Emic QB

EC6011- Electromagnetic Interference and Compatibility Department of ECE 2019-2020
EC6011 ELECTRO MAGNETIC INTERFERENCE AND COMPATIBILITY LTPC3 0 03

Objectives
To tutor the basics of EMI,EMC
To instill knowledge on the EMI coupling mechanism and its mitigation techniques
To impart comprehensive insight about the current EMC standards and about
various measurement techniques
UNIT I BASIC THEORY 8
Introduction to EMI and EMC, Intra and inter system EMI, Elements of Interference, Sources and
Victims of EMI, Conducted and Radiated EMI emission and susceptibility, Case Histories,
Radiation hazards to humans, Various issues of EMC, EMC Testing categories, EMC Engineering
Application.
UNIT II COUPLING MECHANISM 9

Electromagnetic field sources and Coupling paths, Coupling via the supply network, Common
mode coupling, Differential mode coupling, Impedance coupling, Inductive and Capacitive
coupling, Radiative coupling, Ground loop coupling, Cable related emissions and coupling,
Transient sources, Automotive transients.
UNIT III EMI MITIGATION TECHNIQUES 10
Working principle of Shielding and Murphy‟s Law, LF Magnetic shielding, Apertures and
shielding effectiveness, Choice of Materials for H, E, and free space fields, Gasketting and sealing,
PCB Level shielding, Principle of Grounding, Isolated grounds, Grounding strategies for Large
systems, Grounding for mixed signal systems, Filter types and operation, Surge protection devices,
Transient protection.
UNIT IV STANDARDS AND REGULATION 9
Need for Standards, Generic/General Standards for Residential and Industrial environment, Basic
Standards, Product Standards, National and International EMI Standardizing Organizations; IEC,
ANSI, FCC, AS/NZS, CISPR, BSI, CENELEC, ACEC. Electro Magnetic Emission and
susceptibility standards and specifications, MIL461E Standards.
UNIT V EMI TEST METHODS AND INSTRUMENTATION 9

Fundamental considerations, EMI Shielding effectiveness tests, Open field test, TEM cell for
immunity test, Shielded chamber , Shielded anechoic chamber, EMI test receivers, Spectrum
analyzer, EMI test wave simulators, EMI coupling networks, Line impedance stabilization
networks, Feed through capacitors, Antennas, Current probes, MIL -STD test methods, Civilian
STD test methods.
TOTAL: 45 PERIODS
OUTCOMES:
Upon completion of the course, students will be able to:
 Find solution to EMI Sources, EMI problems in PCB level / Subsystem and system level
design.
 To measure emission immunity level from different systems to couple with the prescribed
EMC standards
TEXT BOOK:
1. Clayton Paul, “Introduction to Electromagnetic Compatibility”, Wiley Interscience, 2006
REFERENCES:
1. V Prasad Kodali, “Engineering Electromagnetic Compatibility”, IEEE Press, Newyork, 2001.
2. Henry W. Ott, “Electromagnetic Compatibility Engineering”, John Wiley & Sons Inc, Newyork,
2009
3. Daryl Gerke and William Kimmel, “EDN‟s Designer‟s Guide to Electromagnetic Compatibility”,
Elsevier Science & Technology Books, 2002
4. W Scott Bennett, “Control and Measurement of Unintentional Electromagnetic Radiation”,
John Wiley & Sons Inc., (Wiley Interscience Series) 1997.
5. Dr Kenneth L Kaiser, “The Electromagnetic Compatibility Handbook”, CRC Press 2005.
St.Joseph’s college of Engineering/ St.Joseph’s Institute of Technology
1
COURSE OUTCOMES
Upon Completion of the course, the students will be able:
C405.1 To understand the basic concepts of interference and compatibility and its sources.
C405.2 To study the different methods by which interference can occur.
C405.3 To design and study the different methods used to prevent interference.
C405.4 To study the different standardization procedures of various organizations.
C405.5 To study the different test methods and instruments used to measure electromagnetic interference.
MAPPING BETWEEN CO AND PO, PSO WITH CORRELATION LEVEL 1/2/3
EC601 PO PO PO PO PO PO PO PO PO PO PO PO PS PS PS PS
1 1 2 3 4 5 6 7 8 9 10 11 12 O1 O2 O3 O4
C405.1 3 3 3 3 1 3 3 2 2 2 2 2 3 3 3 3
C405.2 3 3 3 3 2 3 3 2 2 2 2 2 3 3 3 3
C405.3 3 3 3 3 2 3 3 2 2 2 2 2 3 3 3 3
C405.4 3 2 3 3 2 3 3 3 2 2 2 3 3 1 3 3
C405.5 3 3 3 3 2 3 3 2 2 2 2 3 3 3 3 3
RELATION BETWEEN COURSE CONTENT WITH COs

UNIT I BASIC THEORY
S. No. Knowledge level Course Content CO Statement
1. U Introduction to EMI and EMC
2. U Intra and inter system EMI
3. U Elements of Interference
4. U Sources and Victims of EMI C405.1

5. U Conducted and Radiated EMI emission and susceptibility
6. U,An Case Histories
7. U Radiation hazards to humans
Various issues of EMC, EMC Testing categories, EMC
8. U,An,Ap
Engineering Application
UNIT II COUPLING MECHANISM
Knowledge
S. No. Course Content CO Statement
level
1. U Electromagnetic field sources and Coupling paths
2. U Coupling via the supply network
3. U,An Common mode coupling
4. U,An Differential mode coupling C405.2

5. U,An Impedance coupling
6. U,An Inductive and Capacitive coupling,
7. U,An Radiative coupling, Ground loop coupling
8. U,An,R Cable related emissions and coupling
9. U Transient sources, Automotive transients
St.Joseph’s college of Engineering/ St.Joseph’s Institute of Technology 2
UNIT III EMI MITIGATION TECHNIQUES

Knowledge CO
S. No. Course Content
level Statement
1. U,An,Ap Working principle of Shielding and Murphy’s Law
2. U,An,Ap LF Magnetic shielding
Apertures and shielding effectiveness, Choice of Materials for H, E,

3. U,An,Ap
and free space fields
4. U,Ap Gasketting and sealing C405.3

5. U,Ap PCB Level shielding
6. U,An,Ap Principle of Grounding, Isolated grounds

Grounding strategies for Large systems, Grounding for mixed
7. U,An,Ap
signal systems
8. U,An,Ap Filter types and operation
9. U,An,Ap Surge protection devices, Transient protection

UNIT IV STANDARDS AND REGULATION
Knowledge CO
level Statement
Need for Standards, Generic/General Standards for
1. U,An,Ap,R
Residential and Industrial environment
U,An,Ap,R
2. Basic Standards, Product Standards
U,An,Ap,R National and International EMI Standardizing Organizations;

3.
IEC
U,An,Ap,R
4. ANSI, FCC
C405.4
5. U,An,Ap,R AS/NZS, CISPR
U,An,Ap,R
6. BSI, CENELEC, ACEC
U,An,Ap,R
Electro Magnetic Emission and susceptibility standards and
7.
specifications
U,An,Ap,R
8. MIL461E Standards
UNIT V EMI TEST METHODS AND INSTRUMENTATION
Knowledge CO
level Statement
1. U,Ap Fundamental considerations, EMI Shielding effectiveness tests

2. U,Ap Open field test, TEM cell for immunity test
3. U,Ap Shielded chamber , Shielded anechoic chamber
4. U,Ap EMI test receivers, Spectrum analyzer
5. U,Ap EMI test wave simulators, EMI coupling networks C405.5

6. U,Ap Line impedance stabilization networks, Feed through capacitors
7. U,Ap Antennas, Current probes
8. U,Ap MIL - STD test methods, Civilian STD test methods
UNIT I: BASIC THEORY (C405.1)

PART A
1. Define EMI.
The undesired or unintentional coupling of electromagnetic energy from one
equipment to the other equipment is the electromagnetic interference.
Electromagnetic interference leads to the degradation of the performance of a device,
equipment or system caused by an electromagnetic noise.
Electromagnetic noise is a time varying electromagnetic phenomenon which does not
convey information and which may be superimposed or combined with a wanted signal.
2. List different types of EMI sources.

 Natural and man made sources
Example: Natural – lightning discharge
Man made – telephone equipment
 Intentional and unintentional sources
Example: Intentional – Broad cast transmitter
Unintentional – Ignition system
 Radiated and conducted EMI
Example: Radiated – radio relay
Conducted – heater circuits
3. What are the basic differences between conducted and radiated emission?(Nov/Dec
2016)(Nov.2018)
Conducted emission: The conduction coupling between an emitter and a receptor occurs via
a direct conduction path between the emitter and receptor.
Radiated emission: The radiation coupling between an emitter and a receptor results from a
transfer of electromagnetic energy through a radiation path.
4. Why electromagnetic interference must be under control?

Electromagnetic Interference must be under control since EMI adversely affects the
performance of a device/system. EMI reduce the reliability of the system and leads to system
malfunction.

5. What are the three criteria required for a system to be electromagnetically
compatible? (Nov/Dec 2016)
A system is electromagnetically compatible with it’s environment if it satisfies the three
criteria:
 It does not cause interference with other systems
 It is not susceptible to emissions (conducted, radiated) from other systems.
 It does not cause interference with itself
6. List the unintentional (non functional) sources of conducted interference.
Commutator, Heater circuits, Data processing machines, Fluorescent lamps, Static power
devices.
7. What are the functional (Intentional) sources of radiated interference?

Broadcast transmitter, navigation equipment, communication equipments.
8. Draw an equivalent circuit model for electrostatic discharge.
9. Give the units for radiated emission and radiation susceptibility.

Electric field: Volts /meter, dBV/ meter, dBmV/meter,
Magnetic field: Webers/meter (Tesla)
10. What is the biological effect of EMI?

Human body is source of naturally generated electric and magnetic fields. The body
uses electro chemical signals to control the movement of muscles and to transmit information
from one part of the body to another.
For example, ECG signals have peak value of about 1mV with repetition rate of 45 to
150 beats per minute. When electric fields and signals of comparable strengths flow through
the human body, such signals induce charges on natural electro chemical processes.
Continued exposure of humans and other biological systems to electric, magnetic or
electromagnetic fields could affect the feed back functions in biological systems and the
behavior of cells.
11. What is narrow band radio noise?

Narrow band radio noise is radio noise having a spectrum exhibiting one or more
sharp peaks, narrow in bandwidth compared to the nominal bandwidth of, and far enough
apart to be resolved by, the measuring instrument.
12. How do electrostatic discharges occur?

Static electricity is generated when two materials of different dielectric constants (for
example, wool and glass) rub against each other. Charging of a material body may also result
from heating (loss of electrons) or contact with a charged body. This static charge is
discharged to another object which has a lower resistance to the ground. This phenomenon is
referred to as ESD. The effects of such a discharge, which results in electromagnetic
interference, could vary from noise and disturbances in audio or measuring instruments to
unpleasant electrical shocks to the equipment or person involved.
13. List some materials that exhibit electrostatic discharge.

Asbestos, Glass, Nylon, Paper, Wood, sealing wax, polyester, PVC, Teflon, Synthetic rubber
14. What is meant by electromagnetic compatibility?(Nov.2018)(April/May 2018)

The ability of a receptor (a device, or equipment or a system) to function satisfactorily
in its electromagnetic environment without at the same time introducing intolerable
electromagnetic disturbances to any other device/equipment/system in that environment is
called electromagnetic compatibility (EMC).
15. List four EMI mitigation techniques.

(i)Grounding, (ii)Shielding, (iii)Bonding, (iv)Filtering
16. Sketch the waveforms of pulsed EMI.
(a) ESD (b) EFT (c) Surge
17. Define : Susceptibility with respect to EMI/EMC. (NOV/DEC 2017)

The inability of a device, equipment, or system to perform without degradation in the
presence of an electromagnetic disturbance.Susceptibility is lack of immunity to EMI.
18. What is radio frequency interference?

 Degradation of the performance of a device, equipment, or system caused by radio
frequency disturbance( noise).
 Degradation of the reception of a wanted signal caused by radio frequency disturbance.
19. How many types of EMI exist?

Two types Based on propagation: Radiated EMI and conducted EMI.
Two types based on source: Natural EMI and Man made EMI
20. What are the three ways to prevent EMI?

(i) Suppress the emission at its source.
(ii) Make the coupling path as inefficient as possible.
(iii) Make the receptor less susceptible to the emission.
21. Why EMI is a vital problem? (April/May 2017)

Electromagnetic Interference (EMI) can cause interference or noise in various
electronic and electrical devices and effect the performance operations. EMI degrades the
performance of a device or equipment or a system.
22. List the testing strategies in EMC. (April/May 2017)

For Electromagnetic compatibility (EMC), a system should not be a source of EMI
and it should not be susceptible to EMI from other systems. EMC testing categories are:
(i) Radiating emission
(ii) Conducted Emissions
(iii) Radiated susceptibility
(iv) Conducted susceptibility
23. What are the harmful effects of EMI? (Nov/Dec 2017)

 Electromagnetic environment created by intentional and unintentional sources, when
sufficiently strong, interferes with the normal operation of many electrical, electronic
equipments and systems.
 Low-frequency magnetic fields induce circulating currents within the human body. If
sufficiently large, these currents could cause stimulation of nerves and muscles or
affect other biological processes.
 The main effect of radiofrequency electromagnetic fields is heating of body
tissues. Short-term exposure to very high levels of electromagnetic fields can be
harmful to health.
24. List the three aspects of the EMC problem to form the basic framework of any
EMC design. (Apr/ May 2019)
A system is electromagnetically compatible with it’s environment if it satisfies the three
criteria:
 It does not cause interference with other systems
 It is not susceptible to emissions (conducted, radiated) from other systems.
 It does not cause interference with itself
PART B (C405.1)
1. (i) Describe natural sources of EMI.
(ii) Briefly explain any two EMI problems with examples.
2. Explain in detail classification of EMI.
3. Explain the various mechanisms in which electromagnetic interference can travel from
its source to the receptor. (Nov/Dec 2016)
4. Write short notes on: (i) EMC testing categories (ii) Inter system EMI.
5. Give a detailed account on (i) manmade noise (ii) Electrostatic Discharge
6. (i)Discuss on the strong sources of atmospheric noise.

(ii) Discuss how lightning discharges affect the transmission line communications.
(Nov/Dec 2016)
7. (i) Distinguish between the features of conducted EMI and radiated EMI.
(Nov/Dec 2018)
(ii)Explain the different sources of EMI in detail. Give examples. (Apr/May 2017)
8. Discriminate time domain and frequency domain EMI. Why analysis is made in
frequency domain in the design and location of high voltage equipments? (Apr/May
2017)
9. (i) Explain the mechanisms of EMI . Mention its applications.
(ii) What are the types of EMI? With real diagram explain the sources and consequences
of EMI. (Nov/Dec 2017)
10. (i) Explain the classification of electromagnetic radiation and its hazards.
(ii) Explain the effect of radiation on the human body. (Nov/Dec 2017)
11.(i) How do you break the transfer of electromagnetic energy with regard to the prevention
of interference? Explain.
(ii) List the equipment to equipment effects and equipment to human effects with regard
to human interference. (Apr/May 2018)
12. Discuss about the sources and victims of Electromagnetic Interference. (Nov/Dec 2018)
13. Discuss the noise parameters involved in EMC/EMI. (Nov/Dec 2018)
UNIT II: COUPLING MECHANISM (C405.2)

1. Define the term crosstalk.(Nov.2018)
Crosstalk is defined as an undesired signal disturbance introduced in a transmission
line (circuit) by mutual electric (capacitive) or magnetic (inductive) field coupling with other
transmission lines (circuits).
2. What is the maximum value of the mutual inductance between two coils?
The mutual inductance has a relationship with the coupling coefficient. The coupling
coefficient is always between 1 and 0, and is a convenient way to specify the relationship
between a certain orientation of inductors with arbitrary inductance:
Mutual Induc tan ce  M  k L1 L2
Where k is the coupling coefficient and 0 ≤ k ≤ 1,
L1 is the inductance of the first coil, and
L2 is the inductance of the second coil.
Maximum value of mutual inductance is M  L1 L2
3. Differentiate cable coupling and power supply coupling.

Cable coupling: Coupling between signal/data cables.
Power supply coupling: Coupling between electrical power transmission line and signal
cable.
4. What is transient coupling? (April/May 2017)

The radiated electromagnetic energy from the lightning discharge, which is
horizontally polarized, is picked up by the electrical power lines and the interfering signals
appears in the form of transient voltages on the electrical power transmission lines. This
transient voltage propagates along the transmission line and affects all equipment and
appliances connected to the electrical power lines.

5. List out the types of coupling between cables.
Inductive coupling, capacitive coupling.
6. What are the various techniques used to eliminate ground loop?(April 2018)
Ground loop can be eliminated by,
- inserting a transformer
- inserting a common mode choke
- inserting an optical isolator
- using a balanced circuit
7. How field coupling affects the systems?

Field coupling leads to cross talk which introduces an undesired signal disturbance.
8. Define common mode interference.

Defined as the unwanted electrical potential differences between any (or all) current
carrying conductors and the reference ground.
9. List the drawbacks of various coupling mechanisms. (Nov/Dec 2016)

Coupling mechanism Drawback
Common mode Devices linked by a common reference conductor are
impedance coupling( affected by intense current variations
conductive coupling)
Capacitive coupling Nearby cables subjected to rapid voltage variations
Inductive coupling Nearby cables subjected to rapid current variations
Radiated coupling Victim’s performance is affected by EMI from source
10. Define differential mode interference.

Defined as the unwanted potential differences between any two current carrying conductors.
11. Define ground loop. What is GLC?

When a system contains two or more pieces of grounded equipment, whether via power-cords
or other ground connections, a “ground loop” may be formed. Electrical coupling through
the loop is referred to as ground loop coupling.
12. Define near field.


Region surrounding the source of radiation at a distance less than is referred to
2
as near field. In the near field, the electric and magnetic fields are considered separately.

13. Define ground coupled interference.
The coupling of EMI through common ground is referred to as ground coupled interference.
14. Define far field.


Region surrounding the source of radiation at a distance greater than is referred
2
to as far field. In the far field, the electric and magnetic fields combine to form a plane wave
with an impedance of 377 ohms.
15. Define surge.

Transients carried by the electrical power lines are called as surge. Surges can be
identified and divided in to the following three categories:
 Transient over voltages ( as a result of lightning, strong radio/radar transmissions from
the equipments located near the power transmission line)
 Sudden increase or decrease in the mains voltage ( caused by the switching ON, or OFF
of a low impedance load)
 Burst of high frequency noise ( due to switching of reactive load)
Transients of the first type are coupled into the power supply lines by way of radiated
electromagnetic fields. Transients of the second and third type are coupled into the power
supply lines both by way of radiated fields and more significantly by direct conduction.
16. List examples for common ground impedance coupling.

CATV system, Un balanced audio interface, Inter connection of recording studio
equipments, Inter connection of laboratory equipments.
17. What do you mean by power mains and power supply coupling?
This involves conducted emission on AC or DC unregulated power mains, where the
emission may be harmonics of 50 Hz, 60 Hz, narrow band signals from intentional emitters,
or broad band energy from pulse-type or transient causing sources. The coupling of EMI
associated with power mains also includes emissions generated by equipment that are
coupled in to the power mains and potentially can interfere with other equipment on the line.
18. Define EFT.

Electrical Fast Transients are a class of EMI which is characterized by a burst of
repetitive and relatively short duration pulses or transients. A typical EFT waveform is shown
in figure. Each burst may have several pulses each of which may be of up to several kilovolts
intensity, with pulse rise time of about 5 ns. The duration of each transient pulse is typically
50 ns.
The EFT type disturbances are generated when inductive-capacitive circuits are
interrupted.

19. What is common impedance coupling?
At the ground point of subsystem 1, V1 has the signals of subsystem 2, I2 coupled to it

by virtue of the nonzero impedance ZG1 shared by both signals. At the ground point for
subsystem 2, V2 has the signals of subsystem 1, I1 imposed on it through ZG1. This
phenomenon is referred to as common-impedance coupling.
20. What are the factors that influence grounding scheme? (Nov/Dec 2016)
 type of circuitry
 frequency of operation
 size of the system
 whether it is self-contained or distributed
 safety
 ESD protections
21. Define LISN? (April/May 2017)(Nov/Dec 2018)

Line Impedance Stabilization Network (LISN) connects power leads of the test
specimen to the power mains by passing only the dc or ac power to the test specimen.
It prevents test specimen’s electromagnetic noise from going back into the power line. At the
same time, it blocks any power main’s RF noise from coupling into the test specimen.
22. What is pigtail effect? (NOV/DEC 2017)
The pigtail connection shown in figure is used to connect the outer conductor of a
coaxial line to a shielded box. Pigtail connections cause the shield current to be concentrated
on one side of the shield and are therefore liable to degrade shielding effectiveness.
An electrically short pigtail does not radiate significantly at low frequencies, but it can
excite external currents on the outside surface of a coaxial line which in turn result in RF
leakage and cross talk. At higher frequencies, the pigtail can be a source of RF leakage.

23. What are the three objectives of signal grounding? (Apr/May 2018)
 Main objective of signal grounding is to provide return path for signal currents.
 Large loop areas increase the radiated emissions of the signal currents flowing around
that loop and hence must be avoided.
 The total loop area consists of the “going down” path and the return path that closes
the loop. We should, minimize the lengths of each path in order to control the radiated
emissions of the common-mode currents on these conductors.
24. What are the ways to prevent interference? (Apr/May 2018)

There are three ways to prevent interference:
1. Suppress the emission at its source.
2. Make the coupling path as inefficient as possible.
3. Make the receptor less susceptible to the emission.
PART B (C405.2)
1. How do cable coupling, near and far coupling of EM fields produced can be reduced?
How to enhance immunity of circuits/equipments and systems?
2. (i)Explain conducted, radiated and common impedance ground coupling with example.
(ii) Discuss about transient coupling.
3. What is Differential mode coupling? How do radiated coupling and transient coupling
vary from DMC?
4. Discuss the impact of radiated common mode and differential mode coupling. Also
explain how the surges on main power supply affect appliances and how it can be avoided
with appropriate design. (Nov/Dec 2016)
5. Explain Common mode, Differential mode and ground loop coupling. (Nov/Dec 2016)
6. Discuss on the sources of transients and their effects in electrical power supply lines
7. (i) Describe the cable related emissions and coupling briefly.
(ii) Demonstrate the common impedance ground couplings with examples.
(Apr/May2017) (Nov/Dec 2018)
8. (i) Explain how common mains supply acts as a frequent source of conducted interference.
(ii)Illustrate the electromagnetic impact of cable coupling in a system design.
(Apr/May 2017)
9. Write short notes on:
(i) Conducted coupling (ii) Near- field coupling (iii) Far field coupling (Nov/Dec 2017)
10. Explain in detail about transient sources and automotive transients. (Nov/Dec 2017)
11. (i) Compare radiated DM coupling and radiated CM coupling.
(ii) Explain the separation of conducted emissions into common and different mode
currents for diagnostic purposes. (Apr/May2018)
12 (i) Write the principle behind EFT and Surge. What are the typical modes of noise
coupling? List the basic elements of EMI situations.
(ii) Explain the relation between ground loops and subsystem decoupling. (Apr/May2018)
13. Explain in detail about radiation coupling and conduction coupling. (Nov/Dec 2018)
14. Discuss in detail how transients affect electronic systems. Explain automotive transients
and its detrimental effects. (Apr/May 2018)

UNIT III: EMI MITIGATION TECHNIQUES (C405.3)
1. What does ‘chemical salting’ mean?
The ground resistance of an electrode may be reduced by the addition of an ion-producing
chemical (such as Potassium Nitrate, Magnesium Sulphate) to the soil immediately
surrounding the electrode. This process is referred to as chemical salting.
2. What is an electrical filter?

An electrical filter is a electrical circuit designed to pass signals in certain frequency
range and attenuate signals of other frequencies.
3. List any four shielding materials.

Mu-metal, Iron, Steel, Copper, Aluminium.
4. What is the role of transient suppressors?

Transient suppressors are used to mitigate interference effects from transient EMI
voltage and current surges. Gas-tube surge suppressors are used in AC power distribution
lines and in telecommunication lines as high energy surge or transient arrestors. These
devices are not suitable for circuit board operation because of their high break down voltages.
Semiconductor transient suppressors (MOVs, Silicon zener diode, Bipolar avalanche
diode) are used in circuit board level applications. In a complex interference situation, hybrid
circuits consisting of gas tubes, MOVs and BADs are used to suppress the high energy
surges, moderate surges and fast rise time spikes respectively.
5. What is the need for shielding? (Nov. /Dec. 2018)

Shielding is the technique that reduces or prevents coupling of undesired radiated
electromagnetic energy into equipment. Shielding enables the equipment to operate
compatibly in its electromagnetic environment. Shielding is provided by putting a metallic
barrier in the path of electromagnetic waves between the culprit emitter and a receptor.
6.What is the need for EMI Gasket?(Nov/Dec 2017)

The leakage of electromagnetic energy at metal-to-metal joints are to be controlled in the
shielded environment. Gaskets are used to reduce the leakage of electromagnetic energy at
metal-to metal joints. Conductive gaskets, provide electrical continuity between seam-mating
surfaces.
Electrical properties of the gaskets are selected to be nearly identical to those of the
shield in order to maintain a high degree of electrical conductivity at the interface, and to
avoid air or high resistance gaps.
7.What is the purpose of EMC grounding?

EMC ground is a zero impedance plane for voltage reference of signals. The purposes of
EMC grounding are,
(i) Realization of the signal, power and electrical safety paths necessary for effective
performance without introducing excessive common mode interference.
(ii) Establishment of a path to divert interference energy existing on external conductors,
or present in the environment, away from susceptible circuits.
8. Classify EMI filters. (Nov/Dec 2016) (Apr/May 2018)

Depending on the frequency range to be suppressed and the function performed, EMI filters
can be classified as:
 Low-pass power line filter: to pass 50Hz/60Hz power line frequency, and attenuate
higher harmonics and RF
 Low-pass telephone line filter: to pass 0-4kHz, and attenuate higher frequencies
 High-pass data line filter: to pass high-frequency components, and attenuate low-
frequency components
 Band pass communication filter: to pass a band of RF frequencies
 Band reject filter: to eliminate the fundamental frequency of the transmitter from
entering into the receiver circuits
9. What is the principle of operation of gas-tube suppressors?

A gas discharge tube can handle very large transient currents (> 10KA) when the tube
is connected between the line and the ground. When transient EMI voltage in a line exceeds
the striking voltage of the gas tube, an arc discharge occurs and the ionized gas produces a
low impedance path from line to ground to shunt surge currents.
10. Differentiate various shielding methods.

Single shield: Single metal sheet.
Multimedia laminated shield: Shield have a number of metal sheets and air gaps. Shielding
effectiveness of multimedia shielding is more.
Isolated double shield: Shield consists of double isolated conducting metal sheets separated
by a inner core made up of dry plywood. Absorption and reflection losses are both double
those of a single sheet.
11. What are the advantages of multipoint grounding?

Multipoint grounding behaves well at high frequencies. At high frequencies, there exist
different potentials at different points on the interconnecting systems which need to be
grounded at multiple points to zero reference potential.
In multipoint grounding scheme, every equipment is heavily bonded to a solid ground
conducting plane which is then earthed for safety purposes.
12. What are the disadvantages of gas-tube surge suppressors?

(i) Its response time is slow and it cannot be used for fast rise-time surges.
(ii) The gas tube remains in a conducting state even after the surge is removed.
13. What is an opto-isolator? (Nov/Dec 2016)

EMI problems are greatly reduced in signal transmission lines when optical isolators are
used for coupling signals in both analog and digital form. A typical opto-isolator is shown in
figure. It consists of a LED and a photo sensitive detector made of a silicon diode and
transistor. Because of very low value of parasitic capacitance Cc, between the LED and
transistor, very good isolation is obtained between the input and output ports. Ground current
loops are also broken. Opto-isolators are ideal for linking computers and control devices.
14. Define shielding effectiveness. (April/May 2017)

Shielding effectiveness is defined as the ratio of powers at the receptor without the
shielding barrier and with the shielding barrier.
Plane wave,
P
shielding effectiveness (dB)  10 log 10 1
P2
P1  power at the receptor without a shielding barrier
P2  power at the receptor with a shielding barrier
E-Field,
E1
shielding effectiveness (dB)  20 log 10
E2
E1  electric field at the receptor without a shielding barrier
E 2  electric field at the receptor with a shielding barrier
H-Field,
H
H2
H 1  magnetic field at the receptor without a shielding barrier
H 2  magnetic field at the receptor with a shielding barrier
15. Define Insertion loss of a filter circuit.

V
Insertion Loss  IL (dB)  20 log10 1
VL
V1  the output voltage of the signal source without the filter being connected
VL  the output voltage of the signal source at the outpu t ter min als of the filter
with the filter in the circuit

16. Give the typical configuration of a combined CM and DM power line filter.
17. Draw the circuit of a telephone line filter.
18. What is cable shield grounding?

A cable shield is needed to prevent the outward emission of electromagnetic waves
from the cable and to protect the signal conductors from external EMI. When a shielded cable
is used for interconnection between two systems or subsystems, the shield must be connected
to a single ground reference at both ends. This is referred to as cable shield grounding.
19. What is shielding? How effective is the shielding for EMI?(NOV/DEC

2017)(Apr/May 2018)
Shielding is the technique that reduces or prevents coupling of undesired radiated
electromagnetic energy into equipment. Shielding enables the equipment to operate
compatibly in its electromagnetic environment. Shielding is provided by putting a
metallic barrier in the path of electromagnetic waves between the culprit emitter and a
receptor.
Shielding effectiveness is defined as the ratio of powers at the receptor without the shielding
barrier and with the shielding barrier.
P
P2
P1  power at the receptor without a shielding barrier
P2  power at the receptor with a shielding barrier

20. What is meant by ‘bulging’ capacitor? (April/May 2017)
Bulging capacitor is a failed capacitor. Bulging capacitor should be removed and
replaced with a new one. Bulging capacitor indicates that a particular area of the board is
getting too hot. Failed capacitor may lead to circuit malfunction.
21. What do you understand from single point ground system? (Nov./ Dec.2018)
A single-point ground system is one in which subsystem ground returns are tied to a single
point within that sub system.
The intent in using a single-point ground system is to prevent currents of two different
subsystems from sharing the same return path and producing common impedance coupling.
PART B(C405.3)
1. How filtering control electro magnetic interference? Explain in detail.

2. Explain about the various types of shielding techniques. (Nov/Dec 2016)
3. Explain various methods of grounding.
4. (i)Using spherical ground electrodes define ground resistance. How does the ground
resistance vary with different soils?
(ii)What are the various precautions taken to reduce ground resistance?
5. Explain any two techniques for determining shielding effectiveness.
6. Filters may be designed with two different types of components. What are they? Discuss
all the techniques for designing filters
7. Explain about the transient and surge suppression devices.
8. Discuss on the grounding strategies for (i) Large systems (ii) Mixed signal systems.
(Nov/Dec 2016)
9. (i) How does an isolation transformer control EMI? Explain shielding and filtering
methods of controlling EMI.
(ii) Explain various methods of grounding with examples. (Apr/May 2017)
10. (i) How does cable routing control EMI? How is signal control achieved?
(ii) Describe the shielding effectiveness of both solid and nonsolid materials including
soil shields and thin film shading. (Apr/May 2017)
11. (i) Describe the strategy used in EMC grounding for large systems.
(ii) Explain the precautions used in earthing. (Nov/Dec 2017)
12. Define filter. With neat diagram, explain in detail about different types of filter.
(Nov/Dec 2017)
13. (i) List the important techniques to control EMI at source point. Explain about the
shielding effectiveness for far field sources.
(ii) Explain the effect of filter elements on common mode and differential mode currents.
(Apr/May 2018)
14. Explain the features of power supply filters. Describe about shielding effectiveness for
near field sources. (Apr/May 2018)
15. (i) Explain how shielding done to prevent magnetic radiation.
(ii) Write short notes on magnetic shielding. (Nov/Dec 2018)
16. Explain in detail about Lumped low pass filters. (Nov/Dec 2018)
17. Explain the principle of grounding. Explain the method of grounding for mixed signal
systems. (Apr/May 2018)
UNIT IV: STANDARDS AND REGULATION (C405.4)

1. What is safety margin in EMC design?
Safety margin is defined as the difference between the susceptibility threshold and the
interference present on a critical test point or signal line.
2. What are Class A devices with reference to FCC?

Class A devices are devices used in a commercial, Industrial or business environment.
3. Differentiate Military standard and Civilian standards.

Military standards:
These standards provide specifications for conducted and radiated emission and
susceptibility limits for military equipments. The specifications vary depending upon the
agency ( army, Navy, Airforce) and the applications ( ship, submarine, aircraft, etc) within
that agency. Various military specifications are generally more stringent than their
commercial counterparts. Eg: MIL-STD-461D
Civilian standards: These standards provide specifications for conducted and radiated
emission and susceptibility limits for non military equipments. Non military equipments are
those intended for use in commercial and business environment and residential environment.
Eg: CISPR/IEC standards, FCC standards, IEEE/ANSI standards, VDE standards.
4. What are the FCC limits for conducted and radiated emissions for class A
equipments? (Nov/Dec 2016)
Frequency range Class A equipment Other than class A
equipment
Conducted emission, dB V
0.45 – 1.705 MHz 60 47.9
1.705 – 30 MHz 69 47.9
Radiated emission dB V /m
30 – 88 MHz 39 40
88 – 216 MHz 43.5 43.5
216 – 960 MHz 46.4 46
Above 960 MHz 49 54
5. Expand the terms CISPR, FCC

CISPR - Comite International Special des Perturbations Radio electrique
FCC - Federal communications Commission

6. Give the IEC/CISPR emission limits for class A and class B devices.
Frequency range Class A equipment Class B equipment
Conducted emission, dB V
Quasi Average Quasi peak Average
peak detector detector detector
detector
0.15 – 0.5 MHz 79 66 66-56 56-46
0.5 – 5.0 MHz 73 60 56 46
5.0 – 30.0 MHz 60 60 60 50
Radiated emission dB V /m
30 – 230 MHz 30(A) 30(B)
230 – 1000 MHz 37(A) 37(B)
(A) – measurement at 30m distance
(B) – measurement at 10m distance
7. Give the immunity limits for pulsed interferences specified by IEC and EN.
Immunity IEC 801 EN 55101
Electrostatic discharge
- contact discharge 8 kV 3 kV
- air discharge 15 kV 8 kV
Electrical Fast Transients
1- 4 kV 1- 4 kV
( 5 ns rise time and 50 ns pulse
( 5 kHz prf) ( 4 kHz prf)
width)
Electrical surges 1- 4 kV 1- 4 kV
(1.2/50  s surges) ( 0.7 – 3 kA) ( 0.7 – 3 kA)
8. Write few parameters of MIL461E/462.

Conducted emission, Radiated emission, Susceptibility to conducted emission,
Susceptibility to radiated emission. Permissible levels of above parameters are given for
military/ Defence equipments and sub systems. Typical Radiated RF Immunity parameters –
Frequency range, field strength, step size, dwell time, modulation.
9. Define Class A digital device.

A digital device that is marketed for use in a commercial, industrial or business
environment, exclusive of a device which is marketed for use by the general public or is
intended to be used in the home.
10. List some of the standard setting organizations for EMI/EMC.

Organization Name Country
Institute of Electrical and Electronics
IEEE/ANSI Engineers/American National United States of America
Standards Institution
Comite International Special des Europe and non European
Perturbations Radioelectrique/ nations such as Australia,
CISPR/IEC
International Electrotechnical Canada, India, Japan, Korea
Commission and United States
FCC Federal communications Commission United States of America
VDE Verband Deutscher Elektrotechniker Germany
BSI British Standards Institution United Kingdom
EN Euro Norms Europe
Voluntary Control Council for
VCCI Japan
Interference
11. What are the different categories of standards?

(i) Basic Standards
(ii)Generic Standards
(iii)Product Standards
12. What is ‘Basic Standards’ in EMC?

Basic EMC Standards give the general and fundamental conditions or rules for the
assessment of EMC and related performance of all products, systems or installations, and
serve as reference documents for Generic and Product Standards.
Basic Standards are general and hence are not dedicated to specific product families
or products; they relate to general information, to the disturbing phenomena and to the
measurement or testing techniques. They do not contain any prescribed limits or any
product/system related performance specifications.
13. What is ‘Generic Standards’ in EMC?

Generic EMC Standards are Standards related to a particular environment, which
specify the minimum set of essential EMC requirements and test procedures, applicable to all
the products or systems intended for operation in this environment, provided there do not
exist any specific EMC Standards for a particular product family, product, system or
installation. Limits are included, and reference is made to the test procedures.
14. Give any two BSI published Standard. (NOV/DEC 2018)
BS 4727, BS 5406
15.What is ‘Product Standards’ in EMC?

Product Standards define specific EMC requirements, test procedures and limits
dedicated to particular products, systems or installations for which specific conditions must
be considered.
16. What is the objective of Generic standards- Emission standard for industrial
Environment?
The objective of this standard is to define the emission test requirements for apparatus
defined in the scope in relation to continuous and transient conducted and radiated defined
disturbances.
The emission requirements have been selected so as to ensure that disturbances
generated by apparatus operating normally in industrial locations do not exceed a level that
could prevent other apparatus from operating as intended. Fault conditions of apparatus are
not taken into account.
17. Define Class B digital device.

A digital device that is marketed for use in a residential environment not withstanding
use in commercial, business and industrial environments. Examples of such devices include,

but are not limited to, personal computers, calculators, and similar electronic devices that are
marketed for use by the general public.
18.What is the objective of Generic standards- Emission standard for residential,

commercial and light industrial environment?
The objective of this standard is to define the emission test requirements for apparatus
defined in the scope in relation to continuous and transient, conducted and radiated
disturbances.
The emission requirements have been selected so as to ensure that disturbances
generated by apparatus operating normally in residential, commercial and light-industrial
locations do not exceed a level which could prevent other apparatus from operating as
intended. Fault conditions of apparatus are not taken into account.
19.Give the FCC/CISPR conducted emission limits for class A digital devices.
20. What is the purpose of EMC standards? (Nov/Dec 2016)

These EMC regulatory standards are set by the appropriate government agency and are
imposed in order to control the amount of electromagnetic interference in the environment.
The EMC standards that a particular electronic product must meet depend on the product
application (commercial or military) and the country in which the product is to be used.
Manufacturers commonly impose EMC requirements that are even more stringent than
the government standards given a product that must operate in the vicinity of some other
sensitive equipment (emissions), or a product that must operate in a particularly harsh
environment (susceptibility).
21.Give the FCC/CISPR conducted emission limits for class B digital devices.

22. Analyze the key for conducted emission (CE) EMC standards. (April/May 2017)
Limitation on the noise current conducted out through the AC power chord of the
product is specified in the CE EMC standards.
For Eg: IEC/CISPR specifies the following restrictions for class A equipment for the
frequency range 0.5-5.0MHz.
73 dBµV – Quasi peak detector measurement
60 dBµV – Average detector measurement
23. Interpret the need for EMI standards. (April/May 2017)

EMI regulatory standards are set by the appropriate government agency and are
imposed in order to control the amount of electromagnetic interference in the environment.
The standards that a particular electronic product must meet depend on the product
application and the country in which the product is to be used.
24. What are product standards? Give an example. (NOV/DEC 2017)

 Product standards describe the characteristics of goods or services, in particular with
respect to aspects such as quality, safety, and fitness for purpose.
 A simple example of a product standard is the limit, set by the U.S. Food and Drug
Administration (FDA), of one part per million of methyl mercury (a potential toxin) in
fish marketed for human consumption
25. List out the advantages of EMC standards. (NOV/DEC 2017)

 Compliance with Electro Magnetic Compatibility (EMC) standards is required by
national laws and demanded by industries and consumers.
 EMC tests the ability of devices to withstand interference from other electrical or
electronic equipment and environments and verify that its emission cannot cause
harmful interference with other electrical or electronic equipment.
26. What are the classes of EMC requirements imposed on electronic systems?
(Apr/May 2018)
There are basically two classes of EMC requirements that are imposed on electronic systems:
1. Those mandated by governmental agencies
2. Those imposed by the product manufacturer
The requirements imposed by governmental agencies are legal requirements and
generally cannot be waived. These requirements are imposed in order to minimize the
interference produced by the product.
EMC requirements that manufacturers voluntarily impose on their products are
intended to result in customer satisfaction. They are imposed for the purpose of ensuring a
reliable, quality product.
Compliance with both of these EMC requirements is critical to the success of the
product in the marketplace.
27. List the three objectives of EMI standards. (Apr/May 2018)

Objective of EMI standard is to provide information about the following:
 Definitions and terminology
 Test and measurement procedures
 Design guidelines
 Performance limits for RE, CE, RS, CS
This aid the manufacturer, the user and others who are likely to be affected by EMI.
28. Point out the parameters that involves in testing and evaluation of EMI and EMC?
(NOV/DEC 2018)
The test and evaluation for Electromagnetic Interfernce(EMI) and Electromagnetic
Compatibility(EMC) involves measurements and compliance relating to
 Conducted Emission(CE)
 Radiated Emission(RE)
 Susceptibility/Immunity to Conducted emission ( CS)
 Susceptibility/Immunity to Radiated emission ( RS)
PART B (C405.4)
1. Discuss in detail the specifications for emissions and susceptibility given in MIL-STD-
461E. (Nov/Dec 2016)
2. Why do the standards vary with reference to civilian and military applications? What are
the various standards for civilian applications? Discuss them in detail.
3. Discuss in detail on the FCC regulations for class A and class B devices.
4. Explain the civilian standards FCC, CISPR and IEC in detail. (Nov/Dec 2016)
5. (i) What is the need for EMI standards? Explain. (ii)Discuss briefly on FCC regulations.
6. What is the purpose of EMI standards and give different types of standards followed in
different countries.
7. Write notes on the following standards: (i) BSI (ii) AS/NZS
8. Discuss in detail the specifications for emissions and susceptibility given in ANSI.
9. Summarize FCC and CISPR conducted and Radiated Emission standards. (Apr/May
2017)
10. Write short notes on
(i) BSI (ii) CENELEC (Apr/May 2017)
11. Briefly explain the following standards:
(i) CISPR (ii) CENELEC (Nov/Dec 2017)
12 .Explain in detail about the CE, CS, RE, RS limits in military standards. (Nov/Dec 2017)
13. Explain the measurement of radiated and conducted emission for verification of
compliance. (Apr/May 2018)
14. (i) List out the emission and susceptibility requirements of MIL-STD-461E.
(ii) List the requirements for commercial products marketed in the United States.
(Apr/May 2018)
15. Explain in detail about various military standards. (Nov/Dec 2018)
16. Explain VDE and Euro norms for EMI/EMC. (Nov/Dec 2018)
UNIT V: EMI TEST METHODS AND INSTRUMENTATION (C405.5)
1. Why is shielded chamber needed for EMI testing? (Nov/Dec 2016)

It is not always convenient or possible to use OATS for EMI testing. OATS need to
be relatively free from the presence of strong electromagnetic signals (man made and natural
interferences) and it is to be ensured that it is free from electromagnetic scatterers. These

conditions are almost never present in a practical situation and selection and preparation of
OATS require utmost care.
Shielded chambers which are exclusively designed for the purpose of EMI testing
provides indoor facility for measurements. Shielded chambers provide good isolation from
the external electromagnetic environment and are alternative to the OATS.
2. List detectors used in EMI testing

 Noise figure meter
 CRO
 Spectrum analyzer
 Peak detector /Qausi Peak detector
3. List the possible errors in EMI testing in OATS.

The primary sources of error in testing in OATS:
 site imperfections, terrain undulations,
 inaccuracies in antenna characterization
 direct coupling of electromagnetic energy between the EUT and the antenna
 calibration inaccuracies of test instruments
4. List the possible errors in EMI testing in shielded chamber.

The primary sources of error in testing in shielded chamber:
 reflections from the chamber walls that distort the field
 cable losses between the transmitter/receiver and the antenna
 inaccuracies in precisely estimating the distance and antenna factor
 In TEM cell and GTEM cell, the electric filed is altered when EUT is placed inside the
cell. This give rise to change in electrical characteristics of the cell and give rise to higher
order modes.
5. Why are EMI measurements normally performed in open area test sites?
EMI measurements are normally performed in OATS. In a carefully prepared open area
test sites, there will not be scattering and reflection of signals. If these measurements are done
in a room or in an enclosed area, there may be reflections or scattering of signals from walls,
floor and ceiling which may give rise to error in test results.
6. What are the advantages of loop antenna?

 simple structure, low cost
 Highly directional antenna
7. What are the drawbacks of OATS?

 OATS need to be relatively free from the presence of strong electromagnetic signals
(man made and natural interferences) and it is to be ensured that it is free from
electromagnetic scatterers (buildings, trees, fences, terrain undulations, electric
transmission lines). These conditions are almost never present in a practical situation and
selection and preparation of OATS require utmost care.
 The OATS requires a large obstruction free site and this will increase the cost of the
facility.
 Weather protection is required.

 OATS require the use of exactly calibrated antennas and precision error-free
performance measurement equipments.
8. Define Normalized site attenuation.

Normalized site attenuation is defined as, site attenuation divided by the antenna factor
of the receiving antenna. Antenna factor is the quantity relating the strength of the field in
which the antenna is immersed to the output voltage across the load connected to the antenna.
9. What is LISN? Draw the circuit diagram of a typical LISN.(April 2018)

It prevents test specimen’s electromagnetic noise from going back into the power line.
At the same time, it blocks any power main’s RF noise from coupling into the test specimen.
10. Define the term ‘site attenuation’ with reference to OATS.

The ratio of the power input to a matched balanced lossless tuned dipole radiator to
that at the output of a similarly balanced matched lossless tuned dipole receiving antenna for
specified polarization, separation, and heights above a flat reflecting surface.
power input to a matched lossless tuned dipole radiator

site attenuation 
power output at the matched lossless tuned receiving antenna
for the specified polarization, separation and heights above a flat reflecting surface.
11. List some commonly used test antenna and the useful frequency range for each.
(Nov/Dec 2016)
Test antenna Frequency range MHz
Rod antenna 0.01-30
Loop antenna 0.01-30
Biconical antenna 30-220
Dipole antenna 30-1000
Log periodic antenna 200-1000
Conical log spiral 200-10,000
Double edged waveguide 1000-18000
Waveguide horn Above 1000

12. What are the precautions to be taken for power and cable connections in OATS?
(i)The electrical power connections to the EUT and the cables between the transmit/
receive antenna and the equipments are to be placed in the underground trenches.
(ii) The power leads used to energize the EUT, Transmitter and Receiver should pass
through EMI filters to eliminate conducted interferences carried by the power lines.
13. What are the factors to be considered for OATS?

 OATS need to be relatively free from the presence of strong EM signals as those from
broadcast radio or TV transmitters and man-made EM radiations such as those from
automobile ignition system or arc-welding.
 It is to be ensured that the OATS is free from EM scatterers such as buildings, electric
transmission lines, trees, fences, terrain undulations.
 The antennas used in the measurements should be precisely calibrated.
 The instruments used must also be precisely calibrated in order to minimize or limit
instrumentation measurement errors.
Weather protection is to be provided for equipments used in the measurement setup
14. List the commonly used radiated interference measurement facilities and the useful
frequency range of each.
Microwave anechoic chamber- above few hundred MHz
TEM cell- up to few hundred MHz
GTEM Cell – Wide frequency range Up to GHz
15. What is a spectrum analyzer?

Spectrum analyzers are equipments that display the magnitude spectrum of applied input
signals. They are used in EMI test set up for measuring and analysing signals.
16. What is the important feature of feed through capacitor?

 High resonant frequency( Available with a resonant frequency above 1 GHz)
 Low inherent lead inductance
17. What is a current probe?

A current probe is an apparatus for sensing and measuring EMI noise currents. The
current probe fits around a current carrying conductor and measures noise current in the line.
The current probe is usually placed between the EUT and the LISN.
18. What is the purpose of radiation susceptibility testing?

The purpose of radiation susceptibility testing is to determine the degradation in
equipment performance caused by externally coupled electromagnetic energy. The
permissible limits to such degradation are normally specified by the user.
19. Give out the need for feed through capacitors. (NOV/DEC 2017)
Feed through capacitors are used for filtering EMI in high frequency applications. Feed
through capacitors are available with resonant frequency well above 1 GHz. Feed through
capacitors are three terminal capacitors designed to reduce inherent lead inductance.

20. Define antenna factor.
When the radiated emissions of a UT are measured with an antenna (biconical, log-periodic,
etc.), the electric field incident on the measurement antenna produces a voltage at the antenna
terminals which is fed to a spectrum analyzer through a transmission line (coaxial cable). The
ratio of the incident electric field at the antenna to the voltage received at the antenna
terminals is defined as the antenna factor (af).
21. Illustrate the significance of narrow band testing. (April/May 2017)

During EMC testing, differentiating between narrowband and broad band
disturbances is essential for identifying the source of noise, so that appropriate corrective
action can be taken.
A narrow band EMI has a bandwidth less than or equal to that of a particular
measuring apparatus.
22. Give the list of antennas used for microwave frequencies. (April/May 2017)
 Micro strip patch antenna
 Horn antenna
 Parabolic antenna
 Plasma antenna
23. Write down the advantages of OAT. (NOV/DEC 2017)

 No multiple reflections
 Cheap investment
 Easy to construct
 No frequency limitation
24. Why are shielding problems difficult to handle? (April/May 2018)

Shielding problems are difficult to handle since perfect shielding integrity is not possible
because of the presence of intentional discontinuities in shielding walls such as shielding
panel joints, ventilation holes, visual access windows or switches.
25. Write the purposes of LISN. (Apr/May 2018)

specimen to the power mains by passing only the dc or ac power to the test specimen. It
prevents test specimen’s electromagnetic noise from going back into the power line. At the

26. Write the advantages of Anechoic Chamber, in EMI measurements. (Nov/Dec 2018)
 Anechoic chambers provide an indoor facility for measurements. They also provide
high isolation, often in excess of 100 dB, from the external electromagnetic
environment.
 Anechoic chambers are particularly suitable for highly sensitive measurements
involving very low signal levels.
 Because of the properties of this absorber lining, the chamber walls provide higher
power absorption capabilities at higher frequencies and lesser absorption at lower
frequencies. Use of microwave anechoic chambers for EMI/EMC measurements is
limited to frequencies above about 200MHz.
 Anechoic chambers usually have a door to facilitate the taking-in and setting-up, or
bringing out, the EUT and antennas and other accessories used in the measurement.
 The door is a carefully designed unit with firm metallic spring contacts on all sides
for providing good isolation between the electromagnetic environments outside and
inside of the chamber.
27. Write the purposes of LISN. (Apr/May 2018)

It prevents test specimen’s electromagnetic noise from going back into the power line. At the
28. A log periodic antenna is to be used from 500MHz to 10GHz. Determine the length
of the shortest and longest terminals. (Nov/Dec 2018)
λmax = C/fmin =3x 108/500x106=0.6m
λmin = C/fmax =3x 108/109= 0.3m
Lmin = λmin/2 = 0.15m
Lmax==λmax/2 = 0.3m
PART B (C405.5)
1. Explain the measurement procedure for RE using OATS.
2. Give a detailed account on anechoic chamber used for EMI measurement and explain the
procedure for RE and RS measurement. (Nov/Dec 2016)
3. Explain the various EMI test instruments and EFT test bed.
4. What do you mean by open area test site and explain how radiation susceptibility
measurements are done?
5. Write notes on: (i) Current probes (ii) Feed through capacitor (iii) LISN
6. Give a detailed account on EMI test receivers and EMI test wave simulators. (Nov/Dec
2016)
7. With neat diagram, explain the super-heterodyne spectrum analyzer. (Apr/May 2017)
8. Define EMI test receiver. Explain. List out the key features used to design EMI test
receiver. (Apr/May 2017)
9. Describe about the open area test site measurements. What are its limitations? Outline the
characteristics of open area test site.(Nov/Dec 2017)
10. (i) Formulate the various EMI Test Instruments
(ii)Develop a test bed for EFT. (Nov/Dec 2017)
11. Explain the application of spectrum analyzer in EMI/EMC area. Distinguish between
intentional antennas and unintentional antennas. (April/May 2018)
12. (i) Write the purpose and methodology for EMC system.
(ii) Explain the significance of shielding effectiveness tests. Write the application of
current probes. (April/May 2018)
13. What do you understand from TEM cell? Discuss any one measurement using TEM cell.
(Nov/Dec 2018)
14. Write notes on Broadband measurement antennas.
(i) The Biconical antenna
(ii) Log Periodic antenna (Nov/Dec 2018)

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EC6011- Electromagnetic Interference and Compatibility Department of ECE 2019-2020

EC6011 ELECTRO MAGNETIC INTERFERENCE AND COMPATIBILITY LTPC3 0 03

UNIT II COUPLING MECHANISM 9

UNIT V EMI TEST METHODS AND INSTRUMENTATION 9

RELATION BETWEEN COURSE CONTENT WITH COs

4. U Sources and Victims of EMI C405.1

2. U Coupling via the supply network

3. U,An Common mode coupling

4. U,An Differential mode coupling C405.2

UNIT III EMI MITIGATION TECHNIQUES

2. U,An,Ap LF Magnetic shielding

Apertures and shielding effectiveness, Choice of Materials for H, E,

4. U,Ap Gasketting and sealing C405.3

6. U,An,Ap Principle of Grounding, Isolated grounds

9. U,An,Ap Surge protection devices, Transient protection

U,An,Ap,R National and International EMI Standardizing Organizations;

St.Joseph’s college of Engineering/ St.Joseph’s Institute of Technology 3

2. U,Ap Open field test, TEM cell for immunity test

3. U,Ap Shielded chamber , Shielded anechoic chamber

4. U,Ap EMI test receivers, Spectrum analyzer

5. U,Ap EMI test wave simulators, EMI coupling networks C405.5

8. U,Ap MIL - STD test methods, Civilian STD test methods

UNIT I: BASIC THEORY (C405.1)

2. List different types of EMI sources.

4. Why electromagnetic interference must be under control?

St.Joseph’s college of Engineering/ St.Joseph’s Institute of Technology 4

7. What are the functional (Intentional) sources of radiated interference?

8. Draw an equivalent circuit model for electrostatic discharge.

9. Give the units for radiated emission and radiation susceptibility.

10. What is the biological effect of EMI?

11. What is narrow band radio noise?

12. How do electrostatic discharges occur?

13. List some materials that exhibit electrostatic discharge.

14. What is meant by electromagnetic compatibility?(Nov.2018)(April/May 2018)

15. List four EMI mitigation techniques.

16. Sketch the waveforms of pulsed EMI.

(a) ESD (b) EFT (c) Surge

17. Define : Susceptibility with respect to EMI/EMC. (NOV/DEC 2017)

18. What is radio frequency interference?

19. How many types of EMI exist?

20. What are the three ways to prevent EMI?

21. Why EMI is a vital problem? (April/May 2017)

22. List the testing strategies in EMC. (April/May 2017)

23. What are the harmful effects of EMI? (Nov/Dec 2017)

St.Joseph’s college of Engineering/ St.Joseph’s Institute of Technology 7

UNIT II: COUPLING MECHANISM (C405.2)

3. Differentiate cable coupling and power supply coupling.

4. What is transient coupling? (April/May 2017)

St.Joseph’s college of Engineering/ St.Joseph’s Institute of Technology 8

7. How field coupling affects the systems?

8. Define common mode interference.

9. List the drawbacks of various coupling mechanisms. (Nov/Dec 2016)

10. Define differential mode interference.

11. Define ground loop. What is GLC?

12. Define near field.

St.Joseph’s college of Engineering/ St.Joseph’s Institute of Technology 9

14. Define far field.

15. Define surge.

16. List examples for common ground impedance coupling.

18. Define EFT.

St.Joseph’s college of Engineering/ St.Joseph’s Institute of Technology 10

At the ground point of subsystem 1, V1 has the signals of subsystem 2, I2 coupled to it