Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
(Received 21 January 2016; revised manuscript received 09 June 2016; published online 21 June 2016)
The thermal conductivity of the composite materials based on the zinc oxide powders with different av-
erage particle sizes (micrometer, submicrometer and nanometer) dispersed in the polymethylsiloxane (sili-
cone oil) was measured using the radial heat flow method. The thermal conductivity of the composite ma-
terial based on the commercial ZnO micropowder with an average particle size of 50 m was found to be
0.8 W/(m∙K). The thermal conductivity of the composite material on the basis of ZnO nanopowder with an
average particle size of approximately 3 nm synthesized using the wet chemistry methods was found to be
2.5 W/(m∙K). The discovered enhancement of the above mentioned parameter is considered as manifesta-
tion of the quantum size effects in heat transfer.
* tyrko_borys@ukr.net
of the composite layers; l – the length of the cylindrical is known to be equal α 0.15 W/(m∙K) at room temper-
composite layer; U – the voltage on the heater; I – the ature [12]. Besides, it is known [4, 5, 13], that the coef-
current in a heater. ficient of thermal conductivity of ZnO single crystals is
in the range from 100 W/(m∙K) up to 120 W/(m∙K) and
depends on the manufacturing technology and pro-
cessing samples.
The heat transfer in the semiconductors is de-
scribed by [14]:
αe L∙∙T, (7)
L (s + 2)(k/e)2, (8)
02004-2
THERMAL CONDUCTIVITY OF ZINC OXIDE… J. NANO- ELECTRON. PHYS. 8, 02004 (2016)
the bipolar thermal conductivity depends on the con- the flow and the temperature jump on the interface:
centration of the electron-hole pairs and the band gap.
For the bipolar thermal conductivity one can use q ΔT/hK, (12)
the same relation as for the case of the electronic ther- where q - is the heat flow through the interface; ΔT -
mal conductivity: temperature difference at the interface; hK - Kapitza
αbp Lbp∙∙T, (9) resistance.
In spite of the widely spread application of these ide-
where Lbp – is the analogue of the Lorentz number, but as, Khalatnikov model is highly idealized and implies a
for a bipolar thermal conductivity. quite large error. The model does not consider the sur-
The photon thermal conductivity is relevant for the face roughness, possibility of mutual diffusion of the two
semiconductors with a low enough absorption coeffi- materials, quantum size effects, energy release directly
cient in the region of thermal radiation. In this case the on the interface at phonons scattering and so on. Never-
photons are characterized by a large mean free path, theless, the equation (12) in many cases is acceptable.
and it is necessary to take into account the contribution Under such circumstances the experimental studies of
of the heat transfer due to the electromagnetic radia- Kapitza resistance changes depending on the type of
tion. material, temperature, manufacturing technology of the
The photon thermal conductivity αphot can be esti- contacts and other conditions are of great importance.
mated using the Genzel's relation [16]: Recently, many researches are devoted to minimi-
zation of Kapitza resistance - creating of the highly
αphot 16/3n20T 3/k, (10) heat-conducting layers at the borders between the two
where n – is the refractive index, 0 – Stefan- substances using special thermal interface materials.
Boltzmann constant, k – the absorption coefficient. Using the nanoparticles as the components of such lay-
The exciton thermal conductivity is caused by diffu- ers it is possible to provide extremely full contact be-
sion of excitons due to the temperature gradient. It tween the adjacent rough surfaces. By such a way one
becomes important when the conditions of excitons can obtain the maximum contact area, contrary to the
generation are realized in a semiconductor. case of the microparticles contact with a rough surface.
The exciton binding energy Eex for the quantum In our case, increasing of the thermal conductivity
dots with a size a little larger than the exciton Bohr of the thermal compound based on the ZnO nanopow-
radius is described by the equation [17]: der instead of ZnO micropowder may be considered as
manifestation of the quantum size effect. Since the par-
(memh ) 2aB2 Rex
3D ticle sizes in the nanopowder (~ 3 nm) is commensurate
Eex , (11) with the exciton Bohr radius (~ 2 nm) [19], that is sig-
(me mh )2 a2
nificantly lower than the mean free path of phonons
3D
(~ 30 nm) [20] and the de Broglie wavelength in ZnO
where Rex - is the exciton binding energy in the bulk (14 nm) [21], it is convenient to consider the ballistic
sample; me – effective electron mass; mh – effective hole mechanism of the heat conductivity. The free excitons
mass; a – the size of the quantum dot; aB – the exciton in zinc oxide are stable even at room temperature due
Bohr radius. to their large binding energy (60 meV) [22]. Therefore,
It is also necessary to draw attention to some specif- in the nanocomposite material on the basis of ZnO the
ic features of heat transfer in the nanostructures such exciton component of thermal conductivity could also
as ballistic conductivity and reducing of the thermal be significant.
contact resistance [18].
In the case when the mean free path of carriers or 4. CONCLUSION
quasiparticles is larger than the typical sample size the
ballistic thermal conductivity is realized and heat is The coefficients of thermal conductivity of the compo-
transferred without collisions. The thermal resistance site materials based on the zinc oxide powders with a
of a sample in this case is equal to zero. different grain size – 50 m, less than 1 μm and about
It is also necessary to consider the contact thermal 3 nm were determined by radial heat flow method. They
resistance or Kapitza resistance - namely the thermal were found to be equal to 0.8 W/(m∙K), 1.1 W/(m∙K) and
resistance at the boundaries of the two bodies contact. 2.5 W/(m∙K) respectively. The observed clear increase of
The I. M. Khalatnikov proposed the theoretical work the thermal conductivity of the thermal compound based
allowing evaluation of the thermal contact resistance. on ZnO nanopowder instead of ZnO micropowder is ex-
In his model the surface of the contact interface is con- plained by the ballistic conductivity, increasing of the
sidered as a flat infinitely thin boundary between the exciton thermal conductivity and reduction of the contact
two materials. Depending on the properties of these thermal resistance.
materials there occurs refraction or reflection of pho-
nons on the both sides of the boundary. The difference AKNOWLEDGEMENTS
between the phonon energy flows from the material This work was supported by Ministry of Education
with a higher temperature to the material with a lower and Science of Ukraine.
temperature and back determines the relation between
02004-3
B.I. TURKO, V.B. KAPUSTIANYK, ET AL. J. NANO- ELECTRON. PHYS. 8, 02004 (2016)
REFERENCES
1. Chips 2020: A Guide to the Future of Nanoelectronics 12. B. Kolade, K.E. Goodson, J.K. Eaton, J. Heat Transf. 131,
(Ed. B. Hoefflinger) (Berlin: Springer-Verlag: 2012). 052402 (2009).
2. T. Olorunyolemi, A. Birnboim, Y. Carmel, O. Wilson, 13. C.F. Klingshirn, A. Waag, A. Hoffmann, J. Geurts, Zinc
I.K. Lloyd, S. Smith, R. Campbell, J. Am. Ceram. Soc. 85, Oxide: From Fundamental Properties Towards Novel Ap-
1249 (2002). plications (Berlin: Springer-Verlag: 2010).
3. K.T. Igamberdiev, S.U. Yuldashev, H.D. Cho, T.W. Kang, 14. Y.M. Poplavko, Electrophysics of Solids States: Tutorial
S.M. Rakhimova, Phys. Solid State 54, 1514 (2012). (Kyiv: KPI: 2012).
4. U. Ozgur, X. Gu, S. Chevtchenko, J. Spradlin, S. Cho, 15. X. Liang, M. Baram, D.R. Clarke, Appl. Phys. Lett. 102,
H. Morkoc, F.H. Pollak, H.O. Everitt, B. Nemeth, 223903 (2013).
J.E. Nause, J. Electron. Mater. 35, 550 (2006). 16. M. Faucher, F. Cabannes, A.M. Anthony, B. Piriou,
5. D.I. Florescu, L.G. Mourikh, F.H. Pollak, D.C. Look, J. Simonato, J. Am. Ceram. Soc. 58, 368 (1975).
G. Cantwell, X. Li, J. Appl. Phys. 91, 890 (2002). 17. S.V. Gaponenko, Phys. Tech. Semicond. 30, 577 (1996).
6. Z.X. Huang, Z.A. Tang, J. Yu, S. Bai, Physica B 406, 818 18. V.I. Кhvеsyuk, Eng. J.: Sci. Innov. 5, 1 (2013).
(2011). 19. V. Kapustianyk, M. Panasiuk, G. Lubochkova, B. Turko,
7. Y. Xu, M. Goto, R. Kato, Y. Tanaka, Y. Kagawa, J. Appl. V. Rudyk, M. Partyka, R. Serkiz, D. Voznyuk, J. Phys.
Phys. 111, 084320 (2012). Stud. 12, 2602 (2008).
8. H.Q. Le, S.J. Chua, Y.W. Koh, K.P. Loh, Z. Chen, 20. D. Gautam, M. Engenhorst, C. Schilling, G. Schierning,
C.V. Thompson, E.A. Fitzgerald, Appl. Phys. Lett. 87, R. Schmechel, M. Winterer, J. Mater. Chem. A 3, 189
101908 (2005). (2015).
9. P. Mitra, S. Mondal, Progr. Theor. Appl. Phys. 1, 17 21. V.P. Gavrilenko, Int. Rev. Atom. Mol. Phys. 4, 1 (2013).
(2013). 22. V. Kapustianyk, B. Turko, Y. Rudyk, V. Tsybulskyi,
10. M.O. Haluschak, V.G. Ralchenko, A.I. Tkachuk, V. Rudyk, A. Vaskiv, Phys. Surf. Eng. 13, 169 (2015).
D.M. Freik, Phys. Chem. Solid State 14, 317 (2013).
11. S. Samuel, L. Bose, Acad. Rev. 16, 57 (2009).
02004-4