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Presentation by:
. 11th Edition
. Ground:fheearth.
. Grounded (Grounding):Conneded (connecting) to ground
or to a conductive body that eKends the ground
connection.
. Bonded (Bonding).'Connected to establish electrical
continuity and conductivity.
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Grounded (Grounding)
Gdnded (Grourding): ConnEted (csnecttrE) to
grrund or some @djctive body that extends the
9rund qrnection.
Grdnded ffiductfr
o
t
@
Grunded
t
Bonded (Bonding)
@ = eonded (EordirE)
Servie
disnnect
L---.--*
Mettr etrlo$re
Pamlboard
High-Impedance Path
G.ounded condxtor !O! in*alled from source to Sedic disonnect
: High-impedance path
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Low-Impedance paUr
C{otfid€d corductor installed fom source to sewice discdlnect
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Parallel Service-Entrance Conductors
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Example Number 1:
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Example Number 2:
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EquP.ncd
""##,/ \
Or&
2. GtoundirE
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For example:
. Dead-front switchboards, UL-891
. Motor Control Centers, UL-845
. Panelboards, UL-67
. PowerOutlets, UL-231
. Furnished by the manufacturer
r'-- /' -
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t[r
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(All mnducttrs not shM)
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ro Borlding Itlbdge
-
around conc€ntic or c€cer{rlc hoclorjts;
wf,fi q withqrt bfidlng fumper wfi€r€ m
coocerti€ or ccet*ric kffikouts
(St nd.d lodout pennr'tted on oppo6fte si&)
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Gmunding Electro(h; A cdducting object
through whi.t a dj€ct connection to earttt
is eslaui*Ed.
w
li"ip;1ag
1. Connects the elctrical q/stem to ear$r
--l*
Ule effect in dearing ground faufis
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r, E',ll
4.
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Dissipation of Over-Voltages
7 ffi
0&6 m€tal
[*oo.,ob
luoales
l--
7
dtrtlds
?-
Grcurdnng
2Awccopperr )
minimum+\--l
u Rr
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Clamp suilaH€
fol concaete
s6*ment or
wld
exothermic
<
e Minimum 6.0 m (20 ft)
-
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o-,^, 6-lg
-{f.
Seryice
equiprent ;;;J^,-- il
,-'l I
Groundrine)-O --
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Servlce No. 1r
r**-t !,ktd frarE grouffilng eledrodes o. inEior
m€tal u,Ehr t*r€s aE pern*tt€d for bording
grouftliB d€cbod€s together in indJddd
ard @mmercii{ boildirqF
*to"*. rJ
,-seruice No.4
The sm groundiog ehctod{s) must be used fotr all eruiEs, fe€ders, and
brdnch druiE, Tm or mp electrodes bonded bg€$er are cmsidered ffi
grounding electode sy:tem [250.58]
High-imp€dance p.th
g-B,
Low-inF€dance path
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Presentation bY:
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