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There is a 4 layer PCB need to being reversed engineering, all the components
assembled on the surface have already been removed by hand-held soldering iron
and air pressure gun, during this stage operator must be aware of components
especially for those components with �ne lead and high unit price delicate IC, after
that, pcb board surface must be cleaned by washer water Washer which main
ingredients are chlorinated solvents, buffer, corrosion inhibitor, antioxidant, surface
active agent composition. Features of washer water is Low toxicity, no risk of
explosion, the maximum allowable concentration in air 100PPM.
2 of 7 22/08/19, 8:38 am
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/F807ZZCGOW49R34.jpg?auto=webp&
width=1024&height=1024&fit=bounds)
/ORIG/F80/7ZZC/GOW49R34
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/FT3FM2HGP5SZL24.jpg?auto=webp&width=1024&height=1024&
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1 Scan TOP layer circuit board, save the scanning picture and name as TOP.jpg, the
DPI value can be set according to the density of PCB, hereby we choose 400DPI as
reference;
3 Use sand paper to abrade the TOP layer copper and expose the 2nd layer copper
circuit pattern, scan the circuit pattern after clean it out and name it as MID1.jpg;
4 Use sand paper to abrade the 2nd layer copper and expose the 3nd layer copper
circuit pattern, scan the circuit pattern after clean it out and name it as MID2.jpg;
6 Open PCB Reverse Engineering software, click on “�le” from MAIN MENU, and
then click “OPEN BMP”, select the TOP.bmp �le and open it, set up DPI value and
then choose the layer feature as TOP layer, start to place components, through-
hole and arrange circuit line, after you have arranged everything on the TOP layer,
save �le as temporary and name as TOP-1.dpb ( save the �les periodically under
different name such as TOP-2, TOP-3, TOP-4 prevent �les lost from unexpected
power cut-off or computer breakdown );
7 Click on “�le” from MAIN MENU, and then click “OPEN BMP”, select the
BOTTOM.bmp �le, at the same time open temporary �le TOP-1.dpb, and you will
�nd that TOP layer picture which has been �nished already can’t align to BOTTOM
layer background picture, so you have to use cursor “UP”, ”DOWN”, ”LEFT”,
”RIGHT” to move its location, now you can choose some reference points to align
the layers and after you have �nished alignment you can start to place components,
through-hole and arrange circuit line on BOTTOM layer, what if circuit line on the
TOP layer block your eyesight on BOTTOM layer? It is easy, just from the main
menu "Options" select "layer color settings”, cancel the selection of TOP layer as
well as silkscreen, after you have arranged everything on the BOTTOM layer, save
�le as temporary and name as BOTTOM-1.dpb, or as BOTTOM-1.pcb;
8 Repeat the process from point 5 to point 7 you have just been through then can
output completed PCB �le of 4 layer circuit board.
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5 of 7 22/08/19, 8:38 am
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Hello Circuiteng,
Can someone give me contact details who can do the step 2(remove Copper/prepreg layer by layer) in
India.
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