Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Transistor Technologies
Chenming Hu
Univ. of California
2
Chenming Hu, July 2011
Other Background Info
• TSMC, IBM…new transistors soon
• Since 2001 ITRS shows FinFET and
ultra-thin-body UTB-SOI as the two
successor MOSFETs
• SOITEC UTB-SOI recently available
• IBM 2009 5nm UTB SOI paper
3
Chenming Hu, July 2011
New MOSFET Structures
Cylindrical FET
4
Chenming Hu, July 2011
Good Old MOSFET Nearing Limits
Vt, S (swing) and Ioff
are sensitive to Lg &
dopant variations.
Need smaller
S and less
variations of
S and Vt
7
Chenming Hu, July 2011
How Vt Variation & S Got So Bad
MOSFET becomes “resistor” at very
small L –- Drain competes with Gate to
control the channel barrier.
Drain Current, IDS (A/µm)
10-3
L
Gate
Gate
10-5
Cg Insulator
10-7 Smaller
Size
Source Drain
size
shrink
10-9
or larger Vd Cd
10-11
0.0 0.3 0.6 0.9
Gate Voltage, VGS (V)
Chenming Hu, July 2011
Reducing EOT is Not Enough
Gate
Source Drain
Leakage Path
Source
Gate
Source Drain
Gate
Drain
Fin Height
FinFET body is a Fin Width
thin fin N. Lindert et al., DRC paper II.A.6, 2001
0.2
ΔVt [V]
0.0
-0.2
-0.4
Fin width: 20 nm
-0.6
0 10 20 30 40 50
Lg [nm]
STI Si
STI
28nm SoC
C.C. Yeh et al.,
2010 IEDM
Lg =
5 nm
1.E-12
0 0.2 0.4 0.6 0.8 1
Y-K. Choi, IEEE EDL, p. 254, 2000
Gate Voltage [V]
ETSOI, IBM
K. Cheng et al, IEDM, 2009
Gate 1
Gate 2
Si
STI
STI
0 1p 1p
0.0 0.4 0.8 1.2 0.0 0.4 0.8 1.2 0
0.0 0.4 0.8 1.2
Gate Voltage (V)
Gate Voltage (V) Drain Voltage (V)
M. Dunga, 2008 VLSI Tech Sym
Chenming Hu, July 2011
Chenming Hu, July 2011
Chenming Hu, July 2011
Chenming Hu, July 2011
Chenming Hu, July 2011
Reduce C
f ⋅ C ⋅Vdd
2
30
Chenming Hu, July 2011
Vacuum-Sheath Interconnect
Load Capacitance : CO
Dielectric Beam
1.4
1.5
1.6
2.9
1.7
1.8
1.9
2.0
3.3
2.1
2.3 2.2
2.4 No Solution
3.6 2.5
No Solution
2.6
3.9
20 30 40 50 60 70 80
Air Percentage (%)
Gate
Scale Down
Vacuum
Spacer
Oxide
Self-
Spacer
aligned
Vacuum contact
Oxide (SAC)
Inverter 6.15 5.05
Delay, ps (1) (0.82)
Inverter
24.2 18.8
switching
(1) (0.78)
energy, fJ
Relative
1 0.7
Area
S<60mV/dec
Log Drain Current Id
S>60mV/dec
Gate Voltage Vg
35
Chenming Hu, July 2011
How to reduce Vdd to 0.15V?
COX
A potential
barrier controls Ec
the electron flow. Ev
Source Channel Drain
S N+ N-
- P+ D
Buried Oxide
P+ Gate
Pocket
Hole flow
Electronband
Energy flow diagram P+ Drain
N+ Source
1E-06
Eg=0.69eV, Vdd=0.5V, EOT=7 Å, CV/I=2.2pS
1E-07
1E-08 Eg=1.1eV, Vdd=1V, EOT=10 Å, CV/I=4.2pS
1E-09 Eg=0.36eV
1E-10 Eg=0.69eV
Eg=1.1eV Lg=40nm
1E-11
0.0 0.2 0.4 0.6 0.8 1.0
100
50
0
0 50 100 150 200
Input Voltage, VIN (mV)
Gate Oxide
Gate
Ge Substrate Ge tFET
~ ~ Si-Ge HtFET
Si Ge