDS and then start to measure the discharge for 1.5 considered. Therefore the proper machining parameter
minutes. The difference of the machined area will be scope should be considered to achieve the most
observed with regard to two different electrolytes. The economical machining condition, and also the quality of
etched area without SDS as shown in Fig. 9(A) is machining.
obviously lighter and approximately of 0.246mm2. Its
etched area or depth are minor than the ones with Table 1. the sum S/N value of various standard factors in L18
surfactant SDS as shown in Fig. 9(B). Its area is experiments
approximately 0.313mm2 and the improvement in
Factor Add SDS Voltage
etched area is about 27%. Therefore, the SDS could
Index
strengthen the spark intensity which results in better S/N rate Index Taper Reaming (> cri. Taper Reaming
rate rate
machining capability and etched area. In addition, the volt.)
discharge spot from the electrode is more concentrated 1 No 48.87 80.09 10V 53.56 54.99
Level 2
which causes deeper etching mark. Yes 77.79 54.74 20V 41.62 45.77
3 30V 31.48 34.07
total 126.66 134.83 126.66 134.83
Factor Frequency Duty Factor
Reaming Reaming
S/N rate Index Taper Index Taper
rate rate
100 45.43 44.47 0.5 46.57 51.91 54.99
Level 200 41.58 43.56 0.7 41.02 42.63 45.77
300 39.65 46.80 0.9 39.07 40.29 34.07
total 126.66 134.83 126.66 134.83

Fig. 8. the current waveform without SDS, with the parameter (A) 30
volts (B) 50 volts and both with 0.75 of duty factor, and 250Hz of DC
pulse input 3.2.1. The parameters to influence the taper
In terms of the taper which is part of the machined
qualities, it is expected that the smaller the figure means
the better quality referred. This characteristic of non-
negative and zero best condition is categorized as The-
Smaller-The-Better. As the experiment is proceeding,
we get the S/N value of taper of this experiment under
all machining conditions, and the S/N ration of each
experiment. In order to figure out the parameter during
the machining, we will carry on the response to the table
and the chart analysis regarding the empirical datum.
Under the different standards regarding the influence of
Fig. 9. optical views of the machined holes (A) without SDS and (B) the characteristics of machining, the response table and
with SDS the response chart analysis regarding the empirical
datum are conducted. According to this analysis method,
3.2. Parameters with regard to the machined hole each parameter is calculated separately under each
quality standard. Then sum the empirical datum which will
reflect, and compare with the difference to obtain the
After the preliminary understanding of the SDS effect, qualitative relationship between the machining
the machined hole quality is investigated with Taguchi parameter and the taper. Take the add surfactant SDS
method, the L18 experiment. Joins or not, and between as an example. From Table 1, we may extract the sum of
the relative number of the critical voltage, the S/N rate by adding or not adding SDS electrolyte which
Y.S. Laio et al. / Procedia CIRP 6 (2013) 609 – 614 613

is under two different standards. By comparing mechanism after adding surfactant should be different
computed results, the S/N of each factor is shown in from the one before adding surfactant. Therefore we can
Table 1. The four factors are influential regarding taper. infer as shown in Fig. 10 that adding surfactant in the
The adding surfactant or not is especially crucial on the electrolyte will decrease the size of bubble, decreasing
value of the voltage. With smaller machining voltage, effectively the surface of every bubble interacting with
smaller machining frequency and the smaller value of electrode surface. This will speed up the leading of the
duty factor, better machined taper will be obtained. bubble. According to Wuthrich s et al. study[8], if the
The key factor is assumed as the SDS has produced bubble becomes the ellipse shape of bigger contacted
the function of the massive and stable air bubbles. In area, it will not be bigger. But by S/N sum, its influence
terms of the electrode side, it s not necessary to still could be observed. We may figure out the influence
congregate the degree of gas film, but only to generate regarding hole enlargement rate, the influence is
massive air bubbles. Then it can achieve the condition of particularly enormous on the voltage by adding SDS
stable electric discharge. surfactant since the hole enlargement rate is directly
related to the density of electric current. SDS itself has
3.2.2. The parameters of influencing reaming rate function of promoting electric current to machine, and
In terms of the reaming rate, it has The-Smaller-The- increases the reaction of the voltage. It becomes the
Better trend. From Table 1, those 4 factors have primary reason to influence machining electric current.
influence on reaming rate, especially the adding Therefore, it also influences the diameter size of the
surfactant and voltage value and duty factor . Under glass air inlet scoop.
the condition without surfactant, the smaller machining
voltage, bigger machining frequency and smaller duty
factor value, will result in smaller reaming rate. Tables 2
shows the experimental parameters of peck drilling. Two
sets of downward feed rate were used. Only if the SDS
had been added, could the drilling operation proceed at
higher feed rate of 0.4mm/min.

3.3. General discussion of the experimental results

If the surfactant is added with lower machining


Fig. 10. scheme comparison of the electrochemical spark machining
voltage, lower machining frequency, and smaller duty bubbles (A) with pure KOH electrolyte (B) with surfactant SDS in the
factor value, it will cause smaller machining taper. If the electrolyte
surfactant is not added with lower machining voltage,
higher machining frequency, and smaller duty factor Table 2 : Experimental scheme of peck drilling
value, it will cause smaller hole enlargement rate. If the
purpose of machining is to attain taper, hole enlargement Name of peck
A B
rate, and machining speed, it is unable to find perfect parameters
parameters to accommodate all scenario. Therefore, if Z axis Z axis
this is required for the combination of machined quality, shift Speed(m shift Speed(m
it is suggested that the adjustment method of machining quantity( m/min) quantity( m/min)
taper and speed be used, which is using surfactant lower The content of mm) mm)
the formula
machining voltage, lower machining frequency, and -0.02 0.2 -0.02 0.4
smaller duty factor value. As for the hole enlargement +0.06 1.8 +0.06 1.8
rate, smaller electrode of small diameter to do machining
-0.06 1.8 -0.06 1.8
could be used which could satisfy all of the three
characteristics and will not affect its surface quality. Times of
33 33
repetition

3.4. About the bubble mechanism Sum shift of


-0.66 mm -0.66 mm
machining

From the experimental results, it is found that adding Sum of


machining 5.43 min 3.78 min
surfactant-SDS in the electrolyte will not only produce a
time
great amount of bubble but also enable the speed of
Product
bubble leaving the electrode surface to rise significantly. A Unable machining
without SDS
Under the same machining condition, it will have deeper
and wider machining mark. We can infer that the bubble
614 Y.S. Laio et al. / Procedia CIRP 6 (2013) 609 – 614

4. Conclusions

The SDS surfactant effects on ECDM is investigated.


The current density is obviously enhanced due to the
bubble structure shift. Consequently a less taper and a
better quality but a little over size hole can be drilled
with a higher engraving speed. Besides, certain electric
power could be saved since less time is consumed for
peck drilling.

References
[1] Kurafuji, H. and Suda, K.,
Annals of the CIRP, Vol.16, pp. 415-418, 1968.
[2] Kubota, M. and Tamura,

Vol. 7, p. 117, 1973.


[3] Jain, V.K., Dixit, P.M. and Pandey,

of Machine Tools and Manufacture, Vol. 39, pp. 165-189, 1999.


[4] Basak, I., Electrochemical discharge machining mechanism and a
scheme for enhancing material removal capacity, Dissertation
Thesis, Indian Institute of Technology, Kanpur, 1991.
[5] Langen, H., Breguet, J. M., Bleuler, H., Renaud, Ph., Masuzawa,

International Journal of Electrical Machining, Vol. 3, pp. 65-69,


1998
[6] W.Y. Peng Electrochemical spark phenomena and its
machining applications, Ph. D. dissertation, National Taiwan
University, Taiwan, 2005
[7] S.S. Her, Investigation of glass machining properties of
electrochemical spark machining, master thesis, National Central
University, Taiwan, 1997
[8] Wuthrich, R., Hof, L. A, Lal1, A., Fujisaki, K. and Bleuler, H.,

Microengineering, Vol.15, pp. 268-275, 2005


[9] F.Y. Wang, Theory and applications of surfactants, Gau Lih
Book company, Taiwan, 1986
[10] http://en.wikipedia.org/wiki/Sodium_dodecyl_sulfate
[11] C.S. Chao, Fundamental theory of surface science, Fu Win Book
company, Taiwan, 1991
[12] Ross, P. J., Taguchi Techniques for Quality Engineering,
McGraw-Hill, 1989.
[13] Taguchi method department QFD and experimental design,
CPC Taiwan, 1991
[14] Montgomery, D. C., Design and analysis of Experiment, Wiley,
6th Edition. [2]

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