ACKNOWLEDGEMENT

Pattern Transfer

We take this occasion to thank God, Almighty for blessing us with his
grace and taking our endeavor to a successful culmination. We extend
our sincere and heartfelt thanks to our esteemed guide, Ms. PREETHA
M.S. for providing us with the right guidance and advice at the crucial
junctures and for showing us the right way. We extend our sincere
thanks to our respected head of the division Dr. David Peter , for
allowing us to use the facilities available. We would also like to
thank the our class co-ordinator Mr. Sudheep Elayidom for his kind
suggestion towards the initiative of this seminar.We would like to thank
the other faculty members also,at this occasion. Last but not least we would
like to thank friends for the support and encouragement they have given us
during the course of our work.
abstract MEMS
MEMS is a technology consists of microelectronic element, actuator, sensors and
mechanical structure built onto substrate, which is usually silicon. They are
developed using micro fabrication technique, deposition, patterning and etching.
The most common forms of production for MEMS are bulk micromachining, surface
micromachining. The benefits of this small scale integration bring the technology
to a vast number and verify of device.
Micromechanical systems can be combined with microelectronics, photonics or
wireless capabilities new generation of Microsystems can be developed which will
offer far reaching efficiency regarding space, accuracy, precision
The MEMS technology can be used for permanent, semi permanent or temporary
interconnection of sub modules in a System.
This field is called by a wide variety of names in different parts of the world:
micro electro mechanical systems (MEMS), micromechanics, Microsystems technology
(MST), micro machines, industrial application.
MEMS are the next logical step in the silicon revolution. The silicon revolution
began over three decades ago; with the introduction of the first IC
MEMS technology has enabled us to realize advanced micro
devices by using processes similar to VLSI technology. When MEMS
devices are combined with other technologies new generation of
innovative technology will b created. This will offer outstanding
functionality. Such technologies will have wide scale applications in
fields ranging from automotive, aerodynamics, hydrodynamics, biomedical
and so forth. The main challenge is to integrate all these
potentially non-compatible technologies into a single working
microsystem that will offer outstanding functionality.
The micro array can provide dynamically variable directional
sensitivity by employing suitable beam forming and tracking
algorithms while implanted completely inside the ear canal.
It is a hearing instrument in which an array of acoustical sensors is
used to provide dynamic directional sensitivity that can minimize
background noise and reverberation thereby increasing speech
intelligibility for the user. The micro array can provide dynamically
variable directional sensitivity by employing suitable beam forming
and tracking algorithms while implanted completely inside the ear
canal.
Micromechanical System for System-on-Chip Connectivity
Division of Computer Engineering ,CUSAT 5
The use of MEMS technology for permanent, semi permanent or
temporary interconnection of non-compatible technologies like
CMOS, BJT, GaAs, SiGe, and so forth into a System-on-Chip
environment can be described using an example application. It is a
hearing instrument in which an array of acoustical sensors is used to
provide dynamic directional sensitivity that can minimize background
noise and reverberation thereby increasing speech intelligibility for the
user. The micro array can provide dynamically variable directional
sensitivity by employing suitable beam forming and tracking
algorithms while implanted completely inside the ear canal.
The micro array can provide dynamically variable directional
sensitivity by employing suitable beam forming and tracking
algorithms while implanted completely inside the ear canal.