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Typical Application
PVCCR
PVCCR
GND
GND
10 μ F 10 μ F
ROUTN
ROUTN
PVCCR
PGNDR
PGNDR
ROUTP
BSRP
BSRN
ROUTP
PVCCR
1μF
1μF
RINN VCLAMPR
RINN GND
1μF
RINP RINP SD SHUTDOWN
1μF AGND
GND AVDD
GND
1μF
VREF V2P5 GND
VCC
VOLUME VOLUME
REFGND
PAM8610 AVCC
10 μ F 100nF
MUTE
MUTE
GND
AGND1 AGND
120K GND
FADE FADE ROSC
1μF COSC
LINP LINP
220pF GND
1μF LINN VCLAMPL
LINN
1μF
GND
PGNDL
LOUTN
LOUTN
PVCCL
PVCCL
PGNDL
LOUTP
LOUTP
BSLN
BSLP
1μF 1μF
10 μ F 1μF 1μF 10 μ F
PVCCL
PVCCL
GND
GND
Block Diagram
BSRN
PVCCR
Driver ROUTN
_ PGNDR
RINN - + + PAM
_ Modulation BSRP
RINP + - + PVCCR
Driver ROUTP
VOLUME PGNDR
Gain
Feedback
FADE Adjust System
AVCC
ROSC AGND
osc
COSC
SD Biases &
LDO References
V2P5
BSLN
MUTE
PVCCL
Driver LOUTN
_ PGNDL
LINN - + PAM
+ _ Modulation BSLP
LINP + - + PVCCL
Driver LOUTP
PGNDL
Feedback
System
ROUTN
ROUTN
PVCCR
PGNDR
ROUTP
PVCCR
ROUTP
BSRN
BSRP
40 39 38 37 36 35 34 33 32 31
RINN 1 30 VCLAMPR
RINP 2 29 SD
LINP 9 22 COSC
LINN 10 21 VCLAMPL
11
12
13 14 15 16 17 18 19 20
PGNDL
PVCCL
LOUTN
PGNDL
PVCCL
BSLN
BSLP
LOUTP
LOUTP
LOUTN
Pin Descriptions
Pin Number Name Function
1 RINN Negative differential audio input for right channel
2 RINP Positive differential audio input for right channel
3 AVDD 5V Analog VDD
4 VREF Analog reference for gain control section
5 VOLUME DC voltage that sets the gain of the amplifier
Ground for gain control circuitry. Connect to AGND. If using a DAC to control the
6 REFGND
volume, connect the DAC ground to this terminal.
7 AGND1 Analog GND
Input for controlling volume ramp rate when cycling SD or during power-up. A
8 FADE logic low on this pin places the amplifier in fade mode. A logic high on this pin
allows a quick transition to the desired volume setting.
9 LINP Positive differential audio input for left channel
10 LINN Negative differential audio input for left channel
11,20 PGNDL Power ground for left channel H-bridge
12,19 PVCCL Power supply for left channel H-bridge, not connected to PVCCR or AVCC.
13,14 LOUTN Class-D 1/2-H-bridge negative output for left channel
15 BSLN Bootstrap I/O for left channel, negative high-side FET
16 BSLP Bootstrap I/O for left channel, positive high-side FET
17,18 LOUTP Class-D 1/2-H-bridge positive output for left channel
21 VCLAMPL Internally generated voltage supply for left channel bootstrap capacitors.
I/O for charge/discharging currents onto capacitor for ramp generator triangle
22 COSC
wave biased at V2P5
23 ROSC Current setting resistor for ramp generator. Nominally equal to 1/8*VCC
24,28 AGND Analog GND
25 MUTE A logic high on this pin disables the outputs and a logic low enables the outputs.
26 AVCC High-voltage analog power supply (7V to 15V)
2.5V Reference for analog cells, as well as reference for unused audio input
27 V2P5
when using single-ended inputs.
Shutdown signal for IC (low= shutdown, high =operational). TTL logic levels with
29 SD
compliance to VCC.
30 VCLAMPR Internally generated voltage supply for right channel bootstrap capacitors.
31,40 PGNDR Power ground for right channel H-bridge
32,39 PVCCR Power supply for right channel H-bridge, not connected to PVCCL or AVCC.
33,34 ROUTP Class-D 1/2-H-bridge positive output for right channel
35 BSRP Bootstrap I/O for right channel, positive high-side FET
36 BSRN Bootstrap I/O for right channel, negative high-side FET
37,38 ROUTN Class-D 1/2-H-bridge negative output for right channel
Thermal Information
Parameter Package Symbol Maximum Unit
Thermal Resistance
QFN 6mm*6mm θJC 7.6
(Junction to Case)
°C/W
Thermal Resistance
QFN 6mm*6mm θJA 18.1
(Junction to Ambient)
Electrical Characteristic
T A=25 °C , V DD=12V,R L=8 Ω (unless otherwise noted)
0.02 0.1
V DD=15V
0.01 0.06
10m 20m 50m 100m 200m 500m 1 2 5 10 20 50 100 200 500 1k 2k 5k 10k 20k
W
Hz
0.2 0.2
0.1
0.1
0.05 Gv=12dB
0.02 Gv=18dB 0.05 Gv=12dB
0.01 0.03
10m 20m 50m 100m 200m 500m 1 2 5 10 20 50 100 200 500 1k 2k 5k 10k 20k
W Hz
50
5
20
V DD=15V
10
2
5
V DD=12V
Po=1W
2 1
% 1 V DD=7V %
0.5
Po=3W
0.5
0.2
0.1 0.2
0.05
0.1
0.02 Po=5W
0.01 0.05
10m 20m 50m 100m 200m 500m 1 2 5 10 20 30 20 50 100 200 500 1k 2k 5k 10k 20k
W Hz
50
5
20
10
5
f=10kHz 2
2 f=500Hz 1 V DD=7V
% 1 %
W Hz
50
5
20
10 2
5
1
2
0.5
Gv=18dB Gv=32dB
% 1 Gv=32dB %
0. 5
0.2
0. 2
0. 1 0.1
0.02
0.01 0.02
10m 20m 50m 100m 200m 500m 1 2 5 10 20 20 50 100 200 500 1k 2k 5k 10k 20k
Hz
W
d d -70
-50 B
B -80
V
-60 -90
-100
-70
-110
-80 -120
-90 -130
-140
-100 -150
10 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k 20 50 100 200 500 1k 2k 5k 10k 20k
Hz Hz
-55
-10
-60
-20
-65
-30
-70
d
d
L to R B
-75 r -40
B
-80 A
-50
-85
-60
-90
-70
-95 R to L
-100 -80
20 50 100 200 500 1k 2k 5k 10k 20k 20 50 100 200 500 1k 2k 5k 10k 20k
Hz Hz
+4 90
+3 80
+2 70
60
Efficiency(%)
+1
d
B
r +0 50
A -1 40
-2 30
-3 20
-4 10
-5 0
20 50 100 200 500 1k 2k 5k 10k 20k 30k
0 1 2 3 4 5 6 7 8 9 10
Hz
Output Power(W)
16
14
THD+N=10%
Output Power (W)
12
Gain (dB)
10
6
THD+N=1%
4
0
7 8 9 10 11 12 13 14 15 0 0.4 0.8 1.2 1.6 2 2.4 2.8
20. Quesicent Current vs Supply Voltage 22.Power Dissipation vs. Output Power
25 4
3.5
20
Quiescent Current (mA)
Power Dissipation(W)
2.5
15
2
10
1.5
1
5
0.5
0 0
7 8 9 10 11 12 13 14 15 0 3 6 9 12
Supply Voltage (V)
Output Power (W)
Two channels driven
Note:
PCB information for power dissipation measurement.
1. The PCB size is 74mm * 68mm with 1.2mm thickness,
two layers and Fr4.
2. 16 vias at the thermal land on the PCB with 0.5mm
diameter.
3. The size of exposed copper is 10mm*10mm with
3oz thickness.
Power Supply
Notes
1. The AP AUX-0025 low pass filter is necessary for class-D amplifier measurement with AP analyzer.
2. Two 22μH inductors are used in series with load resistor to emulate the small speaker for efficiency
measurement.
Application Information
Power and Heat Dissipation If the rated workable junction temperature is
150°C, the relationship between ambient
Choose speakers that are able to stand large temperature and permitted P loss is shown in below
output power from the PAM8610. Otherwise, diagram.
speaker may suffer damage.
Generally, class-D amplifiers are high efficiency Filters are not required if the traces from the
and need no heat sink. For high power ones that amplifier to the speakers are short (<20cm). But
has high dissipation power, the heat sink may also most applications require a ferrite bead filter as
not necessary if the PCB is carefully designed to shown in below figure. The ferrite bead filter
achieve good heat dissipation by the PCB itself. reduces EMI of around 1MHz and higher to meet
the FCC and CE's requirements. It is
Dual-Side PCB recommended to use a ferrite bead with very low
To achieve good heat dissipation , the PCB’s impedances at low frequencies and high
copper plate should be thicker than 0.035mm and impedance at high frequencies (above 1MHz).
the copper plate on both sides of the PCB should
be utilized for heat sink.
Ferrite Bead
OUTP
The thermal pad on the bottom of the device OUT+
should be soldered to the plate of the PCB, and
via holes, usually 9 to 16, should be drilled in the 200pF
PCB area under the device and deposited copper
on the vias should be thick enough so that the Ferrite Bead
heat can be dissipated to the other side of the OUTN
plate. There should be no insulation mask on the OUT-
other side of the copper plate. It is better to drill 200pF
more vias on the PCB around the device if
possible.
Vertical Polarization
4-layer PCB
If it is 4-layer PCB, the two middle layers of Horizontal Polarization
grounding and power can be employed for heat
dissipation, isolating them into serval islands to
avoid short between ground and power.
Ordering Information
PAM8610 X X
Shipping
Package Type
PAM8610
PAM8610TR QFN 6mm*6mm 3,000 units/Tape & Reel
XATYWWLL
Please consult PAM sales office or authorized distributors for more details.
Outline Dimension
40pin QFN
QFN
Unit: Millimeter