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IRGB10B60KD
IRGS10B60KD
INSULATED GATE BIPOLAR TRANSISTOR WITH
IRGSL10B60KD
ULTRAFAST SOFT RECOVERY DIODE
C
Features VCES = 600V
• Low VCE (on) Non Punch Through IGBT Technology.
• Low Diode VF. IC = 12A, TC=100°C
• 10µs Short Circuit Capability.
• Square RBSOA. G
• Ultrasoft Diode Reverse Recovery Characteristics. tsc > 10µs, TJ=150°C
• Positive VCE (on) Temperature Coefficient.
E
n-channel VCE(on) typ. = 1.8V
Benefits
• Benchmark Efficiency for Motor Control.
• Rugged Transient Performance.
• Low EMI.
• Excellent Current Sharing in Parallel Operation.
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IRG/B/S/SL10B60KD
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions Ref.Fig.
V(BR)CES Collector-to-Emitter Breakdown Voltage 600 ––– ––– V VGE = 0V, IC = 500µA
∆V(BR)CES/∆TJ Temperature Coeff. of Breakdown Voltage ––– 0.3 ––– V/°C VGE = 0V, IC = 1.0mA, (25°C-150°C)
VCE(on) Collector-to-Emitter Saturation Voltage 1.5 1.80 2.20 IC = 10A, VGE = 15V 5, 6,7
––– 2.20 2.50 V IC = 10A, VGE = 15V TJ = 150°C 9,10,11
VGE(th) Gate Threshold Voltage 3.5 4.5 5.5 V VCE = VGE, IC = 250µA 9,10,11
∆VGE(th)/∆TJ Temperature Coeff. of Threshold Voltage ––– -10 ––– mV/°C VCE = VGE, IC = 1.0mA, (25°C-150°C) 12
gfe Forward Transconductance ––– 7.0 ––– S VCE = 50V, IC = 10A, PW=80µs
ICES Zero Gate Voltage Collector Current ––– 3.0 150 µA VGE = 0V, VCE = 600V
––– 300 700 VGE = 0V, VCE = 600V, TJ = 150°C
VFM Diode Forward Voltage Drop ––– 1.30 1.45 IC = 10A
8
––– 1.30 1.45 V IC = 10A TJ = 150°C
IGES Gate-to-Emitter Leakage Current ––– ––– ±100 nA VGE = ±20V
25 180
160
20
140
120
15
Ptot (W)
IC (A)
100
80
10
60
5 40
20
0 0
0 20 40 60 80 100 120 140 160 0 20 40 60 80 100 120 140 160
T C (°C) T C (°C)
Fig. 1 - Maximum DC Collector Current vs. Fig. 2 - Power Dissipation vs. Case
Case Temperature Temperature
100 100
10 10 µs 10
IC (A)
20 µs
IC A)
1 100 µs
DC 1
1ms
0.1
0
1 10 100 1000 10000
10 100 1000
VCE (V)
VCE (V)
ICE (A)
20 20
15 15
10 10
5 5
0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
VCE (V) VCE (V)
Fig. 5 - Typ. IGBT Output Characteristics Fig. 6 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 80µs TJ = 25°C; tp = 80µs
40 40
IF (A)
20 20
15 15
10 10
5 5
0 0
0 1 2 3 4 5 6 0.0 0.5 1.0 1.5 2.0 2.5 3.0
VCE (V) VF (V)
Fig. 7 - Typ. IGBT Output Characteristics Fig. 8 - Typ. Diode Forward Characteristics
TJ = 150°C; tp = 80µs tp = 80µs
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IRG/B/S/SL10B60KD
20 20
18 18
16 16
14 14
12 ICE = 5.0A 12 ICE = 5.0A
VCE (V)
VCE (V)
10 ICE = 10A 10 ICE = 10A
ICE = 15A ICE = 15A
8 8
6 6
4 4
2 2
0 0
5 10 15 20 5 10 15 20
VGE (V) VGE (V)
Fig. 9 - Typical VCE vs. VGE Fig. 10 - Typical VCE vs. VGE
TJ = -40°C TJ = 25°C
20 80
18 T J = 25°C
70
16 T J = 150°C
60
14
12 50
ICE = 5.0A
VCE (V)
ICE (A)
10 ICE = 10A 40
ICE = 15A
8
30
6
20
4 T J = 150°C
2 10 T J = 25°C
0 0
5 10 15 20 0 5 10 15 20
VGE (V) VGE (V)
700
tdOFF
600
400 100
300
EON tdON
200
100 tF
tR
0
10
0 5 10 15 20 25
0 5 10 15 20 25
IC (A)
IC (A)
Fig. 13 - Typ. Energy Loss vs. IC Fig. 14 - Typ. Switching Time vs. IC
TJ = 150°C; L=200µH; VCE= 400V TJ = 150°C; L=200µH; VCE= 400V
RG= 47Ω; VGE= 15V RG= 47Ω; VGE= 15V
500 1000
450 EOFF
tdOFF
400
350
Swiching Time (ns)
Energy (µJ)
300
EON
250 100
200
tdON
150
tR
100
tF
50
0 10
0 50 100 150 0 50 100 150
R G (Ω) RG (Ω)
Fig. 15 - Typ. Energy Loss vs. RG Fig. 16 - Typ. Switching Time vs. RG
TJ = 150°C; L=200µH; VCE= 400V TJ = 150°C; L=200µH; VCE= 400V
ICE= 10A; VGE= 15V ICE= 10A; VGE= 15V
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IRG/B/S/SL10B60KD
25 25
RG = 10 Ω
20 RG = 22 Ω 20
RG = 47 Ω
15 15
IRR (A)
IRR (A)
10 RG = 100 Ω 10
5 5
0 0
0 5 10 15 20 25 0 50 100 150
IF (A) RG (Ω)
Fig. 17 - Typical Diode IRR vs. IF Fig. 18 - Typical Diode IRR vs. RG
TJ = 150°C TJ = 150°C; IF = 10A
25 1200
10Ω
1100 22Ω
20
1000
47Ω
900
Q RR (µC)
15 100 Ω
IRR (A)
800
20A
10 700
10A
600
5 5.0A
500
400
0
0 500 1000 1500
0 500 1000 1500
diF /dt (A/µs)
diF /dt (A/µs)
Fig. 19- Typical Diode IRR vs. diF/dt Fig. 20 - Typical Diode QRR
VCC= 400V; VGE= 15V; VCC= 400V; VGE= 15V;TJ = 150°C
ICE= 10A; TJ = 150°C
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IRG/B/S/SL10B60KD
450
400
10Ω
350
22 Ω
300
Energy (µJ)
250
47 Ω
200
100 Ω
150
100
50
0
0 5 10 15 20 25
IF (A)
1000 16
Cies
14
300V
12
400V
Capacitance (pF)
10
VGE (V)
8
100 Coes
6
Cres 4
0
10
0 10 20 30 40
1 10 100
Q G , Total Gate Charge (nC)
VCE (V)
Fig. 22- Typ. Capacitance vs. VCE Fig. 23 - Typical Gate Charge vs. VGE
VGE= 0V; f = 1MHz ICE = 10A; L = 600µH
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IRG/B/S/SL10B60KD
1
D = 0.50
Thermal Response ( Z thJC )
0.20
0.1
0.10
τi (sec)
R1 R2 R3
R1 R2 R3 Ri (°C/W)
0.05 τJ τC
τJ τ
0.285 0.000134
0.01 τ1 τ2 τ3
τ1 τ2 τ3 0.241 0.000565
0.02
Ci= τi/Ri 0.288 0.0083
0.01 Ci i/Ri
10
D = 0.50
Thermal Response ( Z thJC )
1
0.20
0.10
Ri (°C/W) τi (sec)
R1 R2 R3
0.05 R1 R2 R3
τJ τC
0.1 0.01 τJ τ
0.846 0.000149
0.02 τ1 τ2 τ3
τ1 τ2 τ3 1.830 0.001575
Ci= τi/Ri 1.143 0.027005
Ci i/Ri
0.01 SINGLE PULSE
Notes:
( THERMAL RESPONSE )
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
1E-6 1E-5 1E-4 1E-3 1E-2 1E-1 1E+0
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IRG/B/S/SL10B60KD
L
L
VCC 80 V +
DUT DUT
0 - 480V
Rg
1K
diode clamp /
DUT
Driver L
- 5V
DC 360V DUT /
DRIVER VCC
DUT Rg
VCC
R=
ICM
DUT VCC
Rg
500 10 500 25
400 8 400 20
90% ICE
TEST CURRENT
300 6 300 15
VCE (V)
V CE (V)
I CE (A)
ICE (A)
tf
90% test current
200 4 200 10
10% test current
5% V CE
tr 5% V CE
100 5% ICE 2 100 5
0 0 0 0
Eon Loss
Eoff Loss
-100 -2 -100 -5
-0.20 0.00 0.20 0.40 0.60 0.80 15.90 16.00 16.10 16.20
time(µs) time (µs)
Fig. WF1- Typ. Turn-off Loss Waveform Fig. WF2- Typ. Turn-on Loss Waveform
@ TJ = 150°C using Fig. CT.4 @ TJ = 150°C using Fig. CT.4
tR R
300
-100 5
ICE
250
-200 0
V CE (V)
ICE (A)
VF (V)
IF (A)
200 50
-300 10% -5
Peak 150
Peak
IRR
-400 IRR -10
100
-500 -15 50
-600 -20 0 0
-0.15 -0.05 0.05 0.15 0.25 -5.00 0.00 5.00 10.00 15.00
time (µS) time (µS)
Fig. WF3- Typ. Diode Recovery Waveform Fig. WF4- Typ. S.C Waveform
@ TJ = 150°C using Fig. CT.4 @ TJ = 150°C using Fig. CT.3
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IRG/B/S/SL10B60KD
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IRG/B/S/SL10B60KD
D2Pak Package Outline
IGBT
1- GATE
2- COLLECTOR
3- EMITTER
4- COLLECTOR
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IRG/B/S/SL10B60KD
D2Pak Tape & Reel Information
TRR
1.60 (.063)
1.50 (.059)
1.60 (.063)
4.10 (.161) 1.50 (.059)
3.90 (.153) 0.368 (.0145)
0.342 (.0135)
FEED DIRECTION
30.40 (1.197)
NOTES : MAX.
1. COMFORMS TO EIA-418. 26.40 (1.039) 4
2. CONTROLLING DIMENSION: MILLIMETER. 24.40 (.961)
3. DIMENSION MEASURED @ HUB.
3
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
Notes:
This is only applied to TO-220AB package
This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
Energy losses include "tail" and diode reverse recovery.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 6/02
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This datasheet has been download from:
www.datasheetcatalog.com