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Transactions of The Japan Institute of Electronics Packaging  Vol. 6, No.

1, 2013

[Technical Paper]

A 36 W Wireless Power Transfer System with 82% Efficiency for


LED Lighting Applications
Wei-Ting Chen*, Raul A. Chinga**, Shuhei Yoshida***, Jenshan Lin**, and Chao-Kai Hsu*
*Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan, ROC
**Department of Electrical and Computer Engineering, University of Florida, Gainesville, Florida 32611, USA
***Green Innovation Research Laboratories, NEC Corporation, Tsukuba, Ibaraki 305-841, Japan

(Received July 26, 2013; accepted October 25, 2013)

Abstract
This paper presents the design and implementation of an LED lighting module powered by a wireless power transfer
system. The overall system achieves an efficiency of 82% with an output power of 36 W when the load resistance in the
receiver is 30 Ω, which is the turn-on resistance of the LED lighting module. The transmitter of the system adopts Class-
E power amplifier structure instead of Class-D, to decrease the number of transistors and its cost. The coils of the system
are designed by electromagnetic coupling methodology and realized by Litz wire to reach high efficiency. Matching cir-
cuits between the system blocks are also discussed in this paper in order to obtain the excellent system performance.

Keywords: Wireless power transfer, Class-E power amplifier, Electromagnetic coupling, Litz wire, LED

1. Introduction also a switching type amplifier. It has fewer components


Recently, interest in wireless power transfer (WPT) with high reliability and a low-cost advantage, with a theo-
technology has been growing substantially. This technol- retical efficiency of 100%.[1] However, compared to Class-
ogy can be applied to charge or power electronic devices D power amplifiers, Class-E power amplifiers are more
wirelessly. WPT further contributes to technical fields sensitive to the output impedance. Understanding the
such as medical science and automobile industry. A WPT methodology on how to design an accurate output imped-
system consists of a transmitter, coupling coils, a receiver, ance of the Class-E power amplifier is the crucial aspect in
and matching circuits. The matching circuits between the system implementation. In this study, the matching
each system block are introduced to transform the imped- circuit between the Class-E power amplifier and transmit-
ance in order to confirm the system blocks operate at cor- ting coil is combined with the capacitor of the resonating
rect input and output impedance condition. However, the circuit in the Class-E power amplifier, simplifying the sys-
matching design depends on the load resistance in the tem structure while keeping the same performance.
receiver. When the resistance changes, the efficiency of Three main methodologies are introduced to achieve
the receiver drops due to the mismatch, resulting in a drop wireless power transmission, including electromagnetic
in coupling coefficient which consequently causes a drop coupling, magnetic resonance, and microwave power
in efficiencies of the transmitter and overall system. In this transmission.[2, 3] Among these technologies, electro-
study, the turn-on resistance of the LED module is 30 Ω, magnetic coupling is the most suitable solution for LED
thus, the system design is based on this condition. lighting applications. It can achieve efficiency levels of at
Another design challenge is the transmitter circuit. It least 70% for distances of several millimeters to several
determines the performance of WPT systems. Generally, centimeters between the transmitting and receiving coil.
Class-D power amplifiers are chosen to realize the trans- For designing the coils, the quality factor Q is the key
mitter, but it requires at least two transistors to achieve parameter. In order to obtain the high quality factor, this
zero voltage switching (ZVS), increasing the cost of prod- study uses Litz wire to fabricate the coils to improve the
ucts and introducing process yield problems. This study efficiency.
selects Class-E power amplifier circuit structure which is In this paper, section 2 describes the design and mea-

32 Copyright © The Japan Institute of Electronics Packaging


Chen et al.: A 36 W Wireless Power Transfer System with 82% Efficiency (2/6)

surement results of a 38 W Class-E power amplifier with generated by Agilent 33521A waveform generator. Figure
93% efficiency. The content also includes the experiment of 2 shows the implemented Class-E power amplifier. Figure
varying the amplitude of driving clock signal to examine 3–6 show the performance of the circuit, and the wave-
the performance of the Class-E. The implementation of the forms and output power are measured by using a current
WPT system is demonstrated in section 3. The discussion probe (Tektronix P6021), voltage probes (Tektronix
of load resistance variation is also presented. Section 4 P2220) and an oscilloscope (Tektronix TDS2004B).
shows the LED lighting module powered by the designed Figure 3 displays the drain voltage waveform and the
WPT circuit. Finally, the conclusion of this work is pre- clock signal of 50% duty cycle at the gate of the transistor
sented in section 5. M1 when VDD of 25 V was applied. As shown, the drain
voltage drops to zero right before the transistor is turned
2.  High Performance Class-E Power Amplifier on, preventing the overlap between these two waveforms.
Figure 1 shows the schematic diagram of the Class-E This proves that the Class-E power amplifier achieves
power amplifier which is used to convert DC power to AC proper zero voltage switching condition. Figure 4 shows
power. The output power capability of a WPT system is the output voltage and current waveforms. Since they are
related to the maximum output power of the DC-AC both in phase, the Class-E can yield the maximum possible
inverter. In order to obtain a higher output power, the output power. Figure 5 is the output power and drain effi-
value of load resistor R of the Class-E power amplifier ciency versus drain supply voltage. When the supply volt-
should be smaller. That is because the Class-E power age VDD is 32 V, the output power is 38.1 W with a drain
amplifier will be driven by a higher current, and the output efficiency of 93%. The correlation among the amplitude of
power will dramatically increase when the biasing voltage the clock signal, the output power and the drain efficiency
is at the same condition. However, according to the equa- is summarized in Fig. 6. The amplitude of the clock signal
tions listed in [3], the Class-E power amplifier needs a is varied from 5 V to 10 V while the supply voltage VDD
smaller C1 to operate normally when a smaller R is cho- remains at 25 V. The result shows how the circuit per-
sen. Therefore, a transistor with small parasitic capaci-
tance Cds is a better choice to design a high output power
Class-E power amplifier.[4] In this study, the transistor
IRF640 with less than 200 pF parasitic capacitor Cds was
selected when the drain to source voltage is over 30 V.
Considering the value of load resistor R should be higher
than parasitic resistance of L2 to reduce the power loss in
the inductor, a 10 Ω load resistor was used to be the initial
condition for the equations listed in [3]. Selecting 240 kHz
as the operating frequency, the other component values
are L1 = 500 µH, C1 = 14.4 nF, C2 = 54 nF, L2 = 18 µH. Con-
sidering the maximum output power is over 38 W, these Fig. 2  Photograph of the Class-E power amplifier.

components have the characteristic of high voltage and


current rating. The quality factor of the components was
also considered to reduce the power loss in the compo-
nents. The 240 kHz clock operating the transistor M1 is

Fig. 1  Schematic diagram of the Class-E power amplifier. Fig. 3  Drain and gate waveform.

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Transactions of The Japan Institute of Electronics Packaging  Vol. 6, No. 1, 2013

VDD
M
L1
L2 C2 C3

Clock
M1 L3 L4
C4
Rload

Fig. 7  Schematic diagram of the WPT system, consisting of


Class-E, coupling coils, rectifier, and matching networks.

Fig. 4  Voltage and current waveforms at R.

Fig. 8  Photograph of the WPT system, including transmitter


and receiver.

coils, a rectifier circuit and matching networks.[3] Wire-


less power transfer is accomplished by the coupling coils.
These coils, designed by using electromagnetic field analy-
sis method, were made by using Litz wire to form an 8-turn
rectangular shape on a paperboard. Due to its multiple-
Fig. 5  Output power (solid squares) and drain efficiency strand structure, this type of wire can reduce the power
(hollow circles) versus drain supply voltage. loss caused by skin effect and proximity effect at high fre-
quency, thus the quality factor is increased. The measured
mutual inductance between the two coils separated by 5
mm is 21.59 μH while the inductance of the transmitting
coil L3 is 17 μH with a parasitic resistance of 0.17 Ω, and
the inductance of the receiving coil L4 is 17.36 μH with a
parasitic resistance of 0.17 Ω. Those values were measured
by using an Agilent impedance analyzer 4192A at 240 kHz.
The quality factor of the designed coils is higher than 150.
It proves that Litz wire has excellent performance to imple-
ment low loss electromagnetic coupling coils. The full-
bridge rectifier, composed of four SK310A diodes and a
capacitor C4 of 68 uF, was selected to convert the AC
Fig. 6  Output power (solid squares) and drain efficiency power to DC power. The series-series matching network
(hollow circles) versus amplitude of clock signal. structure[5, 6] is chosen to transform the impedance in
order to ensure the system blocks operating with correct
forms more efficiently when it is driven by clock signals input and output impedances when the load resistance R is
with the amplitude over 5.5 V. 30 Ω. C2 of 38 nF, combining the capacitor of the resonator
in the Class-E power amplifier with the capacitance from
3.  Design and Verification of WPT System series matching network, is designed to obtain the maxi-
Figure 7 illustrates the schematic diagram of the WPT mum power transmission. C3 of 10 nF performs the same
system, consisting of the Class-E power amplifier, coupling role. The photograph of the WPT system is shown in Fig. 8.

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Chen et al.: A 36 W Wireless Power Transfer System with 82% Efficiency (4/6)

M
C1 C2

L1 L2 Rload
Zin

Fig. 11  Simplified circuit model of Class-E output imped-


ance.

Fig. 9  Power delivered to a 30-Ω load (solid squares) and


system efficiency (hollow circles) versus drain supply voltage.

Fig. 12  Photograph of the LED Module.

Fig. 10  Power delivered to Rload (solid squares) and system


efficiency (hollow circles) versus load resistance.

Figure 9 shows the power delivered to the load and the Fig. 13  Photograph of the measuring setup.

system efficiency versus drain supply voltage when the


load resistance is 30 Ω. The system delivers 35.9 W to the system achieves the highest efficiency and output power
load resistance R with a system efficiency of 81.8%. The at an optimal Rload.
system efficiency versus load resistance when a supply ω2M 2
Zin = (1)
voltage VDD of 34 V is shown in Fig. 10, which verifies Rload
that the system achieves the best performance when the
load resistance is 30 Ω. Figure 11 illustrated the simplified 4.  LED Lighting Module With WPT System
circuit model of the Class-E output impedance. Equation Figure 12 displays the photograph of the LED module
(1) further explains why the performance of the system consisting of 12 LED chips bonded on a flexible PCB that
degrades fleetly when the load resistance changes in Fig. can be attached to a curved surface. Measurement setup
10. This equation represents the impedance looking into for testing the LED lighting module powered by the WPT
the transmitting coil at the resonance which is also the system is illustrated in Fig. 13. The receiving coil is on top
output impedance of the Class-E power amplifier. When of the transmitting coil, and the distance between the two
the load resistance Rload of the system changes, the out- coils is 5 mm. The system load resistance of 30 Ω is
put impedance of the Class-E power amplifier also replaced by the LED module and it is connected to the
changes, resulting in a non-optimal operating condition of rectifier directly. When the LED module turns on, the
the Class-E power amplifier. This is the reason that the power delivered to the module is 2.5 W while the Class-E

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Transactions of The Japan Institute of Electronics Packaging  Vol. 6, No. 1, 2013

power amplifier consumes 3.1 W from a supply voltage of 9 while the system load is changing is a challenging problem
V. The system efficiency is 80.6%. It is capable of powering in practical applications.
more LED modules.
References
5. Conclusion [1] N. O. Sokal and A. D. Sokal, “Class E - A new class of
In this study, a 36 W wireless power transfer system high-efficiency tuned single-ended switching power
with 82% efficiency had been developed to power an LED amplifiers,” Solid-State Circuits, IEEE Journal of, Vol.
lighting module. Due to the sensitivity to load variation in 10, pp. 168–176, 1975.
the WPT system, the load is fixed to 30 Ω to meet the turn- [2] H. Shoki, “Issues and initiatives for practical use of
on resistance of the lighting module. In this load condition, wireless power transmission technologies in Japan,”
it is confirmed that the system can achieve the best output in Microwave Workshop Series on Innovative Wire-
power and efficiency when it is connected to the module. less Power Transmission: Technologies, Systems, and
The measured result proves that the wireless power trans- Applications (IMWS), 2011 IEEE MTT-S Interna-
fer technology is a suitable solution for powering this type tional, pp. 87–90, 2011.
of appliances. [3] K. A. Grajski, R. Tseng, and C. Wheatley, “Loosely-
The Class-E power amplifier was chosen as the DC-AC coupled wireless power transfer: Physics, circuits,
inverter of the WPT system, achieving 38.1 W output standards,” Microwave Workshop Series on Innova-
power with 93% efficiency. In the design, the small load tive Wireless Power Transmission: Technologies, Sys-
resistance and the transistor with low parasitic capacitance tems, and Applications (IMWS), 2012 IEEE MTT-S
were selected to generate higher current, yielding more International, pp. 9–14, 2012.
output power. Choosing high quality passive components [4] W. Chen, R. A. Chinga, S. Yoshida, J. Lin, C. Chen, and
also reduced the power loss, thus improving the circuit W. Lo, “A 25.6 W 13.56 MHz wireless power transfer
efficiency. The wireless power transfer was realized by system with a 94% efficiency GaN class-E power
using electromagnetic coupling technology and Litz wire, amplifier,” Microwave Symposium Digest (MTT),
which achieved a good power transfer performance at a 2012 IEEE MTT-S International, pp. 1–3, 2012.
distance of 5 mm between coils. In addition, the matching [5] Z. N. Low, R. A. Chinga, R. Tseng, and J. Lin, “Design
networks were used to enable each system block to oper- and test of a high-power high-efficiency loosely cou-
ate at the correct input and output impedance condition. pled planar wireless power transfer system,” Indus-
For the future work, the sensitivity to load variation trial Electronics, IEEE Transactions on, Vol. 56, pp.
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solved. This situation appears when the WPT technology [6] J. J. Casanova, Z. N. Low, and J. Lin, “Design and opti-
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Chen et al.: A 36 W Wireless Power Transfer System with 82% Efficiency (6/6)

Wei-Ting Chen received his master’s Shuhei Yoshida received M.A in school of
degree in communication engineering from integrated design engineering from Keio
Yuan Ze University, Taiwan, in 2005. In the University, Japan in 2007. Since 2007, he has
same year, he joined the electronic and opto- been a research member of Smart Energy
electronics research laboratories at the research labs at NEC Corporation, Japan.
Industrial Technology Research Institute, His current research interests are design
Hsinchu, Taiwan, as an engineer. Between and analysis of wireless power transmission
2011 and 2012, he was sent to the University of Florida to study system including antennas, rectifiers, amplifiers and control cir-
wireless power transfer technology, ser ving as a visiting cuits.
researcher. His major research interests include system in pack-
age (SiP) technology, wireless communication systems, and wire- Jenshan Lin received the Ph.D. degree in
less power transmission (WPT) technology. Electrical Engineering from the University
of California at Los Angeles (UCLA) in 1994.
Raul A. Chinga began attending the Uni- He worked for AT&T Bell Labs (later
versity of Florida in 2005 where he went on became Lucent Bell Labs), Murray Hill, New
to receive bachelor’s degree in electrical and Jersey, from 1994 to 2001, and its spin-off
computer engineering. Upon finishing his Agere Systems from 2001 to 2003. In July
undergraduate curriculum, Raul began 2003, he joined University of Florida as an Associate Professor,
working towards his Doctor of Philosophy in and became a Professor in August 2007. He has authored or co-
electrical and computer engineering in 2008 authored over 230 technical publications in refereed journals and
under the guidance of Dr. Jenshan Lin. The same year, Raul conferences proceedings, and holds 10 U.S. patents. Dr. Lin is a
received the Bridge to the Doctorate Fellowship from the Univer- Fellow of IEEE.
sity of Florida Graduate School. In 2010, Raul received an Honor-
able Mention for the Graduate Research Fellowship from NSF, Chao-Kai Hsu received his bachelor’s
the Verosi Scholarship from the University of Florida in 2012 and degree in mechanical engineering from
the SEAGEP Fellowship from University of Florida in 2013. His National Chin-Yi University of Technology in
work concentrates in switching RF power amplifiers for wireless 1991. Since 2004, he has served in electronic
power transmission applications and dielectric barrier discharge and optoelectronics research laboratories at
plasma. the Industrial Technology Research Insti-
tute, Hsinchu, Taiwan, and is now an engi-
neer in the advanced packaging technology division of EOL/
ITRI. His research interests include wafer-level packaging, optical
interconnects packaging, flexible electronic packaging, and 3D
IC technologies.

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