A MINI PROJECT REPORT

ON
DESIGN & FABRICATION OF
MINI COMPRESSOR LESS PELTIER
REFRIGERATOR
 Submitted to

ADITYA COLLEGE OF ENGINEERING & TECHNOLOGY

DEPARTMENT OF MECHANICAL ENGINEERING
Surampalem, Peddapuram

Submitted by Under the guidance of

L.ENOCH TEJ (15P31A0318) Ms.CH.SIVA JYOTHI (M.Tech)
S.SRIDHAR (15P31A0350) (Assistant professor)

ADITYA COLLEGE OF ENGINEERING & TECHNOLOGY

Surampalem, Peddapuram.
 CERTIFICATE
This is to certify that the project entitled, “DESIGN &
FABRICATION OF MINI COMPRESSOR LESS PELTIER
REFRIGERATOR” is being submitted by L.ENOCH TEJ
(15P31A0318) S.SRIDHAR (15P31A0350).
In partial fulfillment for the degree of B.Tech in MECHANICAL
ENGINEERING, ACET, Peddapuram, Affiliated to JNTUK, is record
of bonafide work carried by them under our supervision.
Ms. Siva jyothi T.S.S.Sagar
(Assistant professor) (HOD, Mechanical)
 ACKNOWLEDGEMENT
It is with the sense of great satisfaction and pride that we are sitting
down to pen our project report. On this day, we stand indebted to
Miss.CH.SIVA JYOTHI, Assistant professor at Aditya college of
Engineering & Technology, surampalem, peddapuram for her valuable
advices, guidance and suggestions through our project work which
played a vital role in carrying out this project successfully. We are also
thankful for her cooperation and help for successful completion of this
project.
We are profoundly thankful to Mr. T.S.S.Sagar (HOD) and all the
staff members of Mechanical Department of ACET, for their constant
encouragement in carrying out our project work.
 DECLARATION
We hereby declare the results embodied in this dissertation titled
“DESIGN AND FABRICATION OF MINI COMPRESSOR LESS
PELTIER REFRIGERATOR”.
 ABSTRACT
Peltiers allow for instant cooling using electricity at lower costs.
So here we propose a mini can cooler fridge that can cool cold drink
cans easily. Our system uses peltier, along with heat sink, power supply
and insulation with outer frame to achieve this system. We develop a
customized casing to ensure we get peltier cooling can on the inside
while the heatsink and fan throw the generated heat outside. We use
insulation to achieve as much thermal insulation as possible. A power
supply circuit is used to supply power to the peltier. Thus we develop a
mini can cooling fridge using a peltier.
 TABLE OF CONTENTS
TITLE
 INTRODUCTION
 THEORY OF PELTIER
 Peltier History
 Peltier Structure
 Peltier theory
 Why use TE coolers
 Disadvantages
 Applications
 Basic principles
 Semiconductor P & N type Doping
 Thermoelectric materials
 Condensation
 TE performance
 MATERIALS USED
 CONSTRUCTION & DESIGN
 WORKING OF FRIDGE
 COST ANALYSIS
 CONCLUSION
 INTRODUCTION
Conventional cooling systems such as those used in refrigerators
utilize a compressor and a working fluid to transfer heat. Thermal
energy is absorbed and released as the working fluid undergoes
expansion and compression and changes phase from liquid to vapor and
back, respectively. Semiconductor thermoelectric coolers (also known as
peltier coolers) offer several advantages over conventional systems.
They are entirely solid state devices, with no moving parts; this
makes them rugged, reliable and quite. They use no ozone depleting
chlorofluorocarbons, potentially offering a more environmentally
responsible alternative to conventional refrigeration. They can be
compact, much more so then compressor based systems. Precise
temperature control(<±0.1 0C) can be achieved with peltier coolers.
However, their efficiency is low compared to conventional refrigerators.
Thus, they are used in niche applications where their unique advantages
outweigh their low efficiency. Although some large scale applications
have been considered (on submarines and surface vessels), peltier
coolers are generally used in applications where small size is needed and
the cooling demands are not too great, such as for cooling electronic
components.
The objectives of this study is to design and develop a working
thermo electric refrigerator interior cooling volume of 5L that utilizes
the peltier effect to refrigerate and maintain a selected temperature from
50C to 250C. The design requirements are to cool this volume to
temperature with in a time period of 6 hours and provide retention of at
least next half an hour. The design requirement, options available and
the final design of thermo electric refrigerator for applications are
presented.
 BASIC THEORY OF PELTIER DEVICE
Peltier History:
Early 19th century scientists, Thomas See beck and Jean Peltier,
first discovered the phenomena that are the basis for found that if you
placed a temperature gradient across the junctions of two dissimilar
conductors, electrical current would flow. Peltier, on the other hand,
learned that passing current through two dissimilar electrical conductors,
caused heat to be either emitted or absorbed at the junction of the
materials. It was only after mid-20th century advancements in
semiconductor technology, however, that practical applications for
thermoelectric devices became feasible. With modern techniques, we
can now produce thermos electric efficient solid state heat-pumping for
both cooling and heating; many of these units can also be used to
generate DC power at reduced efficiency. New and often elegant uses
for thermo-electrics continue to be developed each day.

Peltier Structure
A typical thermoelectric module consists of an array of Bismuth
Telluride semiconductor pellets that have been carrier either positive or
negative carriers the majority of current. The pairs of P/N pellets are
configured so that they are connected electrically in series, but thermally
in parallel. Metalized ceramic substrates provide the platform for the
pellets and the small conductive tabs that connect them.
Peltier Theory
When DC voltage is applied to the module, the positive and
negative charge carriers in the pellet array absorb heat energy from one
substrate at the opposite side. The surface where heat energy is absorbed
becomes cold; the opposite surface where heat energy is released
becomes hot. Reversing the polarity will result in Reversed hot and cold
sides

Why is TE Coolers Used for Cooling?

 No moving parts make them very reliable; approximately 105
hours of operation at 100 degrees Celsius, longer for lower temps
(Goldsmid, 1986).
 Ideal when precise temperature control is required.
 Ability to lower temperature below ambient.
 Heat transport controlled by current input.
 Able to operate in any orientation.
 Compact sizes make them useful for applications where size or
weight is a constraint.
 Ability to alternate between heating and cooling.
 Excellent cooling alternative to vapor compression coolers for
systems that are sensitive to mechanical vibration.
DISADVANTAGES
 Able to dissipate limited amount of heat flux.
 Less efficient then VCR system.
 Relegated to low heat flux applications.
 More total heat to remove than without a TEC
Qremoved=Qchip+WTEC

Which Industries Use TEC Cooling

 Electronic
 Medical
 Aerospace
 Telecommunications

What are Some Applications?

 Electronic enclosures
 Laser diodes
 Laboratory instruments
 Temperature baths
 Refrigerators
 Telecommunications equipment
 Temperature control in missiles and space systems
 Heat transport ranges vary from a few mill watts to several
thousand watts, however, since the efficiency of TE devices are
low, smaller heat transfer applications are more practical.

Basic Principles
When a P type semiconductor (doped with holes) Is used
instead, the holes move in a direction opposite the current flow.
The heat is also transported in a direction opposite the current
flow and in the direction of the holes. Essentially, the charge
carriers dictate the direction of heat flow.
Semiconductor Doping: N Type
N doped semiconductors have an abundant number of extra
electrons to use as charge carriers. Normally, a Group IV material
(like Si) with 4 covalent bonds (4 valence electrons) is bonded with 4
other Si. To produce an N type semiconductor, Si material is doped with
a Group V metal (P or AS) having 5 valence electrons, so that an
additional electron on the Group V metal is free to move and are the
charge carriers.
Semiconductor Doping: P Type
For P type semiconductors, the dopants are Group III (In, B) which
have 3 valence electrons, these materials need an extra electron for
bonding which creates “holes”. P doped semiconductors are positive
charge carriers. There’s an appearance that a hole is moving when there
is a current applied because an electron moves to fill a hole, creating a
new hole where the electron was originally. Holes and electrons move in
opposite directions.
THERMOELECTRIC MATERIAL
Semiconductors are the optimum choice of material to sandwich
between two metal conductors (copper) because of the ability to control
the semiconductors charge carriers, as well as, increase the heat
pumping ability

The most commonly used semiconductor for electronics cooling

applications is Bi2Te3 because of its relatively high figure of merit.
However, the performance of this material is still relatively low and
alternate materials are being investigated with possibly better
performance.
Alternative materials include:
 Alternating thin film layers of Sb2Te3 and Bi2Te3.
 Lead telluride and its alloys
 SiGe.
 Materials based on nanotechnology.
 A plot of various p-type semiconductor figures of merit times
temperature vs. temperature are shown. Within the temperature ranges
concerned in electronics cooling (0-2000C) Bi2Te3 performs the best.
Condensation
A common problem with TE cooling is that condensation may
occur causing corrosion and eroding the TE’s inherent reliability.
Condensation occurs when the dew point is reached. The dew
point is the temperature to which air must be cooled at constant pressure
for the water vapor to start to condense Condensation occurs because the
air loses the ability to carry the water vapor that condensed. As the air’s
temperature decreases its water vapor carrying capacity decreases.
Since TE coolers can cool to low and even below ambient
temperatures, condensation is a problem. The most common sealant
employed is silicon rubber. Research has been performed to determine
the most effective sealing agent used to protect the chip from water.
Four sealants were used to seal a TE cooling device and the weight gain
due to water entering the device measured. The best sealants should
have the lowest weight gain. The epoxy has virtually no weight Gain
 According to the previous results, it seems that the epoxy is the
vest sealant. These results are verified by the published permeability
data showing the epoxy having the lowest permeability (vapor
transmission rate) of all the sealants.

PUBLISHED PERMEABILITY DATA

Vapor transmission rate

Type g.mm/m2.day

Acrylic Not listed

Epoxy 0.7-0.94

Polyurethane 0.94-3.43

Silicone Rubber 1.73-3.11

Thermoelectric Performance
 TE performance depends on the following factors:
 The temperature of the cold and hot sides.
 Thermal and electrical conductivities of the device’s
materials.
 Contact resistance between the TE device and heat
source/heat sink.
 Thermal resistance of the heat sink.
Coefficient of Performance
A typical AC unit has a COP of approximately 3. TE coolers
usually have COP’s below 1; 0.4 to 0.7 is a typical range.
Below are COP values plotted versus the ratio of input current to
the module’s Imax specification. Each line corresponds with a constant
DT/DTmax (the ratio of the required temperature difference to the
module’s max temperature difference specification).
 MATERIALS USED
12V –BATTERY
Peltier device is powered by 12v battery.
An electric battery is a device consisting of two or more electrochemical
cells that convert stored chemical energy into electrical energy. Each cell
has a positive terminal, or cathode and a negative terminal, or anode.
The terminal marked positive is at a higher electrical potential energy
than the terminal marked negative. The terminal which is marked
negative is the source of electrons that when connected to an external
circuit will flow and deliver energy to an external device.
HEAT SINK
HEATSINK is a passive heat exchanger that tranfers the heat
generated by an electronic or a mechanical device into a coolant fluid in
motion. Then transferred heat leaves the device with the fluid in motion,
therefore allowing the regulation of the device temperature at physically
feasible levels. The heat sink used in this fridge is of the dimension
8cmX8cmX1.8cm (LxBxH).
COOLER FANS
In this we use pc fans for the temperature transfer purpose i.e.., we
use it for active cooling and may refer to the fans that draw cooler air
into the case or move air across a heat sink to cool a particular
component. Generally these are found in axial and sometimes
centrifugal forms. The former is sometimes called a “electric” fan, after
the Rotron Vertical line, while the latter maybe called a “biscuit blower”
in some product literature.
Insulation Material
As we know the ice vendors take advantage of thermocol for its
economic value and good insulation property as it does not allow the
inner temperature of cooling medium to go down. Hence it is also an
economic source of insulation. So the whole refrigerator is made of
thermocol.
 Construction and Design
Dimensions of the Fridge

1. Outer dimensions
 Length 180mm
 Breadth 215mm
 Height 230mm

2. Inner dimensions
 Length 140mm
 Breadth 175mm
 Height 195mm

3. Volume of the Fridge 4777500mm3

4. Dimensions of peltier 40mm × 40mm × 2mm

STEPS IN THE CONSTRUCTION OF FRIDGE

 Firstly make a box of thermocol with the required dimensions as

mentioned above.
 The thermocol box is mounted with the peltier device at the top
and bottom with the help of thermal paste.
 The heat side of the peltier is placed outside of the thermocol box.
 The cold side of the peltier is placed inside the thermocol box.
 Heat sinks are attached to both the sides of the peltier to absorb
and release temperature.
 Both the heat sinks are attached to pc fans which are used for flow
of temperatures.
 A battery is placed outside the thermocol box which is used as
energy source and is connected with proper insulation.
 The terminals of the peltier device and pc fans should be connected
properly.

.
 WORKING OF THE PROJECT
Fridge
 The fridge is provided power supply from a 12 volt DC battery.
 Turn on the switch to start the fridge.
 When the switch is turned on the peltier device and pc fans
starts functioning.
 Then the peltier will start cooling on one and release heat on
other side.
 So, the heat sinks absorb the heat from hot side of peltier and
absorb cool from cold side of the peltier.
 Then the pc fans are used for flow of temperatures respective
to their sides.
 The peltier thermoelectric device will be arranged in a box
with proper insulation system and heat sink, so that the
efficient cooling takes place at all the time.
 When all the work is done we can turn it off using switch.
 COST ANALYSIS
The cost analysis for this project is done as follows. All the components
along with the miscellaneous cost are included in the total cost of the
fridge.

S.NO Name of the material/Equipment Cost Rs.

1. Peltier device-1 400/-
2. Thermocol box 200/-
3. Battery 12v 600/-

4. PC Fans along with heat sinks-2 1500/-

5. Thermal paste 80/-

Total Cost Rs.2780/-

The cost analysis shows that the overall cost of the project strikes
Rs.2780/-
 CONCLUSION
During construction of the device several minor changes were made to
the design. Each of these changes we feel was justified as they made for
easier construction while maintaining the performance of the device with
respect to the project goals. The device passed its final inspection and
was deemed to have a professional appearance by the design project
coordinator.
The device was discovered to ample precision and total heat transfer
capabilities while meeting its accuracy requirement.
 REFERENCES
1. Google.com
2. Wikipedia