Digital Design Vlsi PDF

JAIN University – Regulations, Scheme & Syllabi B.E (Electronics & Communication Engineering).
2009-10
Semester –VI
Digital VLSI Design
Subject Code: EC 64 Total No. of Hrs: 48
Credits: 4 Hours per week: 4
MOS Transistor Theory
Introduction, MOS device design equations, Complementary CMOS Inverter-DC

characteristics, Static Load MOS Inverters, Differential Inverter, Transmission Gate,
Tristate Inverter, Bipolar devices
CMOS Processing Technology
Silicon semiconductor technology An overview, basic CMOS technology, CMOS process

enhancements, Layout Design rules, Latchup, Technology related CAD issues
Circuit Characterization and performance Estimation
Resistance Estimation, Capacitance Estimation, Inductance, Switching Characteristics,
CMOS gate transistor sizing, Power dissipation, sizing routing conductors, charge
sharing, Design Margining, Yield, reliability
Scaling of MOS circuits
Scaling principles, Interconnect layer scaling, Scaling models and scaling factors, scaling
factors for device parameters, some discussion on scaling, and limitations of scaling.
CMOS Circuit and Logic Design
Introduction, CMOS Logic Gate Design, Basic Physical Design of Simple Logic Gates,
CMOS Logic Structures Clocking Strategies, I/O Structures, Low power Design
CMOS Subsystem Design I
Introduction, Data path operations- Addition/ subtraction, Parity Generators,

Comparators, Zero/one detectors, Binary counters, Boolean operations-ALUs,
Multiplication, Shifters
CMOS Subsystem Design II
Memory Elements, Control-FSM, Control Logic Implementation
Reference Books:
1. Principles of CMOS VLSI design – Neil Weste & Kamaran Eshraghian
2. CMOS Digital Integrated Circuits Analysis and Design- Sung-mo-kang & Yusuf
Leblebici
7
MOS Transistor Theory
Metal Oxide Semiconductor Field Effect Transistor (MOSFET)
Introduction
The Metal Oxide Semiconductor Field Effect Transistor (MOSFET) is the fundamental
building block of MOS and CMOS digital integrated circuits. Compared to the bipolar junction
transistor (BJT), the MOS transistor occupies a relatively smaller silicon area, and its fabrication
involves fewer processing steps. These technological advantages, together with the relative
simplicity of MOSFET operation, have helped make the MOS transistor the most widely used
switching device in VLSI and VLSI circuits.
The MOSFET is a four terminal device. The voltage applied to the gate terminal
determines if and how much current flows between the source and the drain ports. The body
represents the fourth terminal of the transistor. Its function is secondary as it only serves to
modulate the device characteristics and parameters.
At the most superficial level, the transistor can be considered to be a switch. When a
voltage is applied to the gate that is larger than a given value called the threshold voltage VTh, a
conducting channel is formed between drain and source. In the presence of a voltage difference
between the latter two, current flows between them. The conductivity of the channel is
modulated by the gate voltage—the larger the voltage difference between gate and source, the
smaller the resistance of the conducting channel and the larger the current.
Digital VLSI Design, ECE Dept.SET,JU. Page 1

A conducting channel will eventually be formed through applied gate voltage in the
section of the device between the drain and the source diffusion regions. The distance
between the drain and source diffusion regions is the channel length L, and the lateral
extent of the channel (perpendicular to the length dimension) is the channel width W.
Both the charnel length and the channel width are important parameters which can be
used to control some of the electrical properties of the MOSFET.
The thickness of the oxide layer covering the channel region, tox, is also an important
parameter.
ENHANCEMENT-mode and DEPLETION-mode MOSFET.

1. ENHANCEMENT-mode MOSFET:
 A MOS transistor which has no conducting channel region at zero gate bias is
called 'an enhancement-type (or enhancement-mode) MOSFET.
 MOSFET diagram
 n-channel and p-channel enhancement MOSFET normally OFF, below Threshold

and above VTh on
 + VGS in n-MOSFET and - VGS in p-MOSFET
 Symbol:

2. DEPLETION-mode MOSFET :
 If a conducting channel already exists at zero gate bias, on the other hand,
the device is called a depletion-type (or depletion-mode) MOSFET.

 MOSFET diagram
 n-channel and p-channel Depletion MOSFET normally ON, Pinch off on

 –VGS in n-MOSFET and + VGS in p-MOSFET
 Symbol
MOSFET Explanation
 In a MOSFET with p-type substrate and with n+ source and drain regions, the
channel region to be formed on the surface is n-type. Thus, such a device with p-
type substrate is called an n-channel MOSFET. 

 In a MOSFET with n-type substrate and with p+ source and drain regions, on the
other hand, the channel is p-type and the device is called a p-channel MOSFET. 

 The device terminals are: G for the gate, D for the drain, S for the source,
and B for the substrate (or body). 

 In an n-channel MOSFET, the source is defined as the n region which has
a lower potential than the other n region, the drain. 

 By convention, all terminal voltages of the device are defined with respect to the
source potential. Thus, the gate-to-source voltage is denoted by VGS, the drain-to-
source voltage is denoted by VDS , and the substrate-to-source voltage is denoted 
by VBS.

Consider first the n-channel enhancement-type MOSFET shown in Figure. The simple operation
principle of this device is: control the current conduction between the source and the drain,
using the electric field generated by the gate voltage as a control variable. Since the current flow
in the channel is also controlled by the drain-, to-source voltage and by the substrate voltage, the
current can be considered a function of these external terminal voltages. In order to start current
flow between the source and the drain regions, however, we have to form a conducting channel
first.
Region of Operation
I. Cut off Region

When gate-to-source voltage is less than threshold voltage i.e., VGS <VTh . There will be
no channel across the surface and no current between source and drain i.e., ID=0 as show in
above figure.

II. Resistive/Linear Operation (Active Region)
Now assume that the gate-to-source voltage is further increased. The conducting n-type
layer will form between the source and the drain diffusion regions as shown in below figure.
This channel now provides an electrical connection between the two n+ regions, and it allows
current flow, as long as there is a potential difference between the source and the drain terminal
voltages. The bias conditions for the onset of surface inversion and for the creation of the
conducting channel are therefore very significant for MOSFET operation.
Now VGS > VTh and that a small voltage, VDS, is applied between drain and source. The
voltage difference causes a current ID to flow from drain to source. Using a simple analysis, a
first-order expression of the current as a function of VGS and VDS can be obtained.
At a point x along the channel, the voltage is V(x), and the gate-to-channel voltage at that
point equals VGS – V(x). Under the assumption that this voltage exceeds the threshold voltage all
along the channel, the induced channel charge per unit area at point x can be computed.
Qi(x) = –Cox[V GS – V(x) – VTh]--------------------1.1
Cox stands for the capacitance per unit area presented by the gate oxide, and equals

-11
With ox = 3.97o = 3.5 10 F/m the oxide permittivity, and tox is the thickness of the oxide.
The current is given as the product of the drift velocity of the carrier’s n and the
available charge. Due to charge conservation, it is a constant over the length of the channel. W is
the width of the channel in a direction perpendicular to the current flow.

----------------------- 1.2
The electron velocity is related to the electric field through a parameter called the mobility
2/
(expressed in m V s). The mobility is a complex function of crystal structure, and local electrical
field. In general, an empirical value is used.
--------------------------------1.3
---------------1.4
Substitute equations 1.1 and 1.3 in 1.2 yields
Integrating the equation over the length of the channel L yields the voltage-current relation of
the transistor with boundary conditions x=0 to L and V=0 to VDS along the channel
------------------------------------------1.5
’
Where kn , is called the process transconductance parameter and equals
-------------------------------1.6
The W and L parameters in Equation the effective channel width and length of the transistor
respectively.

III. The Saturation Region
As the value of the drain-source voltage is further increased, the assumption that the
channel voltage is larger than the threshold all along the channel ceases to hold. This happens
when VGS V(x) < VTh . At that point, the induced charge is zero, and the conducting channel
disappears or is pinched off.
Figure shows that the current is not valid beyond the linear region/ saturation region
boundary, i.e., for
V =V -V
DS DSAT GS Th-------------------------1.7
Also, drain current measurements with constant VS show that the current ID does not show much
variation as a function of the drain voltage. VDS beyond the saturation boundary, but rather remains
approximately constant around the peak value reached for VDS = VDSAT .This saturation drain current
level can be found simply by substituting Eq.5 in Eq.4
------------1.8

MOSFET Current-Voltage Characteristics
Figure shows the typical drain current versus drain voltage characteristics of an n-channel
MOSFET, as described by the current equations (4) and (6). The parabolic boundary between the
linear and the saturation regions is indicated here. The current-voltage characteristics of the MOS
transistor can also be visualized by plotting the drain current as a function of the gate voltage, as
shown in Fig. This ID Versus VGS transfer characteristic in saturation mode (VDS > VDSAT)
provides a simple view of the drain current increasing as a second-order function of the gate-to
source voltage The current is obviously equal to zero for any gate voltage smaller than the
threshold voltage VT

Body effect on Threshold Voltage
As the gate voltage increases, the potential at the silicon surface at some point reaches a
critical value, where the semiconductor surface inverts to n-type material. This point marks the
onset of a phenomenon known as strong inversion and occurs at a voltage equal to twice the
Fermi Potential.
---------1.9
Further increases in the gate voltage produce no further changes in the depletion layer width, but
result in additional electrons in the thin inversion layer directly under the oxide. These are drawn
into the inversion layer from the heavily doped n+ source region. Hence, a continuous n-type
channel is formed between the source and drain regions, the conductivity of which is modulated
by the gate-source voltage. In the presence of an inversion layer, the charge stored in the
depletion region is fixed and equals
------------1.10
This picture changes somewhat in case a substrate bias voltage VSB is applied (VSB is
normally positive for n-channel devices). This causes the surface potential required for strong
inversion to increase and to become |–2 F + VSB|. The charge stored in the depletion region now
is expressed by
----------1.11
The value of the gate-to-source voltage VGS needed to cause strong surface inversion (to
create the conducting channel) is called the threshold voltage VTh.
VTh is a function of several components, most of which are material constants such as
the difference in work-function between gate and substrate material,
the oxide thickness,
the Fermi voltage,
the charge of impurities trapped at the surface between channel and gate oxide, and
The dosage of ions implanted for threshold adjustment.
From the above arguments, it has become clear that the source-bulk voltage VSB has

an impact on the threshold as well.
We rely on an empirical parameter called VT which is the threshold voltage for VSB = 0, and is
mostly a function of the manufacturing process. The threshold voltage under different body-
biasing conditions can then be determined in the following manner,
-----------1.12
The parameter (gamma) is called the body-effect coefficient, and expresses the impact of
changes in VSB.
----------------1.13
Substrate Bias Effect

Note that the derivation of linear-mode and saturation-mode current-voltage
characteristics in the previous pages has been done under the assumption that the substrate
potential is equal to the source potential, i.e., VSB = 0. Consequently, the zero-substrate bias
threshold voltage VTh has been used in the current equations. In many digital circuit applications,
on the other hand, the source potential of an nMOS transistor can be larger than the substrate

potential, which results in a positive source-to-substrate voltage VSB > 0. In this case, the
influence of the nonzero VSB upon the current characteristics must be accounted for.
We can simply replace the threshold voltage terms in linear-mode and saturation-mode current
equations with the more general VTh(VSB) term.
Channel Length Modulation
We will examine the mechanisms of channel pinch-off and current flow in saturation
mode. Consider the inversion layer charge Qi that represents the total mobile electron charge on
the surface. The inversion layer charge at the source end of the channel is
Q(X=0 ) = -C OX (VGS-VTh)
and the inversion layer charge at the drain end of the channel is
Q,(x= L) = -CoX (VGS - VTh - VDS))------1.14
Note that at the edge of saturation, i.e., when the drain-to-source voltage reaches VDSAT,
VDS = VDSAT = VGS - VTh
The inversion layer charge at the drain end becomes zero according to Eq. 1.14.In reality, the
channel charge does not become exactly equal to zero but it indeed becomes very small.
CMOS (COMPLEMENTARY MOSFET)

MOS INVERTERS: STATIC CHARACTERISTICS
The logic symbol and the truth table of the ideal inverter are shown in Figure, In MOS
inverter circuits, both the input variable A and the output variable B are represented by node
voltages, referenced to the ground potential. Using positive logic convention, the Boolean (or
logic) value of "1" can be represented by a high voltage of VDD, and the Boolean (or logic)
value of "0" can be represented by a low voltage of 0. The DC voltage transfer characteristic
(VTC) of the ideal inverter circuit is shown in Figure.

The voltage Vth is called the inverter threshold voltage. Note that for any input voltage
between 0 and Vth = VDD/2 , the output voltage is equal to VDD (logic" 1 ). The output switches
from VDD to 0 when the input is equal to Vth. For any input voltage between Vth and VDD, the
output voltage assumes a value of 0 (logic "0"). Thus, an input voltage 0 < Vin. < Vth is
interpreted by this ideal inverter as a logic "0," while an input voltage Vth <Vin < VDD is
interpreted as a logic “1." The VT characteristics of the ideal Inverter shown in below Figure.
Noise Immunity and Noise Margins
To illustrate the effect of noise on the circuit reliability, we will consider the circuit
consisting of three cascaded inverters, as shown in below Figure. Assume that all inverters are
identical, and that the input voltage of the first inverter is equal to VOH, i.e., logic “1." By
definition, the output voltage of the first inverter will be equal to VOL corresponding to a logic
"0" level.
 VIL is the maximum allowable voltage at the input of the second inverter, which is low
enough to ensure a logic "1" output
 VIH is the minimum allowable voltage at the input of the third inverter which is high
enough to ensure a logic "0" output.
These observations lead us to the definition of noise tolerances for digital circuits, called noise
margins and denoted by NM. The noise immunity of the circuit increases with NM. Two noise
margins will be defined: the noise margin for low signal levels (NML) and the noise margin for
high signal levels (NMH). For a gate to be robust and insensitive to noise disturbances, it is
essential that the “0” and “1” intervals be as large as possible. A measure of the sensitivity of a
gate to noise is given by the noise margins
LOW noise margin NML=VIL-VOL

HIGH noise marginNMH=VOH-V IH

VOH: Maximum output voltage when the output level is logic “1”
VOL: Minimum output voltage when the output level is logic “0”
VIL: Maximum input voltage which can be interpreted as logic "0"
VIH: Minimum input voltage which can be interpreted as logic "1"

CMOS inverter
Now, we will turn our attention to a radically inverter structure, which consists of an
enhancement-type NMOS transistor and an enhancement-type PMOS transistor, operating in
complementary mode. This configuration is called Complementary MOS (CMOS). The circuit
topology is complementary push-pull in the sense that for high input, the NMOS transistor drives
(pulls down) the output node while the PMOS transistor acts as the load, and for low input the
PMOS transistor drives (pulls up) the output node while the NMOS transistor acts as the load.
Consequently, both devices contribute equally to the circuit operation characteristics.
The CMOS inverter has two important advantages over the other inverter configurations.
 The first and perhaps the most important advantage is that the steady-state power
dissipation of the CMOS inverter circuit is virtually negligible, except for small power
dissipation due to leakage currents.
 The other advantages of the CMOS configuration are that the voltage transfer
characteristic (VTC) exhibits a full output voltage swing between 0 V and VDD, and that
the VTC transition is usually very sharp. Thus, the VTC of the CMOS inverter resembles
that of an ideal inverter.

VTC curve and output Voltage at different region of operation

Region A:
Region B:

Region C: EQUATION-B
PMOS, NMOS: saturation

Region D:
EQUATION-D
Region E:

Beta Ratio Effects
kR= =
We have seen that for kp = kn, the inverter threshold voltage Vth is VDD/2. This may be
desirable because it maximizes noise margins and allows a capacitive load to charge and
discharge in equal times by providing equal current source and sink capabilities. Inverters with
different beta ratios kR= kn /kp are called skewed inverters
 If kR < 1, the inverter is HI-skewed.
 If kR >1, the inverter is LO-skewed.
 If kR = 1, the inverter has normal skew or is unskewed.
A HI-skew inverter has a stronger pMOS transistor. Therefore, if the input is VDD /2, we
would expect the output will be greater than VDD /2. In other words, the input threshold must be
higher than for an unskewed inverter. Similarly, a LO-skew inverter has a weaker pMOS
transistor and thus a lower switching threshold.

Static Load MOS Inverters
The figure shows a NMOS inverter with resistive load or a constant current source. For resistor
load, if we superimpose the resistor load line on VI characteristics of Pull down transistor as in
figure B, we can see that at VGS=5 volts, the output is some small VDS(VOL).when
VGS=0volts,VDS rises to 5 volts.
 As resistor load is made larger, the VOL decreases and current flowing when inverter is
turned on decreases.
 As resistor load is made smaller, the VOL increase and on current increases
 Selection of resistor value would seek compromise between VOL, the current drawn and the
pull up speed
Note that the driver MOSFET is initially in saturation, since its drain-to source voltage.
(VDs = V0ut=VDD) is larger than (Vin - Vth) =VGS-Vth VDs>> VGS-Vth
NMOS Saturation current is given by
( )
IR =kn

With increasing input voltage, the drain current of the driver also increases, and the
output voltage Vout starts to drop.
 Eventually, for input voltages larger than Vout + Vth, the driver transistor enters the
linear operation region. At larger input voltages, the transistor remains in linear mode, as
the output voltage continues to decrease.
i.e., Vin> Vout + Vth Vout< Vin-Vthn VDS< VGS-Vth,n

The Pseudo nMOS Inverter
The Pseudo nMOS Inverter uses a p device pull up or load that has its gate is
permanently grounded. An n-device pull down or driver is driven with the input signal. This is
roughly equivalent to use of load in nMOS technology and is thus called “pseudo-nMOS”
When driver is turned on, constant DC current flows in the circuit. This is to contrasted with
CMOS inverter in which no DC current flows when the input is either the terminal high or low
state. The importance of whether DC current flows, and hence whether one can use pseudo
nMOS inverter, depends on application
Derivation of output voltage equation and n/ p
Consider PMOS

Consider NMOS
PMOS always in ACTIVE region
for VGS <VTh,p
NMOS in Saturation region
for VGS >VTh,n and VDS> VGS-VTh,n Vout> Vin-Vthn
Equating both the current equations

DC transfer characteristics

Transmission gate
The strength of a signal is measured by how closely it approximates an ideal voltage
source. In general, the stronger a signal, the more current it can source or sink. The power
supplies, or rails, (VDD and GND) are the source of the strongest 1s and 0s
An nMOS transistor is an almost perfect switch when passing a 0 and thus we say it
passes a strong 0. However, the nMOS transistor is imperfect at passing a 1. The high voltage
level is somewhat less than VDD; NMOS transistors pass ‘0’s well but 1s poorly. We are now
ready to better define “poorly.” Figure shows an nMOS transistor with the gate and drain tied to
VDD. Imagine that the source is initially at Vs = 0. Vgs > VTh, so the transistor is ON and current
flows. If the voltage on the source rises to Vs = VDD – Vth, Vgs falls to Vth and the transistor
cuts itself OFF. Therefore, nMOS transistors attempting to pass a 1 never pull the source above
VDD – Vth
Similarly, pMOS transistors pass 1s well but 0s poorly. If the pMOS source drops below |Vtp|,
the transistor cuts off. Hence, pMOS transistors only pull down to within a threshold above
GND, as shown in Figure

When an nMOS or pMOS is used alone as an imperfect switch, we sometimes call it as a pass
transistor. By combining an nMOS and a pMOS transistor in parallel. We obtain a switch that
turns on when a 1 is applied to g, in which 0s and 1s are both passed in an acceptable fashion.
We term this a transmission gate or pass gate. In a circuit where only a 0 or a 1 has to be
passed, the appropriate transistor (n or p) can be deleted, reverting to a single nMOS or pMOS
device. Note that both the control input and its complement are required by the transmission
gate. This is called double rail logic. Some circuit symbols for the transmission gate are shown
in Figure.
Thus, the nMOS transistors only need to pass 0s and the pMOS only pass 1s, so the
output is always strongly driven and the levels are never degraded. This is called a fully
restored logic gate and simplifies circuit design considerably.

TRISTATE INVERTER
Figure shows symbols for a tristate Inverter. When the enable input EN is 1, the output
Y equals the input complement of A, just as in an ordinary inverter. When the enable is 0, Y is left
floating (‘Z’ value).

Figure shows a tristate inverter. The output is actively driven from VDD or GND, so it is a
restoring logic gate. The tristate inverter does not obey the conduction complements rule because
it allows the output to float under certain input combinations.
When EN is 0, both enable transistors are OFF, leaving the output floating.
When EN is 1, both enable transistors are ON. They are conceptually removed from the circuit,
leaving a simple inverter.
Tristate were once commonly used to allow multiple units to drive a common bus, as
long as exactly one unit is enabled at a time. If multiple units drive the bus, contention
occurs and power is wasted. If no units drive the bus, it can float to an invalid logic level
that causes the receivers to waste power. Moreover, it can be difficult to switch enable
signals at exactly the same time when they are distributed across a large chip. Delay
between different enables switching can cause contention. Given these problems,
multiplexers are now preferred over tristate busses.

Differential Inverter
All of the that we hace examined so far is single ended;that is.they have single end input
and produces single output. Now an inverter that uses two differential inputs and produces two
differential outputs is as shown in figure,
Two n transistors have their sources commoned and fed by a constant current
source that in turn connected to ground
The drains of each n transistor are connected to resistor load that are connected to
the supply voltage.
Now we make some analysis, if the input voltage is applied ie., Vleft= VA= VRight then
each transistor has VGS=VA-VN, where VN is the voltage accrossthe constant current source. Thus
is IDS is same for both the MOSFET and also Vout1=Vout2 .
Now increase the Vleft and VRight equally,then VN also rises to maintain the constant
current through the current source. The ouput voltages Vout1 and Vout2 will stay at same value.

Applying common signal to both the inputs therefore results no gain(ideally). This gain is
reffered as Common mode gain.
Now Vleft is increased by right is decreased by ,then current in N1 increases

by and Vout1 decreases by out2 increases by
Thus is the differential gain from Vleft to Vout
gm is / V transconductance of the driver transistor
Vout1=VDD- (Isource *Rload)/2
BIPOLAR DEVICES
1. DIODE
2. BJT
3. BiCMOS

BiCMOS Inverter
BiCMOS Inverter
Two bipolar transistors (T3 and T4), one nMOS and one pMOS transistor (both enhancement-
type devices)
 The MOS switches perform the logic function & bipolar transistors drive output loads
 Vin = 0 :
T1 is off. Therefore T3 is non-conducting
T2 ON - supplies current to base of T4
T4 base voltage set to Vdd.
T4 conducts & acts as current source to charge load CL towards Vdd.
Vout rises to VDD - VBE (of T4)
Note: VBE (of T4) is base-emitter voltage of T4.
(Pull-up bipolar transistor turns off as the output approaches 5V - VBE (of T4))
 Vin = VDD :
T2 is off. Therefore T4 is non-conducting.
T1 is on and supplies current to the base of T3
T3 conducts & acts as a current sink to discharge load CL towards 0V.
Vout falls to 0V+ VCEsat (of T3)
Note: VCEsat (of T3) is saturation Voltage from T3 collector to emitter

 T3 & T4 present low impedances when turned on into saturation & load CL will be
charged or discharged rapidly

 Output logic levels will be good & will be close to rail voltages since VCEsat is quite
small & VBE  0.7V. Therefore, inverter has high noise margins
 Inverter has high input impedance, i.e., MOS gate input

 Inverter has low output impedance
 Inverter has high drive capability but occupies a relatively small area
 However, this is not a good arrangement to implement since no discharge path exists for
current from the base of either bipolar transistor when it is being turned off, i.e.,
 when Vin=Vdd,T2 is off and no conducting path to the base of T4 exists
 when Vin=0, T1 is off and no conducting path to the base of T3 exists
 This will slow down the action of the circuit

 The impedances Z1 and Z2 are necessary to remove the base charge of the bipolar
transistors when they are being turned off. For instance, during a high-to-low transition
on the input, T2 turns off first. To turn off T4, its base charge has to be removed. This
happens through Z1. Adding these resistors not only reduces the transition times, but also
has a positive effect on the power consumption. There exists a short period during the
transition when both T3 and T4 are on simultaneously, thus creating a temporary current
path between VDD and GND. The resulting current spike can be large and has a
detrimental effect on both the power consumption and the supply noise. Therefore,
turning off the devices as fast as possible is of utmost importance.
The conventional BiCMOS Inverter

 Two additional enhancement-type nMOS devices have been added (T5 and T6).
 These transistors provide discharge paths for transistor base currents during turn-off.
Without T5, the output low voltage cannot fall below the base to emitter voltage VBE of
T3.
 Vin = 0 :
T1 is off. Therefore T3 is non-conducting
T2 ON - supplies current to base of T4
T4 base voltage set to Vdd.
T5 is turned on & clamps base of T3 to GND. T3 is turned off.

T4 conducts & acts as current source to charge load CL towards Vdd.
Vout rises to Vdd - Vbe (of T4)
 Vin = Vdd :
T2 is off
T1 is on and supplies current to the base of T3
T6 is turned on and clamps the base of T4 to GND. T4 is turned off.
T3 conducts & acts as a current sink to discharge load CL towards 0V
Vout falls to 0V+ VCEsat (of T3)
Again, this BiCMOS gate does not swing rail to rail. Hence some finite power is dissipated
when driving another CMOS or BiCMOS gate. The leakage component of power dissipation can
be reduced by varying the BiCMOS device parameters
Advantage:
 BiCMOS devices offer many advantages where high load current sinking and sourcing
is required. The high current gain of the NPN transistor greatly improves the output
drive capability of a conventional CMOS device.
 It follows that BiCMOS technology goes some way towards combining the virtues of
both CMOS and Bipolar technologies.

 Design uses CMOS gates along with bipolar totem-pole stage where driving of high
capacitance loads is required.
 Improved speed over purely-CMOS technology
 Lower power dissipation than purely-bipolar technology (simplifying packaging and
board requirements)
 Flexible I/Os (i.e., TTL, CMOS or ECL) –
BiCMOS technology is well suited for I/O intensive applications.
ECL, TTL and CMOS input and output levels can easily be generated with no speed or
tracking consequences.
 Large circuits can impose severe performance penalties due to simultaneously switching
noise, internal clock skews and high nodal capacitances in critical paths - BiCMOS
has demonstrated superiority over CMOS in all of these factors.
 High performance analogue
 Latchup immunity
Main disadvantage:
 Greater process complexity compared to CMOS
 Results in a 1.25  1.4 times increase in die costs over conventional CMOS.
Taking into account packaging costs, the total manufacturing costs of supplying a
BiCMOS chip ranges from 1.1 1.3 times that of CMOS.

CMOS Processing Technology
CMOS processing steps can be broadly divided into two parts. Transistors are formed in
the Front-End-of-Line (FEOL) phase, while wires are built in the Back-End-of-Line (BEOL)
phase. This section examines the steps used through both phases of the manufacturing process.
Wafer Formation
The basic raw material used in CMOS fabs is a wafer or disk of silicon, roughly 75 mm to 300
mm in diameter and less than 1 mm thick. Wafers are cut from boules, cylindrical ingots of
single-crystal silicon that have been pulled from a crucible of pure molten silicon. This is known
as the Czochralski method and is currently the most common method for producing single-
crystal material.
Photolithography
The regions of dopants, polysilicon, metal, and contacts are defined using masks. For
instance, in places covered by the mask, ion implantation might not occur or the dielectric or
metal layer might be left intact. In areas where the mask is absent, the implantation can occur, or

dielectric or metal could be etched away. The patterning is achieved by a process called
photolithography
The primary method for defining areas of interest (i.e., where we want material to be
present or absent) on a wafer is by the use of photoresists. The wafer is coated with the
Photoresist and subjected to selective illumination through the photomask. A photomask is
constructed with chromium (chrome) covered quartz glass. A UV light source is used to expose
the Photoresist. Below Figure illustrates the lithography process.
The photomask has chrome where light should be blocked. The UV light floods the mask from
the backside and passes through the clear sections of the mask to expose the organic Photoresist
(PR) that has been coated on the wafer. A developer solvent is then used to dissolve the soluble
exposed or unexposed Photoresist
Silicon Dioxide (SiO2)
Oxidation of silicon is achieved by heating silicon wafers in an oxidizing atmosphere.
The following are some common approaches:
 Wet oxidation––when the oxidizing atmosphere contains water vapor. The temperature is
usually between 900 °C and 1000 °C. This is also called pyrogenic oxidation when a 2:1
mixture of hydrogen and oxygen is used. Wet oxidation is a rapid process.
Si+2H2O  SiO2+2H2
 Dry oxidation––when the oxidizing atmosphere is pure oxygen. Temperatures are in the
region of 1200 °C to achieve an acceptable growth rate. Dry oxidation forms a better
quality oxide than wet oxidation. It is used to form thin, highly controlled gate oxides,
while wet oxidation may be used to form thick field oxides.

Si+O2  SiO2
CMOS TECHNOLOGIES
CMOS provides an inherently low power static circuit technology that has the capability
of providing a lower-delay product than comparable design-rule nMOS or pMOS technologies.
The four dominant CMOS technologies are:
 n-well process
 P-well process
 twin-tub process
 Silicon on Insulator process
The n-well process

A common approach to n-well CMOS fabrication is to start with moderately doped p-
type substrate (wafer), create the n-type well for the p-channel devices, and build the n-channel
transistor in the native p-substrate. The processing steps are,
Note: (Here I have not mentioned or drawn any Mask layer during this processing but in
exam you have to mention)
Step1:
 Process starts with a moderately doped (1015 cm-3) p-type substrate (wafer)
 An initial oxide layer is grown on the entire surface (barrier oxide)
Field
Oxide
Step2:
N-Well mask - defines the n-Well regions

• Pattern the oxide
• Implant n-type impurity atoms (phosphorus) - 1016cm-3
• Drive-in the impurities (vertical but also lateral redistribution - limits the density )

Mask
Step3:
• Active area mask - define the regions in which MOS devices will be created
• LOCOS process to isolate NMOS and PMOS transistors
• Grow gate oxide (dry oxidation) - only in the open area of active region
Thin oxide
of 500Å
Step4:
• Polysilicon mask - define the gates of the MOS transistors

• Polysilicon is deposited over the entire wafer (CVD process) and doped (typically n-type)
• Pattern the polysilicon in the dry (plasma) etching process
• Etch the gate oxide
Step5:

• n-Select mask - define the n+ source/drain regions of NMOS transistors
• Define an ohmic contact to the n-well
• Implant n-type impurity atoms (arsenic)
• Polysilicon layer protects transistor channel regions from the arsenic dopant
Step6:
• Complement of the n-select mask - define the p+ source/drain regions of PMOS

transistors
• Define the ohmic contacts to the substrate
• Implant p-type impurity atoms (boron)
• Polisilicon layer protects transistor channel regions from the boron dopant
Step7:
• In the n-well two p+ and one n+ regions are created

• After source/drain implantation a short thermal process is performed (annealing):
• moderate temperature
• drive the impurities deeper into the substrate
• repair some of the crystal structure damage
• lateral diffusion under the gate: overlap capacitances
• Next the SiO2 insulated layer is deposited over the entire wafer area using a CVD
technique
• The surface becomes nonplanar: impact on the metal deposition step

Step8:
• Contact mask - define the contact cuts in the insulating layer

• Contacts to polysilicon must be made outside the gate region (avoid metal spikes
throughthe poly and the thin gate oxide)
Step9:
• Metallization mask - define the interconnection pattern

• Aluminum is deposited over the entire wafer (evaporation) and selectively etched
• The step coverage in this process is most critical (nonplanarity of the wafer surface)
•
The P-well process

The twin-tub process:
Twin-tub CMOS technology provides the basis for separate optimization of the p-type
and n-type transistors, thus making it possible for threshold voltage, body effect, and the gain
associated with n-and p-devices to be independently optimized. Generally the starting material is
either an n+ or p+ substrate with a lightly doped epitaxial or epi layer, which is used for
protection against latch-up. The aim of epitaxy is to grow high purity silicon layers of controlled
thickness with accurately determined dopant concentrations distributed homogeneously
throughout the layer. The electrical properties for this layer are determined by the dopant and its
concentration in the silicon. The process sequence, which is similar to the p-well process apart
from the tub formation where both p-well and n-well are utilized.
The following steps
 Tub formation
 Thin oxide etching
 Source and drain implantations

 Contact cut definition
 Metallization.
Since this process provides separately optimized wells, better performance n-transistors
(lower capacitance, less body effect) may be constructed when compared with a
conventional p-well process. Similarly the p-transistors may be optimized. The use of
threshold adjust steps is included in this process.
Flow diagram of twin-tub process

Silicon on insulator process:
Silicon on insulator (SOI) CMOS processes has several potential advantages such as
higher density, no latch-up problems, and lower parasitic capacitances. In the SOI process a thin
layer of single crystal silicon film is epitaxial grown on an insulator such as sapphire or
magnesium aluminate spinel. The steps involves are:
1) A thin film (7-8 μm) of very lightly doped n-type Si is grown over an insulator. Sapphire is a
commonly used insulator.
2) An anisotropic etch is used to etch away the Si except where a diffusion area will be needed.
3) The p-islands are formed next by masking the n-islands with a photoresist. A p-type dopant
(boron) is then implanted. It is masked by the photoresist and at the unmasked islands. The p-
islands will become the n-channel devices.
4) The p-islands are then covered with a photoresist and an n-type dopant, phosphorus, is
implanted to form the n-islands. The n-islands will become the p-channel devices.
5) A thin gate oxide (500-600Å) is grown over all of the Si structures. This is normally done by
thermal oxidation.
6) A polysilicon film is deposited over the oxide.
7) The polysilicon is then patterned by photomasking and is etched. This defines the polysilicon
layer in the structure.
8) The next step is to form the n-doped source and drain of the n-channel devices in the p-
islands. The n-island is covered with a photoresist and an n-type dopant (phosphorus) is
implanted.
9) The p-channel devices are formed next by masking the p-islands and implanting a p-type
dopant. The polysilicon over the gate of the n-islands will block the dopant from the gate,
thus forming the p-channel devices
10) A layer of phosphorus glass is deposited over the entire structure. The glass is etched at
contact cut locations. The metallization layer is formed. A final passivation layer of a
phosphorus glass is deposited and etched over bonding pad locations.
The advantages of SOI technology are:

Due to the absence of wells, denser structures than bulk silicon can be obtained.
Low capacitances provide the basis of very fast circuits.
No field-inversion problems exist.
No latch-up due to isolation of n- and p- transistors by insulating substrate.
As there is no conducting substrate; there are no body effect problems
Enhanced radiation tolerance.
But the drawback is due to absence of substrate diodes, the inputs are difficult to protect. As
device gains are lower, I/O structures have to be larger. Single crystal sapphires are more
expensive than silicon and processing techniques tend to be less developed than bulk silicon
techniques.

CMOS Process Enhancements
Note:(In this topic just know this and if question asked in exam just head lines are enough)
a) Using Multiple Threshold Voltages and Oxide Thicknesses
b) Silicon on Insulator (SOI)
c) Using High-k Gate Dielectrics

 MOS transistors need high gate capacitance to attract charge to the channel. This leads to
very thin SiO2 gate dielectrics (e.g., 10.5–12 Å, merely four atomic layers, in a 65 nm
process)
 Gate leakage increases unacceptably below these thicknesses, which brings an end to
classical scaling
 Simple SiO2 has a dielectric constant of k = 3.9, so gates could use thicker dielectrics and
hence leak less if a material with a higher dielectric constant are available
 Example, Hafnium oxide (HfO2) has k 20.
d) Using Higher Mobility

 Increasing the mobility (u) of the semiconductor improves drive current and
transistor speed. One way to improve the mobility is to introduce mechanical strain
in the channel. This is called strained silicon.
e) Using Plastic Transistors
 MOS transistors can be fabricated with organic chemicals. These transistors show
promise in active matrix displays, flexible electronic paper, and radio-frequency ID
tags because the devices can be manufactured from an inexpensive chemical
solution.
f) Using High-Voltage Transistors
 High-voltage MOSFETs can also be integrated onto conventional CMOS processes
for switching and high-power applications. Gate oxide thickness and channel length
have to be larger than usual to prevent breakdown.
g) Interconnect
 Interconnect has advanced rapidly. While two or three metal layers were once the
norm, CMP has enabled inexpensive processes to include seven or more layers.
Copper metal and low-k dielectrics are almost universal to reduce the resistance and
capacitance of these wires.
i. Copper Damascene Process While aluminum was long the interconnect metal of
choice; copper has largely superseded it in nanometer processes. This is primarily due
to the higher conductivity of copper compared to aluminum.
 Copper atoms diffuse into the silicon and dielectrics, destroying transistors.
 The processing required to etch copper wires is tricky.
 Copper oxide forms readily and interferes with good contacts.
 Care has to be taken not to introduce copper into the environment as a pollutant.
 Barrier layers have to be used to prevent the copper from entering the silicon
surface. A new metallization procedure called the damascene process was invented
to form this barrier.
ii. Low-k Dielectrics SiO2 has a dielectric constant of k = 3.9–4.2. Low-k dielectrics
between wires are attractive because they decrease the wire capacitance. This reduces
wire delay, noise, and power consumption.
LAYOUT DESIGN RULES

Design rules include width rules and spacing rules. Mead and Conway developed a set of
simplified scalable λ -based design rules, which are valid for a range of fabrication technologies.
In these rules, the minimum feature size of a technology is characterized as 2 λ. All width and
spacing rules are specified in terms of the parameter λ. suppose we have design rules that call for
a minimum width of 2λ, and a minimum spacing of 3λ. If we select a 2 um technology (i.e., λ= 1
um), the above rules are translated to a minimum width of 2 um and a minimum spacing of 3 um.
On the other hand, if a 1 um technology (i.e., λ= 0.5 um) is selected, then the same width and
spacing rules are now specified as 1 um and 1.5 um, respectively.
LAMBDA RULE (λ=1um)
LAYER TYPE OF RULE VALUE
Minimum Spacing 2λ
POLY Minimum Width 2λ
Minimum Spacing 3λ
ACTIVE Minimum Width 3λ

NSELECT/ Minimum Spacing 3λ
PSELECT Minimum Width 3λ
Minimum Spacing 3λ
METAL1 Minimum Width 3λ
i. POLY
Minimum Spacing 2λ
Minimum Width 2λ
2λ 2λ
2λ
ii. ACTIVE
Minimum Spacing 3λ
Minimum Width 3λ
iii. METAL1
Minimum Spacing 3λ
Minimum Width 3λ

3λ 3λ
3λ
iv. NWELL
Minimum Spacing 6λ
Minimum Width 10λ
Minimum Spacing between different layers

i. POLY to ACTIVE  1λ

Butting contact: The layers are butted together in such a way the two contact cuts become
contiguous. Metallization is used to establish the contact between poly and diffusion. We can
better under the butting contact from figure
Poly
Metal1
Buried contact: The contact cut is made down each layer to be joined and it is shown
in figure

MOSFET LAYOUT RULES
RULE Meaning VALUE
POLY Overlap Minimum Extension over ACTIVE 2λ
POLY-ACTIVE Minimum Spacing 1λ
MOSFET Width Minimum N+/P+ MOSFET (W) 3λ
ACTIVE CONTACT Exact Size 2λ x 2λ
Minimum Space to Active Edge 2λ
POLY CONTACT Exact Size 2λ x 2λ
Minimum Space to Active Edge 2λ

SCHEMATIC AND LAYOUT OF BASIC GATES using CMOS Logic
(Note: Here I have not consider any design Rule while drawing Layout and also I left
out Bulk/Body terminal in Layout)
1. INVERTER

2.

Implement the following using CMOS logic with minimum number of transistor and also
draw Layout
3.
4.
5. 2- INPUT NAND
6. 2- INPUT NOR

Latch up in Bulk CMOS
A byproduct of the Bulk CMOS structure is a pair of parasitic bipolar transistors. The collector
of each BJT is connected to the base of the other transistor in a positive feedback structure. A
phenomenon called latch up
It can occur when
(1) Both BJT's conduct, creating a low resistance path between VDD and GND
(2) The product of the gains of the two transistors in the feedback loop, beta1 x beta2, is greater
than one.
The result of latch up is at the minimum a circuit malfunction, and in the worst case, the
destruction of the device.
Cross section of parasitic transistors in Bulk CMOS

Latch up may begin when Vout drops below GND due to a noise spike or an improper circuit
hookup (Vout is the base of the lateral NPN Q2). If sufficient current flows through Rsub to turn
on Q2 (I Rsub > 0.7 V), this will draw current through Rwell. If the voltage drop across Rwell is
high enough, Q1 will also turn on, and a self-sustaining low resistance path between the power
rails is formed. If the gains are such that beta1 x beta2 > 1, latch up may occur. Once latch up has
begun, the only way to stop it is to reduce the current below a critical level, usually by removing
power from the circuit.
The most likely place for latch up to occur is in pad drivers, where large voltage transients and
large currents are present.
Preventing latch up(Fab/Design Approaches)
1. Reduce the gain product beta1 x beta2

o move n-well and n+ source/drain farther apart increases width of the base of Q2
and reduces gain beta2 also reduces circuit density
o buried n+ layer in well reduces gain beta1 of Q1
2. Reduce the well and substrate resistances, producing lower voltage drops
o higher substrate doping level reduces Rsub
o reduce Rwell by making low resistance contact to GND
o Guard rings around p and/or n-well, with frequent contacts to the rings, reduces
the parasitic resistances.

Technology related CAD issues
The mask database is the interface between the semiconductor manufacturer and the chip
designer. Two basic checks have to be completed to ensure that this description can be turned
into a working chip.
 First, the specified geometric design rules must be obeyed.
 Second, the interrelationship of the masks must, upon passing through the
manufacturing process, produce the correct interconnected set of circuit elements.
 To check these two requirements, two basic CAD tools are required: a Design
Rule Check (DRC) program and a mask circuit extraction program.
a. Design Rule Checking (DRC)

Although we can design the physical layout in a certain set of mask layers, the actual
masks used in fabrication can be derived from the original specification. Similarly, when we
want a program to determine what we have designed by examining the interrelationship of the
various mask layers, it may be necessary to determine various logical combinations between
masks.
b. Circuit Extraction
Now imagine that we want to determine the electrical connectivity of a mask database..
An output statement might then be used to output the extracted transistors in some netlist format.
The extracted netlist is often used to compare the layout against the intended schematic, Pre
versus Post.
BASIC CIRCUIT DESIGN CONCEPTS

We have already seen that MOS structures are formed by the super imposition of a
number conducting, insulating and transistor forming material. Now each of these layers has
their own characteristics like capacitance and resistances. These fundamental components are
required to estimate the performance of the system. These layers also have inductance
characteristics that are important for I/O behavior but are usually neglected for on chip devices.

The issues of prominence are
1. Resistance, capacitance and inductance calculations.
2. Delay estimations
3. Determination of conductor size for power and clock distribution
4. Power consumption
5. Charge sharing
6. Design margin
7. Reliability
8. Yield
RESISTANCE ESTIMATION
Integrated Circuit (IC) chips contain many types of materials such as polysilicon, oxide,
various diffusions of basic CMOS transistors, and metal. A popular resistor material is
polysilicon, also known as poly.
The concept of sheet resistance is being used to know the resistive behavior of the layers
that go into formation of the MOS device. Let us consider a uniform slab of conducting material
of the following characteristics.

R - Resistance (ohms)
L - Length
W -width
-sheet resistivity (ohms-per-square)
 We know that the resistance is given by R AB= L/A.

 The area of the slab considered above is given by A=Wt.
RAB= L/Wt.
 If the slab is considered as a square then L=W. therefore RAB=/t which is called as sheet
resistance represented by Rs.The unit of sheet resistance is ohm per square.
 It is to be noted that Rs is independent of the area of the slab. Hence we can conclude
that a 1um per side square has the same resistance as that of 1cm per side square of the
same material.
SHEET RESISTANCE OF MOS TRANSISTORS
2λ
2λ
The N transistor above is formed by a 2λ wide poly and 2λ n+ diffusion.
 The L/W ratio is 1. Hence the transistor is a square,

 Therefore the resistance R is 1sqxRs ohm/sq i.e. R=1x104.
 If L/W ratio is 4 then R = 4x104.

 If it is a P transistor then for L/W =1, the value of R is 2.5x104.
CAPACITANCE ESTIMATION
Parasitics capacitances are associated with the MOS device due to different layers that go
into its formation. Interconnection capacitance can also be formed by the metal, diffusion and
polysilicon in addition with the transistor and conductor resistance. All these capacitances
actually define the switching speed of the MOS device.
Understanding the source of parasitics and their variation becomes a very essential part of
the design specially when system performance is measured in terms of the speed. The various
capacitances that are associated with the CMOS device are
1) Gate capacitance - due to other inputs connected to output of the device
2) Diffusion capacitance - Drain regions connected to the output
3) Routing capacitance- due to connections between output and other inputs
MOS Device Capacitance

The gate to channel capacitance formed due to the sio 2 separation is the most profound of the
mentioned three types. It is directly connected to the input and the output. The other capacitance
like the metal, poly can be evaluated against the substrate. The gate capacitance is therefore
standardized so as to enable to move from one technology to the other conveniently.
The standard unit is denoted by Cg. It represents the capacitance between gate to channel with
W=L=min feature size. Here is a figure showing the different capacitances that add up to give
the total gate capacitance
Cgd, Cgs = gate to channel capacitance lumped at the source and drain
Csb, Cdb = source and drain diffusion capacitance to substrate

Cgb = gate to bulk capacitance
Total gate capacitance Cg = Cgd+Cgs+Cgb
Parameter Off Active Saturation

C gb Ɛo A 0 0
t ox
C gs 0 Ɛo A 2Ɛo A
2 t ox 3 t ox
C gd 0 Ɛo A 0
2 t ox
Ct= C gb+ C gs+ C gd Ɛo A Ɛo A 2Ɛo A
t ox t ox 3 t ox
Area Capacitances of Layers

The fabrication process illustrates that the conducting layers are apparently separated from the
substrate and other layers by the insulating layer leading to the formation of parallel capacitors.
Since the silicon dioxide is the insulator knowing its thickness we can calculate the capacitance.
Ɛ 
C=
Ɛo= permittivity of free space-8.854x1014 f/cm

ins= relative permittivity of sio2=4.0
D= thickness of the dioxide in cm
A = area of the plate in cm2
Standard unit of Capacitance Cg

It is convenient to employ a standard unit of capacitance that can be given a value
appropriate to the technology but can also be used in calculations without associating it with an
absolute value. the unit is denoted Cg and is defined the gate-to-channel capacitance of a MOS
transistor having W=L=feature size, that is ,a ‘standard or ‘feature size’ of square.
Since the standard gate capacitance has been defined, the other capacitances like
polysilicon, metal, diffusion can be expressed in terms of the same standard units so that the total
capacitance can be obtained by simply adding all the values. In order to express in standard
values the following steps must be followed,
1. Calculate the areas of area under consideration relative to that of standard gate i.e.4. (Standard
gate varies according to the technology)
2. Multiply the obtained area by relative capacitance values tabulated.
3. This gives the value of the capacitance in the standard unit of capacitance Cg
4. Ratio= Relative area=
5. Capacitance = Relative area of Selected layer X Relative Capacitance of Selected layer
Problems
I. A particular layer of MOS circuit has a resistivity  of 1 ohm -cm. The section is 55um long, 5um wide and
1 um thick. Calculate the resistance and also find Rs
Solution:
R= RsxL/W,
Rs= /t
Rs=1x10-2/1x106=104ohm
R= 104x55x10-6/5x106=110k
II. For a 5u technology the area of the minimum sized transistor is 5uX5u=25um2 i.e. λ=2.5u,
hence, area of minimum sized transistor in lambda is 2λX2λ= 4λ2. Therefore for 2u or 1.2u
or any other technology the area of a minimum sized transistor in lambda is 4λ2
Solution:
The figure above shows the dimensions and the interaction of different layers, for evaluating the total
capacitance resulting so.
Three capacitance to be evaluated
Metal Cm, polysilicon Cp and gate capacitance Cg
 Metal
Area of metal = 100λx3λ=300λ 2

Area of minimum sized transistor in lambda is 2λX2λ= 4λ2.
( )
Ratio= Relative area=
2 2
Relative area =300λ /4λ =75
Metal Capacitance = Relative area of Selected layer (i.e. Meta) X Relative Capacitance of metal
Relative Capacitance of metal from table=0.075
Cm= 75 x0.075=5.625
 Polysilicon
Area of Polysilicon= (4λx4λ+1λx2λ+2λX2λ)(excluding Gate region)
=22λ2
2 2
Relative area =22λ /4λ =5.5
Cp=5.5x0.1=0.55
 Gate
Area of Gate=2λX2λ= 4λ2
Relative area =4λ2 /4λ2=1(because it is a standard min size gate)
Cg=1x1=1
Total capacitance Ct=Cm+Cp+Cg=5.625+0.55+1=7.2

Switching Characteristics
Charging and Discharging

The delay of the CMOS inverter is a performance metric for how fast the circuit is. This
delay is dependent upon the RC charging or discharging of the load capacitor by the pMOS or
nMOS devices respectively and provides a quantitative feel for the time that is taken by the
output of the inverter to completely respond to a change at its input.
Rise time estimation:

In this analysis we assume that the p-device stays in saturation for entire charging period of load
capacitor CL. The circuit may then be modeled as shown in below figure,

The saturation current for P-transistor is given by
( | |)
Idsp=
This current charges CL and since its magnitude is approximately constant we have
∗
Vout=
Substituting for Idsp and rearranging we have
t=
( )
We now assume that t=tr when vout=+VDD and |Vtp|=20%VDD=0.2VDD
After simplifying we get
tr=
This results compares reasonably well with a more detailed analysis in which the charging of
CL is divided, more correctly, into two parts(1) saturation and (2) Resistive region of transistor.

Fall time
Similar reasoning can be applied to the discharge of CL through n-transistor.the circuit model in
this case is given as shown in below figure
Making similar assumption we may write for fall time:
tf=
Delay Time:
In MOS circuits, the delay of a single Gate is dominated by the output rise and
fall time, the delay is approximately given by
tdr= tr/2
tdf= tf/2
The average gate delay for rising edge and falling transitions is given by
tav=(tdr+tdf)/2
(tr+tf)/4

Gate Transistor Sizing
Size the following logic with respect to INVERTER Gate Size
1.

2.
3.

4. Size the transistor for the function out=AB+(C+D)E with reference to
inverter i.e., Wp= Wn
5. Repeat the above function for Wp=3* Wn

Pair delay of cascaded Inverter
Case a :Symmetrical inverter design

– P mobility = ½ x N mobility
– Wp = 2 x Wn
– Input gate capacitance = 3 x Ceq, where Ceq is the pull-down device gate capac.
Pair delay = tfall + trise = R*3Ceq + 2(R/2)*3Ceq
= 6RCeq
Case b: Non-symmetrical inverter design

• Wp = Wn
• Input gate capacitance = 2 x Ceq
Pair delay = tfall + trise = R*2Ceq + 2R*2Ceq
= 6RCeq
• In the simple case where the load is comprised mainly of input gate capacitance no
impact to the total delay of the pair of inverters was observed by using non-symmetrical
Wn=Wp

Power Consumption:
There are 2 components which that establish the amount of power dissipated in the CMOS
circuit. These are
i. Static Power Dissipation – due to leakage current
ii. Dynamic Power Dissipation—
a) Switching transient Current
b) Charging and Discharging of Capacitor.
i. Static Power Dissipation

Consider CMOS gate as shown in figure,
 when vin=0, n-MOS is OFF, and p-MOS is ON and vout=1
 when vin=1, n-MOS is ON, and p-MOS is OFF and vout=0

 Here any one of the transistor will be OFF always, since no current flows into gate terminal
and hence no DC current path between VDD and VSS , so Static Power (Ps) is zero.

However, there is some small static dissipation due to reverse bias leakage between
diffusion regions and the substrate. We need to look at a simple model that describes the
parasitic diodes for a CMOS inverter in order to have an understanding of the leakage involved
in the device. The source-drain diffusion and the p-well diffusion form parasitic diode. This can
be represented in the profile of an inverter shown in fig. In the model, diode D1 is a parasitic
diode between p-well to substrate. Since parasitic diodes are reversed biased, only their leakage
current contributes to static power dissipation. The leakage current is described by the diode
equation
IO=IS( )
Where IO  reverse saturation current
Q electronic charge
V  diode voltage
K  Boltzmann constant
T  temperature
The static power dissipation is the product of the device leakage current and the supply voltage.
Total static power dissipation p is obtained from
Ps= ∑ ( ∗ )
Where N is number of devices

Dynamic dissipation
During transition from either ‘0’ to ‘1’ or alternatively from ‘1’ to ‘0’, both n- and p-
transistors are on for a short period of time .This results in a short current pulse from VDD to VSS
current is also required to charge and discharge the output capacitive load. This latter term is
generally the dominant term. The current pulse from VDD to VSS results in a “short-circuit”
dissipation which is dependent on the load capacitance and gate design. This is of relevance to
I/O buffer design.
The dynamic dissipation can be modeled by assuming the rise and fall time of the step input is
much less than the repetition period. The average dynamic power, PD, dissipated during
switching for a square-wave input vin, having a repetition frequency of fp=1/tp as shown by fig
Thus for a repetitive step input the average power that is dissipated is proportional to the energy
required to change and discharge the circuit capacitance .the important factor to be noted here is
that shows power to be proportional to switching frequency but independent of the device
parameters.

For a step input and with in(t)=CL dVo/dt
Total power dissipation can be obtained from the sum of the two dissipation components, so
Ptotal=Ps+Pd
When calculating the power dissipation a rule of thumb is to add all capacitance operating at
particular frequency and calculate the power. Then the power from other groups operating at
different frequencies may be summed, the dynamic power dissipation may be used to estimate
total power consumption of a circuit and also the size of VDD and VSS conductors to minimize
transient induced voltage drops.
Charge sharing:
In many structures a bus can be modeled as a capacitors Cb as shown in fig. Sometimes the
voltage on this bus is sampled to determine the state of a given signal frequency, this sampling
can be modeled by the two capacitors Cs and Cb and a switch. In general Cs is in some way
related to the switching element. The charge associated with each of the capacitance prior to
closing the switch can be described by
• At time t=0-, switch is open and each capacitor contains some initial charge
• At time t=0+, the switch is closed and the charge redistributes across both capacitors
• Conserve the total charge:
– Sum up initial charge Qt = Qb + Qs = CbVb + CsVs

– Total capacitance Ct= Cb + Cs
– When switch is closed the resultant voltage VR=Qt/Ct
– Therefore, VR = (CbVb + CsVs)/(Cb + Cs)
• If Vb = VDD and Vs = 0, then
VR= VDD Cb/(Cb + Cs) (which is similar to the equation for a resistor divider)
Design Margin:
As semiconductor technology scales to the nanometer regime, the variation of process
parameters is a critical problem in VLSI design. Thus the need for variation-aware timing
analysis for the performance yield is increasing. However, the traditional worst-case corner-
based approach gives pessimistic results, and makes meeting given designs specifications
difficult. As an alternative to this approach, statistical analysis is proposed as a new and
promising variation-aware analysis technique. However, statistical design flow cannot be applied
easily to existing design flow, and not enough tools for statistical design exist. To overcome
these problems, new design methodology based on traditional static timing analysis (STA) using
a relaxed corner proposed
Yield
An important issue in the manufacture of VLSI structure is yield, although yield is not a
performance parameter, it is influenced by such factors are
 Technology
 Chip area

 Layout
Yield is defined as a ratio of
Y= x 100%
And may be described as a function of chip area and defect density.
Two common equations used are,
1) Seed’s Model which is given by
Y= √
Where A is chip area

D is defect density
This model is used for large chips and for yields less than 30%
2) Murphy’s Model, which is described by
Y= ( )
Where A is chip area
D is defect density
This model is used for small chips and for yields greater than 30% from these relations it
is obvious that yield decreases dramatically as the area of the chip increases.

Unit -3
Scaling of MOS Circuits

What is scaling?
Proportional adjustment of the dimensions of an electronic device while maintaining the

electrical properties of the device, results in a device either larger or smaller than the un-scaled
device.
.
Technology Scaling
 Goals of scaling the dimensions by 30%:
 Reduce gate delay by 30% (increase operating frequency by 43%)
 Double transistor density
 Reduce energy per transition by 65% (50% power savings @ 43% increase in frequency)
 Die size used to increase by 14% per generation
 Technology generation spans 2-3 years
International Technology Roadmap for Semiconductors (ITRS)

Scaling Models
1. Full Scaling (Constant Electrical Field)
 Ideal model – dimensions and voltage scale together by the same scale factor
2. Fixed Voltage Scaling
 Most common model until recently – only the dimensions scale, voltages remain
constant
3. General Scaling
 Most realistic for today’s situation – voltages and dimensions scale with different
factors
Scaling Factors for Device Parameters
Device scaling modeled in terms of generic scaling factors:

1/α and 1/β
• 1/β: scaling factor for supply voltage VDD and gate oxide thickness D
• 1/α: linear dimensions both horizontal and vertical dimensions
Why is the scaling factor for gate oxide thickness different from other linear horizontal and
vertical dimensions? Consider the cross section of the device as in Figure, various parameters
derived are as follows.
Gate -Poly

1 Gate Length L L/α
2 Gate Channel Width W W/α
3 Gate Thickness t t/α
4 Gate Oxide Thickness D D/β
5. Supply Voltage VDD VDD/β
1. Gate area Ag
Ag= L* W
Where
 L: Channel length scaled by 1/α and
 W: Channel width and both are scaled by 1/α
2
 Thus Ag is scaled up by 1/α
2. Gate capacitance per unit area Co or Cox

Cox =
Where
 εox is permittivity of gate oxide (thin-ox)= εins* εo constant and
 D is the gate oxide thickness scaled by 1/β
Thus Cox is scaled up by
Co =Cox = =β
( )
3. Gate capacitance Cg= oxide capacitance * Gate Area

Cg= Co* Ag= Co *(LW)
Thus Cg is scaled up by β* 1/ α2 =β/ α2

4. Parasitic capacitance Cx
Cx is proportional to Ax/d
 Where d is the depletion width around source or drain and scaled by 1/ α
 Ax is the area of the depletion region around source or drain, scaled by (1/ α2).
 Thus Cx is scaled up by {1/(1/α)}* (1/ α 2 ) =1/ α
5. Carrier density in channel Qon
Qon = Co * Vgs
Where Qon is the average charge per unit area in the ‘on’ state.
 Co is scaled by β and
 Vgs is scaled by 1/ β.
 Thus Qon is scaled by 1
6. Channel Resistance Ron

Ron = *
∗
Where μ= channel carrier mobility and assumed constant

Thus Ron is scaled by 1.
7. Gate delay Td
Td is proportional to Ron*Cg
2 2
Td is scaled by 1* β/ α = β/ α
8. Maximum operating frequency fo
fo= ∗
/ ( ∗ ∗ )
fo is inversely proportional to delay Td and is scaled by= *( )= /
/ /
9. Saturation current
∗
IDSAT = *( − )
 = channel carrier mobility and assumed constant

 Cox is scaled by β

 W and L are scaled by 1/α
 Both Vgs and Vth are scaled by (1/ β)
Therefore, IDSAT is scaled by (β* )=
10. Current density J
Current density= ,
Where A is cross sectional area of the Channel=W* L= in the “on” state which is scaled
by (1/α2).
( )
Therefore, J is scaled by = =
( )
11. Switching energy per gate Eg
Eg= VDD 2 Cg
VDD is scaled by
2
Cg is scaled by β/ α
Hence Eg is scaled by = ∗ =
12. Power dissipation per gate Pg
Pg comprises of two components: static component Pgs and dynamic component Pgd:
Pg= Pgs+ Pgd
Where, the static power component is given by: Pgs=

 Since VDD scales by (1/β) and
 Ron scales by 1,
 Pgs scales by (1/β2).
And the dynamic component by: Pgd= Eg * fo

 Since Eg scales by and
 fo by
 Pgd also scales by ∗. =
 Therefore, Pg scales by .
13. Power – speed product PT

PT=Pg * Td
= * =
Device parameters for scaling models

FULL SCALING for Constant E: β = α;
CONSTANT VOLTAGE SCALINGfor Constant V: β =1

MERITS
Implications of Scaling
 Improved Performance
 Improved Cost
 Interconnect Woes
 Power Woes
 Productivity Challenges
 Physical Limits
Interconnect Woes
 Scaled transistors are steadily improving in delay, but scaled wires are holding
constant or getting worse.
 For short wires, such as those inside a logic gate, the wire RC delay is negligible.
 However, the long wires present a considerable challenge.

Productivity Challenges
• Transistor count is increasing faster than designer productivity (gates / week)
– Bigger design teams
– More expensive design cost
– Pressure to raise productivity
• Rely on synthesis, IP blocks
– Need for good engineering managers
Physical Limits
• Will Moore’s Law run out of steam?
Yes, Can’t build transistors smaller than an atom…
Moore's Law Upheld
• Moore's law, first postulated by Intel co-founder Gordon Moore, says the number of
transistors -- the main component of a microchip -- that can fit on a chip doubles about
every 18-24 months.
• To keep pace with Moore's law, transistors would have to reach the atomic level by 2020.
• The smallest transistor ever built has been created using a single phosphorous atom by an
international team of researchers at the University of New South Wales, Purdue
University and the University of Melbourne. "To me, this is the physical limit of Moore's
Law," Klimeck says. "We can't make it smaller than this (atom)."
Limitations of Scaling
 Substrate doping
 Depletion width
 Limits of miniaturization
 Limits of interconnect and contact resistance
 Limits due to sub threshold currents
 Limits on logic levels and supply voltage due to noise
 Limits due to current density

Substrate doping
 Built-in (junction) potential VB depends on substrate doping level – can be neglected as

long as VB is small compared to VDD.
 As length of a MOS transistor is reduced, the depletion region width –scaled down to
prevent source and drain depletion region from meeting.
 the depletion region width d for the junctions is
d= ∗ ∗ ∗
εsi relative permittivity of silicon

ε 0 permittivity of free space(8.85*10-14 F/cm)
V effective voltage across the junction Va + Vb

q Electron charge
NB doping level of substrate
Va maximum value Vdd-applied voltage
Vb built in potential and Vb = ln

For 5 μm Technology Vb=500mv while VDD=5v hence we must neglect Vb hence depletion
width
d= ∗ ∗ ∗ DD
For recent technologies NB is increased to reduce so that Vb is enlarged. At the same

time VDD is scaled down hence Vb is no longer smaller
Depletion width
• NB is increased to reduce d, but this increases threshold voltage Vth –against trends for scaling
down.
• Maximum value of N B (1.3*1019 cm-3, at higher values, maximum electric field applied to gate
is insufficient and no channel is formed.

• N B maintained at satisfactory level in the channel region to reduce the above problem.
Limits of miniaturization
• Minimum size of transistor; process tech and physics of the device

• Reduction of geometry; alignment accuracy and resolution
• Size of transistor measured in terms of channel length L
L=2d (to prevent push through)
• L determined by NB and VDD
• Minimum transit time for an electron to travel from source to drain is
Vdrift =μE
t= =
Limits of interconnect and contact resistance

• Short distance interconnect- conductor length is scaled by 1/α and resistance is increased by α
• For constant field scaling, I is scaled by 1/ α so that IR drop remains constant as a result of
scaling.-driving capability/noise margin.
The Propagation delay along single aluminum interconnect can be calculated as

TP= Rint* Cint+2.3(RON *Cint+RON*CL+ Rint* CL )
Limits due to subthreshold currents

• Major concern in scaling devices.
• I sub is directly proportional exp (Vgs – Vth) q/KT
• As voltages are scaled down, ratio of Vgs-Vth to KT will reduce-so that threshold current
increases.
• Therefore scaling Vgs and Vth together with Vdd.
• Maximum electric field across a depletion region is
Emax=2∗ ( )
Limits on supply voltage due to noise
Decreased inter-feature spacing and greater switching speed –result in noise problems.
Observations – Device scaling

 Gate capacitance per micron is nearly independent of process
 But ON resistance * micron improves with process
 Gates get faster with scaling (good)
 Dynamic power goes down with scaling (good)
 Current density goes up with scaling (bad)
 Velocity saturation makes lateral scaling unsustainable
Observations – Interconnect scaling
 Capacitance per micron is remaining constant
 About 0.2 fF/mm
 Roughly 1/10 of gate capacitance
 Local wires are getting faster
 Not quite tracking transistor improvement
 But not a major problem
 Global wires are getting slower
 No longer possible to cross chip in one cycle

CMOS Circuit and Logic Design

CMOS COMPLEMENTARY LOGIC
CMOS structures require a nblock and a pblock for completion of the logic. That is for a n input
logic 2n gates are required. Each logic function is duplicated for both pull-down and pull-up
logic tree
– pull-down tree gives the zero entries of the truth table, i.e. implements the
negative of the given function
– pull-up tree is the dual of the pull-down tree, i.e. implements the true logic with
each input negative-going
Advantages: low power, high noise margins, design ease, functionality
Disadvantage:
 high input capacitance reduces the ultimate performance

 For an N input logic 2N gates are required.

Implement following function using CMOS LOGIC
Number of transistor required= 2N, Here N=5, TOTAL=10 Transistor required to

implement the function using Complementary CMOS logic

CMOS INVERTER CIRCUIT AND LAYOUT

CMOS 2-Input NAND with Layout

CMOS 2-Input NOR with Layout

PSEUDO – nMOS LOGIC
• This logic structure consists of the pull up circuit being replaced by a single pull up
PMOS whose gate is permanently grounded.
• This actually means that PMOS is all the time on and that now for a n input logic we
have only n+1 gates.
• This technology is equivalent to the depletion mode type and preceded the CMOS
technology and hence the name pseudo.
PSEUDO – nMOS LOGIC NAND GATE
(DRIVER)
• The two sections of the device are now called as load and driver.
• The ßn/ßp (ßdriver/ßload) has to be selected such that sufficient gain is achieved to get
consistent pull up and pull down levels.
• This involves having ratioed transistor sizes so that correct operation is obtained.
However if minimum size drivers are being used then the gain of the load has to be
reduced to get adequate noise margin.

OTHER VARIATIONS OF PSEUDO NMOS
1. Multi drain logic
One way of implementing Pseudo NMOS is to use multidrain logic. It represents a
merged transistor kind of implementation. The gates are combined in an open drain
manner, which is useful in some automated circuits.
2. GANGED LOGIC
The inputs are separately connected but the output is connected to a common terminal.
The logic depends on the pull up and pull down ratio. If PMOS is able to overcome
NMOS it behaves as NAND else NOR.
Example: NOR gate; Z = A+B+CCan be operated as NAND gate by suitably ratioing

PMOS over NMOS.

Implement following function using PSEUDO – nMOS LOGIC
Number of transistor required to implement PSEUDO – nMOS LOGIC = N+1
Here N=5
TOTAL=6 Transistor

ADVANTAGES
1. The gate capacitance of CMOS logic is two unit gate but for Psuedo logic it is only one gate
unit.
2. Since number of transistors per input is reduced area is reduced drastically.
Drawbacks of the design
 Since the PMOS is always on, static power dissipation occurs, whenever the NMOS
is on. Hence the conclusion is that in order to use Psuedo logic a tradeoff between
size & load or power dissipation has to be made.
DYNAMIC CMOS LOGIC
• This logic looks into enhancing the speed of the pull up device by Precharging the
output node to VDD.
• Hence we need to split the working of the device into
 Precharge stage and
 Evaluate stage for which we need a clock. Hence it is called as dynamic
logic

 The output node is precharged to VDD by the PMOS and is discharged conditionally
through the NMOS. Alternatively you can also have a p block and precharge the n
transistor to VSS.
 When the clock is low the precharge phase occurs
 The pull up time is improved because of the active PMOS which is already
precharged.
 The path to VSS is closed by the NMOS i.e., the ground switch and hence the pull
down time increases.
Two-Phase Operation
Phase CLK Inputs Output
Precharge low don’t care high
Evaluation high Valid inputs Valid outputs
Example

Two phase operation
 Precharge (CLK = 0)
 Evaluate (CLK = 1)
Conditions on Output
• Once the output of a dynamic gate is discharged, it cannot be charged again until the next
precharge operation.
• Inputs to the gate can make at most one transition during evaluation.
• Output can be in the high impedance state during and after evaluation (PDN off), state is
stored on CL
Implement following function using DYNAMIC CMOS LOGIC

Number of transistor required= N+2
=5+2
TOTAL=7 Transistor
Example :4-Input NAND Dynamic CMOS Gate
Properties of Dynamic Gates
• Logic function is implemented by the PDN only
– number of transistors is N + 2(CLOCK)(versus 2N for static complementary

CMOS)
– should be smaller in area than static complementary CMOS
• Full swing outputs (VOL = GND and VOH = VDD)
• Nonratioed - sizing of the devices is not important for proper functioning (only for
performance)

• Faster switching speeds
– reduced load capacitance due to lower number of transistors per gate.
• Power dissipation should be better
– consumes only dynamic power – no short circuit power consumption since the
pull-up path is not on when evaluating
• But power dissipation can be significantly higher due to
– higher transition probabilities
– extra load on CLK
• PDN starts to work as soon as the input signals exceed VTn, so set VM, VIH and VIL all
equal to VTn
– low noise margin (NML)
• Needs a precharge clock
DRAWBACK
• Inputs have to change during the precharge stage and must be stable during the evaluate.
If this condition cannot occur then charge redistribution corrupts the output node.
• A simple single dynamic logic cannot be cascaded. During the evaluate phase the first
gate will conditionally discharge but by the time the second gate evaluates, there is going
to be a finite delay. By then the first gate may precharge.
Cascading Problem in Dynamic CMOS Logic
• If several stages of the previous CMOS dynamic logic circuit are cascaded together using
the same clock CLK, a problem in evaluation involving a built-in “race condition” will
exist

• Consider the two stage dynamic logic circuit in the above diagram :
– During pre-charge, both output1 and output2 are pre-charged to VDD
– When CLK goes high to begin evaluate, all inputs at stage 1 require some finite
time to resolve, but during this time charge may erroneously be discharged from
output2
 Now assume that eventually the 1 st stage NMOS logic tree conducts and fully discharges
output1, but since all the inputs to the N-tree all not immediately resolved, it takes some
time for the N-tree to finally discharge output1 to GND.
 If, during this time delay, the 2nd stage has the input condition shown with bottom NMOS
transistor gate at a logic 1, then output2 will start to fall and discharge its load
capacitance until output1 finally evaluates and turns off the top series NMOS transistor in
stage 2
 The result is an error in the output of the 2nd stage output2

CMOS Domino Logic
• A modification of clocked CMOS logic allows a single clock to precharge and evaluate a
cascaded set of dynamic logic blocks. This involves incorporating a static CMOS inverter
into each logic gate as shown in below figure.
• The problem with faulty discharge of precharged nodes in CMOS dynamic logic circuits
can be solved by placing an inverter in series with the output of each gate
– All inputs to N logic blocks (which are derived from inverted outputs of previous
stages) therefore will be at zero volts during precharge and will remain at zero
until the evaluation stage has logic inputs to discharge the precharged node.
All circuits only provide non-inverted outputs
When CLK is low, dynamic node is precharged high and buffer inverter output is low. NFETs in
the next logic block will be off. When CLK goes high, dynamic node is conditionally discharged
and the buffer output will conditionally go high. Since discharge can only happen once, buffer
output can only make one low-to-high transition.
When domino gates are cascaded, as each gate “evaluates”, if its output rises, it will
trigger the evaluation of the next stage, and so on… like a line of dominos falling. Like dominos,
once the internal node in a gate “falls”, it stays “fallen” until it is “picked up” by the precharge
phase of the next cycle.
Thus many gates may evaluate in one eval cycle.

CMOS Domino Logic Design Hazards
• In (a) the N evaluate transistor is placed nearest to the output C1 node (poor design)
– During precharge C1 is charged high to VDD, but C2-C7 do not get charged and
may be sitting at ground potential.
– When the clock goes high for the evaluate phase, some or all of capacitors C2-C7
will bleed charge from the larger node capacitor C1, thus reducing the voltage on
C1.
• Voltage across C1 i.e. V(C1) may reduce to VDD(C1/(C1 + C2 + C3 + C4 + C5 + C6 + C7)) in

the worst case
Vn1=
∑

V (C1) =
If = and = = = = = and VDD=5v
then V (C1) = == = = =1.5v
this is below the threshold voltage of buffering inverter
– The solution is to put the discharge transistor N1 at the bottom of the logic tree
thus allowing the possibility of getting C2-C7 charged during the precharge phase
• Using additional precharge P transistors (as in b) to charge intermediate nodes in a

complex logic tree will help with the charge sharing problem.
NP Domino Logic (NORA Logic)
• An elegant solution to the dynamic CMOS logic “erroneous evaluation” problem is to use
NP Domino Logic (also called NORA logic) as shown below.
• Alternate stages of N logic with stages of P logic

• N logic stages use true clock, normal precharge and evaluation phases, with N logic tree
in the pull down leg. P logic stages use a complement clock, with P logic stage tied
above the output node.
• During precharge clk is low (-clk is high) and the P-logic output precharges to ground
while N-logic outputs precharge to Vdd.
• During evaluate clk is high (-clk is low) and both type stages go through evaluation; N-
logic tree logically evaluates to ground while P-logic tree logically evaluates to Vdd.
If we turn a dynamic gate “upside down” and use PFETs to build the logic block, we get a logic
gate that “precharges” low and “discharges” high. By using these gates in an alternating
sequence with regular NFET dynamic gates we can eliminate the race problem we had with
NFET-only dynamic gate sequences and hence we don’t need the buffer inverter present in
domino gates.
Removing the buffer is a mixed blessing since we may need it for drive reasons and to
keep compatibility with other domino gates. It also makes NORA logic very susceptible to noise
since during the evaluate phase all information is stored dynamically.
NORA CMOS Logic Circuit Example
• An example of NP or NORA (No Race) logic is shown below:

• During CLK low (CLK’ high), each stage pre-charges
– N logic stages pre-charge to VDD; P logic stages pre-charge to GND

• When CLK goes high (CLK’ low), each stage enters the evaluation phase
– N logic evaluates to GND; P logic stages evaluate to VDD
– All NMOS and PMOS stages evaluate one after another in succession, as in
Domino logic
• Logic below:
– Stage 1 is X = (A · B)’
– Stage 2 is G = X’ + Y’
– Stage 3 is Z = (F · G + H)’

CLOCKED CMOS LOGIC
• Clocked CMOS logic has been used for very low power CMOS and/or for minimizing
hot electron effect problems in N-FET devices
• Clocking transistors allow valid logic output only when CLK is high
• Clocking transistors may be at output end of logic trees (maximum performance) or at

power supply end of logic trees (maximum protection from hot electrons)

Implement following function using CLOCKED CMOS LOGIC
a) NAND2 GATE b) NOR2 GATE

Differential Cascode Voltage Switch Logic
• It is possible to create a ratioed logic style that completely eliminates static currents and
provides rail-to-rail swing. Such a gate combines two concepts: differential logic and
positive feedback.
• A differential gate requires that each input is provided in complementary format, and
produces complementary outputs in turn. The feedback mechanism ensures that the load
device is turned off when no needed

CASE 1: Assume PDN1 OFF (0) this will make PDN2 ON (1) (Because PDN1 and
PDN2 are mutually exclusive) So PDN2 ON (1) will make Out will discharge completely
and it will become (Out=0) this will make M1 ON this will make Out to charge VDD
(Out=1) because of PDN1 is OFF, Out stays at 1 this will turn off M2
CASE 2: Assume PDN1 ON (1) this will make PDN2 OFF (0) (Because PDN1 and
PDN2 are mutually exclusive) So PDN1 ON (1) will make Out will discharge completely
and it will become (Out=0) this will make M2 ON this will make Out to charge VDD
(Out=1) because of PDN2 is OFF Out stays at 1 only, this will turn off M1
1. NAND and AND

2.XNOR and XOR
2. XNOR and XOR  Verification
OR

3. Implement following function using DCVL LOGIC

ADVANTAGES
 The DCVSL gate provides differential (or complementary) outputs.

 Both the output signal (Vout1) and its inverted value (Vout2) are simultaneously
available.
 This is a distinct advantage, as it eliminates the need for an extra inverter to produce the
complementary signal.
 It has been observed that a differential implementation of a complex function may reduce
the number of gates required by a factor of two
Pass-Transistor Logic
 A popular and widely-used alternative to complementary CMOS is pass-transistor logic
 which attempts to reduce the number of transistors required to implement logic by
allowing the primary inputs to drive gate terminals as well as source/drain terminals

COMPLEMENTARY PASS TRANSISTOR LOGIC
1. AND/NAND
2. OR/NOR

3. XOR/XNOR
TRANSMISSION GATE – SYMBOL & LAYOUT

1. Implementation of Multiplexor(2:1) using TG

2. Implementation of XOR using TG

3. Implementation of D Latch using TG

Problems
1. Design 4 to 1 multiplexor using transmission-gates.
2. Implement a full adder using transmission gates.
3. Implement AB+BC using Pass Transistor Logic
Case Study and Seminar

 Clocking Strategies
 I/O Structures
 Low power Design

UNIT-5
Datapath Subsystems
Chip functions generally can be divided into the following categories:
1. Data path operators
2. Memory elements
3. Control structures
4. Special-purpose cells
 I/O
 Power distribution
 Clock generation and distribution
 Analog and RF
Data path operations-Addition/Subtraction
Addition forms the basis for many processing operations, from ALUs to address generation to
multiplication to filtering. As a result, adder circuits that add two binary numbers are of great
interest to digital system designers. An extensive, almost endless, assortment of adder
architectures serves different speed/power/area requirements. This section begins with half
adders and full adders for single-bit addition
ADDER
HALF ADDER
The half adder adds two single-bit inputs, A and B, The result of two bits are required to
represent the value; they are called the sum S and carry-out Cout. The carry-out is equivalent to a
carry-in to the next more significant column of a multibit adder,

1. FULL ADDER
For a full adder, it is sometimes useful to define Generate (G), Propagate (P), and Kill (K)
signals.
 The adder generates a carry when Cout is true independent of Cin, so Generate G =
A · B.
 The adder kills a carry when Cout is false independent of Cin, so K = A · B = A + B
 The adder propagates a carry; i.e., it produces a carry-out if and only if it receives a
carry-in, when exactly one input is true:
the full adder logic is

Write K map , simplify and get the equation for S and Cout

2. SIMPLIFIED FULL ADDER in single design

SUBTRACTOR
An N-bit subtractor uses the two’s complement relationship
This involves inverting one operand to an N-bit carry-propagate adder and adding 1 via the
carry input, as shown in Figure
ADDER/SUBTRACTOR
An adder/subtractor uses XOR gates to conditionally invert B, as shown in below Figure.
In prefix adders, the XOR gates on the B inputs are sometimes merged into the bitwise PG
circuitry.
Example: Design of 4 bit Binary Adder/Subtractor
While it is perfectly possible to design a custom circuit for the subtraction operation, it is
much more common to re-use an existing adder and to replace a subtraction by a two-
complement's addition.
The figure shows how this is done
 When the SUB/ADD input is low (0), the XOR-gates act as non-inverting buffers and the
carry-input to the adder is 0. Therefore, the adder calculates a four-bit sum plus carry-out:
(Cout, S3, S2, S1, S0) = (A3, A2, A1, A0) + (B3, B2, B1, B0)

 If the SUB/ADD input is high (1), the XOR-gates act as inverting buffers, and the carry-
input to the adder is 1.
(Cout, S3, S2, S1, S0) = (A3, A2, A1, A0) - (B3, B2, B1, B0)
2. ADD A+B
A 1110
B 1111
SUM= 1101 CAR=1
2. SUBTRACT A-B
A 1110
B 1111
1‘s Compliment of B 0000
2’s Compliment of B=1‘s Compliment of B+1= 0000+1= 0001
S=A-B=A+B+1=A+2’s Compliment of B

S=1110+0001
S=1111
BOR=1
MULTIPLICATION
Multiplication can be considered as a series of repeated additions. The number to be added is
the multiplicand, the number of times that it is added is the multiplier, and the result is the
product. Each step of the addition generates a partial product. In most computers, the operands
usually contain the same number of bits. When the operands are interpreted as integers, the
product is generally twice the length of the operands in order to preserve the information content.
This repeated addition method that is suggested by the arithmetic definition is slow that it is
almost always replaced by an algorithm that makes use of positional number representation. It is
possible to decompose multipliers in two parts. The first part is dedicated to the generation of partial
products, and the second one collects and adds them.
1. Parallel Multiplier

2. Serial Multiplier
3. Serial Parallel Multiplier
4. Booth Multiplier
1. Parallel Multiplier
M × N-bit multiplication P = Y × X can be viewed as forming N partial products of M bits each,

and then summing the appropriately shifted partial products to produce an M+ N-bit result P.
Binary multiplication is equivalent to a logical AND operation. Therefore, generating partial
products consists of the logical ANDing of the appropriate bits of the multiplier and
multiplicand. Each column of partial products must then be added and, if necessary, any carry
values passed to the next column. We denote the multiplicand as
We denote the multiplicand as Y {yM–1, yM–2, …, y 1, y 0} and the multiplier as X {x N–1, xN–2, …, x 1, x0}.
For unsigned multiplication, the product is given in Equation
For example, the multiplication of two positive 6-bit binary integers, 25 10 and 3910, proceeds as
shown in Figure

4 Bit array Multiplication

COMPARATOR
Digital or Binary Comparators are made up from standard AND, NOR and NOT gates
that compare the digital signals present at their input terminals and produce an output depending
upon the condition of those inputs. For example, along with being able to add and subtract binary
numbers we need to be able to compare them and determine whether the value of input A is
greater than, smaller than or equal to the value at input B etc. The digital comparator
accomplishes this using several logic gates that operate on the principles of Boolean algebra.
There are two main types of digital comparator available and these are.
1. Identity Comparator - an Identity Comparator is a digital comparator that has only one
output terminal for when A = B either "HIGH" A = B = 1 or "LOW" A = B = 0
2. Magnitude Comparator - a Magnitude Comparator is a type of digital comparator that
has three output terminals, one each for equality, A = B greater than, A > B and less
than A < B
The purpose of a Digital Comparator is to compare a set of variables or unknown

numbers, for example A (A1, A2, A3, .... An, etc) against that of a constant or unknown value
such as B (B1, B2, B3, .... Bn, etc) and produce an output condition or flag depending upon the
result of the comparison. For example, a magnitude comparator of two 1-bits, (A and B) inputs
would produce the following three output conditions when compared to each other.
Which means: A is greater than B, A is equal to B, and A is less than B
This is useful if we want to compare two variables and want to produce an output when
any of the above three conditions are achieved. For example, produce an output from a counter
when a certain count number is reached. You may notice two distinct features about the
comparator from the above truth table. Firstly, the circuit does not distinguish between either two
"0" or two "1"'s as an output A = B is produced when they are both equal, either A = B = "0" or
A = B = "1". Secondly, the output condition for A = B resembles that of a commonly available
logic gate, the Exclusive-NOR or Ex-NOR function (equivalence) on each of the n-bits giving:
Q=A⊕B
Digital comparators actually use Exclusive-NOR gates within their design for comparing their
respective pairs of bits. When we are comparing two binary or BCD values or variables against

each other, we are comparing the "magnitude" of these values, a logic "0" against a logic "1"
which is where the term Magnitude Comparator comes from.
1-bit Comparator
Then the operation of a 1-bit digital comparator is given in the following Truth Table.
Truth Table
CMOS LOGIC STRUCTURE OF 1-BIT COMPARATOR
XNOR
PARITY GENERATORS
A parity bit can be added to an N-bit word to indicate whether the number of 1s in the word is
even or odd. In even parity, the extra bit is the XOR of the other N bits, which ensures the (N +
1)-bit coded word has an even number of 1s:
Parity generator helps in indicating the parity of a binary number or a word. Let us consider
One/Zero Detectors
Detecting all ones or zeros on wide N-bit words requires large fan-in AND or NOR gates. Recall
that by DeMorgan’s law, AND, OR, NAND, and NOR are fundamentally the same operation
except for possible inversions of the inputs and/or outputs. You can build a tree of AND gates, as
shown in Figure. Here, alternate NAND and NOR gates have been used.

Don’t go in detail of Counters and Shifters( not required)
Counters
Two commonly used types of counters are binary counters and linear-feedback shift
registers. An N-bit binary counter sequences through 2N outputs in binary order. Simple designs
have a minimum cycle time that increases with N, but faster designs operate in constant time. An
N-bit linear-feedback shift registers sequences through up to 2 N – 1 outputs in pseudo-random
order. It has a short minimum cycle time independent of N, so it is useful for extremely fast
counters as well as pseudo-random number generation.
Some of the common features of counters include the following:
 Resettable: counter value is reset to 0 when RESET is asserted (essential for testing)
 Loadable: counter value is loaded with N-bit value when LOAD is asserted
 Enabled: counter counts only on clock cycles when EN is asserted
 Reversible: counter increments or decrements based on UP/DOWN input
 Terminal Count: TC output asserted when counter overflows (when counting up)
or underflows (when counting down)
1. Binary Counters
The simplest binary counter is the asynchronous ripple-carry counter, as shown in Figure
It is composed of N registers connected in toggle configuration, where the falling transition of
each register clocks the subsequent register. Therefore, the delay can be quite long. It has no
reset signal, making it difficult to test. In general, asynchronous circuits introduce a whole

assortment of problems, so the ripple-carry counter is shown mainly for historical interest and is
not recommended for commercial designs.
2. Ring Counters
A ring counter consists of an M-bit shift register with the output fed back to the input, as
shown in Figure. On reset, the first bit is initialized to 1 and the others are initialized to 0. TC
toggles once every M cycles. Ring counters are a convenient way to build extremely fast
prescalars because there is no logic between flip-flops, but they become costly for larger M.
3. Johnson Counters
Johnson or Mobius counter is similar to a ring counter, but inverts the output before it is fed
back to the input, as shown in Figure. The flip-flops are reset to all zeros and count through 2M
states before repeating. Table shows the sequence for a 3-bit Johnson counter.

4. Linear-Feedback Shift Registers
A linear-feedback shift register (LFSR) consists of N registers configured as a shift register. The
input to the shift register comes from the XOR of particular bits of the register, as shown in
Figure for a 3-bit LFSR. On reset, the registers must be initialized to a nonzero value (e.g., all
1s). The pattern of outputs for the LFSR is shown in Table.

Shifters
Shifts can either be performed by a constant or variable amount. Constant shifts are trivial in
hardware, requiring only wires. They are also an efficient way to perform multiplication or
division by powers of two. A variable shifter takes an N-bit input, A, a shift amount, k, and
control signals indicating the shift type and direction. It produces an N-bit output, Y. There are
three common types of variable shifts, each of which can be to the left or right:
 Rotate: Rotate numbers in a circle such that empty spots are filled with bits shifted off the
other end
 Example: 1011 ROR 1 = 1101; 1011 ROL 1 = 0111
 Logical shift: Shift the number to the left or right and fills empty spots with zeros.
 Example: 1011 LSR 1 = 0101; 1011 LSL 1 = 0110
 Arithmetic shift: Same as logical shifter, but on right shifts fills the most significant bits
with copies of the sign bit (to properly sign, extend two’s complement numbers when
using right shift by k for division by 2k).
 Example: 1011 ASR 1 = 1101; 1011 ASL 1 = 0110
A. Funnel Shifter
B. Barrel Shifter
Funnel Shifter
Perform 6 different operations
 Logic Shift Right
 Logic Shift Left
 Arithmetic Shift Right
 Arithmetic Shift Left
 Barrel Shift Right
 Barrel Shift Left
Logic Shifter – After shift fills vacated positions with 0’s.
ex. Logic Shift Right 2
110110 →
_ _1101 →
001101
ex. Logic Shift Left 2
110110 →
0110_ _ →
011000

Arithmic shifter-For Right shift fills vacated positions with a value of Most Significant Bit
ex. Arithmic Shift Right 2
110110 → 110110 →
_ _1101 →
111101
For Left shift, same as Logic Shifter
Barrel shifter - Pushed out bits fill vacated bit positions.

ex. Barrel Shift Right 2
110110 →
_ _1101 →
101101
ex. Barrel Shift Left 2

110110 → 0110_ _ →011011
Relations between the Functions
 Logic Shift Left = Arithmic Shift Left
 Barrel Shift Right = Nt – Barrel Shift left;
where Nt = Total number of Bits
Ex. For a 4 Bit shifter
4 - Barrel Shift Left 1 = Barrel Shift Right 3
 Logic Shift Right = Nt – Logic Shift left;

where Nt = Total number of Bits
Shift and rotate examples for A = a7a6a5a4a3a2a1a0 and B = 3.

UNIT-6
Datapath Control
So far we have talked about what goes into the datapath. These function units / latches /
muxes manipulate the data itself. But this logic is only part of the whole chip. Something needs
to tell the datapath elements what to do. And this is the function of the control.
Control
It is usually an FSM since some operations that the chip performs take multiple clock cycles, and
the controller must know where it is in the instruction. In pipelined microprocessors, each
instruction may take n cycles to complete, but the next instructions are started before previous
ones have finished. The controller must track which instruction is at each function in each cycle.
FSM
Finite State Machines (as a sequential network) hold the present state in memory and compute
the next state and output using combinational logic. The input to the next state computation is the
present state and any inputs. A modulus counter represents the simplest FSM since it has no

inputs, the next state depends completely on the present state. For example, a Mod-5 counter
FSM counts 0, 1, 2, 3, 4, 0, 1, ... The general architecture of an FSM is the following: the
architecture consists of Compute Next State that uses the Present State to determine which will
be the next state to enter. The Clock input serves to synchronize the FSM operation into discrete
points of state change.
It is important to understand the role of the clock in coordinating the operation of the FSM. As
the following diagram illustrates, the Next State computation is (must be) completed when the
clock pulse occurs. The clock is active on the rising edge in this example meaning that all
changes to the memory occur on the rising clock edge. The Next State becomes the Present State
on the active clock edge, meaning the count changes.
FSM Design
• This presentation deals with front to end design of finite state machines, both Mealy and
Moore types.
FSM Implementation
• Converting a problem to equivalent state table and state diagram is just the first step in
the design process
• The next step is to design the system hardware that implements the state machine.
• This section deals with the process involved to design the digital logic to implement a
finite state machine.
• First step is to assign a uniquely binary value to each of the state that the machine can
be in. The state must be encoded in binary.
• Next we design the hardware to go from the current state to the correct next state. This
logic converts the current state and the current input values to the next state values and
stores that value.
• The final stage would be to generate the outputs of the state machine. This is done
using combinatorial logic.
Assigning State Values

• Each state must be assigned to a unique binary value; for a machine with n states we
have [log2n] bits;
• Any values can be assigned to the states, some values can be better than others (in
terms of minimizing the logic to create the output and the next state values)
• This is actually an iterative process: first the designer creates a preliminary design to
generate the outputs and the next states, then modifies the state values and repeats
the process. There is a rule of thumb, that simplifies the process: whenever possible, the
state should be assigned the same with the output values associated with that state. In
this case, same logic can be used to generate the next state and the output
Mealy and Moore Machine Implementations
• The current state value is stored into the register
• The state value together with the machine inputs, are input to a logic block (CLC) that
generates the next state value and machine outputs
• The next state is loaded into the register on the rising edge of the clock signal

EXAMPLE: Modulo 6 Counter
Specification:
• A module 6 counter is a 3-bit counter that counts through the following sequence:
– 000->001->010->011->100->101->000->…
– 0 -> 1 -> 2 -> 3 -> 4 -> 5 -> 0 …
• It doesn’t use value 6 (110) nor 7 (111)
• It has an input I that controls the counter:
– When I=1 the counter increments its value on the rising edge of the clock
– When I=0 the counter retains its value on the rising edge of the clock
• The value of the count is represented as three bit value (C2C1C0)
• There is an additional output O (Carry) that is 1 when going from 5 to 0 and 0 otherwise
(the O output remains 1 until the counter goes from 0 to 1)
Modulo 6 Counter – State table
Present I Next 0 C2C1C0

State State
S0 0 S0 1 000
S0 1 S1 0 001
S1 0 S1 0 001
S1 1 S2 0 010
S2 0 S2 0 010
S2 1 S3 0 011
S3 0 S3 0 011
S3 1 S4 0 100
S4 0 S4 0 100

S4 1 S5 0 101
S5 0 S5 0 101
S5 1 S0 1 000
• For each state examine what happens for all possible values of the inputs
– In state S0 input ‘I’ can be either 0 or 1
– If I=0 the state machine remains in state S0 and outputs ‘O’=1 and C2C1C0=000
– If I=1 the state machine goes in state S1, outputs O=0 and C2C1C0=001
• In the same manner, each state goes to the next state if I=1 and remains in the same
state if I=0
Generating the Next State
• Since the Mealy and Moore machines must traverse the same states under the same
conditions, their next state logic is identical
• We will present three methods to generate the next state logic:
– (i) Combinatorial logic gates
– (ii) Using multiplexers
– (iii) Using lookup ROM
• To begin with, we need to setup the truth table for the next state logic
Modulo 6 Counter - Next State Logic (i)
Present State I Next State
P2P1P0 N2N1N0
000 0 000
000 1 001

001 0 001
001 1 010
010 0 010
010 1 011
011 0 011
011 1 100
100 0 100
100 1 101
101 0 101
101 1 000
• The system inputs and the present states are the inputs of the truth table
• Next state bits are the outputs
• We have to construct a Karnaugh map for each output bit and obtain its equation
• After that we design the logic to match the equations
• N2 = P2P0 + P2I +P1P 0I
• N1 = P 1P0 + P1I + P2P1P0I
• N0 = P 0I + P0I

• Modulo 6 Counter – Next State implementation using logic gates (i)
Generating System Outputs
• Both for Mealy and Moore machines we follow the same design procedure to develop
their output logic
• There are two approaches to generate the output (similar to generate the next state
logic):
– Using combinatorial logic gates
– Using lookup ROM
• We are beginning by creating the truth table:
– For Mealy machine, the truth table inputs will be the present state and the
system inputs, and the table outputs are the system outputs
– For Moore machine, only the state bits are inputs of the truth table, since only
these bits are used to generate the system outputs; the table outputs are the
system outputs

Moore
Modulo 6 Counter – Moore state diagram
• The outputs are represented adjacent to the state
• The inputs are represented on the arcs
P2P1P0 O C2C1C0
000 1 000
001 0 001
010 0 010
011 0 011
100 0 100
101 0 101

Mod 6 Counter – Moore Implementation
• The outputs depend only on the present state and not on its inputs
• Its configuration is different than the Mealy machine
– The system output depends only on the present state, so the implementation of
the output logic is done separately
– The next state is obtained from the input and the present state (same as for the
Mealy machine)
• Outputs - Moore machine:
– C 2 = P2
– C 1 = P1
– C 0 = P0
– O = P2’P1’P0’ = (P2+P1+P0)’

• Modulo 6 Counter – Moore Implementation
Mealy
Modulo 6 Counter - Mealy state diagram
• The outputs are represented on the arcs as I/OC2C1C0

P2P1P0 I O C2C1C0
000 0 1 000
000 1 0 001
001 0 0 001
001 1 0 010
010 0 0 010
010 1 0 011
011 0 0 011
011 1 0 100
100 0 0 100
100 1 0 101
101 0 0 101
101 1 1 000

Mod 6 Counter – Mealy Implementation
• The logic block (CLC) is specific to every system and may consist of combinatorial logic
gates, multiplexers, lookup ROMs and other logic components
• The logic block can’t include any sequential components, since it must generate its value
in one clock cycle
• The logic block contains two parts:
– One that generates the outputs (f function, CLC1)
– One that generates the next state (g function, CLC2)

Outputs - Mealy (i)
• Mealy machine (note that the equations for C2, C1, C0 are exactly the same as for the
N2, N1, N0. This is the result of optimally assignation of the state values. Same
combinatorial logic can be use to obtain the outputs):
– C2 = P2P0’+P2I’+P1P0I
– C1 = P1P0’+P1I’+P2P1’P0I
– C0 = P0’I+P0I’
– O = P2’P1’P0’I’+P2P0I

Modulo 6 Counter – Mealy Implementation

Digital Design Vlsi PDF

Caricato da

Informazioni sul documento

Titolo originale

Copyright

Formati disponibili

Condividi questo documento

Condividi o incorpora il documento

Opzioni di condivisione

Hai trovato utile questo documento?

Questo contenuto è inappropriato?

Copyright:

Formati disponibili

Digital Design Vlsi PDF

Caricato da

Copyright:

Formati disponibili

JAIN University – Regulations, Scheme & Syllabi B.E (Electronics & Communication Engineering).

MOS Transistor Theory

Introduction, MOS device design equations, Complementary CMOS Inverter-DC

CMOS Processing Technology

Silicon semiconductor technology An overview, basic CMOS technology, CMOS process

Scaling of MOS circuits

CMOS Circuit and Logic Design

CMOS Subsystem Design I

Introduction, Data path operations- Addition/ subtraction, Parity Generators,

CMOS Subsystem Design II

Memory Elements, Control-FSM, Control Logic Implementation

Digital VLSI Design, ECE Dept.SET,JU. Page 1

 n-channel and p-channel enhancement MOSFET normally OFF, below Threshold

Digital VLSI Design, ECE Dept.SET,JU. Page 2

 n-channel and p-channel Depletion MOSFET normally ON, Pinch off on

Digital VLSI Design, ECE Dept.SET,JU. Page 3

I. Cut off Region

Digital VLSI Design, ECE Dept.SET,JU. Page 4

Digital VLSI Design, ECE Dept.SET,JU. Page 5

the width of the channel in a direction perpendicular to the current flow.

Digital VLSI Design, ECE Dept.SET,JU. Page 6

Digital VLSI Design, ECE Dept.SET,JU. Page 7

Digital VLSI Design, ECE Dept.SET,JU. Page 9

the Fermi voltage,

Digital VLSI Design, ECE Dept.SET,JU. Page 10

Substrate Bias Effect

Digital VLSI Design, ECE Dept.SET,JU. Page 11

Channel Length Modulation

CMOS (COMPLEMENTARY MOSFET)

Digital VLSI Design, ECE Dept.SET,JU. Page 12

LOW noise margin NML=VIL-VOL

Digital VLSI Design, ECE Dept.SET,JU. Page 13

Digital VLSI Design, ECE Dept.SET,JU. Page 14

Digital VLSI Design, ECE Dept.SET,JU. Page 15

Digital VLSI Design, ECE Dept.SET,JU. Page 16

Digital VLSI Design, ECE Dept.SET,JU. Page 17

PMOS, NMOS: saturation

Digital VLSI Design, ECE Dept.SET,JU. Page 18

Digital VLSI Design, ECE Dept.SET,JU. Page 20

Digital VLSI Design, ECE Dept.SET,JU. Page 21

Digital VLSI Design, ECE Dept.SET,JU. Page 22

Digital VLSI Design, ECE Dept.SET,JU. Page 23

Derivation of output voltage equation and n/ p

Digital VLSI Design, ECE Dept.SET,JU. Page 34

PMOS always in ACTIVE region

for VGS <VTh,p

NMOS in Saturation region

for VGS >VTh,n and VDS> VGS-VTh,n Vout> Vin-Vthn

Equating both the current equations

Digital VLSI Design, ECE Dept.SET,JU. Page 35

Digital VLSI Design, ECE Dept.SET,JU. Page 36

Digital VLSI Design, ECE Dept.SET,JU. Page 37

Digital VLSI Design, ECE Dept.SET,JU. Page 38

Digital VLSI Design, ECE Dept.SET,JU. Page 40

Digital VLSI Design, ECE Dept.SET,JU. Page 41

Digital VLSI Design, ECE Dept.SET,JU. Page 42

Now Vleft is increased by right is decreased by ,then current in N1 increases

Thus is the differential gain from Vleft to Vout

gm is / V transconductance of the driver transistor

Vout1=VDD- (Isource *Rload)/2

Digital VLSI Design, ECE Dept.SET,JU. Page 43

Digital VLSI Design, ECE Dept.SET,JU. Page 1

charged or discharged rapidly