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2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303)

Spring 2008

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 Control of Manufacturing

Processes

Subject 2.830/6.780/ESD.63

Spring 2008

Lecture #2

Semiconductor Process Variation

February 7, 2008

Manufacturing 1
 Agenda
• The Semiconductor Fabrication Process
– Manufacturing process control

• Types of Variation in Microfabrication

– Defects vs. parametric variations
– Temporal variations: wafer to wafer (run to run)

– Spatial variations: wafer, chip, and feature level

• Preview of manufacturing control techniques

– Statistical detection/analysis of variations

– Characterization/modeling of processes & variation
– Process optimization & robust design
– Feedback control of process variation

Manufacturing 2
 Semiconductor Fabrication Process, Part 1

R. J. Shutz, in “Statistical Case Studies for Industrial Process Improvement,” pp. 470-471, SIAM, 1997.
Manufacturing
Courtesy of the Society for Industrial and Applied Mathematics. Used with permission.
3
 Semiconductor Fabrication Process, Part 2

R. J. Shutz, in “Statistical Case Studies for Industrial Process Improvement,” pp. 470-471, SIAM, 1997.
Manufacturing
Courtesy of the Society for Industrial and Applied Mathematics. Used with permission.
4
 Semiconductor Fabrication Process, Part 3

R. J. Shutz, in “Statistical Case Studies for Industrial Process Improvement,” pp. 470-471, SIAM, 1997.
Manufacturing
Courtesy of the Society for Industrial and Applied Mathematics. Used with permission.
5
 Semiconductor Fabrication Process, Part 4

R. J. Shutz, in “Statistical Case Studies for Industrial Process Improvement,” pp. 470-471, SIAM, 1997.
Manufacturing
Courtesy of the Society for Industrial and Applied Mathematics. Used with permission.
6
 (Semiconductor) Manufacturing

Process Control

Image removed due to copyright restrictions. Please see Fig.

26 in Boning, D. S., et al. “A General Semiconductor
Process Modeling Framework.” IEEE Transactions on
Semiconductor Manufacturing 5 (November 1992): 266-280.

Manufacturing 7
 Agenda
• The Semiconductor Fabrication Process
– Manufacturing process control

• Types of Variation in Microfabrication

– Defects vs. parametric variations
– Temporal variations: wafer to wafer (run to run)

– Spatial variations: wafer, chip, and feature level

• Preview of manufacturing control techniques

– Statistical detection/analysis of variations

– Characterization/modeling of processes & variation
– Process optimization & robust design
– Feedback control of process variation

Manufacturing 8
Defect vs. Parametric Variation

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 Yield & Variation from Defects

• Electrical test
– measure shorts in test

structures for different spacings

between patterned lines (at or

near the “design rule” or DR

feature size)

– measure opens in other test

structures

Images removed due to copyright restrictions. Please see: Hess, Christopher. "Test Structures for Circuit Yield Assessment
and Modeling." IEEE International Symposium on Quality Electronics Design, 2003.

Manufacturing
Hess, ISQED 2003 Tutorial
10
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 Temporal Variation

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 Spatial Variation

• Wafer scale
• Chip scale
• Feature scale

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 Modeling of Processes

and Variation

• Empirical modeling
• Physical modeling

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 Process Optimization &

Robust Design

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 Image removed due to copyright restrictions. Please see Fig. 7 in
Lakshminarayanan, S., et al. “Design Rule Methodology to Improve the
Manufacturability of the Copper CMP Process.” Proceedings of the IEEE
International Interconnect Technology Conference (2002): 99-101.

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Feedback Control of Variation

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 The General Process Control Problem

Desired
Product Product
CONTROLLER
CONTROLLER EQUIPMENT MATERIAL

Equipment loop

Material loop

Process output loop

Control of Equipment: Control of Material Control of Product:

Forces, Strains Geometry
Velocities Stresses and
Temperatures, ... Temperatures, Properties
Pressures, ...

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 Summary
• The Semiconductor Fabrication Process
– Manufacturing process control

• Types of Variation in Microfabrication

– Defects vs. parametric variations
– Temporal variations: wafer to wafer (run to run)

– Spatial variations: wafer, chip, and feature level

• Preview of manufacturing control techniques

– Statistical detection/analysis of variations

– Characterization/modeling of processes & variation
– Process optimization & robust design
– Feedback control of process variation

Manufacturing 55