energies

Letter
Modeling and Experimentation of New
Thermoelectric Cooler–Thermoelectric
Generator Module
Khaled Teffah 1,2 ID
, Youtong Zhang 1, * and Xiao-long Mou 3
1 Laboratory of Low Emission Vehicle, Beijing Institute of Technology, Beijing 100081, China;
baronecrist@hotmail.fr
2 Algerian Space Agency, Algiers 16000, Algeria
3 Laboratory of Power Machinery and Engineering, Beijing Institute of Technology, Beijing 100081, China;
mxlzhenzhu@163.com
* Correspondence: youtong@bit.edu.cn; Tel.: +86-132-6109-9900

Received: 23 January 2018; Accepted: 2 March 2018; Published: 7 March 2018

Abstract: In this work, a modeling and experimental study of a new thermoelectric

cooler–thermoelectric generator (TEC-TEG) module is investigated. The studied module is composed
of TEC, TEG and total system heatsink, all connected thermally in series. An input voltage (1–5 V)
passes through the TEC where the electrons by means of Peltier effect entrain the heat from the upper
side of the module to the lower one creating temperature difference; TEG plays the role of a partial
heatsink for the TEC by transferring this waste heat to the total system heatsink and converting an
amount of this heat into electricity by a phenomenon called Seebeck effect, of the thermoelectric
modules. The performance of the TEG as partial heatsink of TEC at different input voltages
is demonstrated theoretically using the modeling software COMSOL Multiphysics. Moreover,
the experiment validates the simulation result which smooths the path for a new manufacturing
thermoelectric cascade model for the cooling and the immediate electric power generation.

Keywords: thermoelectric generator-thermoelectric cooler (TEC-TEG); Peltier effect; Seebeck effect;

heatsink

1. Introduction
Due to the necessity of cooling in several fields such as electronics [1–4], automotive [5],
and photovoltaic [6,7], thermoelectric coolers (TEC) have become widespread in the last decades.
Thermoelectric coolers contain a number (N) of n-p thermoelectric doped couples made of
semiconductor material inserted between two thermally conducting and electrically insulating ceramic
plates [7]. The conversion efficiency of thermoelectric materials is governed by a dimensionless factor
called the figure of merit (ZT), which is defined as ZT “ pSσ{kqT, where S, σ, T and k are Seebeck
coefficient, electrical conductivity, operating temperature and the thermal conductivity of the material,
respectively [8]. Practically, when direct current flows from n-type material to p-type material in
a TEC, it provokes a heat transfer from a side called the cold side with a temperature Tcold, to the
other side known as the hot side of the device with a temperature Thot , where the absorbed heat
from the cold side and the rejected heat at the hot side are, respectively, Qcold and Qhot , as shown in
Figure 1A. This phenomenon is called the Peltier effect [9]. The cooling efficiency of the thermoelectric
coolers is also known as the coefficient of performance (COP) and governed by Equation (1) with
(Tave = (Tcold + Thot )/2) as follows [8]:
„? 
Thot 1 ` ZTave ´ Tcold {Thot
COP “ ? , (1)
Thot ´ Tcold 1 ` ZTave ` 1

Energies 2018, 11, 576; doi:10.3390/en11030576 www.mdpi.com/journal/energies

Energies 2018, 11, x FOR PEER REVIEW 2 of 11

Energies 2018, 11, 576 √ / (1)

2 of 11
COP = [ ],
√

Figure 1. Working principle of: (A) thermoelectric cooler; and (B) thermoelectric generator.
Figure 1. Working principle of: (A) thermoelectric cooler; and (B) thermoelectric generator.

Oppositely to Peltier effect, the thermoelectric generator (TEG) produces electric energy by
means Oppositely
of Seebecktoeffect,
Peltierviaeffect,
applying the temperature
thermoelectric generator
gradient (ΔT) (TEG)
on the produces
cold (Tcold)electric
and hotenergy
side (Thot by)
means of Seebeck effect, via applying temperature gradient
of the module [6,7,10]. Figure 1B describes the working principle of TEG. Similarcold (∆T) on the cold (T ) and hot
to TEC, TEG is a side
(T
compact device with a noiseless simple design that has no moving organs [11]; itSimilar
hot ) of the module [6,7,10]. Figure 1B describes the working principle of TEG. has been to TEC,
used
TEG is a compact device with a noiseless simple design that has no
generally in the industry as waste heat remedy [9], in vehicles [5–10], buildings (houses, restaurants,moving organs [11]; it has
been usedconcentrated
etc.), and generally in photovoltaic
the industry systemsas waste[12–14].
heat remedy [9], in vehicles
The electric [5–10], buildings
power generation efficiency (houses,
of the
restaurants, etc.), and concentrated photovoltaic
thermoelectric generators is governed by Equation (2) as follows [8]: systems [12–14]. The electric power generation
efficiency of the thermoelectric generators is governed by Equation (2) as follows [8]:
√
η= „ [√ ? ],  (2)
/
Thot ´ Tcold 1 ´ ZTave ´ 1
η“ ? , (2)
The efficiency of thermoelectric Thot generators 1 ` ZTηave and
` Tcold the coefficient of performance of
{Thot
thermoelectric coolers COP are the major challenges of the thermoelectric modules, which is why
someThe efficiency
research of thermoelectric
[15–17] has been carried generators and thethe
out to ηexpand coefficient of performance
thermoelectric materialsoffigure
thermoelectric
of merit
coolers
(ZT) byCOP are the major
maximizing challenges
Seebeck of the Sthermoelectric
coefficient [18,19] and themodules,
electricwhich is why some
conductivity research [15–17]
σ, minimizing the
has been carried out to expand the thermoelectric materials figure of merit
thermal conductivity k [20,21] of thermoelectric materials, and diminishing the manufacturing cost (ZT) by maximizing Seebeck
coefficient
of the TEM S [18,19] andHowever,
[22,23]. the electric conductivity
remarkable σ, minimizing
progress has been themade
thermal in conductivity
the last decades k [20,21] in
of thermoelectric materials, and diminishing the manufacturing cost of
thermoelectric field since the first encounter of Seebeck effect; therefore, we can divide thermoelectricthe TEM [22,23]. However,
remarkable
materials based progress
on thehasfigure
been madeof meritin the lastinto
value decades
threeingenerations
thermoelectric [8]. field
The since the first encounter
first generation is from
of
1960 to 1990 for the materials with a figure of merit value of about (ZT = 1.0) andofamerit
Seebeck effect; therefore, we can divide thermoelectric materials based on the figure maximumvalue
into three of
efficiency generations
5% [24,25]. [8].
The The first generation
second generationisproceeded
from 1960untilto 1990
2010,forduring
the materials
which the withefficiency
a figure
of merit value of about (ZT = 1.0) and a maximum efficiency of 5% [24,25].
value is about 11–15% with ZT value of about 1.8 [26]. The third generation includes research on new The second generation
proceeded
approachesuntil 2010, during
and different concepts whichthetthehaveefficiency valuesince
been carried is about 11–15%
2010 until now, with ZT value
on bulk of about
thermoelectric
1.8 [26]. The third generation includes research on new
to enlarge the figure of merit to ZT ≥ 2.0 with efficiency reaching 20% [27]. approaches and different concepts thet have
beenIn carried since 2010 until now, on bulk thermoelectric to enlarge the
this paper, we have combined equally, the cooling capability and electrical energy generation figure of merit to ZT ě 2.0
with efficiency reaching
of thermoelectric 20% [27].
materials to fit into one module. Furthermore, our module consists of two
In this paper,
components, TEC and TEG. we have combined
TEC is used equally, the cooling
for cooling capability and
by transferring theelectrical
heat from energy
its coldgeneration
side to the of
thermoelectric materials to fit into one module. Furthermore, our module
hot side by means of Seebeck effect; TEG plays the role of a remedy device by converting the waste consists of two components,
TEC
heat andof theTEG.hotTECsideisofused
TECfor intocooling by transferring
electrical the heatoffrom
energy by means its cold
Peltier effect. side
The to combination
the hot side by of
means of Seebeck effect; TEG plays the role of a remedy device
thermoelectric coolers and thermoelectric generators is novel and such module has been by converting the waste heatused
of thein hot
the
side of TEC into
photovoltaic electrical under
application energydifferent
by meanssun of Peltier effect. The
concentration combination
ratio in a previous of thermoelectric
study [7]. Modeling coolers
and thermoelectric generators is novel and such module has been
and finite element method is used to examine the cooling behavior and the electrical power used in the photovoltaic application
under different sun concentration ratio in a previous study [7]. Modeling and finite element method
Energies 2018, 11, 576 3 of 11

is used to examine the cooling behavior and the electrical power generation of TEC-TEG module at
different electrical potential using COMSOL Multiphysics software.

2. Modeling and Experimentations

2.1. COMSOL Finite Element Model

The design of the TEC-TEG module using COMSOL Multiphysics software (COMSOL Group,
version 5.2.0.220, Stockholm, Sweden) is shown in Figure 2. Theoretically, an external direct electrical
potential (1–5 V) passes through the proposed thermally insulated module (except the TEG’s cold side
(lower side) which is kept at ambient temperature Tcold (TEG) = Tamb ) for the purpose of studying the
cooling ability of TEC. A heat flow Qcold (TEC) is absorbed from the upper side of TEC and transferred
to the contact point of the two modules where is located the highest temperature of the system
Thot (TEC-TEG) = Tmax . However, as the cooling capacity and power generation of thermoelectric
modules depend on the temperature difference between the module sides, TEG will be a remedy
device of the TEC, by converting a portion of its waste heat Qhot into electric power. The materials
properties used for simulation and design parameters are in Tables 1 and 2, respectively; the value of
Energies
Seebeck 2018, 11, x FOR PEER
coefficient, REVIEW
electrical conductivity and thermal conductivity can be found in Reference 4[7].
of 11

Figure
Figure 2.
2. 3D
3Dview
view of
of the
the TEC-TEG
TEC-TEG module
module using
using COMSOL
COMSOL Multiphysics.
Multiphysics.

The steady state

Table 1. finite element
Material model
proprieties of computes the temperature
the hybrid model (From COMSOL and the electric potential values
Multiphysics).
corresponding to spatial coordinates only; the governing equations that analyze the thermoelectric
device behavior are Heat
the heat flow described Equation (3),Seebeck
in Density Electrical of electric
and the continuity Thermal
charge in
Proprieties
Capacity Cp 3 Coefficient Conductivity Conductivity
Equation (4) [28], where both are coupled
Material
(J/kg¨¨K) by constitutive
(kg/m ) Equations
(V/K)
(5) and (6)
(S/m)
as follow:
(W/m¨¨K)
P-n thermocouple (Bi1 Te3 ) 154 7700 ˘S(T) σ(T) K(T)
Conductors (Copper) 385 ρC +8960 q = , / 5.998 ˆ 107 400 (3)
Ceramic plate (Tungsten) 132 17,800 / / 175

[ε] + J=0, (4)

q = [ᴨ] J − [ ] T, (5)

J = [σ] E − [σ] [S] T, (6)

where ρ, C, T, t, , q, J, E, [ε], [ᴨ], [ ], [σ] and [S] are the density, specific heat capacity, absolute
Energies 2018, 11, 576 4 of 11

Table 2. Geometrical used parameters for TEC/TEG.

Design Parameters Value

TEC/TEG length (mm) 40.1
TEC/TEG width (mm) 40.1
TEC/TEG height (mm) 4
Ceramics thickness (mm) 1
Conductor thickness (µm) 100
Leg length (mm) 2
Leg width (mm) 1.5
Leg height (mm) 1.8
Pitch (mm) 0.9
number of Thermocouples (N) 60

The steady state finite element model computes the temperature and the electric potential values
corresponding to spatial coordinates only; the governing equations that analyze the thermoelectric
device behavior are the heat flow described in Equation (3), and the continuity of electric charge in
Equation (4) [28], where both are coupled by constitutive Equations (5) and (6) as follow:

BT Ñ Ñ
ρC ` ∇¨ q “ q9 , (3)
Bt
¨ Ñ
˛
Ñ B E Ñ Ñ
∇¨˝rεs¨ ‚` ∇¨ J “ 0 , (4)
Bt

Ñ Ñ Ñ
q “ rΠs¨ J ´ rks¨∇T, (5)
Ñ Ñ Ñ
J “ rσs¨ E ´ rσs¨rSs¨∇T, (6)
. Ñ Ñ Ñ
where ρ, C, T, t, q, q , J , E , rεs, rΠs, rks, rσs and rSs are the density, specific heat capacity, absolute
temperature, time, heat generation rate per unit of volume, heat flux vector, electric current intensity
vector, electric field intensity vector, electric permittivity matrix, Peltier coefficient matrix, thermal
conductivity matrix, electric conductivity matrix, and Seebeck coefficient matrix, respectively.
Ñ
The electric field E can be derived from an electric scalar potential ϕ, as shown in Equation (7):
Ñ Ñ
E “ ´∇ϕ , (7)

Under a steady state condition and by substituting Equations (5)–(7) into Equations (3) and (4),
we get the thermoelectric system Equations (8) and (9), where they can be transformed into finite
element equations to solve the temperature T and the electric potential ϕ:
Ñ Ñ Ñ Ñ
∇¨rΠs¨ J ´ ∇ ¨rks¨∇T “ q9 , (8)
Ñ Ñ Ñ Ñ
∇¨rσs¨∇ϕ ` ∇¨rσs¨rSs¨∇T “ 0 , (9)

To get the emitted heat from the hot side Qhot, and the absorbed heat at the cold side Qcold by
TEC device, Equations (10) and (11) are the differential equations solution at the junction, in which S,
Tcold , Thot , ITEC , RTEC , and kTEC , are Seebeck coefficient of the module, cold and hot side temperature,
electric current, total electric resistance, thermal conductivity of the TEC module, correspondently.

Qcold “ SITEC Tcold ´ 0.5ITEC 2 RTEC ´ kTEC pThot ´ Tcold q, (10)

Qhot “ SITEC Thot ` 0.5ITEC 2 RTEC ´ kTEC pThot ´ Tcold q, (11)

Tcold
T cold,, T
Thot
hot,, I
ITEC
TEC,, R
RTEC Tcold
TEC ,, and
and
, Thotkk,TEC
ITEC
TEC ,, are
are
, RTEC
Seebeck
, and kcoefficient
Seebeck coefficient
TEC, are Seebeck of the
of thecoefficient
module, cold
module, cold
of the
and
and module,
hot side
hot sidecold
temperature,
and hot side temperature,
temperature,
electric current, total electric resistance, thermal conductivity of the TEC module, correspondently.correspondently.
electric current, total
electric electric
current,resistance,
total electric
thermal resistance,
conductivity thermalof the
conductivity
TEC module, of the
correspondently.
TEC module,
Energies 2018, 11, x FOR PEER REVIEW (10)5 of 11 (10)
Qcold = SITECTcold Qcold− 0.5I
= SITECTECT
2
Rcold
TEC − 0.5I𝑘TEC TEC
2
(Thot RTEC− T− ), (Thot − Tcold), (10)
𝑘TEC
cold
Energies 2018, 11, 576 5 of 11
TEnergies
cold, Thot , ITEC
2018, 11,, xRFOR
TEC, PEER
and kREVIEW
TEC, are Seebeck coefficient 2 of the module,
2 cold and hot side temperature, (11)5 of 11 (11)
Qhot = SITECThot Qhot
+ 0.5I= SITECRThot − + 0.5I
𝑘 TEC
TEC(Thot
RTEC− T− 𝑘TEC), (Thot − Tcold),
electric current, total electric resistance, TEC
thermal TEC
conductivity of the cold
TEC module, correspondently.
Tcold
The
The, Theat
hot, ITEC
heat , RTEC
input
input ,hot
фThe and
hot andkTEC
heat , are Seebeck
output
input ф
фcold
hot and
cold coefficient
ofofTEGoutput
are of of
aredetermined
ф cold theTEG
module,
by
are cold and(12)
by Equations
determined hot side
byand temperature,
Equations
(13), where
(12)
(10)and (13), where
Qcold hot and output
= SITECTcoldcold
TEG determined
− 0.5ITEC2 RTEC − 𝑘TEC(Thot − Tcold),
Equations (12) and (13), where
kkTEG
TEG electric
, ,RRTEG
TEG andcurrent,
ITEG
TEG kTEG total
are, ,are,TEGelectric
Rrespectively,
and ITEG resistance,
are,
the thermal
respectively,
thermal conductivity
the thermal
conductivity, of
total the TEC module,
conductivity,
resistance, total
and correspondently.
resistance,
andgenerated and generated current
current
TEG TEG and ITEG respectively, the thermal conductivity, total resistance, generated current
of the thermoelectric of
of the thermoelectricQQgenerator the generator
thermoelectric module:
module: generator module:
22 (10)
(11)
hot =
cold = SISITEC
TECTThotcold+−0.5I 0.5I TECRR
TEC TEC−−𝑘TEC
TEC 𝑘TEC (T(T hot−−TT
hot cold
cold ),),
(12) (12)
фcold ф =hot SIand фcold
Toutput
cold +ф = SITEG2T
0.5I Rcold + 0.5I
𝑘 TEG 2
(Thot RTEG
−byT+
cold ) (Thot
𝑘TEG − Tcold)
The heat input TEG coldTEG
of TEG2TEG2are TEG
determined
RTEC ` kTEG pThot−´TTcold),Equations (12) and (13), (11)
where
Qhotcold = SI“TEC SITEC
ThotTcold
+ 0.5I` 0.5ITEC
TEC R TEC − 𝑘TEC(T hot cold
q (12)
kTEG, RTEG and ITEG are, respectively, the thermal 2 conductivity, 2total resistance, and generated(13) current (13)
фhot =фSI hotTEG
Toutput
фhot− 0.5I
= SITEG
TEG TRcold
TEG −+ 0.5I
𝑘determined
TEGTEG(ThotRTEG−by
T+ 𝑘TEG
) (Thot(12) − Tand
cold)(13), (13)
of theThe heat input
thermoelectric hot and
generator “ SIcoldmodule:
T
TEC cold
ф cold
´ of
0.5I TEG
TEC
2 are
R TEC ` k pT
TEG hot ´cold
Equations
T cold q where
kTEG, RTEG and ITEG are, respectively, the thermal2 conductivity, total resistance, and generated current (12)
2.2.ofExperimental
Experimental 2.2. фExperimental
Settlement Tcold + 0.5ITEG RTEG + 𝑘TEG(Thot − Tcold)
= SITEGSettlement
coldgenerator
2.2. the thermoelectric Settlement module:
22 RFigure (12) (3)–(13). The
(13)
In experimentation,
In фhot
cold=
experimentation, =the
theSISIsystem
TEGTTcold
In experimentation,
TEG
system −
is is
cold +0.5I
0.5ITEG
the
based
based system
on onRTEG
TEGFigureTEG+ 3+𝑘
is based 𝑘TEG
and 3 and
TEG (Thot
(T
on Figure−−TTcold
governed
governed
hot 3by and
cold ) governed
)by Equations
Equations by(3)–(13).
Equations
(3)–(13). The
TEC-TEG
The TEC-TEG moduleTEC-TEG
is well
module module
illustrated
is well is well
illustrated in Figure
inillustrated
Figure 3A3A andin
andFigure
thethewhole 3A system
whole and
system thewith
whole
with the
thesystem
measuring
measuringwith the measuring
2 (13)
equipment in
equipment in Figure
Figure ф
equipment = SIinTEG
3B. Furthermore,
hot
3B. Furthermore,T
Figure
cold3B. − 0.5I
aa CP12706
CP12706
TEG TEC R
Furthermore, TEG + 𝑘
TEC a(Hebei
CP12706
(Hebei
TEG IT,(T hot
IT, − T
TEC cold
(Hebei
Shanghai,
Shanghai, ) IT, Shanghai,
China)
China) module with
module China) module with
with
2.2. Experimental Settlement
dimensions (40 ׈dimensions
dimensions 40׈3.92
40 mm³
3.92mm³)
mm(40)3and
)×and
40 internal
×internal
3.92 mm³ ) and internal
resistance
resistance ofof2.07 Ω,Ω,isissettled
2.07resistance of at
settled 2.07 Ω, is settled
atdifferent
different at different
voltages
voltages value voltages value
value
(1–5 V),Intoexperimentation,
(1–5
examine V),
the the behavior
cooling
to examine
cooling system
behavior
the iscooling
based
by
by on
measuring
measuring Figure
behavior the
the 3temperature
by and governed
temperature
measuring Tthe
T by Equations
temperature
cold(TEC) onon the
the (3)–(13).
cold
T
cold side
side
cold(TEC) The
on
in
in the cold side in
2.2. Experimental Settlement cold(TEC)
cold(TEC)
TEC-TEG
every case.
every case. module is
every case. well illustrated in Figure 3A and the whole system with the measuring
In experimentation,
equipment in Figure 3B. the system is based
Furthermore, on Figure
a CP12706 TEC 3(Hebei and governed
IT, Shanghai, by Equations (3)–(13).with
China) module The
TEC-TEG module is well illustrated in Figure 3A and the whole system
dimensions (40 × 40 × 3.92 mm³) and internal resistance of 2.07 Ω, is settled at different voltages value with the measuring
equipment
(1–5 in Figure
V), to examine the3B. Furthermore,
cooling behavioraby CP12706
measuringTECthe (Hebei IT, Shanghai,
temperature Tcold(TEC)China)
on themodule
cold side with
in
dimensions
every case. (40 × 40 × 3.92 mm³ ) and internal resistance of 2.07 Ω, is settled at different voltages value
(1–5 V), to examine the cooling behavior by measuring the temperature Tcold(TEC) on the cold side in
every case.

Figure 3. (A)
Figure 3.
Figure (A) TEC-TEG
TEC-TEG
Figure
TEC-TEG module
3. (A)illustration;
module
module TEC-TEG
illustration;
module
and(B)
and
illustration; and (B)
illustration;
laboratory
laboratory
(B) and
equipment
(B) laboratory
equipment
laboratory equipment set-up
set-up equipment
to measure
measure
to measure
set-up to set-up
TEC- to measure TEC-
TEC-TEG
TEC-
TEG cooling
cooling
TEG and voltage
TEG
and voltage
cooling cooling
potential
potential
and voltage and generation.
voltage
generation.
potential potential
generation. generation.

A A Thermocouple of K type (Thermometer GM1312 madecompany, by BENETECH company, Shenzhen,

A Thermocouple
Thermocouple of of KK type
type (Thermometer
(Thermometer GM1312 GM1312made madeby by BENETECH
BENETECH company, Shenzhen, Shenzhen,
China) Figure
is used China)
3. for
(A) TEC-TEG
that is used
purpose for
module
and that purpose
illustration;
similarly and
and
to (B)similarly
measurelaboratory
the toequipment
measure set-up
temperature the
valuetemperature
to measure
Thot
hot value
at theThot (TEC-TEG) at the
(TEC-TEG)TEC-
(TEC-TEG)
China) is used for that purpose and similarly to measure the temperature value Thot (TEC-TEG) at the
contactTEGpoint between
cooling contact
and the point
TECpotential
voltage between
and TEG. the TEC and TEG.
generation.
contact point between the TEC and TEG.
Figure
TEC 3. (A) TEC-TEG module illustration;
TEC is connected thermally and (B) laboratory
in series with TEG, equipment
as shown set-up tothe
in Figuremeasure TEC- is the TEG used is
3. However,
TEC isis connected
connectedthermallythermallyininseries
serieswith
withTEG,
TEG,asasshown
showninin Figure
Figure3. 3.
However,
However, TEG
the TEG used
used
A
TEGThermocouple
cooling
also a CP12706 model and
also a with of
voltageK
CP12706 type (Thermometer
potential
the same generation.
modeldimensions
with the sameGM1312 made
and dimensions by
parameters, and BENETECH
but parameters, company,
used for the but electric Shenzhen,
usedpower
for the electric power
is also a CP12706 model with the same dimensions and parameters, but used for the electric power
China) ispurpose.
generation usedgeneration
forInthat purpose
addition, theand
purpose. similarly the
thermoelectric
In addition, togenerator
measure theconnected
thermoelectric
is temperature
generator value
to a is
copper Theatsink
connected at the heatsink with
to a with
hot (TEC-TEG)copper
generation purpose. In addition,
A point
Thermocouple of K the(Thermometer
type thermoelectric GM1312
generatormade
is connected
by to a copper
BENETECH heatsinkShenzhen,
company, with a
contact
atemperature between
temperature(T(Taheatsink temperaturethe TEC and TEG.
(Theatsink ) for thethe
aim of cooling the whole TEC-TEG module (Heatsink temperature it
))that
for the
the aim
aim ofcooling
cooling whole TEC-TEG module (Heatsink temperature itatit
heatsink
China) for of the whole TEC-TEG theinmodule (Heatsink
valuetemperature isthe
TECisand
is constant isused is for
heatsink
connected
equal constant
to 301 purpose
thermally
and
K. equal and
in to similarly
series
301with
K. TEG, to measure
as shown temperature
Figure 3. However, Tthe TEG used
hot (TEC-TEG) is
constant
contact and
pointequal to 301 K. TEC and TEG.
between
also a CP12706 model the with the same dimensions and parameters, but used for the electric power
TEC ispurpose.
generation connected In thermally
addition, thein series with TEG,generator
thermoelectric as shownisinconnected
Figure 3. However,
to a copperthe TEG used
heatsink with is
also a CP12706 model with the same dimensions and parameters, but
a temperature (Theatsink) for the aim of cooling the whole TEC-TEG module (Heatsink temperature it used for the electric power
isgeneration
constant and purpose.
equal In to addition,
301 K. the thermoelectric generator is connected to a copper heatsink with
a temperature (Theatsink) for the aim of cooling the whole TEC-TEG module (Heatsink temperature it
is constant and equal to 301 K.
ambient temperature (Tamb = 300.15 K) to 291.11 K at an input voltage equal to 1 V. The TEC cold side
temperature decreases dramatically reaching its lowest temperature, which equals to 278.63 K at 4 V.
Because of overheating due to the intensification of Joule heat, a slight increase in temperature reaching
279 K at input voltage of 5 V is noticed. (The COMSOL Multiphysics simulation results of the
temperature contours of TEC-TEG module at every TEC’s voltage input (1–5 V) is shown in Figure 4).
Energies 2018, 11, 576 6 of 11
However, the experiment validates the simulation results where TEC’s cold side temperature
decreases from the ambient temperature (301 K) to 296.9 K at input voltage equals to 1 V. Besides, the
TEC’s cold sideand
3. Simulation temperature decreases
Experimental Results continually to reach the lowest temperature value of 287.3 K
at input voltage of 4 V, but it increases again at input voltage of 5 V reaching 288.9 K.
The experimental
Figure 5 shows the and simulation
influence resultsvoltage
of the input of TEC’s cold on
of TEC sidethetemperature
temperatureatdifference
different between
voltages
input (1–5 V) is shown in Figure 5. The graph shows the cooling behavior of
the cold and hot side of TEG (∆T) in both simulation and experiment. The temperature difference ∆Tthe module at different
electric
is directlyvoltage input; as
proportional to expected
the TEC’stheinputtemperature of the cold
voltages, where side of in
it increases TEC decreases
simulation in simulation,
from 0 K at 0 V
to 0.88 K at 1 V and reaches a maximum of 16.9 K at voltage input equal to 5 V. Similar to1simulation,
from the ambient temperature (T amb = 300.15 K) to 291.11 K at an input voltage equal to V. The TEC
coldtemperature
the side temperature decreases
difference dramatically
∆T increases fromreaching its lowest
0 K at input temperature,
voltage of 0 V to which
reach equals to 278.63ofK
the maximum
at 4 V.KBecause
23.27 at 5 V of overheating
input duethe
voltage in to experiment.
the intensification
Slightofdifference
Joule heat,ina simulation
slight increase
andinexperimental
temperature
results is noticed, due to predefined geometrical parameters and material properties usedof for
reaching 279 K at input voltage of 5 V is noticed. (The COMSOL Multiphysics simulation results the
temperature contours of TEC-TEG module
simulation and the module used for experiment. at every TEC’s voltage input (1–5 V) is shown in Figure 4).

(a)

Figure 4. Cont.
Energies 2018, 11, 576 7 of 11

Energies 2018, 11, x FOR PEER REVIEW 7 of 11

(b)

(c)
Figure 4. Temperature contour of TEC-TEG and TEG’s electric potential at different TEC’s voltage
Figure 4. Temperature
input: (a) V = 0 and V contour
= 1; (b) V of
= 2TEC-TEG and
and V = 3; (c) V TEG’s
= 4 and electric
V = 5. potential at different TEC’s voltage
input: (a) V = 0 and V = 1; (b) V = 2 and V = 3; (c) V = 4 and V = 5.
Energies 2018, 11, 576 8 of 11

However, the experiment validates the simulation results where TEC’s cold side temperature
decreases from the ambient temperature (301 K) to 296.9 K at input voltage equals to 1 V. Besides,
the TEC’s cold side temperature decreases continually to reach the lowest temperature value of 287.3 K
at input voltage of 4 V, but it increases again at input voltage of 5 V reaching 288.9 K.
Figure 5 shows the influence of the input voltage of TEC on the temperature difference between
the cold and hot side of TEG (∆T) in both simulation and experiment. The temperature difference ∆T
is directly proportional to the TEC’s input voltages, where it increases in simulation from 0 K at 0 V to
0.88 K at 1 V and reaches a maximum of 16.9 K at voltage input equal to 5 V. Similar to simulation,
the temperature difference ∆T increases from 0 K at input voltage of 0 V to reach the maximum of
23.27 K at 5 V input voltage in the experiment. Slight difference in simulation and experimental results
is noticed, due to predefined geometrical parameters and material properties used for simulation and
the module used for experiment.

Figure 5. TEC’s cold side (TECc) and TEC-TEG contact side temperature and temperature difference
(∆T) between TEG’s sides at different TEC’s voltage input.

Figure 4 describes, at different voltages input, the temperature propagation from the cold side of
the thermoelectric cooler to the hot side of the thermoelectric generator, and from this latter side to the
heatsink which is maintained at ambient temperature (Tamb = 300.15 K). The current flows through
TEC at voltage input of 1 V, transfers an amount of heat from its cold side to the contact side of TEC
and TEG and increases its temperature to 301.03 K. With increasing the input voltage of TEC to be 2 V,
3 V, 4 V and 5 V, the TEC-TEG contact side temperature increases to about 303.76 K, 308.41 K, 315 K
and 323.42 K, respectively.
Energies 2018, 11, 576 9 of 11

Figure 5 shows simulation and experimental results comparison of TEC-TEG contact side
temperature at different TEC’s voltages input results. Moreover, the temperature at TEC-TEG contact
side is proportional to the input voltage in both simulation and experiment. From an input voltage of
0 V to 1 V, 2 V, 3 V, 4 V and 5 V, the temperature increases from 301 K to 302.40 K, 305.3 K, 306.8 K,
311.4 K and 317.90 K, respectively.
Results of TEG potential generated in simulation are shown in Figure 4 where the generated
potential of thermoelectric generated is equal to 0 V at input voltage of 0 V (no electric potential
generated). By increasing the TEC’s voltage input to 1 V, 2 V, 3 V, 4 V and 5 V, the electric potential
generated by TEG increases reaching values of about 0.02 V, 0.07 V, 0.17 V, 0.30 V and a maximum
of 0.50 V, respectively. Figure 6 shows the comparison between the electric potential generated by
TEG at different TEC input voltages without load in simulation and experiment. TEG potential
output is directly proportional to TEC’s input voltage in both, simulation and experiment; therefore,
the obtained results of the TEG electric potential generated in experiment are similar to the one of
simulation. Moreover, TEG electric potential generated at input voltage of 1 V in experiment is equal to
0.03 V and it increases at input voltage of TEC of 2 V, 3 V, 4 V and 5 V to about 0.11 V, 0.22 V, 0.4 V and
a maximum of 0.60 V. Slight difference between simulation and experiment result is noticed because of
the experimental
Energies 2018, 11, x FORconditions and the simulation boundary conditions.
PEER REVIEW 9 of 11

Figure
Figure6.6.Electrical
Electricalpotential
potentialgenerated
generatedby
byTEG
TEGatatdifferent
differentTEC
TECvoltage
voltageinput.
input.

4.4.Conclusions
Conclusions
Thermoelectric
Thermoelectricdevices
devicesare
areenvironmentally
environmentallyfriendly
friendlyfor foreither
eitherpower
powergeneration
generationor or cooling
cooling
purposes; therefore, in this work, TEC-TEG module was investigated via simulation and
purposes; therefore, in this work, TEC-TEG module was investigated via simulation and experiment. experiment.
Our
Ourmodule
modulecontains
containsTEC,
TEC,TEG
TEGandandtotal
totalcopper
copperheatsink
heatsinkattached
attachedthermally
thermallyin inseries;
series;the
thecooling
cooling
behavior of TEC and TEG’s electric power generation is examined. The electrical potential
behavior of TEC and TEG’s electric power generation is examined. The electrical potential generation generation
of
ofTEG
TEGincreases
increaseswith
withincreasing
increasingthe
thevoltage
voltageinput
inputof
ofTEC
TECto toreach
reachabout
about0.5 0.5VVatatan
aninput
inputvoltage
voltageofof
55V. Furthermore, when direct electric current passes through TEC, it transfers an amount
V. Furthermore, when direct electric current passes through TEC, it transfers an amount of heat from of heat
from the cold side to the hot side of the module, where the cold side of the thermoelectric cooler
reaches a minimum temperature of 278.63 K and 287.3 K in simulation and experiment, respectively,
at TEC’s input voltage of 4 V. Moreover, results in this study show the influence of the TEC’s input
voltage on the temperature difference between the hot and cold side of the TEG which is important
to maximize the electric potential generated by the TEG. The temperature difference between TEG’s
Energies 2018, 11, 576 10 of 11

the cold side to the hot side of the module, where the cold side of the thermoelectric cooler reaches a
minimum temperature of 278.63 K and 287.3 K in simulation and experiment, respectively, at TEC’s
input voltage of 4 V. Moreover, results in this study show the influence of the TEC’s input voltage on
the temperature difference between the hot and cold side of the TEG which is important to maximize
the electric potential generated by the TEG. The temperature difference between TEG’s sides is directly
proportional to the TEC’s input voltages where the maximum temperature difference is about 17 K
and 23 K at an input voltage of 5 V in experiment and simulation, respectively. Design and results
of this work show the significance of using thermoelectric generators as partial heatsink and remedy
device for thermoelectric coolers, even without an additional external thermal load. This study paves
the way for new thermoelectric modules that can be directed to manufacturing for both cooling and
electric power generation.

Acknowledgments: This work was supported by Laboratory of Low Emission Vehicle of Beijing Institute of
Technology, Beijing, China; and the Algerian Space Agency, Algeria.
Author Contributions: All authors contributed to this work. Khaled Teffah carried out the modeling and
calculations. Xiao-long Mou and Khaled Teffah provided the original idea and analyzed the simulation results.
Youtong Zhang and Khaled Teffah supplied the original data of case study and revised the manuscript. All authors
have read and approved the final manuscript.
Conflicts of Interest: The authors declare no conflict of interest.

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