Sei sulla pagina 1di 9

ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3

November 2009

ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3


EcoSPARK® 500mJ, 360V, N-Channel Ignition IGBT
General Description Applications
• Automotive Ignition Coil Driver Circuits
The ISL9V5036S3S, ISL9V5036P3, and ISL9V5036S3 are the next
• Coil-On Plug Applications
generation IGBTs that offer outstanding SCIS capability in the D²-
Pak (TO-263) and TO-220 plastic package. These devices are Features
intended for use in automotive ignition circuits, specifically as coil
drivers. Internal diodes provide voltage clamping without the need • Industry Standard D2-Pak package
for external components. • SCIS Energy = 500mJ at TJ = 25oC
EcoSPARK® devices can be custom made to specific clamp • Logic Level Gate Drive
voltages. Contact your nearest Fairchild sales office for more • Qualified to AEC Q101
information. • RoHS Compliant
Formerly Developmental Type 49443

Package Symbol
COLLECTOR
JEDEC TO-263AB JEDEC TO-220AB JEDEC TO-262AA
D²-Pak EC
G EC
G R1
GATE
G
R2
E

EMITTER
COLLECTOR COLLECTOR
(FLANGE) (FLANGE)

Device Maximum Ratings TA = 25°C unless otherwise noted


Symbol Parameter Ratings Units
BVCER Collector to Emitter Breakdown Voltage (IC = 1 mA) 390 V
BVECS Emitter to Collector Voltage - Reverse Battery Condition (IC = 10 mA) 24 V
ESCIS25 At Starting TJ = 25°C, ISCIS = 38.5A, L = 670 µHy 500 mJ
ESCIS150 At Starting TJ = 150°C, ISCIS = 30A, L = 670 µHy 300 mJ
IC25 Collector Current Continuous, At TC = 25°C, See Fig 9 46 A
IC110 Collector Current Continuous, At TC = 110°C, See Fig 9 31 A
VGEM Gate to Emitter Voltage Continuous ±10 V
PD Power Dissipation Total TC = 25°C 250 W
Power Dissipation Derating TC > 25°C 1.67 W/°C
TJ Operating Junction Temperature Range -40 to 175 °C
TSTG Storage Junction Temperature Range -40 to 175 °C
TL Max Lead Temp for Soldering (Leads at 1.6mm from Case for 10s) 300 °C
Tpkg Max Lead Temp for Soldering (Package Body for 10s) 260 °C
ESD Electrostatic Discharge Voltage at 100pF, 1500Ω 4 kV

©2009 Fairchild Semiconductor Corporation ISL9V5036S3S / ISl9V5036P3 / ISL9V5036S3 Rev. C4, November 2009
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
V5036S ISL9V5036S3ST TO-263AB 330mm 24mm 800
V5036P ISL9V5036P3 TO-220AA Tube N/A 50
V5036S ISL9V5036S3 TO-262AA Tube N/A 50
V5036S ISL9V5036S3S TO-263AB Tube N/A 50

Electrical Characteristics TA = 25°C unless otherwise noted


Symbol Parameter Test Conditions Min Typ Max Units

Off State Characteristics


BVCER Collector to Emitter Breakdown Voltage IC = 2mA, VGE = 0, 330 360 390 V
RG = 1KΩ, See Fig. 15
TJ = -40 to 150°C
BVCES Collector to Emitter Breakdown Voltage IC = 10mA, VGE = 0, 360 390 420 V
RG = 0, See Fig. 15
TJ = -40 to 150°C
BVECS Emitter to Collector Breakdown Voltage IC = -75mA, VGE = 0V, 30 - - V
TC = 25°C
BVGES Gate to Emitter Breakdown Voltage IGES = ± 2mA ±12 ±14 - V
ICER Collector to Emitter Leakage Current VCER = 250V, TC = 25°C - - 25 µA
RG = 1KΩ, TC = 150°C - - 1 mA
See Fig. 11
IECS Emitter to Collector Leakage Current VEC = 24V, See TC = 25°C - - 1 mA
Fig. 11 TC = 150°C - - 40 mA
R1 Series Gate Resistance - 75 - Ω
R2 Gate to Emitter Resistance 10K - 30K Ω

On State Characteristics
VCE(SAT) Collector to Emitter Saturation Voltage IC = 10A, TC = 25°C, - 1.17 1.60 V
VGE = 4.0V See Fig. 4
VCE(SAT) Collector to Emitter Saturation Voltage IC = 15A, TC = 150°C - 1.50 1.80 V
VGE = 4.5V

Dynamic Characteristics
QG(ON) Gate Charge IC = 10A, VCE = 12V, - 32 - nC
VGE = 5V, See Fig. 14
VGE(TH) Gate to Emitter Threshold Voltage IC = 1.0mA, TC = 25°C 1.3 - 2.2 V
VCE = VGE, TC = 150°C 0.75 - 1.8 V
See Fig. 10
VGEP Gate to Emitter Plateau Voltage IC = 10A, VCE = 12V - 3.0 - V

Switching Characteristics
td(ON)R Current Turn-On Delay Time-Resistive VCE = 14V, RL = 1Ω, - 0.7 4 µs
trR Current Rise Time-Resistive VGE = 5V, RG = 1KΩ - 2.1 7 µs
TJ = 25°C, See Fig. 12
td(OFF)L Current Turn-Off Delay Time-Inductive VCE = 300V, L = 2mH, - 10.8 15 µs
tfL Current Fall Time-Inductive VGE = 5V, RG = 1KΩ - 2.8 15 µs
TJ = 25°C, See Fig. 12
SCIS Self Clamped Inductive Switching TJ = 25°C, L = 670 µH, - - 500 mJ
RG = 1KΩ, VGE = 5V, See
Fig. 1 & 2

Thermal Characteristics
RθJC Thermal Resistance Junction-Case TO-263, TO-220, TO-262 - - 0.6 °C/W

©2009 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C4, November 2009
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
Typical Characteristics
45 45
ISCIS, INDUCTIVE SWITCHING CURRENT (A)

ISCIS, INDUCTIVE SWITCHING CURRENT (A)


RG = 1KΩ, VGE = 5V,Vdd = 14V RG = 1KΩ, VGE = 5V,Vdd = 14V
40 40

35 35

30 30
TJ = 25°C
25 25

20 20
TJ = 25°C
15 TJ = 150°C 15
TJ = 150°C
10 10

5 5
SCIS Curves valid for Vclamp Voltages of <390V SCIS Curves valid for Vclamp Voltages of <390V
0 0
0 50 100 150 200 250 300 350 0 2 4 6 8 10

tCLP, TIME IN CLAMP (µS) L, INDUCTANCE (mHy)

Figure 1. Self Clamped Inductive Switching Figure 2. Self Clamped Inductive Switching
Current vs Time in Clamp Current vs Inductance

1.10 1.25
VCE, COLLECTOR TO EMITTER VOLTAGE (V)

ICE = 6A VCE, COLLECTOR TO EMITTER VOLTAGE (V) ICE = 10A

1.05 1.20
VGE = 3.7V VGE = 4.0V
VGE = 3.7V

1.00 VGE = 4.0V 1.15

0.95 1.10
VGE = 4.5V
VGE = 4.5V
VGE = 5.0V VGE = 5.0V
0.90 VGE = 8.0V 1.05 VGE = 8.0V

0.85 1.00
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

Figure 3. Collector to Emitter On-State Voltage vs Figure 4.Collector to Emitter On-State Voltage vs
Junction Temperature Junction Temperature

50 50
ICE, COLLECTOR TO EMITTER CURRENT (A)

ICE, COLLECTOR TO EMITTER CURRENT (A)

VGE = 8.0V VGE = 8.0V


VGE = 5.0V VGE = 5.0V
40 VGE = 4.5V 40 VGE = 4.5V
VGE = 4.0V VGE = 4.0V
VGE = 3.7V VGE = 3.7V
30 30

20 20

10 10

TJ = - 40°C TJ = 25°C
0 0
0 1.0 2.0 3.0 4.0 0 1.0 2.0 3.0 4.0
VCE, COLLECTOR TO EMITTER VOLTAGE (V) VCE, COLLECTOR TO EMITTER VOLTAGE (V)

Figure 5. Collector Current vs Collector to Emitter Figure 6. Collector Current vs Collector to Emitter
On-State Voltage On-State Voltage

©2009 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C4, November 2009
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
Typical Characteristics (Continued)
50 50

ICE, COLLECTOR TO EMITTER CURRENT (A)


VGE = 8.0V
ICE, COLLECTOR TO EMITTER CURRENT (A)

DUTY CYCLE < 0.5%, VCE = 5V


VGE = 5.0V PULSE DURATION = 250µs

40 VGE = 4.5V 40

VGE = 4.0V
VGE = 3.7V
30 30

TJ = 175°C
20 20

TJ = 25°C
10 10

TJ = 175°C TJ = -40°C
0
0
0 1.0 2.0 3.0 4.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

VCE, COLLECTOR TO EMITTER VOLTAGE (V) VGE, GATE TO EMITTER VOLTAGE (V)

Figure 7. Collector to Emitter On-State Voltage vs Figure 8. Transfer Characteristics


Collector Current

50
VCE = VGE
VGE = 4.0V 2.0
ICE = 1mA
ICE, DC COLLECTOR CURRENT (A)

VTH, THRESHOLD VOLTAGE (V)

40
1.8

30
1.6

20
1.4

10
1.2

0 1.0
25 50 75 100 125 150 175
-50 -25 0 25 50 75 100 125 150 175

TC, CASE TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

Figure 9. DC Collector Current vs Case Figure 10. Threshold Voltage vs Junction


Temperature Temperature

10000 20
ICE = 6.5A, VGE = 5V, RG = 1KΩ Resistive tOFF
VECS = 24V 18

1000 16
LEAKAGE CURRENT (µA)

SWITCHING TIME (µS)

14
100 Inductive tOFF
VCES = 300V 12

10
10
8
VCES = 250V
1 6
Resistive tON
4

0.1 2
-50 -25 0 25 50 75 100 125 150 175 25 50 75 100 125 150 175

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

Figure 11. Leakage Current vs Junction Figure 12. Switching Time vs Junction
Temperature Temperature

©2009 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C4, November 2009
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
Typical Characteristics (Continued)
3000 8
IG(REF) = 1mA, RL = 0.6Ω, TJ = 25°C
FREQUENCY = 1 MHz

VGE, GATE TO EMITTER VOLTAGE (V)


7
2500

6
C, CAPACITANCE (pF)

2000
5
CIES
VCE = 12V
1500
4

1000 3
CRES
2
500
COES
1 VCE = 6V

0
0 5 10 15 20 25 0
0 10 20 30 40 50
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
QG, GATE CHARGE (nC)

Figure 13. Capacitance vs Collector to Emitter Figure 14. Gate Charge


Voltage

360
ICER = 10mA TJ = - 40°C
358
BVCER, BREAKDOWN VOLTAGE (V)

356

354
TJ = 175°C
352
TJ = 25°C
350

348

346

344

342

340
10 100 1000 2000 3000

RG, SERIES GATE RESISTANCE (kΩ)

Figure 15. Breakdown Voltage vs Series Gate Resistance


ZthJC, NORMALIZED THERMAL RESPONSE

100 0.5
0.2
0.1
10-1 0.05
0.02 t1
0.01 PD
10-2
t2

10-3 DUTY FACTOR, D = t1 / t2


SINGLE PULSE PEAK TJ = (PD X ZθJC X RθJC) + TC

10-4
10-6 10-5 10-4 10-3 10-2 10-1

T1, RECTANGULAR PULSE DURATION (s)

Figure 16. IGBT Normalized Transient Thermal Impedance, Junction to Case

©2009 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C4, November 2009
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
Test Circuits and Waveforms

L
VCE R
or LOAD
L
C
C
RG
PULSE RG = 1KΩ
DUT G +
GEN DUT VCE
G
5V -
E

Figure 17. Inductive Switching Test Circuit Figure 18. tON and tOFF Switching Test Circuit

VCE BVCES

tP
VCE
L
IAS
VARY tP TO OBTAIN VDD
+
REQUIRED PEAK IAS RG
VDD
VGS -
DUT

tP
0V IAS 0
0.01Ω
tAV

Figure 19. Energy Test Circuit Figure 20. Energy Waveforms

©2009 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C4, November 2009
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
SPICE Thermal Model JUNCTION
th
REV 1 May 2002

ISL9V5036S3S / ISL9V3536P3 / ISL9V5036S3

CTHERM1 th 6 4.0e2
CTHERM2 6 5 3.6e-3
CTHERM3 5 4 4.9e-2 RTHERM1 CTHERM1
CTHERM4 4 3 3.2e-1
CTHERM5 3 2 3.0e-1
CTHERM6 2 tl 1.6e-2
6
RTHERM1 th 6 1.0e-2
RTHERM2 6 5 1.4e-1
RTHERM3 5 4 1.0e-1
RTHERM2 CTHERM2
RTHERM4 4 3 9.0e-2
RTHERM5 3 2 9.4e-2
RTHERM6 2 tl 1.9e-2
5
SABER Thermal Model
SABER thermal model
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 RTHERM3 CTHERM3
template thermal_model th tl
thermal_c th, tl
{
4
ctherm.ctherm1 th 6 = 4.0e2
ctherm.ctherm2 6 5 = 3.6e-3
ctherm.ctherm3 5 4 = 4.9e-2
ctherm.ctherm4 4 3 = 3.2e-1 RTHERM4 CTHERM4
ctherm.ctherm5 3 2 = 3.0e-1
ctherm.ctherm6 2 tl = 1.6e-2

rtherm.rtherm1 th 6 = 1.0e-2 3
rtherm.rtherm2 6 5 = 1.4e-1
rtherm.rtherm3 5 4 = 1.0e-1
rtherm.rtherm4 4 3 = 9.0e-2
RTHERM5 CTHERM5
rtherm.rtherm5 3 2 = 9.4e-2
rtherm.rtherm6 2 tl = 1.9e-2
}
2

RTHERM6 CTHERM6

tl CASE

©2009 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C4, November 2009
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower™ FlashWriter®* Power-SPM™ ®
*
®
Auto-SPM™ FPS™ PowerTrench ®
PowerXS™ The Power Franchise
Build it Now™ F-PFS™
CorePLUS™ FRFET® Programmable Active Droop™
CorePOWER™ Global Power Resource
SM
QFET®
CROSSVOLT™ Green FPS™ QS™ TinyBoost™
CTL™ Green FPS™ e-Series™ Quiet Series™ TinyBuck™
Current Transfer Logic™ Gmax™ RapidConfigure™ TinyCalc™
EcoSPARK® GTO™ TinyLogic®
EfficientMax™ ™ TINYOPTO™
IntelliMAX™
EZSWITCH™* Saving our world, 1mW/W/kW at a time™ TinyPower™
ISOPLANAR™
™* SignalWise™
MegaBuck™ TinyPWM™
SmartMax™
MICROCOUPLER™ TinyWire™
DEUXPEED™ SMART START™
MicroFET™ TriFault Detect™
® SPM®
MicroPak™ TRUECURRENT™*
STEALTH™
Fairchild
® MillerDrive™ μSerDes™
SuperFET™
Fairchild Semiconductor® MotionMax™
SuperSOT™-3
FACT Quiet Series™ Motion-SPM™
SuperSOT™-6
FACT® OPTOLOGIC® UHC
®
SuperSOT™-8
FAST® OPTOPLANAR® Ultra FRFET™
® SupreMOS™
FastvCore™ SyncFET™ UniFET™
FETBench™ Sync-Lock™ VCX™
PDP SPM™ VisualMax™
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY


FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:
1. Life support devices or systems are devices or systems which, (a) are 2. A critical component in any component of a life support, device, or
intended for surgical implant into the body or (b) support or sustain life, system whose failure to perform can be reasonably expected to
and (c) whose failure to perform when properly used in accordance cause the failure of the life support device or system, or to affect its
with instructions for use provided in the labeling, can be reasonably safety or effectiveness.
expected to result in a significant injury of the user.

ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS


Definition of Terms
Datasheet Identification Product Status Definition
Datasheet contains the design specifications for product development. Specifications may change in
Advance Information Formative / In Design
any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Preliminary First Production
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
No Identification Needed Full Production
at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
Obsolete Not In Production
The datasheet is for reference information only.
Rev. I43

© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com


Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Fairchild Semiconductor:
ISL9V5036P3 ISL9V5036S3S_Q ISL9V5036P3_Q ISL9V5036S3ST_Q

Potrebbero piacerti anche