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Low voltage Low power CMOS Analog Building Blocks for Mobile
Microelectronics Applications
Article
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5 authors, including:
Mohammed Ismail
The Ohio State University
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Changku Hwang1 2 , Akira Hyogo3 , Mohammed Ismail2, Ali Motamed4 and Hong-sun Kim2
;
Recently there is a great demand for lighter hand-held mobile microelectronics with longer battery life-
time. This type of microelectronics requires reduced supply voltage and low power consumption. Hence it
is no doubt that LV/LP IC circuits must be developed.
As the level of integration in RF transceivers increases, CMOS will emerge as the technology with the
greatest potential for cost eectiveness. This will be particularly true when mobile, wireless communication
is integrated in future multimedia systems [1, 2, 3]. Most of the key building blocks for a complete RF front-
end for personal communication systems applications have recently been demonstrated in CMOS, including
complete RF ICs [4]. Because baseband digital circuitry is currently implemented in standard sub-micron
CMOS, there is a tendency to use the same digital CMOS processes for baseband data converters and analog
building blocks.
In this paper we introduce several CMOS analog building blocks useful for such baseband analog signal
processing, especially operating with low supply voltage and low power consumption;LV CMOS composite
cells, LV OpAmp input stage with rail-to-rail constant-gm, single-ended-input fully balanced-output circuit,
LV multiplier and CMOS pseudo exponential current-to-voltage converter for variable gain amplier(VGA).
where Keq and VTeq1 are the equivalent transconductance parameter and the threshold voltage, respectively,
1
Vd
VDD Mpcm VDD
Vd
Id IB
Vg Id
Id Vg Id Vg
Vtn+|Vtp| Mn1 Mn2 Mn1 Mn2
Vg
Mp1
Vtn Vs Vs Vs
Vs IB
IB Mp1 Id
Id
VSS VSS
Conventional
Single Composite
Tr Tr Cell1 Cell2
IB
Id Id Id
Mn3 Id
Id1 Id2 Id
Vg (=Id1) Vg
Mn1 Mn2 Mp1 Vy Mn1 Mn2
Mp1
Vs Vg Mn1 Mn2
Mp1 Vs
Id Id
Id Vx Vs Id
Id
IB Id3 IB
Mn5 Mn4
VSS VSS
VSS
Cell3 Cell4
Cell5
IB
IB IB
Id Id Id Id Id Id
Id Id
Id
Vg Vg Vg
Mn1 Mn2 Mn1 Mn2 Mn1 Mn2
Mp1 Mp1
Mp1 Vs
Vs
Id Id Id
Id Vs Id
IB IB IB
Id
given by
,2
Keq = (p 1 + p1 ) (2)
Kn1 Kp1
s
VTeq1 = j VTp j , 2(IBK, Id ) (3)
n2
2
In the case where IB Id the above equation can be simplied as
r
VTeq1
2IB
= j VTp j , K (4)
n2
which is much less than the equivalent threshold voltage VTeq =j VTp j +VTn of the conventional composite
transistor[7](see Fig.1) and hence is suited for LV application.
Modications[8] of Cell1 and Cell2
As described previously, both circuits should satisfy the assumption that IB Id to reduce VTeq1
variation in Eq.(3). Otherwise it could degrade the accuracy of signal. Therefore, IB has to be set at much
larger value than the maximum Id , implying that Id can not be increased more than IB . This causes high
power consumption at quiescent conditions due to the large IB . This problem can be overcame by using the
following methods;
2. an adaptive bias technique (Cell4&5 based on Cell1 and Cell6; 7&8 based on Cell2).
In order to cancel Id eect in Eq.(3), the current IB + Id can be used instead of the constant current
IB . For this purpose, a current mirror circuit is used to copy Id and add it to IB . The summed current
IB +Id is replaced with IB in the second term of the right hand side in Eq.(3). Thereby, Eq.(3) becomes
Eq.(4) which is constant regardless of the input voltages applied.
The proposed circuits have been simulated using MOSIS 2m n-well process with VTn =0:82V and
VTp =,0:88V and a supply voltage of 3V . The drain currents of each cell(Cell1-4; 6; 8) with IB =120A,
a single NMOS transistor with Kn and VTn equivalent to Keq and VTeq1 (Eq.(4)), respectively and numerical
evaluations of Eq.(1) with Keq and VTeq1 (Eq.(4)) are shown in Fig.2 (a) as a function of Vg with Vs =0:5V
where each cell exhibits square law drain current characteristic on Vgs . Similar simulation is performed with
IB =12A in Fig.2 (b). It should be noted in this gure that the drain currents of Cell3 , 8 can increase
3
80u 80u
Id Id
[A] Vs=0.5V [A] Vs=0.5V
60u 60u
40u 40u
20u 20u
0 0
1 1.5 2 2.5 3 1 1.5 2 2.5 3
Vg [V] Vg [V]
cell1 cell2 cell1 cell2
cell3 cell4 cell3 cell4
cell6 cell8 cell6 cell8
single Tr Eq.(1) single Tr Eq.(1)
(a) (b)
Figure 2: DC characteristics of Cell1-8 (a) IB =120A and (b) IB =12A.
beyond IB (=12A).
io = I2 + I3 , I1 , I4 (5)
= Keq (V1 , V2 ) (V3 , V4 )
Fig.3 (b) shows the region of operation for this multiplier. For a symmetric operation, i.e. when the
4
I1 I3 I4 I2
IB
V1 V1
V3 V4
V2
IB
(a)
V3,4
Maximum
3 Symmetric
Operating
Region
3-|Vtp|-|Vds,sat|
1 Operating
Region
0.5
0 V1,2
Vtn+Vds,sat 2 2.5 3
(b)
0.12 0.12
Vout V34=1.0V Vout
[V] [V]
0.2V
0.00 0.0V 0.00
-0.2V
-0.06 -0.6V -0.06
-1.0V
-0.12 -0.12
-1 -0.5 0 0.5 1 100n 150n 200n 250n 300n
V12 [V] Time [s]
(a) (b)
Figure 4: Multiplier characteristics (a) DC and (b) Transient
5
input voltages have the same dierential input magnitudes v12;max = v34;max =1Vpp , VCM 1 and VCM 2
should be set to 2.5V and 0.5V, respectively and it is pictorially illustrated as rectangular, double cross
hatched region. Fig.4 (a) and (b) show DC and transient characteristics of the multiplier with simple
resistor/capacitor load(Ro=5k
/Co=0.1pF), respectively. In (b) two 1Vpp input signals with frequencies
of 10MHz and 100MHz are modulated. For the simulations, the input common mode voltages used are
VCM 1 =2.5V and VCM 2 =0.5V with a single supply of 3V.
V1 Io
ANALOG MULTIPLIER
V2
V3 V4
V3-V4
Ic or Vc
Ic or Vc
A VGA with an exponential gain control characteristic is desired in applications where wide range gain
control is required; that is, the gain should increase monotonically on a decibel scale with linear increments
in gain control signal. To fulll this need, a new pseudo-exponential voltage generator[9] is introduced in
this section. This very compact and power ecient CMOS circuit oers a superb exponential characteristic.
The generated voltage is ideally suited as a gain control voltage, VV GA;C , in a CMOS VGA circuit built,
e.g., using a voltage multiplier introduced in section 4 with VV GA;C applied to two of the multiplier's four
inputs as shown in Fig.5.
The gain control signal IC of the pseudo-exponential voltage generator shown in Fig.6 (a) is a bidirectional
6
VDD 3
10
f(y), n=1
f(y), n=2
P2 P1 2
10
f(y), n=3
Exp(2ny), n=2
1
I1 I1 10
Ic
Vc 0
10
I2 I2
−1
10
|−−−−− Error < 2% −−−−−|
−0.24 0.24
N2 N1 −2
10 |−−−−−−−− Error < 5% −−−−−−−−|
−0.32 0.32
(a) (b)
Figure 6: (a) Back-to-Back connection of two 1:1 current mirrors. (b) Exp(2ny) with n=2 and f (y) with
n=1, 2 and 3 as a function of y. This gure also shows the regions where the error is less than 2% and 5%
when n=2.
current with positive direction chosen to be outward. Assuming K = Kn1 = Kn2 = Kp1 = Kp2 , we have
The function f (y) is a close approximation of the exponential function Exp(2ny). Fig.6 (b) shows f (y) with
n=1 [10], 2 and 3 and Exp(2ny) with n=2 on semi-logarithmic coordinates and denes the range where the
7
approximation with n=2 holds within less than 2% and 5% error. Note that a larger n yields a larger control
range for f (y).
−5 −5
x 10 x 10
4 4
I2 I1
I1 and I2 [A]
2 3
Kn=7.1E−5
2
0
−4 −3 −2 −1 0 1 2 3 4 Kp=7.1E−5
(a−1) Ic [A] −5
10 x 10
1
I1/I2
Ic [A]
5 0
0 −1
−4 −3 −2 −1 0 1 2 3 4
(a−2) Ic [A] −5
x 10
20 −2
I1/I2 [dB]
0
−3
−20
−4 −3 −2 −1 0 1 2 3 4 −4
(a−3) Ic [A] 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2
−5
x 10 Vc [V]
(a) (b)
Figure 7: (a) (a-1):Simulated currents I1 and I2 of the circuit of Fig.6 (a) (a-2):the ratio II21 (a-3):the ratio
I1 expressed in dB. (b) Simulated input voltage-current characteristic of Fig.6 (a)
I2
Fig.7 (a-1) shows the simulated currents I1 and I2 in Fig.6 (a) as function of the control current IC . As
stated previously IC can assume both positive and negative values. Fig.7 (a-2) depicts the ratio II12 as IC is
varied from -30A to 30A. The accuracy of the approximation is shown more clearly by plotting the graph
on a semi-logarithmic scale as depicted in Fig.7 (a-3) which shows a control range of 40dB.
The two current mirrors of Fig.6 (a) have another interesting characteristic as revealed by Eq.( 7), which
is a constant linear resistance at the input terminal. The resistance can simply be found by examining
Eq.( 7) and can be expressed as
Rin = K (V 1 (11)
DD , j VTp j ,VTn )
The negative sign in Eq.( 7) appears because the positive direction of IC is chosen to be outward as shown
in Fig.6 (a). A constant input resistance implies that the circuit is responsive to a gain control voltage VC as
well as a gain control current. This property is useful if the gain control signal is in voltage form. Fig.7 (b)
shows the simulated input voltage-current characteristics of this circuit where the slope of the line represents
8
the input conductance. Note that VC should vary from almost 1.2V to 1.9V in order to obtain the same
eect as sweeping IC from -30A to 30A.
VDD
P5 P3 P1
P4 P2
I1 I1
I2
Ic
vds Vd
To Vd
I2 I2
vds VG
N4 N3 N2 N1
To Vs
Ic
VSS
(a)
0.5
0.4
Vds [V]
0.3
0.2
0.1
0
−4 −3 −2 −1 0 1 2 3 4
−5
x 10
Ic [A]
0
−10
Vds [dB]
−20
−30
−40
−4 −3 −2 −1 0 1 2 3 4
−5
x 10
Ic [A]
(b)
Figure 8: (a) The complete circuit diagram of the exponential current-to-voltage converter (b) the simulated
output voltage, vds
Fig.8 (a) shows the complete circuit diagram of the pseudo-exponential voltage generator. The current
mirror P3-P4 is used to direct the current I2 to the drains of P5 and N4. A constant resistance, similar to
Rin in Eq.(11), is seen at the common drain node of the two diode connected transistors, P 5 and N 4 which
is also the gate of N 3. It converts the current I2 to a voltage, VG3 , which can be expressed by Eq.(7) with
IC replaced by I2 . Transistor N3 operates in the triode region and acts as a voltage controlled resistor. For
small drain-source voltages, the resistance exhibited by N3 is RDS ' Kn3 (VG13 ,VTn) . Hence, I1
ows through
N3 and generates a drain-source voltage, VDS = RDS I1 , proportional to II12 . Fig.8 (b) shows the simulated
9
drain-source voltage of N3 using both linear and logarithmic scales versus IC which shows close to 30dB
control voltage range. This has been veried experimentally in a 3V CMOS AGC test chip [5] fabricated in
a 2m process.
and constant gm can be obtained by subtracting them at the following gain (or output) stage at any common
mode input voltage.
The measured transconductance of n-, p-pair and total, namely gmn, gmp and gmt in strong inversion is
shown in Fig.9 (b-1) with dierent bias currents (IB =4, 6 and 8 A). This gure depicts that the maximum
10
VDD
P6 P5 IB P3 P4
In2 Ip In1
M1 M2
Vb
P2 N2 N1 P1
Ip2 Ip1
Io2
In
Io1
IB
(a)
−5
x 10
8
gmn, gmp and gmt (A/V)
gmt(8u)
6
gmt(6u)
4
gmt(4u)
2 gmn(4u) gmp(4u)
0
0 0.5 1 1.5 2 2.5 3
(b−1)
−7
x 10
5
gmn, gmp and gmt(A/V)
3
gmt(20n)
2
1 gmn(20n) gmp(20n)
0
0 0.5 1 1.5 2 2.5 3
(b−2) VCM
(b)
Figure 9: (a) A new, simple input stage to achieve programmable rail-to-rail constant-gm and (b) measured
transconductances (b-1) in strong inversion (IB =4, 6 and 8A) and (b-2) weak inversion (IB =20nA)
gmt variation is less than 5%. The transconductance in weak inversion is also measured and shown in Fig.9
(b-2), where the maximum gmt variation is around 17% which is mainly cause by the larger slopes of the gmn
and gmp curves near both ends of the input common mode voltage and the mismatch of the slope factors of
n- and p-MOS transistors.
11
at the outputs is useful for this purpose due to its symmetric circuit structure. In modern CMOS process,
however, the value of R varies by more than 30% from its nominal value and IB variation is not neglectable,
either. Thus, the output common mode voltage, Vo;com =R IB is deviated from the targeted level by, in
worst case, more than 50%. This could cause malfunction of the following circuit due to the deviation of
the DC operating voltage from the desired value and limit signal swing at the outputs of SFC as well. In this
section we intorduce a new SFC composed of a voltage-to-current(V-I) converter with simple resistive load
at the outputs and active current common mode feedback(CMFB) circuit[16]. This SFC generates Vo;com
independent of process variation of resistors and is determined only by a preset dc common mode level Vcom .
Vin Io+
Vo+
V-I Converter
Vref Vo-
Io-
Icom,f Vc R R
Fig.10 illustrates a general block diagram of the proposed SFC with a new active current CMFB circuit.
Vin is single-ended input signal with dc level of Vref . A common mode signal(CMS) corrector in the feedback
path generates a corrected signal Vc proportional to the dierence between Icom;f and Icom that are produced
in the V-I converter and bias circuitry, respectively. This Vc again stabilizes Icom;f in such a way that the
sum of the two output currents Io+ and Io, is equivalent to Icom . In this way, Vo;com of SFC is set at the
desired level, i.e. the preset DC voltage Vcom . This operation is explained in details with the MOS circuit
implementation shown in Fig.11. The CMS generator outputs a common mode current Icom given by
Icom = 2 Vcom
R
(14)
12
V-I Converter CMS Corrector CMS Generator
Icom;f ,
owing through M 11 and M 12 in Fig.11, are compared at node C and CMS corrector generates
control voltage Vc proportional to the dierence between Icom and Icom;f . This Vc adjusts Icom;f to equal
to Icom by means of negative feedback formed by M 3 , M 8 and M 11 , M 15. Current mirrors M 3; M 9 and
M 4; M 10, copy Icom;f
2
at the two outputs, resulting in
Consequently, the common mode output voltage always equals to a preset dc voltage Vcom independent of
R variations.
On the contrary, the current Icom;f does not vary with dierential mode input voltage because any current
increase(decrease) in Icom;f + results in the same amount of current decrease(increase) in Icom;f , and thus
the CMFB circuit seems deactivated for the dierential mode input voltage. This makes the outputs of SFC
interact only with the dierential mode input voltage.
To verify that the proposed circuit should generate Vo;com equal to a preset DC voltage regardless of R
variations, the circuit was simulated with 4 dierent values of R, i.e. R=5, 10, 15 and 20k
and 0.5Vpp input
signal with frequency of 1MHz as shown in Fig.12 (a). The R variation corresponds to 100% deviation
13
Vout [V] Vout [V] Vo+ Vo-
Vo+ Vo-
2
1.75
1.5
1.25
VII. Conclusion
Several analog basic building blocks for baseband analog signal processing in mobile microelectronics
applications have been introduced. These blocks are particulraly suitable for low voltage and low power
operation in standard CMOS VLSI technologies.
14
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