(1) (Welty, Rorrer, Foster, 6th Edition International Student Version 18.

1)

Dimensional analysis has shown the following parameters to be significant for forced
convection:

Evaluate each of these parameters at 340 K, for air, water, benzene, mercury, and
glycerin. The distance x may be taken as 0.3 m, = 15 m/s, and h = 34 W/m2K.

(2) (Welty, Rorrer, Foster, 6th Edition International Student Version 18.3)
In a thermal heat sink the heat flux variation along the axis of a cooling passage is
approximated as

where x is measured along the passage axis and L is its total length.

A large installation involves a stack of plates with a 3-mm air space between them. The
flow passages are 1.22 m long, and the heat flux in the plate varies according to the above
equation where a = 900 W/m2 and W/m2. Air enters at 100 with a mass
velocity (the product of ) of 7.5 . The surface coefficient along the flow
passage can be considered constant with a value of 56 .

Generate a plot of heat flux, mean air temperature, and plate surface temperature as
functions of x. Where does the maximum surface temperature occur and what is its
value?

(3) ID 6.35
For flow over a flat plate of length L, the local heat transfer coefficient hx is known to
vary as , where x is the distance from the leading edge of the plate. What is the ratio
of the average Nusselt number of the entire plate ( to the local Nusselt number at x
=L( )?

(4) ID 6.36
For laminar boundary layer flow over a flat plate with air at 20 and 1 atm, the thermal
boundary layer thicknesss is approximately 13% larger than the velocity boundary
layer thickness . Determine the ratio if the fluid is ethylene glycol under the same flow
conditions.

(5) ID 6.39
Forced air at and V = 10 m/s is used to cool electronic elements on a circuit
board. One such element is a chip, 4 mm by 4 mm, located 120 mm from the leading
edge of the board. Experiments have revealed that flow over the board is disturbed by the
elements and that convection heat transfer is correlated by an expression of the form:
Estimate the surface temperature of the chip is it is dissipating 30 mW.

Extra Data:
(1)(Welty, Rorrer, Foster, 6th Edition International Student Version 18.1)

Air Water Benzene Mercury Glycerin

 1.7 105 0.474 105 0.473 105 1.06 106 0.138 102
C 1.008 103 1.0 0.45 0.033 0.598
k 0.0293 0.383 0.0762 5.03 0.165
Re 2.3 105 1.02 107 1.02 107 4.57 107 37800
Pr 0.699 2.72 5.21 0.021 1305
Nu 348 15.4 77.3 1.17 35.7
St 2.1 103 5.55 107 1.45 106 1.22 106 7.21 107

(2) (Welty, Rorrer, Foster, 6th Edition International Student Version 18.3)

q  x   x 
 a  b sin    900  2500sin  
A  L   1.22 
q
in W / m2 , x in m
A Energy balance  q2  q1  q3  0
dT 2q / A q
q3  c
dx VC D (1) A
q1 q2
T x   x 
Te dT  c 0  a  b sin  L   dx
x
 x 
T  Te  77.4 x  83.5 1  cos 
 1.22 
q q/ A
for h  56W / m2 K  h(T0  T )  T0  T 
A 56
x q/A T T0 q/A T0
0 900 100 116 Tmax  380C
0.4 3040 171 226 @ x  1.15m
0.8 3110 285 340
1.2 1030 360 378 T
1.22 900 361 377
(3) PROBLEM 6.35 (ID)

KNOWN: Variation of hx with x for flow over a flat plate.

FIND: Ratio

SCHEMATIC:
(4) PROBLEM 6.36 (ID)
(5) PROBLEM 6.39 (ID)

KNOWN: Expression for the local heat transfer coefficient of air at prescribed velocity and
temperature flowing over electronic elements on a circuit board and heat dissipation rate for a 4
4 mm chip located 120mm from the leading edge.

FIND: Surface temperature of the chip surface, Ts.

SCHEMATIC:

COMMENTS: (1) Note that the estimated value for Tf used to evaluate the air properties was
reasonable. (2) Alternatively, we could have evaluated chip h by performing the integration of the
local value, h(x).