Internal Use Only

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LCD TV
SERVICE MANUAL
CHASSIS : LP92R

MODEL : 22LK230 22LK230-TA

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL62298310 (1107-REV00) Printed in China

 CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 7

EXPLODED VIEW .................................................................................. 10

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Copyright © 2011 LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
 SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
AC Volt-meter

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to
Good Earth Ground
be sure the set is safe to operate without damage of electrical
such as WATER PIPE,
shock. CONDUIT etc.
To Instrument’s 0.15 uF
exposed
Leakage Current Cold Check(Antenna Cold Check) METALLIC PARTS
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc. When 25A is impressed between Earth and 2nd Ground
If the exposed metallic part has a return path to the chassis, the for 1 second, Resistance must be less than 0.1 Ω
measured resistance should be between 1 MΩ and 5.2 MΩ. *Base on Adjustment standard
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright © 2011 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
Copyright © 2011 LG Electronics. Inc. All right reserved. -4-
Only for training and service purposes
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright © 2011 LG Electronics. Inc. All right reserved. -5-
Only for training and service purposes
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
LGE Internal Use Only
 SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range 3. Test method

This spec. sheet is applied to LCD TV used LP92R chassis. 1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
2. Specification - EMC : CE, IEC
Each part is tested as below without special appointment.

1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF), CST: 40 ºC ± 5 ºC

2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
: Standard input voltage(AC 100-240 V~, 50 / 60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.

4. Model specification
No. Item Specification Measurement Remark
1 Market Non-EU
2 Broadcasting system PAL/SECAM B/G/D/K, PAL I/II, NTSC-M
3 Available BAND PAL NTSC China(DK)
Channel VHF/UHF E2~C69 2~78 C1~C62
Cable S21~47 1~71 S1~S41
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC Rear (1EA)
6. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)
7. RGB Input S/W Upgrade Only Rear (1EA)
8. HDMI Input HDMI-DTV, Only PCM MODE Rear (1EA)
9. Audio Input (1EA) AV (1EA) L/R Input

5. HDMI Input(DTV)(HDMI DVI - Spec out)

Specification
No. Proposed Remarks
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out but display.
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.47 59.94 27 SDTV 480P
5 720*480 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1280*720 37.5 50.00 74.25 HDTV 720P

Copyright © 2011 LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
 ADJUSTMENT INSTRUCTION
1. Application Range 4. PCB assembly adjustment method
This specification sheet is applied to all of the LCD TV, LP92R 4.1. Mstar Main S/W program download
chassis. 4.1.1 Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(JK302) jack or
2. Specification P301(4P) Wafer.
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-220
V~, 50 / 60 Hz.
(5) The standard signal level is approved in 65 ± 1 dB µV.
(6) The receiver must be operated for over 5 minutes prior to
the adjustment when module is in the circumstance of
above 15 ºC.
G In case of keeping module is in the circumstance of 0 °C, (2) Download steps
it should be placed in the circumstance of above 15 °C 1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
for 2 hours. utility Vx.x.x) will be opened.
G In case of keeping module is in the circumstance of 2) Click the “Connect” button and confirm “Dialog Box”.
below -20 °C, it should be placed in the circumstance of
above 15 °C for 3 hours.

3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC604, Mstar ISP Utility)
1) Using D/L Jig
(2) Input Tool-Option
(3) Check SW Version.

3.2. SET assembly adjustment items

(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Preset CH information
(5) Factoring Option Data input

3) Click the “Config” button and Change speed.

I2C Speed setting : 350 Khz ~ 400 Khz

Copyright © 2011 LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes

Filexxx.b
 4) Read and write bin file. 4.3. EDID Data
Click “(1)Read” tab, and then load download file - EDID D/L method: The EDID data is automatically saved.
(XXXX.bin) by clicking “Read”. * 22LK230
** HDMI : 256Bytes
1
0 1 2 3 4 5 6 7 8 9 A B C D E F
Filexxx.bin 0 0 FF FF FF FF FF FF 0 1E 6D 1 0 1 1 1 1
1 10 1 15 1 3 80 30 1B 78 0A F3 30 A4 54 46 96 26
20 0F 49 4B 20 0 0 1 1 1 1 1 1 1 1 1 1
Filexxx.bin
30 1 1 1 1 1 1 1 1D 0 72 51 D0 1E 20 6E 28
40 55 0 E0 0E 11 0 0 1A 1 1D 0 BC 52 D0 1E 20
50 B8 28 55 40 E0 0E 11 0 0 1E 0 0 0 FD 0 31
60 3D 0F 2E 8 0 0A 20 20 20 20 20 20 0 0 0 FC
70 0 4C 47 20 54 56 0A 20 20 20 20 20 20 20 1 A2
80 2 3 1D 72 23 9 7 7 4A 6 7 15 16 2 3 11
90 12 84 93 83 1 0 0 65 3 0C 0 10 0 8C 0A D0
5) Click “(2)Auto” tab and set as below.
A0 8A 20 E0 2D 10 10 3E 96 0 E0 0E 11 0 0 18 8C
6) Click “(3)Run”. B0 0A A0 20 51 20 18 10 18 7E 23 0 E0 0E 11 0 0
7) After downloading, you can see the “4)Pass” message. C0 98 8C 0A D0 90 20 40 31 20 0C 40 55 0 E0 0E 11
D0 0 0 18 8C 0A A0 14 51 F0 16 0 26 7C 43 0 E0
E0 18 11 0 0 0 0 0 0 0 0 0 0 0 0 0 0
F0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 14

4.5. Check SW Version

(1) Method
1) Push In-star key on Adjustment remote control.
2) SW Version check
Check “Main : Vx.xx” - LK230

* If TV is Turn On, Check the updated SW Version and

Tool Option.

4.2. Input tool option.

Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process

After Input Tool Option and AC off

Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)

(1) Profile : Must be changed the option value because being

different with some setting value depend on
module maker, inch and market.
(2) Equipment : Adjustment remote control
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START key on the Adjustment remote control.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value.

[Caution]
- Don’t Press “IN-STOP” key after completing the function
inspection.
- Don’t connect HDMI cable when downloading the EDID.
If the cables are connected, Downloading of EDID could
be failed.

Copyright © 2011 LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
5. SET assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : Adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START key on the Adjustment remote control.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
(Medium data is automatically calibrated by the Cool data)
- Required Equipment
1) Remote control for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product
- LCD TV(ch : 9)
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for auto adjustment)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.2.2. Adjustment of White Balance (for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85 % white pattern)
5) Push the ADJ key two time(entering White Balance
mode) -> Enter “04 13” (Password)
6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
8) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others.
9) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.

5.2.1. Connecting diagram of equipment for measuring * CASE

(For Automatic Adjustment) First adjust the coordinate far away from the target value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target, y > target
* LP92A Support I2C Interface For ADC/DDC Adjustment. i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(1) Enter the adjustment mode of DDC
- 22 Set command delay time : 50 ms (4) Standard color coordinate and temperature when using the
- Enter the DDC adjustment mode at the same time heat- CA100+ or CA210 equipment
run mode when pushing the power on by power only key. (Small size inch’s color coordinate is different from others,
- Maintain the DDC adjustment mode with same condition So use below table.)
of Heat-run => Maintain after AC off/on in status of Heat- Coordinate
run pattern display) Mode Temp uv∆
x y
(2) Release the DDC adjustment mode Cool 0.280 ± 0.002 0.283 ± 0.002 9,300 K 0.000
- Release the adjust mode after AC off/on or std-by off/on Medium 0.290 ± 0.002 0.295 ± 0.002 8,000 K 0.000
in status of finishing the Hear-run mode
Warm 0.308 ± 0.002 0.319 ± 0.002 6,500 K 0.000
- Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment. To check the Coordinates of White Balance, you have to
- Need to transmit the aging off command to TV set after measure at the below conditions.
finishing the adjustment. Picture Mode : User 1
- Check DDC adjust mode release by exit key and release Dynamic Contrast : Off
DDC adjust mode) Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
(3) Enter the adjust mode of white balance can be lower than the spec.)
- Enter the white balance adjustment mode with aging
command (F3, 00, 00)

(4) Release the adjust mode of white balance

- Release the white balance adjustment mode with aging
command(F3, 00, FF)

Copyright © 2011 LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
 EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

400

910

900
401

540
LV1

530

820
120

810

A10
200

A2
510
300

Copyright LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
 INPUT

AV IN/OUT
JK101
PPJ234-03
[YL]E-LUG 6E

[YL]O-SPRING 5E
CVBS_VIN
ZD101
R110 SD05
75 ZD102
SD05 [YL]CONTACT 4E

[WH2]O-SPRING 5D
R103
CVBS_LIN 10K

READY R101 R108 D101

C106
560pF
50V
12K 220K 30V
[RD2]CONTACT 4C

[RD2]O-SPRING 5C
R104
CVBS_RIN 10K

READY R102 R109 D102

C107
560pF
50V
12K 220K 30V
[RD2]E-LUG-S 7C

C105
10uF
16V
[WH1]O-SPRING 5B
R127
MNT_LOUT MMBT3904(NXP) 1K
Q106 C103
C D108
5600pF
MUTE_LINE B E 50V
30V

POP NOISE
[WH1]E-LUG-S 7B
C
B
E
Q104
MMBT3904(NXP)
[RD1]CONTACT 4A
R128
MNT_ROUT C104 1K
10uF MMBT3904(NXP) C102
16V Q105 D107
B C 5600pF 30V
MUTE_LINE E
50V
[RD1]O-SPRING
POP NOISE 5A
B C
E
Q103
MMBT3904(NXP)
[RD1]E-LUG 6A

16.5V_AOUT
FOR DEBUG
GAIN X 4
FOR DEBUG
ISA1530AC1 R111
FOR DEBUG Q101 470
E B
C MMBT3904(NXP)
Q102 FOR DEBUG
C R114
B
JP101 E 47
FOR DEBUG
R106
FOR DEBUG MNT_VOUT_T
220
FOR DEBUG
R112
68

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX64207701 2011/5/6
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. INPUT 1 7
[AV]

Copyright © 2011 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
 LVDS/IR_LED_KEY

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-

5V_LCD HD(22") P204

FF10001-30

30
1
29
2
28

27
3

4
KEY1 READY
C209
IR & LED 12507WR-08L
P201
26 100pF
5 50V
KEY2
25
22"LGD/Tsinghua READY
6 C212
R229 24 100pF KEY1
0
7 50V 1
23 READY
ZD204
8 5.6V
22
9
KEY2
21 MBW3216-501TF
2
JEIDA
10 L203 READY
R230 ST_5V ZD205
20 5.6V
0 500-ohm C207 C208
11
19
0.1uF 100pF GND
50V 50V 3
12
TXCE3+ 18
13
TXCE3- 17 IR
14 READY C205 +ST_5V
16
C202 READY 47pF 4
0.1uF 50V
15 50V
TXCLKE+ 15
16
TXCLKE- 14
GND
17
5
13
18
TXCE2+ 12
19
IR
TXCE2- 11
6
20 3.3V_M ZD201
10 5.6V
21
TXCE1+ 9
LED_KEY
22 R206 7
4.7K READY
TXCE1- 8 ZD202
23 5.6V
7 READY
24
LED_KEY
C206
LED_POWER
TXCE0+ 6 C203 100pF 8
25 ST_3.3V 0.1uF 50V READY
TXCE0- 5 50V ZD200
26
5.6V
4
9
27 R203
10K
3
28 READY
2 LED_POWER
C204
29 C201 100pF
1 0.1uF 50V
30 50V

31

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX64207701 2011/5/6
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. LVDS/IR/KEY 2 7

Copyright © 2011 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
 HDMI

HDMI ฀
2SC3052
C Q301
READY B R313
R302 R301 HPDCTL
1K 10K 10K
E
HD_5V

R320 ENKMC2838-T112
4.7K D302 A1
SHIELD
R323 5V_M
HDMI_5V_DET C
20 10K
R321 A2
C302 HD_5V
10K
19 0.1uF
50V
18 R329 R331
4.7K 4.7K
C303
17 33pF
READY R303 10 HDMI_SDA
16
R304 10 HDMI_SCL
15
C304
33pF
14 READY
13
R305 5.6 TXCLK-
12

11
R306 5.6 TXCLK+
10
R307 5.6 B_TX0-
9

8
R308 5.6 B_TX0+
7
R309 5.6 G_TX1-
6

5
R310 5.6 G_TX1+
4
R311 5.6 R_TX2-
3

2
R312 5.6 R_TX2+
1

JK301
YKF45-7058V

JK302 I2C Control

SPG09-DB-010
6630TGA004Q

6 RED_GND

GND_2
1 11
RED

GREEN_GND
7
DDC_DATA
2 12 C305
DSUB_SDA
GREEN 33pF
D303 READY
30V
8 BLUE_GND

H_SYNC
3 13
BLUE

9 NC

V_SYNC
4 14
GND_1

10 SYNC_GND

DDC_CLOCK
5 15 C306
DSUB_SCL
DDC_GND 33pF
D304 READY
30V

16 SHILED

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX64207701 2011/5/6
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. HDMI/RGB 3 7

Copyright © 2011 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
 TUNER

ONLY_TA
TU401
TDTK-G701D

NC_1
1
NC_2
2
NC_3
3
D401 30V
RF_AGC
4 R418
100
R423 12K
TU_AGC
ONLY_MA ONLY_MA
5V_TUNER C413 C417
B+[+5V] Near the pin
0.1uF
16V
0.1uF
16V 5V_M 5V_M

5
C404 C407 R432 R433
0.01uF 10uF 4.7K 4.7K
SDA 50V 10V

6 C411
R415
47 TUNER_SDA
47pF
50V
SCL
7 C412
R414
47 TUNER_SCL
47pF
50V
NC_4 READY
R444
8 0

NC_5 READY
R445
5V_M

9 0
PRE-AMP
R409
0

NC_6 Layout placement

10 PRE-AMP
Close to Mstar IC
PRE-AMP
L401 R411
820nH 680
AIF-
11 READY
C755
22pF 5V_M
50V
No PRE-AMP
R403 TU_SW_VIF ONLY_TA
R419 L403
12 0
PRE-AMP
C409
PRE-AMP(TA)
C414
6.8K K7257M
R410 INPUT 1 4 OUTPUT1

0.01uF 220 0.01uF

VIF1
PRE-AMP 50V 50V TU_SW_VIF
R406 R420 TU_SW_VIF READY
PRE-AMP 1.5K C PRE-AMP
6.8K D403 SWITCHING_INPUT 2 L404
PRE-AMP(TA) BFS17W 5V_M KDS114E(KEC)
SHIELD C401

0.01uF
R404
0
B Q401 35V TU_SW_VIF
R429 5 OUTPUT2
2.2uH

50V
PRE-AMP
R407
820 E
5V_M TU_SW_VIF
R425
0 VIF2
READY READY
PRE-AMP 3.3K 3 CHIP_CARRIER
C410 R412 R427 TU_SW_VIF NO_SW_VIF
0.1uF 22 22 R424 R430
16V 10K C TU_SW_VIF 0
TU_SW_VIF 2SC3875S(ALY)
R417 B Q403
TU_CTL_VIF 10K 5V_M
E
Layout placement TU_SW_SIF ONLY_TA(NO_SW)
Close to Tuner R421
6.8K
L402
K9362M
ONLY_MA C415 INPUT 1 4 OUTPUT1
TU401-*1
TDTK-H701F 0.01uF
SIF1
50V
TU_SW_SIF
R422
6.8K TU_SW_SIF
NC_1 5V_M D402
1 KDS114E(KEC) INPUT-GND 2 5 OUTPUT2
2
NC_2 35V
TU_SW_SIF
SIF2
5V_M TU_SW_SIF R428 3
NC_3 R416 CHIP_CARRIER-GND
3 0
3.3K
RF_AGC TU_SW_SIF NO_SW_SIF
4 R436 R431
B+[+5V] 10K C TU_SW_SIF 0
5 TU_SW_SIF 2SC3875S(ALY)
R443 B Q402
6
SDA TU_CTL_SIF 10K
SCL E
7
NC_4
8
NC_5
9
NC_6
10
DIF[-]/AIF-
11

12 ONLY_TA(SW) ONLY_MA ONLY_MA

L402-*2 L403-*1 L402-*1
K9653D M3953M M9370M
SHIELD
INPUT 1 4 OUTPUT_1 INPUT 1 4 OUTPUT_1 INPUT 1 4 OUTPUT_1

SWITCHING_INPUT 2

PAL-BG,DK,I NTSC-M
5 OUTPUT_2 INPUT-GND 2 5 OUTPUT_2 INPUT-GND 2 5 OUTPUT_2
TU_CTL_VIF High Low CHIP_CARRIER-GND
3 INPUT-GND/CHIP_CARRIER_GND 3 3 CHIP_CARRIER-GND

L403 L402

NTSC M3953 M9370

PAL(w/o NT) K7257 K9653
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX64207701 2011/5/6
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. TUNER 4 7

Copyright © 2011 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
 AUDIO

R502
0

This parts are Located

on AVSS area.

R526
470

2200pF
4700pF
C536
Separate DGND AND AVSS

22K
0.033uF

0.047uF
C548
C546 4700pF C531 50V
1uF 16.5V_SAMP

C545
25V

C532
R523

GVDD_OUT_1
C547 R525

470

PLL_FLTP
PLL_FLTM

PVDD_A_2
PVDD_A_1
0.047uF

SSTIMER
C523 C512 C511

VR_ANA

OC_ADJ
10uF 10uF

BST_A

OUT_A
0.01uF 25V 25V
READY

AVSS
NC
3.3V_M L508

12
11
10
9
8
7
6
5
4
3
2
1
120-ohm
L504 AVDD 13 48 PGND_AB_2 AD-9060
L506 C544
C524
0.01uF
MLB-201209-0120P-N2
15uH 0.33uF
120-ohm
MLB-201209-0120P-N2 C504
10uF C522 TESTOUT 14 47 PGND_AB_1 2S 2F 50V
R505
10V 0.01uF 3.3
C542
MCLK 15 46 OUT_B 1S 1F 0.47uF
50V
R520 R503
R510 100
200 1% OSC_RES 16 45 PVDD_B_2 C539 3.3 JP504
C537 0.33uF C518
I2S_MCLK 1% 18K C525 50V SPK_L+
+3.3V_DVDD R519 DVSS_1 17 44 PVDD_B_1 0.01uF
0.033uF
50V
0.01uF
L509
JP503
4

VR_DIG 18 43 BST_B 120-ohm

MLB-201209-0120P-N2
SPK_L-
R516 TAS5709PHPR JP501
3
1K
PDN 19 42 BST_C SPK_R+
IC501 JP502
2
C514 C527
C549
4.7uF
LRCLK 20 41 PVDD_C_2 L510
1000pF 0.1uF 10V C538 SPK_R-
C520
50V SCLK 21 40 PVDD_C_1 0.01uF
0.033uF
50V C519 120-ohm
1
.
READY AD-9060 0.01uF MLB-201209-0120P-N2
L507
R524 SDIN 22 39 OUT_C 2S
15uH
2F
C543
0.33uF
22K 50V R504 SMAW250-H04R
PULL DOWN SDA 23 38 PGND_CD_2 C541
0.47uF
3.3 P501
1S 1F
R511 100 50V R506
I2S_WS
R512 100 SCL 24 37 PGND_CD_1 C540
3.3
I2S_SCK
R513 100 0.33uF C517
I2S_SDO 50V 0.01uF
25
26
27
28
29
30
31
32
33
34
35
36
L511

120-ohm
AUAMP_SDA R509 33 MLB-201209-0120P-N2
RESET
STEST
DVDD
DVSS_2
GND
AGND
VREG
GVDD_OUT_2
BST_D
PVDD_D_1
PVDD_D_2
OUT_D
AUAMP_SCL R507 33
C503 C502
33pF 33pF
R514 R515
4.7K 4.7K READY READY
3.3V_M 16.5V_SAMP

C516 C509 C510

R508 33 0.01uF 10uF 10uF
SW_RESET 25V 25V
C501 C529 READY
1000pF +3.3V_DVDD 1uF
READY 25V
3.3V_M C535 0.033uF
50V
L501
C526
0.1uF
120-ohm
MLB-201209-0120P-N2

C508
10uF C521
10V 0.01uF

16.5V_AOUT
AMP:GAIN X 4 IC502

C551 MMBT3904(NXP)
0.1uF C Q502
50V B R538
1 OUT1 SN324 OUT4 14
1K
C552 C553
MNT_LOUT E 6800pF
50V
33pF
50V
R541
12K
R536
4.7K
2 INPUT1- INPUT4- 13
R546
6.8K

MNT_L_AMP
R542
3 INPUT1+ INPUT4+ 12
5.6K

16.5V_AOUT

4 VCC GND 11
C550
0.01uF
50V

MNT_R_AMP
R543
5 INPUT2+ INPUT3+ 10
5.6K

16.5V_AOUT
6 INPUT2- INPUT3- 9
C556 R544 R547
33pF 12K 6.8K
50V
C554 MMBT3904(NXP)
0.1uF C Q503
50V
B R539
7 OUT2 OUT3 8
1K
E C555
MNT_ROUT 6800pF
50V
R537
4.7K

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX64207701 2011/5/6
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. AUDIO 5 7

Copyright © 2011 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
 ST_3.3V

MAIN(MARIA8) ST_3.3V

LED_POWER

MUTE_LINE

DSUB_SDA
AVDDP1

HDMI_SCL
B_TX0+

TXCLK-
G_TX1-

VDDC
B_TX0-

TXCLK+

HDMI_SDA
POWER_SW
I2S_MCLK

I2S_SDO
G_TX1+
HPDCTL

I2S_SCK

HWRESET
I2S_WS

4.7K
KEY2
AVDD_ADC

4.7K
KEY1

IR
SERIAL FLASH 2M 3.3V_M

4.7K

4.7K
AVDDP2
R663
4.7K

Closed IC

READY R648
100 Closed IC

100 Closed IC
0.1uF
0.1uF

R672
R666

R668
100

100

100
C656 0.1uF
C659
C665

Closed IC
IC603

22
C667 0.1uF

Closed IC
READY
100
MX25L1606EM2I-12G

R660
READY

Closed IC

R647
100

R664

R673
R671
R684

R667
R608 R610 CS# VCC
10K SPI_CZ 1 8

R665
100

DDCD_SDA
DDCD_SCL

DDCA_DAT
C606
R611 SO/SIO1 HOLD# 0.1uF
SPI_DO 2 7 16V

AVDD_6

VDDC_3

AUMCKO

WAKEUP
ST_3.3V 100
HOTPLUG
RXA1P
RXA1N

RXA0P
RXA0N
RXACP
RXACN

VSS_2
VDD_6

AUSCK
AUSDO

RESET

VDD_5
R607 WP#/AGC SCLK R620

AUWS

SAR0
SAR1
SAR2
IRIN
FLASH_WP
3 6 SPI_CLK
100 C625 100

INT
33pF

4.7K
GND SI/SIO0 READY R622
4 5 SPI_DI
100

R674
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
RXA2N 1 102 DDCA_CLK R675 22 Closed IC
R_TX2- DSUB_SCL
RXA2P 2 101 AVDD_5
AVDDP1
R_TX2+
AVSS_1 GND_3 C644 EEPROM(A0)
3 100 0.1uF

AVDD_1 LVA0P IC601

AVDD_ADC 4 99 AT24C64D-SSHM-T 3.3V_M
BIN0 5 98 LVA0N
C641 A0 VCC
1 8
0.1uF GIN0M 6 97 LVA1P C602
0.01uF
A1 WP
GIN0 7 96 LVA1N 2 7
50V

SOGIN0 8 95 LVA2P A2 SCL R615

3 6
C621 22 MAIN_SCL
RIN0 9 94 LVA2N 33pF

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-
GND SDA READY R616
VSYNC0 LVACLKP
4 5
C622 22 MAIN_SDA
C651
0.1uF 10 93 33pF

AVDD_ADC
AVDD_ADC 11 IC604 92 LVACLKN READY

R632
33 C619 0.047uF CVBS0 12 91 LVA3P
CVBS_VIN
VCOM0 LVA3N
MNT_VOUT_T
R633 68 C620 0.047uF

CVBSOUT
13
14
LGE7873-LF 90
89 VDD_4
C662
0.1uF
16V
AVDDP1
C648 0.1uF
AVSS_ADC 15 88 LVB0P TXCE0- HDCP EEPROM(A8) 3.3V_M
AVDD_2 16 87 LVB0N TXCE0+
AVDD_MPLL
C612 27pF R642 200
XTAL_OUT 17 86 LVB1P TXCE1-
IC602
C603
0.1uF
CAT24C08WI-GT3-H-RECV(TV) 16V
14.31818MHz R628 XTAL_IN 18 85 LVB1N TXCE1+ R602
X601 1M 4.7K
C613 27pF AVSS_2 19 84 LVB2P TXCE2- NC_1
1 8
VCC

R614
Seperate with IC ground
C646
0.1uF
AVSS_3 20 83 LVB2N TXCE2+ NC_2 WP R655 4.7K READY
R653
2 7
100 0 DDC_CTL
AVDD_3 21 82 LVBCLKP TXCLKE-
AVDD_VIF A2 SCL R617
AVDD_VIF_1 LVBCLKN TXCLKE+
3 6
C623 22
MAIN_SCL
AVDD_VIF 22 81 33pF
C652 VSS SDA READY R618
0.1uF L606 AVSS_VIF_1 23 80 LVB3P TXCE3- 4 5
MAIN_SDA
600 READY C624 22
33pF
VIFIP 24 79 LVB3N TXCE3+ R658
0 READY
VIF2
VIFIM 25 78 VSS_1
VIF1
C666
SIFIM 26 77 VDDC_2 0.1uF
SIF1 VDDC L602 R676 L604
SIFIP GPIOD[0] TU_SW_VIF 3.3V_M AVDDP1 ST_3.3V AVDDP2
5V_M 27 76 R650 100 Closed IC 120-ohm C638 0 120-ohm C650 C664
SIF2 TU_CTL_VIF 10uF 0.01uF
10uF
L601
AVSS_VIF_2 28 75 GPIOD[1] 10V R683
AVDD_ADC
10V 50V
120-ohm C614 C615 SW_RESET 0
R625 10uF 0.1uF
10V 16V VR27 29 74 SPI_CK L605
C655 C607 5.6K C608 C610 SPI_CLK R686 ST_3.3V AVDD_MPLL
1uF 0.1uF 0.1uF 100pF AVDD_VIF
10V 16V 16V 50V
AVDD_VIF
AVDD_VIF_2 30 73 SPI_CZ 0 120-ohm C649
10uF
C663
0.01uF
C645 SPI_CZ READY 10V 50V
0.1uF R691
TAGC 31 72 SPI_DI 0
AVDD_AUSDM
TU_AGC READY SPI_DI L603
C642 0.1uF
AVDD_4 SPI_DO R662
1.2V_VDDC_M8 VDDC
AVDD_AUSDM 32 71 SPI_DO ST_3.3V 120-ohm C640 C643 C654
0 4.7uF 10uF 0.01uF
LINE_IN_0L 33 70 AD[0] R627 100 Closed IC
10V 10V 50V
AUAMP_SCL
3.3V_M
LINE_IN_0R 34 69 AD[1] R626 100 Closed IC AUAMP_SDA

CVBS_LIN
R630 33 C627 2.2uF
LINE_IN_1L 35 68 AD[2] R695 100 Closed IC MAIN_SCL
4.7K
R697

CVBS_RIN
R631 33 C628 2.2uF LINE_IN_1R 36 67 AD[3] R694 100 Closed IC 4.7K
MAIN_SDA R696
C631 AUCOM 37 66 WRZ OLP
R687 100 Closed IC OLP
0.1uF
AUVRM 38 65 RDZ R685 100 Closed IC MUTE_LINE
R692
4.7K RESET
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64

DEBUG
JTP-1127WEM
READY SW601
ST_5V
R693 1 3
4.7K
C611
AUVRP
AUVAG
AVSS_4
LINE_OUT_0L
LINE_OUT_0R
VDDC_1
GND_1
VDD_1
GPIOB[12]
GPIOB[11]
GPIOB[10]
GPIOB[9]
GPIOB[8]
GPIOB[3]
GPIOB[2]
GPIOB[1]
GPIOB[0]
VDD_2
GND_2
PWM3
PWM2
PWM1
PWM0
TESTPIN
VDD_3
ALE

3.3V_M ST_3.3V 4.7uF

10V 2 4
R621
100 HWRESET
R624 C604
D603 33K 0.1uF
KDS181 16V

R659
0
3.3V_M
R682
R661
TU_SW_SIF
C653 0.01uF

R681
R651
R649

Closed IC
Closed IC

Closed IC
READY
IC

R656

Closed IC

C660
Closed

KDS181
Closed IC
0.1uF

R619 100
R654

100
1K
1K

D602
100
Closed IC

ISA1530AC1
100
100

C658
100

KDS181
Closed IC

0.1uF 0.1uF D601 Q601 READY

R609 R612
100

R601
R645
R644

P_16.5V
C661

R603 150 2K 0
100

R689 R698
Closed IC

R670 1K 1K 1K R613
R669 10K
VDDC

100 100
AVDDP1

FLASH_WP
AVDDP1

R604 R606 C601

AVDDP1

READY 1K 6.8K 47uF

READY 25V
0.1uF

4.7uF

R690 R699
C633 10uF

1uF

1K 1K 10k=>6.8k,Park
C636 0.01uF

C637 0.01uF
22K
22K
C635
C632

C634

PANEL_ON

P_DIM
LED_KEY
PANEL_STATUS

A_DIM
TUNER_SDA
TUNER_SCL

INV_ON
DDC_CTL
HDMI_5V_DET

TU_CTL_SIF
R643

R646
MNT_R_AMP
MNT_L_AMP

Close to IC as close as possible

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX64207701 2011/5/6
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MARIA8 128PIN 6 7

Copyright © 2011 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
 Power STAND_BY VOLTAGE
5V_M -> 1.2V_VDDC_M8, 3.3V_M
10K
R780 C773

0.1uF C774
16V 0.1uF

EP[GND]

VIN_3

PWRGD

BOOT
16V

EN
L711

16

15

14

13
3.6uH
VIN_1 1 12 PH_3
5V_M 1.2V_VDDC_M8
VIN_2
THERMAL
PH_2
LQH88PN3R6N38K
C771 C772
2 17 11 C780 OUT:1.27V
P703 10uF 0.1uF C777 C778 0.1uF
GND_1 3 IC702 10 PH_1
10V 16V 22uF 22uF 16V

22K 1% 24K 1%
SN1007054RTER C775 10V 10V
SMAW200-12 GND_2 SS

R783
4 9
0.01uF 50V

8
50V
100pF
C779
R1

AGND

VSENSE

COMP

RT/CLK

R784
16.5V R781
1 1/10W 330K 5%

R782 C776
7.5K 3300pF

P_16.5V 16.5V 1/16W 5% 50V

2 R2
3A
R785
GND Vout=0.8*(1+R1/R2) 75K
1/8W
3
1%

GND
4
IC704
AZ1085S-3.3TR/E1

5V INPUT 3 MAX 3A 2 OUTPUT OUT:3.3V 3.3V_M

5
P_5V C723 1 C729 1
0.1uF ADJ/GND 100uF R743
5V_M 50V 16V
5V C733
6 10uF
ST_3.3V 3.3V_M 10V
R712
3K
READY
GND
R754 R755 7
10K 10K 2SC3875S
Q701
R713 3
INV_ON 2 OLP OLP
10K 1 8
MULTI VOLTAGE
Inverter_ON
9 **Switch 12V:P12V, P5V -> 5V_12V_LCD **Switch 5V:P5V -> 5V_M
PWM_Dim
10
Q705
AO4813
A.Dim EBK60706901
11
MLB-201209-0120P-N2
L705 S2 D2_2 L708
P_5V 1 8 5V_LCD
NC 120-ohm R732
C721 120-ohm
12 READY 1uF C731 C745 C748
C718 33K 25V G2 D2_1 0.1uF R747 R749 R752 100uF 0.01uF PANEL
47uF 2 7 50V 4.7K 4.7K 4.7K 16V 50V
16V
READY ST_3.3V
R725 R706 R733 S1 D1_2
A_DIM 10K 0 R756 R765
10K
C719
3 6
C MMBT3904(NXP)
C706 10K 10K Q703 1uF
2.2uF R764 B 25V G1 4 5 D1_1
16V
R711 C 10K
PANEL_STATUS R729 B E
4.7K
C702
PANEL_ON 10K Q706
DC_DIM READY
0.47uF R727 E MMBT3904(NXP)
R709-*1 25V 10K
1K
PWM_DIM
R715 R709
P_5V 5V_M
P_DIM 1K 100 R734
22K C734 C737
R716 READY 10uF 0.01uF
C701 10V 50V
6.2K 2.2uF
16V R735
1.6K
C
MMBT3904(NXP)
R728 B Q704
POWER_SW 10K
E

READY
TUNER VOLTAGE IC706
AP1117EG-13

**DC-DC CONVERTER READY

C740
READY
C741 READY
IN 3
1
2 OUT
READY READY
5V_TUNER
C743 R759 C750

P_5V
L703
ST_5V P_16.5V
L702
16.5V_SAMP
16.5V->5V_TUNER 10uF
16V
10uF
16V 0.1uF
16V
ADJ/GND

READY
110 47uF
16V
READY
R740
1
120-ohm 500 R757 READY
C705 C709 C711 C703 C707 C712 330 C749
10uF 0.01uF 0.01uF 68uF 0.01uF 0.1uF 0.1uF
16V 50V 50V 35V 50V 50V 16V
DCDC_5V_TUNER
L706
16.5V TO 5V DCDC CONVERTER
120-ohm
AP2121N-3.3TRE1
IC701 16V
L709
VIN VOUT
L701 0.1uF IC703 6.8uH
3 2 C763
ST_5V MAX 300mA
ST_3.3V P_16.5V 16.5V_AOUT 5V_M TPS54331D
1 R745 READY 120-ohm
1 C714 C704 C708

SMAB34
GND 1uF 47uF 0.01uF
25V

D701
25V 50V R736 BOOT PH C764 C765 C766

R770
40V

499
C710 C713 4.7K 1 8 22uF 0.1uF
47uF READY
10uF 0.01uF 10V 50V
10V 25V 16V C769

1%
VIN GND 0.1uF
P_16.5V 2 7 50V

R771
20K
C760 C761
10uF 0.1uF EN COMP PARK
3 6
Power indicator 25V 50V

C767 C768

3.9K
R772
ST_5V SS/TR VSENSE
5V_M 4 5 47pF 4700pF
50V 50V
100K

C762 R742
27K
R741

FOR DEBUG FOR DEBUG 0.022uF

R701 R703 16V
10K 1.2K

FOR DEBUG
SAM2333
LD701

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EAX64207701 2011/5/6
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. POWER 7 7

Copyright © 2011 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
[ DESIGN CONCEPT ]

BIG-BANG (MSTAR) BIG-BANG Revision (MSTAR)

Module (HD) Speaker Module (HD) Speaker

Audio Amplifier Audio Amplifier

(Digital) (Digital)
MSTAR NPT3200L MSTAR TAS5709PHPR
(MARIA8) Hotel speaker out
(MARIA8) Analog AUDIO out
LGE7871 LGE7873

Digital Inputs Analog Inputs Digital Inputs Analog Inputs

HDMI RF/AV/COMPONENT HDMI RF/AV

Option
 Spec. Comparison

TV Minimalist & Value Maximizers

Spec
Maria8 (HD) Maria8-Revision (HD)

Main Chip MSTAR Maria8(LGE7871) MSTAR Maria8(LGE7873)

Module WXGA WXGA

PSU PSU (19”/22” Lips) PSU (22” Lips)
PCB Size 206 x 90.5 (2 Layer) 130 x 103 (2 Layer)
PIP N N

1080p input support N (Support up to 720p for Component/HDMI ) N (Support up to 720p for Component/HDMI )

1080p Panel support N N

AV Output X (Only Support AV Audio Output) X (Only Support AV Audio Output)

Hotel Speaker Out Optional X
HDMI 1EA 1EA
Component 1EA X
AV 1EA 1EA
S-Video X X

RGB_PC X X

RS-232 X X

USB (Function) X X

USB(D/L SVC) X X
Tuner 1EA 1EA
 UI Comparison

Item Detailed Item BigBang BigBang-Revision

UI OSD Font Type GUI Font Type GUI

Setup Program Edit Favorite Channel: supports 8 favorite Favorite Channel: supports 8 favorite
channel channel

Picture Picture Mode Vivid/Standard/Cinema Vivid/Standard/Cinema

(In Vivid/Standard/Cinema, Each (In Vivid/Standard/Cinema, Each items
items support User Mode) support User Mode)

Advanced Picture Mode value can be changed Picture Mode value can be changed for
Control for all mode all mode

Audio Sound Mode Standard/Music/Cinema Standard/Music/Cinema

(In Standard/Music/Cinema, (In Standard/Music/Cinema,
Support Treble & Bass setting for all Support Treble & Bass setting for all
input) input)
Clear Voice Not Support Not Support

Input Input List appearance in vertical box Input List appearance in vertical box

PIP Not Available Not Available

[ BLOCK DIAGRAM ]

POWER BOARD Module

P703 8 9 10 11 P204 P201 IR/KEY

Led_Power
P_16.5V

Led_Key
Inv. ON
P_5V

P Dim
A Dim

KEY
LVDS

OLP

IR
Output
66 55 58 59 79~88 105 107 52 106

26 4 SIF SAW
VIF_12V IC603 74 SPI_CLK 1
27 5 K9362M
Serial Flash 72 SPI_DI Input
LCD_5V

73 SPI_CZ
A_OUT_16.5V 2M
71
SPI_DO 25 4 VIF SAW
1
S_AMP_16.5V IC601 IC602 24 5 K7257M
67 Main SDA Input
EEPROM HDCP
24C64 24C08 68 Main SCL 17
MST7873KM 14.31818Mhz
18 AIF+ AIF-
ST_5V ST_3.3V
IC701
3.3V REG
IC604 10 11
4 4 RF_AGC

50 6 Tuner SDA
Main_5V IC704 Main_3.3V 49 7 Tuner SCL

Audio R-Out
Q705

Audio L-Out
3.3V REG
DUAL FET
AO4813 Main_1.2V
TUNER
IC702
DCDC

114115 116 117 70 69 102 103 110 111 12 35 36 42 43

5

Video In

Audio In
Audio In
S_AMP_19V B+
15 OP-AMP
2 3 I2S_MCLK D-SUB HDMI A_OUT_16.5V

((
20 IC502
I2S_WS SCL/SDA SCL/SDA Tuner_5V
21 x4 Gain
I2S_SCK
Sound AMP 22
1 I2S_SDO Audio IC703
TAS5709PH Out
Low Pass 46 Audio_SDA DCDC
FILTER 36 23 24 Converter

]
(( P501
39 IC501 Audio_SCL

JK201 P_16.5V
[ POWER FLOW DIAGRAM(1) ]
P204 : HD
SMAW200-11 Q705 L708
P703 5 P_5V 1A AO4813(Switching)
5V_LCD 1, 2, 3, 4, 5
5V 4.98V /
5.13V /
IC702 IC604 : MST7873KM IC604 : MST7873KM
5V_M
1.2V_VDDC_M8 44 , 77, 120 -----------------------------
5V 5.09V / 4 : AVDD_ADC
6 4, 11, 21, 22, 30, 46,
1.33V / 11 : AVDD_ADC
DCDC 60, 61, 63, 89, 101, 16 : AVDD_MPLL
118, 125 21 : AVDD_VIF
GND 3 16, 32, 109,
22 : AVDD_VIF
IC704 30 : AVDD_VIF
3.3V_M IC602 : HDCP EEPROM 32 : AVDD_AUSDM
GND 4 44 : VDDC_1
LDO 3.42V / 8 : VCC 46 : AVDDP1
IC603 : Serial Flash 60 : PWM1
NC 7 61 : PWM2
8 : VCC 63 : AVDDP1
L703 IC701 77 : VDDC_2
NC 8 IC601 : EEPROM
ST_5V ST_3.3V 89 : AVDDP1
8 : VCC 101 : AVDDP1
LDO 3.42V / IC501 : Audio Amp 109 : AVDDP2
Inverter_On 9
118 : AVDDP1
L203 13, 27
120 : VDDC_3
P201 : IR + LED 125 : AVDD_ADC
PWM_Dim 10 5.11V /
4 : ST_5V
TPS54331D
IC703
TU401 : TDTK-G701D(B+)
IC706
19V 1 1A 1A 5V_TUNER 5 : Tuner B+ IC501 : TAS5709
DCDC 5.08V / ------------------------
IC502 : Audio Amp 2 : PVDD_A_1,
L701 Vol Reg
3 : PVDD_A_2
4 : VCC
19V 2 P_16.5V 16V_A-Out 13 : AVDD
16.1V / 27 : DVDD
16.2V / IC501 : TAS5709PHPR 34 : PVDD_D1
L702 35 : PVDD_D2
16V_S-Amp 2, 3, 34, 35, 40, 41, 44, 45,
40 : PVDD_C1
A.Dim 11 16.1V /
41 : PVDD_C2
IC707 44 : PVDD_B_1,
1A 12V_VIF IF Pre-amp 45 : PVDD_B_2
AS7812ADTR-E1
DCDC 12.3V /
[ POWER FLOW DIAGRAM (2) ]
4 : VCC
C550
16.5V_AOUT 6 : INPUT2-
Audio Amp
Q503 R539 R544
7 : OUT2
R537 C555 C556 IC502
MNT_R OUT
1 : OUT1
Q502 R539 R541
4 : INPUT1-
R536 C553
MNT_R OUT C552
C511 C523 C525 2 : PVDD_A_1
3 : PVDD_A_2 Sound Amp
44 : PVDD_B_1
45 : PVDD_B_2 IC501
40 : PVDD_C_1 TAS5709PHPR
16.5V_SAMP C516 C509 C523 41 : PVDD_C_2
34 : PVDD_D_1
35 : PVDD_D_2

C602 (0.01uF/50V) EEPROM(A0)

8 : VCC
3.3V_M C603 (0.1uF/16V) R602 IC601 (AT24C64D-SSHM-T)
8 : VCC
3 : A2 HDCP EEPROM(A8)
7 : WP IC602 (CAT24C08WI-GT3-H-RECV)
R614 8 : VCC Serial Flash 2M
7 : HOLD IC603 (MX25L1606EM2I-12G)
R608(10K) C508 3 : AGC
L501 + 3.3V
Sound Amp
C504 27 : DVDD IC501 (TAS5709PHPR)
L504 13 : AVDD
C638
L602 46 : AVDDP1
R691 (56,63,89,101,109,118)
(Ready) 4 : AVDD_ADC (11,125) M-Star IC
21 : AVDD_VIF (22,30) IC604 (MST7873KM)
ST_3.3V R698(1K) 32 : AVDD_AUSDM
60 : PWM1
R689(1K) 61 : PWM0
[ ISP METHOD ]

ISP Program Download Method

1. Unzip H5 Mstar Program.zip file to HDD

2. PLUG DownLoad JIG to PC with USB Cable, then JIG RED LED on.

USB Cable to PC

Move Switch
to the Left-end
&
Right RED LED On

PLUG USB Cable

RGB(D-Sub) Cable to VSC(H5 TV)
3. After a few seconds later, new HardWare setup wizard window will pop up. – Ignore this
window (No Need to push anything).
You’ll see this window several times until finishing install DownLoad Program, but no need
to push anything for this window.
After finishing Installation, this window will be disappeared.

4. Execute Setup.exe in DB07-6 driver directory.(The location of directory can be different.)

Double Click !
5. Push Next(5-1), Select appropriate Directory Path and Push Next(5-2), and Push Next(5-3).

(5-1) Click ! (5-2) Click ! (5-3) Click !

6. While installation, Warning Windows pop up, then push continue.

(6-2) Click ! (6-3) Click !

(6-4) Click ! (6-5) Click !

7. After a minute, install will be finished.

(7-1) Click !

(7-2) Click !

8. Make a ISP_tool.exe short cut to desktop.

(8-1) Right Click !

(8-2) Fix the cursor to send(N) !

(8-3) Click “Make a short cut to desktop” !

S/W ISP Method
1. Connect the download jig to D-sub (RGB) jack

2. Execute ‘ISP Tool’ program, the main window (M star ISP utility Vx.x.x) will be opened
3. Click the “Connect” button and confirm “Dialog Box”
4. Click the “Config.” button and Change speed, I2C Speed setting : 350Khz~400Khz

5. Read and write bin file, Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.
6. Click “(2)Auto” tab and set as below

7. Click “(3)Run”.

8. After downloading, you can see the “(4)Pass” message.

[ TROUBLE SHOOTING GUIDE ]

No power
(LED indicator off)
: [A] PROCESS

Fail
Check 5V
Change Power B/D
of Power B/D

Pass

Check Voltage of P201#4 Fail

Change Main B/D
St_5V

Pass

Fail
Check LED Assy Change LED Assy

Pass

Check P201 Connector

 No Raster [B]: Process

Pass

Check LED status

Repeat A PROCESS
On Display Unit Fail

Pass

Check Panel Link Cable Change Panel Link Cable

Or Module Fail Or Module

Pass

Check Inverter Connector Change Inverter Connector

Or Inverter Fail Or Inverter

Pass

Check Output of Q705 Change Q705

Fail

Pass

Check LVDS Cable Change Module

Fail
 No Raster on HDMI Signal
No Raster on COMPONENT Signal

Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass

Pass Check the Input/Output Re-soldering or

Of JK301 Fail Change the defect part
Check The Input/Output Re-soldering or
Of JK101 Change the defect part Pass
Fail

Check EDID state in SVC Mode Re-Download software

Pass Fail

Check the Input/Output Re-soldering or Pass

Of IC604 Fail Change the defect part
Check the Input/Output
Of IC602 Re-soldering or
Fail
Change the defect part

Pass
Repeat [A], & [B] Process

Check the Input/Output Re-soldering or

Of IC604 Fail Change the defect part

Pass

Repeat [A], & [B] Process

No Raster On AV Signal No Signal On TV(RF) Signal

Pass Pass

Check Input source

Check Input source Cable And Jack
Cable And Jack

Pass
Pass

Check The Input/Output Re-soldering or

Check The Input/Output Re-soldering or Of TU401 Fail Change the defect part
Of JK101 Fail Change the defect part
Pass

Pass
Check the Input/Output Re-soldering or
Of IC703 Fail Change the defect part
Check the Input/Output Re-soldering or
Of IC604 Fail Change the defect part Pass

Pass Check the Input/Output Re-soldering or

Of L402,L403 Fail Change the defect part

Repeat [A], & [B] Process

Pass

Repeat [A], & [B] Process

 No Sound

Check The Input Sourse Change The Source Input

Fail

Pass

Check The Input/Output Re-soldering or

Of IC501 Fail Change the defect part

Pass

Check The Speaker Change Speaker

Fail

Pass

Check The Speaker Wire