SMT REPORT

AUGUST 9, 2019
NIE
Sector H9, Islamabad
NAME: _________________________________________

REGD.NO: _________________________________________

SEMESTER: ________________________________________

CHECKED
BY:_________________________________________

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 LED MOUNTING ON PCB USING SM-TECH

Author

Ayesha Saddiqua

A Project submitted in partial fulfillment of the requirements for the certificate of

internship.

Project Supervisor:

Shoaib Jumali

Project Supervisor Signature:

Surface Mount Technology Production Lab

National Institute of Electronics Islamabad

December 2019

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 Abstract

LED MOUNTING ON PCB USING SM-TECH

Surface-mount technology (SMT) is a method for producing electronic circuits in

which the components are mounted or placed directly onto the surface of printed circuit

boards (PCBs). It has largely replaced the through-hole technology construction method

of fitting components with wire leads into holes in the circuit board. This report focuses

on mounting of LEDs on metal cladded PCBs through surface mount technology. Which

is done through Essemtech software and Essemtech machines that are tucano, cobra,

Paraquda and oven for baking. Mounted LEDs on PCB obtained as output.

Ayesha Saddiqua

Project Supervisor: Shoaib Jumali

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 LED MOUNTING ON PCB USING SM-TECH
Author

Ayesha Saddiqua

A Project submitted in partial fulfillment of the requirements for the certificate of

Internship

Project Supervisor:

Shoaib Jamali

Designation & Department

Project Supervisor Signature: ___________________________________________

Surface Mount Technology Production Lab

National Institute of Electronics Islamabad

August 2019

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UNDERTAKING
I certify that research work titled “LED PRODUCTION USING SMT” is my own work.

The work has not been presented elsewhere for assessment. Where material has been

used from other sources it has been properly acknowledged / referred.

Ayesha Saddiqua

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Acknowledgement
All hymns and prayers to Allah Almighty who is supreme authority knowing the ultimate

realities underlying all sorts of phenomena going on in this universe and all respect and

regards to Holy Prophet Muhammad (peace be upon him) for enlightening our conscience

and paying us on the right path with the essence of faith in Allah.

I feel great pleasure in expressing my deep heartiest sincere gratitude to my respected

project advisor Professor Muhammad Shoaib Jamali for his guidance.

Finally, I gratefully acknowledge the constant support and encouragement of my Parents

and Family to whom I owe a lot more than just thanks.

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 Table of Contents
CHAPTER 1…………………………………………………………………………10
INTRODUCTION…………………………………………………………………...10
1.1 Surface Mount Technology……………………………………………………10
1.2 History…………………………………………………………………………10
1.3 SMT Package………………………………………………………………….10
1.3.1 Two terminal package…………………………………………………..10
1.3.2 Three and Four terminal package ..……………………………...……...10
1.2.3 Packages with more than six terminals (Dual-in-Line) ……….……….11
1.2.4 Packages with more than six terminals (Quad-in-Line) ……………….11
1.2.5 Grid Arrays…………………………………………………….…….…11
1.2.6 Non-Packaged Devices…………………………………………………11
CHAPTER 2………………………………………………………………………….12
ePlace Software……………………………………………………………………....12
2.1 There are some key features of ePlace software………………………………12
2.2 Steps used in ePlace software for mounting components on PCB...13
2.2.1 ePlace Environment…………………………………………………….13
2.2.2 Login……………………………………………………………………13
2.2.3 Initialize Machine………………………………………………………14
2.2.4 Recipi…………………………………………………………………..14
2.2.5 PCB Dimension………………………………………………………...14
2.2.6 Package Dimension……………………………………………………..15
2.2.7 Select the designed package…………………………………………….15
2.2.8 Components……………………………………………………………..15
2.2.9 Panel Dimesion………………………………………………………….16
2.2.10 Panel Recipe……………………………………………………………16
2.2.11 Fiducials………………………………………………………………...16
2.2.12 Baord Local Reference………………………………………………….17
2.2.13 Create Job……………………………………………………………….17
2.2.14 Select Job………………………………………………………………..17
2.2.15 Production ………………………………………………………………18
2.2.16 Pick and Place…………………………………………………………...18
2.2.17 Place Control…………………………………………………………….19
CHAPTER 3……………………………………………………………………………20
SMT Production Line…………………………………………………………………..20
3.1 Surface Mount Assembly Process………………………………………………..20

3.2 Essemtech Production Line………………………………………………………20

3.2.1 Fully Integrated Line Solution……………………………………………..20
3.2.1.1 PCB Loader………………………………………………………...20
3.2.2.2 Tucano Printer………………………………………………………21
3.2.3.3 Cobra Pick and Place 1…………………………………….............23
3.2.4.4 Paraquda Pick and Place 2…………………………………............25
3.2.5.5 Samsung Worktable………………………………………………..25

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 3.2.6.6 Reflow Oven………………………………………………………25
3.2.7.7 PCB Unloader……………………………………………………..26
3.2.1.8 Final PCB………………………………………………………….26
CONCLUSION…………………………………………………………………………27

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List of Figures
Fig.1.1 SMT Packages……………………………………………………………. 11
Fig. 2.2.2 Login……………………………………………………………………13
Fig. 2.2.3 Initialize Machine……………………………………………………….14
Fig. 2.2.4 Recipi……………………………………………………………………14
Fig. 2.2.5 PCB Dimension……………………………………………………….....14
Fig. 2.2.6 Package Dimension………………………………………………………15
Fig. 2.2.7 Select the designed package……………………………………………..15
Fig. 2.2.8 Components………………………………………………………………15
Fig. 2.2.9 Panel Dimesion…………………………………………………………..16
Fig. 2.2.10 Panel Recipe…………………………………………………………….16
Fig. 2.2.11 Fiducials………………………………………………………………...16
Fig. 2.2.12 Baord Local Reference………………………………………………….17
Fig. 2.2.13 Create Job……………………………………………………………….17
Fig. 2.2.14 Select Job………………………………………………………………..17
Fig. 2.2.15 Production ………………………………………………………………18
Fig. 2.2.16 Pick and Place…………………………………………………………...18
Fig. 2.2.17 Place Control…………………………………………………………….19
Fig. 3.1 Essemtech Production line………………………………………………….20
Fig. 3.2 Process Flow Diagram………………………………………………………21
Fig. 3.2.1.1 PCB Loader……………………………………………………………...21
Fig. 3.2.1.2 (a) Tucano Printer……………………………………………………….21
Fig. 3.3.1.2 (b) Squeegee…………………………………………………………….23
Fig. 3.2.1.3 (a) ESSEMTEC Cobra………………………………………………….24
Fig. 3.2.1.3 (b) Feeders………………………………………………………………25
Fig. 3.2.1.4 ESSEMTEC Paraquda…………………………………………………...25
Fig. 3.2.1.6 Reflow Oven…………………………………………………………….25
Fig. 3.2.1.7 PCB Unloader…………………………………………………………...26

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 CHAPTER 1
INTRODUCTION

1.1 Surface Mount Technology

Surface mount technology is a technology in which the components are placed
onto the electronics circuits (PCB). These circuits are the first printed and then
components are mounted on them with the help of automatic machine known as
Pick and Place machine. This technology has currently replaced the through hole
technology in which the components are first put into the holes of the printed PCB
through wires and then are soldered onto the board. Both technologies can be used
on the same board for components not suited to surface mounting such as large
transformers and heat-sink power semiconductors. Usually the size of an SMT
components is much smaller than the through hole component because it may
have very fine pitched and smaller leads or may contain no leads.
1.2 History
Surface mounting was originally called planar mounting. Surface-mount
technology was developed in the 1960s and became widely used in the mid of
1980s.By the late 1990s, the great majority of high-tech electronic printed circuit
assemblies were dominated by surface mount devices. Much of the pioneering
work in this technology was done by IBM. The design approach first
demonstrated by IBM in 1960 in a small-scale computer was later applied in
the Launch Vehicle Digital Computer used in the Instrument Unit that guided
all Saturn IB and Saturn V vehicles. Components were mechanically redesigned
to have small metal tabs or end caps that could be directly soldered to the surface
of the PCB. Components became much smaller and component placement on both
sides of a board became far more common with surface mounting than through-
hole mounting, allowing much higher circuit densities and smaller circuit boards
and, in turn, machines or subassemblies containing the boards.

1.3 SMT Packages

Surface-mount components are usually smaller than their counterparts with
leads and are designed to be handled by machines rather than by humans. The
electronics industry has standardized package shapes and sizes (the leading
standardization body is JEDEC). These include
1.3.1 Two Terminal Packages
Rectangular Passive Components
(resister and capacitor e.g. 0603, 0402)
Small outline Diode (SOD)
Metal Electrodes leadless face (MELF)
1.3.2 Three and Four Terminal Package

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 Small Outline Transistor
1.3.3 Packages with more than six terminals (dual-in-line)
Small-outline integrated circuit (SOIC)
Small-outline package, J-leaded (SOJ)
Thin small-outline package (TSOP)
Shrink small-outline package (SSOP)
Thin shrink small-outline package (TSSOP)
Quarter-size small-outline package (QSOP) Fig. 1.1
Very small outline package (VSOP) SMT Packages
Dual flat no-lead (DFN)
1.3.4 Packages with more than six terminals
(quad-in line)
Plastic leaded chip carrier (PLCC)
Quad flat package (QFP)
Low-profile quad flat package (LQFP)
Plastic quad flat pack (PQFP)
Ceramic quad flat pack (CQFP)
Metric quad flat-pack (MQFP)
Thin quad flat pack (TQFP)
Quad flat no-lead (QFN)
Leadless chip carrier (LCC)
Micro lead frame package (MLP, MLF)
Power quad flat no-lead (PQFN)
1.3.5 Grid Arrays
Ball grid array (BGA)
Fine-pitch ball grid array (FBGA)
Ceramic column grid array (CCGA)
Lead less package (LLP)
1.3.6 Non-packaged devices
Chip-on-board (COB)
Chip-on-flex (COF)
Chip-on-glass (COG)

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 CHAPTER 2
ePlace Software
ePlace is an operating system cobra and Paraquda pick and place machines. ePlace
software defines a new standard of a user-friendly software for the operation of complex
machine. The software is intuitive, graphically, features multi-language support and make
complex things easy to understand.

2.1 There are some key features of ePlace software

1 One software for all task
• Set up and optimize jobs easily
• Produce reliable
• Teach-in efficiently
• Consistent user interface
2. 19” touchscreen based
3. Easy, intuitive user interface
• Zoom, drag and select with your fingertip
• Several search, filter and sorting function
• Powerful camera window:
➢ Move the pick and place head
➢ Capture snap shots
➢ Zoom into the interpolated pictures

4. Guided menu structure

• Guides you through all tasks
• Ensures process reliability
5. Real-time visual display
• What you see is what you say
• Displays each change in real time
• Assists the operator

6. Context sensitive help

• Provides all information about the current screen
• No searching in huge manuals
• Gather all information immediately
7. Simplified handling
8. Helpful validation check
9. Integrated optimization routine

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 10. Enlargeable parameter area
11. Soft link functions
12. operation by a fingertip
13. High contrast, energy saving
14. Universal CAD input
15. Design according semi-standard
16. Multilingual
17. Design to ERP system
18. Job management and archive

2.2 Steps used in ePlace software for mounting components on

PCB
ePlace software is used to make recipe for mounting components on PCB.
Following steps are used to make recipe, job and then load the PCB.
2.2.1 ePlace Environment

Fig. 2.2.1 ePlace Environment

2.2.2 Login

Fig. 2.2.2 Login

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2.2.3 Initialize Machine

Fig. 2.2.3 initialize machine

2.2.4 Recipe

Fig. 2.2.4 Recipe

2.2.5 PCB Dimensions

Fig. 2.2.5 PCB Dimensions

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2.2.6 Package Dimension

Fig. 2.2.6 package dimensions

2.2.7 Select the designed Package

Fig. 2.2.8 designed package

2.2.8 Components
Place components on PCB.

Fig. PCB components

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2.2.9 Panel Dimension
To create a panel, give dimensions of x, y and z coordinates. 1 row and 6 columns.

Fig. 2.2.9 Panel dimension

2.2.10 Panel Recipe
Select panel recipe.

Fig. 2.2.10 Panel Recipe

2.2.11 Fiducials
Fiducials set as Main reference1, main reference 2

Fig. 2.2.11 Fiducials

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2.2.12 Board local refence

Fig. 2.2.12 Board Local Reference

2.2.13 Create Job

Fig. 2.2.14 Job

2.2.14 Select Job

Fig. 2.2.14 select Job

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2.2.15 Production
Go to production.

Fig. 2.2.15 Production

2.2.16 Pick and Place

Fig. 2.2.16 pick and Place

2.2.17 Place Control
Go to place control. Load the PCB and then align PCB.

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Fig. 2.2.17 place Control

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 CHAPTER 3
SMT Production Line

3.1 Surface Mount Assembly Process

The surface mount assembly process starts during the PCB design phase.
Once the PCB design has been finalized and components selected the next phase
is to send the PCB data away to a PCB manufacturing company and components
In SMT Lab we use the technology named ESSEEMTEC Cobra made in Switzerland.
bought in the most suitable way to facilitate automation.
Essemtec AG is a privately-owned company with its development and production site in
Switzerland. The product portfolio comprises of production equipment for electronic assembly
and more. High tech solutions can be adjusted quickly and easily to meet wide ranging
requirements..
3.2 ESSEMTECH Production Line
Essemtech Cobra provides two types of Production Lines:
1. Fully Integrated Line Solution
2. Multi-funtional Cell Solution
3.2.1 Fully Integrated Line Solution
We have worked on Fully integrated Line solution.

Fig. 3.1 Essemtech Production line

Essemtec offers flexible, scalable and affordable line solutions for both large
companies as well as small and medium sized enterprises. A customer can start
with a stand-alone solution and expand in any direction to match the growth of his
company over the years.
There are three stages in SMT production line.
LED stuffing on a metal cladded PCB through SMT Machines

1. Printing
2. Pick and Place

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 3. Baking

Paraquda
PCB loader Tucaono Cobra pick Essemtech Reflow PCB
pick and
Printer and place 1 work table oven unloader
place 2

Fig. 3.2 Process Flow Diagram

3.2.1.1 PCB Loader

The machine starts its working with loading of metal cladded PCB panel.
Place the PCB on conveyer chain belt and adjust the width of conveyer chain belt
according to PCB panel size with the help of adjusting knob.50 PCBs can place in
magazine.

Fig. 3.2.1.1 PCB Loader

3.2.1.2 Tucano Printer

Fig. 3.2.1.2 (a) Tucano Printer

The loaded PCB is sent into tucano printer. A plate known as stencil,
contains desired circuit layout which is placed on the PCB panel. Then machine
applies soldering paste (mixture of Tin, Led, Copper and Flux) on loaded PCB
panel.
The following desired print is taken on the PCB panel with the help of a software
known as tucano that is the operating software of tucano machine and all the
process performed through following steps.

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 I. Production
i. Create new product
ii. Name
iii. PCB dimensions
iv. Fiducials
v. Board Stop Position
vi. Default Pressure and Speed
vii. Print Stroke (movement of squeegee to deposit paste)
viii. Print Mode
ix. Snap off
x. Stencil Cleaning Mode (start clean cycle with wet mode)
II. ON-Contact Calibration
i. Setting of Squeegees
a. Front Squeegee
b. Rear Squeegee

Set the position of both sqeegees and save them. Then, intialize
squuegees.
III. Vision
Now, set area for both fiducials
i. Set area
ii. Set Box
iii. Auto Learn
iv. Learn
v. Select box of Pad
vi. Optimize Set up
vii. Remove Squeegee
viii. Adjust Tolerance
Tolerance should be upto 70%.
IV. Manual Tooling
i. Continue
V. Run Production
1. Start

For further processing the panel is sent into pick and place 1 section. Once the
printed PCB has been confirmed to have the correct amount of solder paste
applied it moves into the next part of the manufacturing process which is
component placement. Each component is picked from its packaging using either
a vacuum or gripper nozzle, checked by the vision system and placed in the
programed location at high speed. ESSEMTEC COBRA and ESSEMTEC
PARAQUADA are used for components pick and place purpose.

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 ➢ Soldering Paste: A solder paste is essentially powder
metal solder suspended in a thick medium called flux It includes led,
copper, tin and flux. Flux is added to act as a temporary adhesion used to
hold the component. The paste is a gray, putty-like material.

For high frequency circuits lead free solder paste is used.

➢ Stencil: For different PCBs, stencils of different are used. The size of
stencil pads is 80% the size of original pads on metal cladded PCB.
Double is camera used for alignment of PCB and stencil. One eye camera
is used to visualize stencil and other is used for PCB.

➢ IR Sensors: IR sensors are present on the conveyors to detect the PCB

➢ Squeegees: Ede metal squeegees are a premium brand of metal squeegee

used for SMT and Microelectronics printing applications. Squeegees are
seemed like wipers.

Fig. 3.3.1.2 (b) Squeegee

Properties
• Print format 600x580 mm
• Auto-setup functionality
• Post-print inspection
• Quick changeover
• Intuitive software
• Quick changeover
• Auto setup functionality
• Selectable camera lighting color (RGB)
• Programmable conveyor system
• Dry, wet and vacuum cleaning
• Reliable and robust design
• 2-D inspection for stencil and PCB

3.2.1.3 Cobra Pick and Place 1

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 Cobra is the second generation of assembly
systems based on ePlace. Linear motors, a high-
speed bus and signal processing system, carbon
fiber parts, and a mineral compound base are a
selection of the many features that make Cobra fast,
reliable and extremely precise. Cobra offers an 8-
axes placement head in which each of the axes can
place the full range of components that range from
01005 to 80x70 mm. Additionally, the system has a
capacity of up to 240 feeders with 220 feeders in
inline mode. The placement area is specified at 23.6
x 31.5" and placement speed is rated at 20,000
components/hour. Cobra is not only fast, but
flexible as well. 75% of placement is done by
COBRA. Fig 3.2.1.3 (a) ESSEMTEC Cobra
8 placement heads
Full range of components that range from 01005 to 80x70
20,000 cph
➢ IR Sensors

Three IR sensor are used in Cobra machine.

• First is placed at starting position to load PCB.
• Next is placed at the middle of conveyor.
• Last is placed at outside of machine.
➢ Conveyor

Conveyor holds PCB. The width of conveyor is adjusted according to PCB

width. There are also supports under PCB to hold the PCB.
➢ Head

There are 8 spindles in head that pick 8 LEDs from feeder and mount on
PCB pads.
Head contains spindles that move down to pick different nozzles for
different components. Head then pick components from feeders and show
it in front of camera to check the packages and orientation. Head also
check different parameters during initialization. Head moves on the
principle of electromagnetism speedily.
➢ Feeders

Components are placed on reels of feeders. Head pick the components

from feeder and mount on PCB.

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 Fig. 3.2.1.3 (b) Feeders
3.2.1.4 Paraquda Pick and Place 2
Paraquda is available with dispensing and jet-dispensing valves for solder
paste and/or adhesive applications. It can pick
and place components with the dimensions
80x70mm and a height up to 25mm. The
Paraquda holds up to 240 components when
8mm double feeders are used on every feeder
space with the capability of placing over 15,000
surface mounted parts an hour. It combines two
different production steps within one machine
platform (solder paste jetting and SMD
assembly). With this unique combination, the
multifunctional center allows an unprecedented
flexibility in the market. Remaining 25%
placement is done with the help of
PARAQUDA. Fig. 3.2.1.4 ESSEMTEC
Following are key features of Paraquda Paraquda
• SMD placement heads
• 15,000 cph
• Laser and Vision “on the fly” centering
• Places 01005
• CAD conversion
• Small footprint

3.2.1.5 Essemtec Worktable

Essemtec worktable is used for
inspection of
PCB panel i.e. loaded PCB panel meets
customer
desired requirements.

3.2.1.6 Reflow Oven

Once all component placements have

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Fig. 3.2.1.6 Reflow Oven
 been checked the PCB assembly moves into the reflow soldering machine where
all the electrical solder connections are formed between the components and PCB
by heating the assembly to sufficient temperature.

3.2.1.7 PCB Unloader

After completion of PCB Panel, the unloader loads the PCB panel.

Fig. 3.2.1.7 PCB Unloader

3.2.1.8 Final PCB

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 CONCLUSION
SMT is extremely valuable in todays world.it is cost effective and efficient technology
which saves time and money. Knowledge of SMT seems very important of an electronics
engineer. Working on such efficient machines seems very helpful for a farm because it
will reduce time and cost required for job that will take much longer time if it is done by
through hole technology. So, government should install more units of SMPTL in Pakistan
for fast production of electronic devices

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