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Material Gr. : API 5L Gr. X70- PSL2 Welding Process: : Film Type :
Designation
Developing Darkroom
Source : Internal X - Ray /External - Ray / Gamma Ray : : degree celcious
Time Temp
Sensitivity : Less than Lead Screens Accept.
Film Density : 2-3.5 : : API 1104 Latest Edition and EIL Spec.
and equal to 2 % Thk F………..B…………. Criteria
Required wire : Visible wire :
Welder no. FOR NDT FOR FOR
Sr.No KM/ Joint No Segment Observation Remarks
R/H Filler C AGENCY KPTL EIL/GAIL
Legends : ACC - Accepted, REP-Repair, RS-Reshoot, RT- Retake, C/O- Cut Out, GRS- Grind & Reshoot, CRS-Clean & Reshoot, CS -Check Surface, FM -Film mark, LD-Low Density, HD-High Density, EU-External Under cut, IU:
Internal Root Under Cut,P-Porosity, CP-Cluster Porosity, HB-Hollow Bead, SI-Slag Inclusion, ESI-Elongated Slag Inclusion, BT-Burn Through, IP-Inadequate penetration, IPD-Inadequate penetration due to high-low, ICP-
Inadequate Cross penetration, IF-Incomplete Fusion, IFD-Incomplete Fusion due to Cold Lap, IC-Internal Concavity,C/S-Check Shot