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HiSilicon

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HiSilicon Semiconductor Co., Ltd.

Native name 海思半导体有限公司

Type Subsidiary

Traded as HiSilicon

Industry Fabless semiconductors, Semiconductors, Integrated


circuit design

Founded 1991; 28 years ago[1]

Headquarters Shenzhen, Guangdong, China

Products SoCs

Parent Huawei

Website www.hisilicon.com

HiSilicon

Simplified Chinese 海思半导体有限公司

Traditional Chinese 海思半導體有限公司

Literal meaning Haisi Semiconductor Limited Company


showTranscriptions

HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor


company based in Shenzhen, Guangdong and fully owned by Huawei.
HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM
Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15
MPCore,[2][3] ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics
cores.[4][5] HiSilicon has also purchased licenses from Vivante Corporation for their GC4000
graphics core.
HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[6]

Contents

 1Smartphone Application Processors


o 1.1K3V2
o 1.2K3V2E
o 1.3Kirin 620
o 1.4Kirin 650, 655, 658, 659
o 1.5Kirin 710
o 1.6Kirin 810
o 1.7Kirin 910 and 910T
o 1.8Kirin 920, 925 and 928
o 1.9Kirin 930 and 935
o 1.10Kirin 950 and 955
o 1.11Kirin 960
o 1.12Kirin 970
o 1.13Kirin 980
 2Smartphone modems
o 2.1Balong 700
o 2.2Balong 710
o 2.3Balong 720
o 2.4Balong 750
o 2.5Balong 765
o 2.6Balong 5G01
o 2.7Balong 5000
 3Server processors
o 3.1Hi1610
o 3.2Hi1612
o 3.3Kunpeng 916 (formally Hi1616)
o 3.4Kunpeng 920 (formally Hi1620)
o 3.5Kunpeng 930 (formally Hi1630)
o 3.6Kunpeng 950
 4AI Acceleration
o 4.1Ascend 310
o 4.2Ascend 910
 5Similar platforms
 6References
 7External links

Smartphone Application Processors[edit]


HiSilicon develops SoCs based on ARM architecture. Though not exclusive, these SoCs
see preliminary use in handheld and tablet devices of its parent company Huawei.
K3V2[edit]
The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad
XL (U9510) smartphones[7] and Huawei MediaPad 10 FHD7 tablets.[8] This chipset is based
on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000
GPU.[9] The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900
instead for lower power consumption.

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K3V2E[edit]
This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC
supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower
power consumption.

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Kirin 620[edit]
• supports - USB 2.0 / 13 MP / 1080p video encode

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Kirin 650, 655, 658, 659[edit]


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Kirin 710[edit]

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Kirin 810[edit]

 DaVinci NPU based on Tensor Arithmetic Unit


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Kirin 910 and 910T[edit]

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Kirin 920, 925 and 928[edit]


• The Kirin 920 SoC also contains an image processor that supports up to 32 megapixel

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Kirin 930 and 935[edit]


• supports - SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low
Energy / USB 2.0 / 32 MP ISP / 1080p video encode
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Kirin 950 and 955[edit]
• supports - SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth
4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5
coprocessor / Tensilica HiFi 4 DSP

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Kirin 960[edit]

 Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1, Sensor Hub: i6

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Kirin 970[edit]
 Interconnect: ARM CCI-550, Storage: UFS 2.1, Sensor Hub: i7
 Cadence Tensilica Vision P6 DSP.[19]
 NPU made in collaboration with Cambricon Technologies. 1.92T FP16 OPS.[20]

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Kirin 980[edit]
It is HiSilicon's first SoC based on 7 nm FinFet technology.

 Interconnect: ARM Mali G76-MP10, Storage: UFS 2.1, Sensor Hub: i8


 Dual NPU made in collaboration with Cambricon Technologies.

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Smartphone modems[edit]
HiSilicon develops smartphone modems which although not exclusively, these SoCs see
preliminary use in handheld and tablet devices of its parent company Huawei.
Balong 700[edit]
The Balong 700 supports LTE TDD/FDD.[22] Its specs:

 3GPP R8 protocol
 LTE TDD and FDD
 4x2/2x2 SU-MIMO
Balong 710[edit]
At MWC 2012 HiSilicon released the Balong 710.[23] It is a multi-mode chipset supporting
3GPP Release 9 and LTE Category 4 at GTI (Global TD-LTE Initiative). The Balong 710
was designed to be used with the K3V2 SoC. Its specs:

 LTE FDD mode : 150 Mbit/s downlink and 50 Mbit/s uplink.


 TD-LTE mode: up to 112 Mbit/s downlink and up to 30 Mbit/s uplink.
 WCDMA Dual Carrier with MIMO: 84Mbit/s downlink and 23Mbit/s uplink.
Balong 720[edit]
The Balong 720 supports LTE Cat6 with 300 Mbit/s peak download rate.[22] Its specs:

 TSMC 28nm HPM process


 TD-LTE Cat.6 standard
 Dual-carrier aggregation for the 40 MHz bandwidth
 5-mode LTE Cat6 Modem
Balong 750[edit]
The Balong 750 supports LTE Cat 12/13, and it is first to support 4CC CA and
3.5GHz.[22] Its specs:

 LTE Cat.12 and Cat.13 UL network standards


 2CC (dual-carrier) data aggregation
 4x4 multiple-input multiple-output (MIMO)
 TSMC 16nm FinFET+ process
Balong 765[edit]
The Balong 765 supports 8×8 MIMO technology, LTE Cat.19 with downlink data-rate up to
1.6 Gbit/s in FDD network and up to 1.16 Gbit/s in the TD-LTE network.[24] Its specs:

 3GPP Rel.14
 LTE Cat.19 Peak data rate up to 1.6 Gbit/s
 4CC CA + 4×4 MIMO/2CC CA + 8×8 MIMO
 DL 256QAM
 C-V2X
Balong 5G01[edit]
The Balong 5G01 supports the 3GPP standard for 5G with downlink speeds of up to 2.3
Gbit/s. It supports 5G across all frequency bands including sub-6GHz and millimeter wave
(mmWave).[22] Its specs:

 3GPP Release 15
 Peak data rate up to 2.3 Gbit/s
 Sub 6GHz and mmWave
 NSA/SA
 DL 256QAM
Balong 5000[edit]
The Balong 5000 supports supports 2G, 3G, 4G, and 5G.[25] Its specs:

 2G/3G/4G/5G Multi Mode


 Fully compliant with 3GPP Release 15
 Sub-6GHz: 100MHz x 2CC CA
 Sub-6GHz:Downlink up to 4.6 Gbit/s, Uplink up to 2.5 Gbit/s
 mmWave:Downlink up to 6.5 Gbit/s, Uplink up to 3.5 Gbit/s
 NR+LTE:Downlink up to 7.5 Gbit/s
 FDD & TDD Spectrum Access
 SA & NSA Fusion Network Architecture
 Supports 3GPP R14 V2X
 3GB LPDDR4X[26]

Server processors[edit]
HiSilicon develops server processor SoCs based on ARM architecture.
Hi1610[edit]
The Hi1610 is HiSilicon's first generation server processor announced in 2015. It features:

 16x ARM Cortex-A57 at up to 2.1 GHz[27]


 48 KB L1-I, 32 KB L1-D, 1MB L2/4 cores and 16MB CCN L3
 TSMC 16nm
 2x DDR4-1866
 16 PCIe 3.0
Hi1612[edit]
The Hi1612 is HiSilicon's second generation server processor launched in 2016. It features:

 32x ARM Cortex-A57 at up to 2.1 GHz[27]


 48 KB L1-I, 32 KB L1-D, 1MB L2/4 cores and 32MB CCN L3
 TSMC 16nm
 4x DDR4-2133
 16 PCIe 3.0
Kunpeng 916 (formally Hi1616)[edit]
The Kunpeng 916 (formally known as Hi1616) is HiSilicon's third generation server
processor launched in 2017. The Kunpeng 916 is utilized in Huawei's TaiShan 2280
Balanced Server, TaiShan 5280 Storage Server, TaiShan XR320 High-Density Server
Node and TaiShan X6000 High-Density Server. [28][29][30][31] It features:

 32x Arm Cortex-A72 at up to 2.4 GHz[27]


 48 KB L1-I, 32 KB L1-D, 1MB L2/4 cores and 32MB CCN L3
 TSMC 16nm
 4x DDR4-2400
 2-way Symmetric multiprocessing (SMP), Each socket has 2x ports with 96 Gbit/s per
port (total of 192 Gbit/s per each socket interconnects)
 46 PCIe 3.0 and 8x 10 GbE
 85 W
Kunpeng 920 (formally Hi1620)[edit]
The Kunpeng 920 (formally known as Hi1620) is HiSilicon's fourth generation server
processor announced in 2018, launched in 2019. Huawei claim the Kunpeng 920 CPU
scores more than an estimated 930 on SPECint®_rate_base2006.[32] The Kunpeng 920 is
utilized in Huawei's TaiShan 2280 V2 Balanced Server, TaiShan 5280 V2 Storage Server
and TaiShan XA320 V2 High-Density Server Node.[33][34][35] It features:

 32 to 64x custom TaiShan v110 cores at up to 2.6 GHz.[36]


 The TaiShan v110 core is a 4-way out-of-order superscalar that implements the
ARMv8.2-A ISA. Huawei reports the core supports almost all the ARMv8.4-A ISA
features with a few exceptions, including dot product and the FP16 FML extension.[36]
 The TaiShan v110 cores are likely a new core not based off ARM designs [37]
 3x Simple ALUs , 1x Complex MDU, 2x BRUs (sharing ports with ALU2/3), 2x FSUs
(ASIMD FPU), 2x LSUs[37]
 64 KB L1-I, 64 KB L1-D, 512 KB Private L2 and 1MB L3/core Shared.
 TSMC 7nm HPC
 8x DDR4-3200
 2-way and 4-way Symmetric multiprocessing (SMP). Each socket has 3x Hydra ports
with 240 Gbit/s per port (total of 720 Gbit/s per each socket interconnects)
 40 PCIe 4.0 with CCIX support, , 4 USB 3.0, 2x SATA 3.0, x8 SAS 3.0 and 2 x
100 GbE
 100 to 200 W
 Compression engine (GZIP, LZS, LZ4) capable of up to 40 Gib/s compress and 100
Gbit/s decompress
 Crypto offload engine (for AES, DES, 3DES, SHA1/2, etc..) capable of throughputs up
to 100 Gbit/s
Kunpeng 930 (formally Hi1630)[edit]
The Kunpeng 930 (formally known as Hi1630) is HiSilicon's fifth-generation server
processor announced in 2019 and scheduled for launch in 2021. It features:

 TBD custom cores with higher frequencies, support for simultaneous multithreading
(SMT) and Arm’s Scalable Vector Extension (SVE).[36]
 64 KB L1-I, 64 KB L1-D, 512 KB Private L2 and 1MB L3/core Shared
 TSMC 7nm?
 8x DDR5
Kunpeng 950[edit]
The Kunpeng 950 is HiSilicon's sixth-generation server processor announced in 2019 and
scheduled for launch in 2023

AI Acceleration[edit]
HiSilicon also develops AI Acceleration chips.
Ascend 310[edit]
It is an AI chip manufactured by Chinese communication electronics manufacturer Huawei.
The Ascend 310 is capable of 16 TOPS@INT8 and 8 TOPS@FP16 with power
consumption of only 8 W. It is fabbed on TSMC's 12nm FFC Process.[38]
Ascend 310 chipsets are based on an architecture called "Da Vinci" and Computing Engine
called "3D Cube".
It includes a new AI framework called "MindSpore", a platform-as-a-service product called
ModelArts, and a lower-level library called Compute Architecture for Neural Networks
(CANN).[citation needed]
Ascend 910[edit]
The Ascend 910 is a 7 nm chip which delivers 256 TFLOPS@FP16 and 512 TOPS@INT8
with power consumption of 350W. The Ascend Cluster has 1024 Ascend 910 chips to
reach 256 petaFLOPS@FP16. The Ascend 910 and Ascend Cluster will be available in Q2
2019.[39]

Similar platforms[edit]
The Kirin processors compete with products from several other companies, including:

 R-Car by Renesas
 Tegra by Nvidia
 OMAP by Texas Instruments
 Exynos by Samsung
 Snapdragon by Qualcomm
 Ax by Apple
 Atom by Intel
 i.MX by Freescale Semiconductor
 RK3xxx by Rockchip
 Allwinner Axy by Allwinner
 MTxxxx by MediaTek

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