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TFT - LED TV
Chassis: - COMBO-LED (V59)
INDEX
SR. NO. CONTENT
1. Safety Precautions
2. Servicing Precautions
3. Design Procedure
4. Chassis Specifications
5. Operating Specifications
6. SW Installation Procedure
9. Critical components
2
1. SAFETY PRECAUTIONS
3
4
2. SERVICING PRECAUTIONS
Examples of typical ES devices are integrated circuits and
some field-effect transistors and semiconductor "chip"
2.1 General Servicing Precautions: components. The following techniques should be used to
Always unplug the receiver AC power cord from the AC help reduce the incidence of component damage caused
power source before: by static by static electricity.
a. Removing or reinstalling any component, circuit 1. Immediately before handling any semiconductor
board module or any other receiver assembly. component r semiconductor-equipped assembly, drain
b. Disconnecting or reconnecting any receiver electrical off any electrostatic charge on your body by touching a
plug known earth ground. Alternatively, obtain and wear a
or other electrical connection. Commercially available discharging wrist strap device,
c. Connecting a test substitute in parallel with an which should be removed to prevent potential shock
electrolytic reasons prior to applying power to the unit under test.
capacitor in the receiver. 2. After removing an electrical assembly equipped with
CAUTION: A wrong part substitution or incorrect ES devices, place the assembly on a conductive surface
polarity such as aluminium foil, to prevent electrostatic charge
installation of electrolytic capacitors may result in an build up or exposure of the assembly.
explosion 3. Use only a grounded-tip soldering iron to solder or
hazard unsolder ES devices.
2. Test high voltage only by measuring it with an 4. Use only an anti-static type solder removal device.
appropriate high voltage meter or other voltage Some solder removal devices not classified as "anti-
measuring device (DVM, FETVOM, etc) equipped with static" can generate electrical charges sufficient to
a suitable high voltage probe. Do not test high damage ES devices.
voltage by "drawing an arc". 5. Do not use Freon-propelled chemicals. These can
3. Do not spray chemicals on or near this receiver or any generate electrical charges sufficient to damage ES
of its assemblies. devices.
4. Unless specified otherwise in this service manual, 6. Do not remove a replacement ES device from its
clean electrical contacts only by applying the protective package until immediately before you are
following mixture to the contacts with a pipe cleaner, ready to install it. (Most replacement ES devices are
cotton-tipped stick or comparable non-abrasive packaged with leads electrically shorted together by
applicator; 10% (by volume) Acetone and 90% (by conductive foam, aluminium foil or comparable
volume) isopropyl alcohol (90%-99% strength) conductive material).
CAUTION: This is a flammable mixture. Unless specified 7. Immediately before removing the protective material
otherwise in this service manual, lubrication of from the leads of a replacement ES device, touch the
contacts in not required. protective material to the chassis or circuit assembly
5. Do not defeat any plug/socket voltage interlocks with into which the device will be installed.
which receivers covered by this service manual might CAUTION: Be sure no power is applied to the chassis
be equipped. or circuit, and observe all other safety precautions.
6. Do not apply AC power to this instrument and/or any 8. Minimize bodily motions when handling unpackaged
of its electrical assemblies unless all solid-state device replacement ES devices. (Otherwise harmless motion
heat sinks are correctly installed. such as the brushing together of your clothes fabric or
7. Always connect the test receiver ground lead to the the lifting of your foot from a carpeted floor can
receiver chassis ground before connecting the test generate static electricity sufficient to damage an ES
receiver positive lead. Always remove the test device.)
receiver ground lead last. 2.3 General Soldering Guidelines
8. Use with this receiver only the test fixtures specified in 1. Use a grounded-tip, low-wattage soldering iron and
this service manual. CAUTION: Do not connect the appropriate tip size and shape that will maintain tip
test fixture ground strap to any heat sink in this temperature within the range or 500°F to 600°F.
receiver. 2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
2.2 Electrostatically Sensitive (ES) Devices:- Some 3. Keep the soldering iron tip clean and well tinned. 4.
semiconductor (solid-state) devices can be damaged Thoroughly clean the surfaces to be soldered. Use a
easily by static electricity. Such components commonly mall wire-bristle (0.5 inch, or 1.25cm) brush with a
are called Electrostatically Sensitive (ES) Devices. metal handle. Do not use Freon-propelled spray-on
cleaners.
5
4. Use the following unsoldering technique 3. Bend into a "U" shape the replacement transistor leads.
a. Allow the soldering iron tip to reach normal 4. Connect the replacement transistor leads to the
temperature (500°F to 600°F) corresponding leads extending from the circuit board
b. Heat the component lead until the solder melts. and crimp the "U" with long nose pliers to insure metal
c. Quickly draw the melted solder with an anti-static, to metal contact then solder each connection.
suction- type solder removal device or with solder
braid. 2.6 Power Output, Transistor Device
CAUTION: Work quickly to avoid overheating the Removal/Replacement :-
circuit board printed foil. 1. Heat and remove all solder from around the transistor
5. Use the following soldering technique. leads.
a. Allow the soldering iron tip to reach a normal 2. Remove the heat sink mounting screw (if so equipped).
temperature (500°F to 600°F). 3. Carefully remove the transistor from the heat sink of
b. First, hold the soldering iron tip and solder the the circuit board.
strand against the component lead until the solder 4. Insert new transistor in the circuit board. 5. Solder each
melts. transistor lead, and clip off excess lead. 6. Replace heat
c. Quickly move the soldering iron tip to the junction of sink.
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and 2.7 Diode Removal/Replacement :-
around both the component lead and the foil. 1. Remove defective diode by clipping its leads as close as
CAUTION: Work quickly to avoid overheating the possible to diode body.
circuit board printed foil. 2. Bend the two remaining leads perpendicular y to the
d. Closely inspect the solder area and remove any circuit board.
excess or splashed solder with a small wire-bristle 3. Observing diode polarity, wrap each lead of the new
brush. diode
2.4 IC Remove/Replacement:- Some chassis circuit around the corresponding lead on the circuit board.
boards have slotted holes (oblong) through which the IC 4. Securely crimp each connection and solder it.
leads are inserted and then bent flat against the circuit 5. Inspect (on the circuit board copper side) the solder
foil. When holes are the slotted type, the following joints
technique should be used to remove and replace the IC. of the two "original" leads. If they are not shiny, reheat
When working with boards using the familiar round hole, them and if necessary, apply additional solder.
use the standard technique as outlined in paragraphs 5
and 6 above. 2.9 Fuse and Conventional Resistor
Removal/Replacement :-
2.4.1 IC Removal:- 1. Clip each fuse or resistor lead at top of the circuit board
1. Desolder and straighten each IC lead in one operation hollows take.
by gently prying up on the lead with the soldering 2. Securely crimp the leads of replacement component
iron tip as the solder melts. around notch at stake top.
2. Draw away the melted solder with an anti-static 3. Solder the connections.
suction-type solder removal device (or with solder
braid) before removing the IC. CAUTION: Maintain original spacing between the replaced
2.4.2 Replacement :- component and adjacent components and the circuit
1. Carefully insert the replacement IC in the circuit board to prevent excessive component temperatures.
board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush.
(It is not necessary to re apply acrylic coating to the
areas).
7
3. DESIGN PROCEDURE FOR Combo CHASSIS
DESIGN MENU : -
Method for entering design data: -
Using remote, go to MENU, then go to AUDIO MENU. Then press
remote Digit keys 8 5 3 2 , then it enters in Design Menu.
CONNECTIVITY VIEW: -
8
DESIGN DATA FOR Combo CHASSIS
Contrast 0
different levels 0-25-50-75-100
To adjust Picture Colour Saturation level
Saturation 0
at different levels 0-25-50-75-100
To adjust Picture Hue level at different
Hue 0
levels 0-25-50-75-100
To adjust Picture Sharpness level at
Sharpness 0
different levels 0-25-50-75-100
value
60
used.
Source
Color Temp Mode: Normal/Cool/Warm
R-Gain
Parameters to adjust white balance of
G-Gain
LCD. These parameters are different for
B-Gain
different sources and vary panel to
R-Cut
panel. Also these settings are different
G-Cut
for Colour temperature modes.
B-Cut
White Balance
Sub Brightness
Parameters to adjust source offsets.
Sub Contrast
WB Offset
Color Temp Mode: Normal/Cool/Warm
R-Gain Offset
Parameters to adjust white balance of
G-Gain Offset
LCD. These parameters are different for
B-Gain Offset
different sources and vary panel to
R-cut Offset
panel. Also these settings are different
G-cut Offset
for Colour temperature modes.
B-cut Offset
Sub brightness Offset
Parameters to adjust source offsets.
Sub Contrast Offset
9
Panel selection
parameter. After
selection of proper
Panel Type
panel type, it
automatically selects all
panel parameters.
10
AUDIO ADJUSTMENT PARAMETERS: -
Audio Data Select audio data as per cabinet and
Selection model.
Source
OSD_0
OSD_25 Parameters used to adjust the audio
Audio Curve
OSD_50 curve of model. This audio curve
OSD_75 may vary from model to model.
OSD_100
Audio Output Parameter used for woofer/Non
2.0CH
Select woofer model
Selection for audio as per model.
Speaker Automatically selects all above audio
selection parameters i.e. all audio parameters
are assigned to this parameter.
Audio On Music
10
Used for adjusting power on music
Vol. volume
Audio Mode Music/Standard/Speech/User
Treble
Bass
Audio Mode 120Hz Parameters used to adjust the audio
500Hz curve of model. This audio curve
1.5KHz may vary from model to model.
5KHz
10KHz
120Hz Parameters used to adjust the audio
500Hz curve of model. This audio curve
Band Max 1.5KHz may vary from model to model.
5KHz Bandmax parameters are different
10KHz for different audio modes.
Note: -
1.) The design parameters may vary depending on model. So, kindly follow the
design data provided with each model.
2.) Clear EEPROM option is at first position in setting design data, so care should
be taken that OK key should not be pressed here, unless and until required, other
wise, Clear EEPROM will execute and all design data (Audio & Video factory
settings) will be erased.
13
4. CHASSIS SPECIFICATIONS
PARAMETERS SPECS REMARKS
NUMBER OF PROGRAMS 200
TUNING SYSTEM FS
COLOUR SYSTEM PAL
NTSC PLAYBACK YES Only in AV
SOUND SYSTEM BG
CHANNEL NAME YES IN PROGRAM EDIT
MANUAL SEARCH YES
ANALOG
TUNNING FINE TUNE YES
SKIP YES
EXCHANGE CHANNEL (SWAP) YES IN PROGRAM EDIT
INSERT CHANNEL YES IN PROGRAM EDIT
COPY CHANNEL YES IN PROGRAM EDIT
DELETE CHANNEL YES IN PROGRAM EDIT
AUTO DETECTION COLOR AND
YES
SOUND
VIVID/HI-BRIGHT/CINEMA/
SELECTABLE PICTURE MODES 5 MODES
SPORTS/USER
Color Transient Improvement YES
DNR YES 3D
ADAPTIVE LUMA CONTROL YES
ZOOM MODE AUTO/4:3/16:9
COLOR IMPROVEMENT YES
3:2 2:2 PULL DOWN YES Inbuilt
DIGITAL COMB FILTER YES 3D
PICTURE
FREEZE YES
BACKLIGHT ADJUST YES
COLOUR TEMP YES NORMAL/COOL/WARM
AUTO ADJUST (IN PC) YES
H POSITION (IN PC) YES
V POSITION (IN PC) YES For VGA Source
PHASE (In PC) YES
CLOCK (In PC) YES
3D NOISE REDUCTION YES 14
SELECTABLE SOUND
4 MODES USER/SPEECH/STANDERED/MUSIC
MODES
AUTO VOLUME LEVELLER YES
AUDIO OUTPUT POWER
(RMS)
8W x 2 (+/-2w)
AUDIO
MUSIC MODE YES Eco Vision =Audio Only
BASS / TREBLE / BALANCE YES/YES/YES
EQUALIZER 5 BAND 120Hz/500Hz/1.5KHz/5KHz/10KHz
NO.OF SPEAKERS 2
CLOCK YES
ON CHANNEL YES
OFF TIME YES Timer Features are Optional
TIMER ON TIME YES
SLEEP TIMER YES
CLOCK DISPALY YES
AUTO SWITCH OFF YES
PROGRAM DIRECTORY YES
OFF/ LOW/ MID /HIGH/AUDIO
ECO VISION YES
ONLY
QUICK VIEW YES
HOTEL MODE YES
VOLUME LOCK YES In Hotel Mode
TUNING LOCK YES In Hotel Mode
FEATURES CHANNEL LOCK -CHILD
YES (RF SOURCE)
LOCK
FRONT PANEL KEY LOCK NO
Start on predefined
YES In Hotel Mode
Source
Start on predefined
YES In Hotel Mode
Channel NO.
ENERGY METER YES
BOOT UP SOUND YES
SPECIAL SMART CONNECT HDMI CEC
YES
FEATURES
FAMILY FAVOURITE YES
15
RF IN YES
AV1 IN YES
AV2 IN NO
CONNECTIVITY
AV OUT YES
YPbPr/YCbCr YES Conectivities present
USB INPUT (2.0 aat rear side of TV.
YES
SUPPORT)
HDMI INPUT YES
PC AUDIO IN YES
PC(VGA IN) YES
PANEL MODEL NO SAMSUNG (LTA230AN01)
SCREEN SIZE & TYPE 23" (VA TYPE) TV GRADE PANEL
ASPECT RATIO 16:9
PANEL SPECIFICATIONS
Average power
consumption by TV in
POWER CONSUMPTION 35 W (Avg.)
Standard operating
condition.
REMOTE HANDSET V-MT 22 (V-2BD)
ACCESSORI
16
5. OPERATING SPECIFICATIONS
CHASSIS/PANEL SPECIFICATIONS: -
17
MULTIMEDIA SUPPORT SPECIFICATIONS
18
SOURCE WISE RESOLUTION SUPPORT
19
6. SW & E2P INSTALLATION PROCEDURE
The ATV SW installation in Combo chassis can be done with USB in two ways.
1.) SW & E2P Installation through USB.
2.) SW Installation through MST Tool.
SW installation through USB: -
Download the SW file in USB to root directory.
Confirm the file name should be “VIDEOCON.bin”
1
for Videocon brand LEDTV and “SANSUI.bin for
SANSUI brand LEDTV.
Turn the TV set ON and insert the USB in USB port
2
of TV set.
21
Note: -
1. Kindly DO NOT SWITCH OFF THE TV SET, While SW/E2P upgrade
is in process.
2. The SW and E2P update through USB is possible with mains
OFF-ON also, but only if M-Mode is ON.
3. In M-Mode, if press stand by key of remote, then M-Mode
becomes OFF.
4. Can not update SW through USB if set is permanently in Stand
by. In this case, use MST jig to load SW.
5. If required to load Videocon SW in SANSUI brand chassis with
SANSUI SW, then rename the SW file as “SANSUI.bin”.
6. If required to load SANSUI SW in Videocon brand chassis with
Videocon SW, then rename the SW as “VIDEOCON.bin”.
7. If use chassis of any other segment on 19.5” D-LED model, then
there will not be any display on this panel. This is not a
problem, but this is because, the panel resolution of 19.5” D-
LED model is different i.e. 1600X900. So, for this model, after
SW loading it is required to update the E2P of this model to
view display.
22
E2P UPLOAD THROUGH USB : -
After SW update, go to Design Menu by
1
Pressing MENU => AUDIO MENU => 8 5 3 2
Go to Setup design menu and Select Clear
2
EEPROM option and press OK key of remote.
After Clear EEPROM, the set will go to stand
3
by and will restart automatically in RF mode.
Then, take E2P in USB. File name for E2P will
4 be for VIDEOCON=> VDC_182VG_EEP
For SANSUI=> SAN_182VG_EEP.
23
E2P DOWNLOAD FROM TV SET IN USB: -
If required to make E2P file from any set in the field, then follow below
steps.
24
SW INSTALLATION THROUGH JIG: -
Step1: - First Connect MST SW loading Jig to USB port of PC and 04 Pin Header
XS352 on chassis (near AV socket). SW loading jig is common with MST719 Jig.
MST Tool is also same as MST719.
Step2: - Kindly confirm pin configuration of Jig conn. should be +5V,
RXD, TXD, GND, which is same as MST719 Jig.
Step4: - After opening tool, Press connect. If Jig is properly connected, then it
will select the chip automatically. If chip is not selected automatically, then go to
Device option in Jig and select the Chip from SPI list WIN25X32 or WIN25Q32.
Then open the MSTV tool and select Baud rate 11500 (as shown below) and
select the COM Port (confirm COM port from your Computer properties, may
be different for different PC).
25
COM Port and Baud Rate selection from MSTV Tool
26
Step4: - Then go to option of ISP tool and select the SW file (.bin file).
Step5: - Then select option of ISP tool and after setting, press RUN in
Note: - 1.) Before running SW, uncheck options Reconnect, lank, Restore data,
Multi flashes, Verify, as these actions are not required.
2.) Kindly DO NOT SWITCH OFF TV Set or PC while SW loading or do not
disconnect the Jig from PC while SW loading.
27
Step6: - After Successful SW loading it will show PASS, as shown in below
window.
28
After SW loading is complete i.e. 100%,
1 the set will go to stand by automatically
and will restart again.
29
7. COMBO LED BLOCK DIA. AND WIRING DIAGRAM
MAJOR COMPONENTS IN COMBO LED CHASSIS
SR. MAJOR IC WITH FUNCTIONS
1 N401 TSUMV59XU-Z1 EPLQFP 100 pins is the main micon.
Power management of LDO output voltage is as follows:
a.N505 output voltage :1.8V +-0.1V
2
b.N411 output voltage :3.3V +-0.1V
c.N503 output voltage :3.3VSB +-0.1V
Tuning circuit of tuner type is NXP silicon tuner,
3 The color system NTSC/PAL/SECAM and sound system
BG/DK/I.
N800 TPA3110LD2 is the digital audio amplifier, Output
4
power option 2x10W stereo.
N403 MX25L1606E12G is the FLASH IC for software
5
storage and operation
30
MAIN CHASSIS (ACTUAL PHOTO): -
IR/KEY
SPEAKER CONN
O/P
RF IN
AUDIO IC
3110LD2
OUT
AV
LVDS
SOCKET
AV1 IN
MICON
V59
FLASH IC
YPbPr
IN
24V TO 5V
REGULATOR
VGA
IN
IN AUDIO
24V TO 12V HDMI VGA
REGULATOR
USB
IN
PWM
CONTROL IC
31
8. Connectors and Electrical Parameters
32
9. CRITICAL COMPONENTS
CRITICAL COMPONENT LIST
SR. IC DESCRIPTION QTY. LOCATION FUNCTION
1 IC,CHIP,EPLQFP,100Pin,NTSUMV59XU,EZ 1 N401 Main Micon IC
IC,CHIP,SOIC8,QM3001S/CEM9435A/AM9435P/
2 2 N504 N502 Panel Power switch IC
WPM9435
3 IC,CHIP,SOT223,G1117-3.3V 2 N503 N411 5VSTB TO 3.3VSTB Regulator
4 IC,CHIP,TO223,AZ1117ADJ 1 N505 2.5V Regulator for Micon.
5 IC,CHIP,SOT-23,CS810S 1 N402 Hardware Reset IC
6 IC,CHIP,SOT23-5-1,SY8008B 1 N551 5VSTB to 1.26V Core Power for Micon
7 IC,CHIP,TSSOP28,TPA3110L 1 N800 Audio IC
8 IC,CHIP,SOP8,BIT3260 1 NS3 PWM control IC for LED driver
9 IC,OPTO-COUPLER,KP10101B/KPC817B,DIP-4 1 N704 Optocoupler
10 IC,PWM,28V,300 MA,OB2263MP,SOT23-6 1 N700 PWM control IC for Power Supply
IC,SMD
11 1 N403 Flash IC
FLASH,SOP8,MX25L1606E12G,WINDBOND
12 IC,CHIP TDA18273 for Silicon Tuner 2 N410 Tuner Driver IC
13 VARISTOR,560V,25AMP,TVR10681KSY 1 RV01 Varistor
TRANS,N-MOSFET,650V/7A FQPF7N65C,TO-
14 1 V700 Main MOSFET
220F
15 TRANSISTOR,MOSFET,ME08N20,MOS252 1 VS1 LED Driver MOSFET
N500 - 24V to 12 V Regulator
16 IC,CHIP,MP1584,SOIC8E,DC TO DC,3A,28V 2 N500 N501
N501 - 24V to 5V Regulator
33
Panel/Model Matrix.: -
PANEL VCC Add Jumper Add Jumper Add Jumper Add Jumper
SELECTION 1100087738 1100087738 1100087737 1100087737
JP003
FFC LVDS XS408 XS408 XS405 XS405
LOCATION
LED DRIVER CNS3 CNS3 CNS2 CNS3
CONN.
LED BAR Add Jumper NA NA NA
Selection 1100087738
JP002
34
10. COMBO-LED TROUBLE SHOOTING
Normal
Abnormal
Check if 24VSTB supply at N501 is
OK or not.
Normal
Abnormal
Check if +5VSTB supply is OK or
not.
Normal
Abnormal
Check Regulator Voltage N503 –
3.3V STB is OK or not.
Normal
Check al working voltages are Abnormal
coming at micon V59, Flash IC
N403. Check if SW loading is
possible
Normal
If all the working conditions are
normal, but still the chassis can not
power ON, the please try to replace
the main chassis..
35
B.) No Picture Condition
Normal
Check the Panel VCC voltage Abnormal
Check the Power
5V/12V at JP003 is coming OK or supply area
not
Normal
Normal
Normal
Press ECO key of remote 2-3 times If change If display come then go
to change backlight value to design data & adjust
(backlight curve in chassis may be Backlight curve as per
reverse). model design data.
No Effect
Upload SW/E2P in the TV set if TV
is in M-Mode.
No Effect
Normal
Upload SW/E2P of that model in
the TV set if TV is in M-Mode.
No Effect
If all the conditions are normal, but
still problem is present, then try to
change the chassis.
37
D.) No Sound Condition
First check the audio source Abnormal Re-connect the input cables to
Input is proper. Also check all
TV and source properly.
audio inputs given to TV are OK.
Normal
1. Re-connect the speaker
Check Speaker conn. is Abnormal conn. in header XS901.
connected properly to TV or not
2. If damaged change the SPK.
damaged
Conn., SPK. Box assy.
Normal
If 12V not coming then check if
Check the power supply 12V is Abnormal 12V is coming at N500 pin
coming at C809/C817 i.e. VCC
no.7. Also check if Mute Pin no.
pin of audio IC.
1/2 of IC N800.
Normal
Normal
Check if O/P coils of Audio IC
L805/806/807/808 are OK or not.
No Effect
If all the conditions are normal, but
still problem is present, then try to
replace the Audio IC TPA3110LD2
or replace the main chassis.
38
11. REMOTE CONTROL
39
REMOTE CONTROL KEY DESCRIPTION
40
41
42
12. Common Abbreviations