Wei Hu

hu2144@vandals.uidaho.edu

Objective:
Obtain an internship of product engineer position in SMIC where I can apply my
technical skills about IC fabrication to production line.

Education:
High School Diploma
Shanghai No.1 High School, Shanghai, China
Spring 2016
GPA: 3.0/4.0

Bachelor of Science in Electrical Engineering

Spring 2020
University of Idaho, Moscow, Idaho
GPA: 4.0/4.0

Course Highlights:
 ECE 210/211/212/213 Circuits I/ Circuits II
 CS 120 Computer Science I
 ECE 240 Digital Logic
 ECE 310 Circuits II
 ECE 320 Power System I
 ECE 404 Analog Linear Integrated Circuit
 ECE 465 IC Fabrication
Technical Competencies:
 Programing Languages: C++, Python and Arduino.
 Office Tools: Word, Excel and Power Point.
 Major Tools: VHDL and Cadence.
Transferable Skills:
a. Be able to prepare and preform a presentation in the form of slide-cast,
podcast and screencast.
b. Be able to design a basic infographic and write a standard white paper.

Research:
Image deconvolution
spring 2018
 Verified parameters in AutoQuant to process image deconvolution which
maximize the image quality.
 Facilitated a data library containing ROIs of the image.
Wei Hu
hu2144@vandals.uidaho.edu

 Built a simple tool based on C++ to increase the efficiency of processing data.
 Learnt basic parameters of image processing such as Numerical Aperture, Reflect
Index and Wavelength.

Work Experience:
Shanghai Xiang Cheng Co., LLC Intern
summer 2017
 Tested serval kinds of Sensors used in Arduino and concluded each
performance.
 Programed Arduino Mega with RF315/433MHz Module to achieve
transferring data by referring examples.

Community Volunteering:
SYNC Volunteering:
 Served in local farm to clean farmer’s house.
08/19/16

Additional skills:
Second Language:
Both written and spoken fluently in Chinese and English.