Road Map for Conduction Lectures

MECH 4406 C p
T   T    T    T 
 k   k   k   g
t x  x  y  y  z  z 
HDE: (shown in Cartesian Coordinates)

Heat Transfer Special Cases we consider:

1. One Dimensional
a) 1D in Space
 2T  1   T  
i) No Energy Generation: 0  r   0
x 2  r r  r  

 2T g
ii) With energy generation  0
x 2 k
Prof. Matthew Johnson, Ph.D., P.Eng. dT
iii) 1D Conduction with Varying dx
: Extended Surfaces / Fins
Canada Research Chair in Energy & Combustion
Generated Air Emissions
b) 1D in Time
Mechanical & Aerospace Engineering
Carleton, University • Lumped heat capacity
Ottawa, ON Canada
2

Road Map for Conduction Lectures

MECH 4406: Heat Transfer
T   T    T    T 
Part I: Conduction
C p  k   k   k   g
t x  x  y  y  z  z 
HDE: (shown in Cartesian Coordinates)

Special Cases we consider:

2. Multi-Dimensonal
a) Space-Time (no energy generation)
T  2T • Generalized transient solution
C p k 2
t x • Semi-infinite solid solution

b) Two-space (no energy generation)

6. Transient Conduction
 2T  2T • Shape factors
 0
x 2 y 2 • Intro to numerical methods

MECH 4406: Heat Transfer Prof. M. Johnson, Carleton University 1

 The Biot Number The Biot Number

 Biot number, Bi Biot number rules of thumb:

• Bi  Ratio of conductive resistance to convective resistance  If Bi << 0.1: k h
(named for Jean-Baptiste Biot, ~1850)
• Rconduction << Rconvection Ts
 Consider heat transfer in a plane wall: T1 Bi << 1
• Forget about conduction and
T1 Bi = 1
concentrate on convection!
T T  T T  T T  T T1 Bi >> 1
q  o  0 1  1  If Bi > 20: T
R L 1 L 1
 • Rconvection << Rconduction
kA hA kA hA
Ts • Forget about convective heat transfer and concentrate on
T1
T0  T1 L kA hL conduction aspects. Set wall temperatures to fluid temperatures.
T Bi   
k T1  T 1 hA k  If 0.1 < Bi < 20:
h
• Both convective and conductive heat transfer must be considered
• Can also think of the Biot number as a
Ts T1 T
ratio of temperature drop within the  The Biot number is a powerful engineering criterion for simplifying
L 1 solid wall to temperature drop between problems
kA hA
the surface and the fluid
5 6

Transient Conduction and the Biot Number 6.2 Lumped Heat Capacitance Approach

Bi >> 1 Bi  1 Bi << 1  If Bi <<1 (usually Bi<0.1) then can ignore temperature

T(x,0) = Ti T(x,0) = Ti T(x,0) = Ti variation in solid and write 1st law for “lump” of material:

1st Law: E st  E gen  E in  E out 

h h h T=T(t) only qconv E st   E out
(no spatial
T , h
  hAs T  T 
dT
T T T T T T
variation) Vc
@ t=0, T=Ti dt
Vc d
  (where   T  T )
-L L -L L -L L hAs dt
x x x
Vc  d t

T=T(x,t) T=T(x,t) TT(t)

Solution:
(assuming h is 
hAs  
   dt
0  T  T   hA  
  exp   s t 
i
independent of Or:
Vc i  i Ti  T   Vc  
time) ln t
hAs 
 If Bi <<1 (usually Bi<0.1), then T=T(t) only within solid!!

7 8

MECH 4406: Heat Transfer Prof. M. Johnson, Carleton University 2

 Lumped Heat Capacitance Approach Lumped Heat Capacitance Approach

 Solution to basic transient conduction using basic lumped  Thus, in non-dimensional form:
heat-capacitance model (Bi<<1): hAs t hL* t

Vc k L* 2
 T  T   hA   t 
  exp   s t   exp 
 i Ti  T   V c    t  and defining:
 1  Vc
Vc   Rt Ct hL* t
• Where t is thermal time constant:  t   Bi  (Biot Number) Fo  (Fourier Number)
hAs  hAs  k L*2
 Lumped capacitance solution:
 Can rewrite in non-dimensional form by defining:  T  T   hA  
  exp   s t 
 hAs t ht V  i Ti  T   Vc  
*  where: L* 
i Vc L* c As
becomes:
 *  exp Bi  Fo 
hAs t hL* k t k
    thermal diffusivity
Vc k c L*2 c

9 10

6.3 Generalized Lumped Capacitance Generalized Lumped Capacitance

 Lumped capacitance model with other boundary conditions  Note that at least 2 Biot numbers may be necessary to
(not just convection) determine applicability of Lumped Capacitance Model:

qconv • For convection boundary condition: Bi  hL (as before)

q" T=T(t) only h
(no spatial
k
T , h • For radiation boundary condition: Bih hL
variation)
 r
E gen r
k
@ t=0, T=Ti
qrad
• For either convection or radiation, to use lumped heat capacitance
model: Bih, Bihr < 0.1
1st Law at any instant in time:

 
q s As  E gen  hT  T    T 4  Tsurr
4

As  CV
dT
dt
• If both convection are radiation are relevant, then:
Rconduction • where Requiv is equivalent thermal resistance for
• Non-linear, 1st order, non-homogeneous ODE. Bih,equiv   0.1 both convection and radiation
Must be solved numerically. Requiv
• Two special cases are interesting analytically.

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MECH 4406: Heat Transfer Prof. M. Johnson, Carleton University 3

 Generalized Lumped Capacitance:
2 special cases MECH 4406: Heat Transfer
Part I: Conduction
1. No generation, convection insignificant relative to radiation,
no applied heat flux:

 As T 4  Tsurr
4

 CV
dT
dt
• Solve by separation of variables and integration:
Vc  Tsurr  T T  Ti   T  1  Ti  
t ln  ln surr  2 tan 1    tan  T

 
4As Tsurr
3
 Tsurr  T Tsurr  Ti   Tsurr   surr  

2. No radiation; just generation, convection, and applied heat

flux:
q s As  E gen  hAs T  T   CV
dT
 
dt
6.5 Transient Conduction with Spatial
• Let q s As  E g b
a
hAs
cV
and b 
Vc
, so equation becomes      , and
a
solve: Temperature Variation
T  T
 exp(  at ) 
ba
1  exp(at ) (subtitle: What if Bi > 0.1?)
Ti  T Ti  T

13

1D Transient Heat Conduction Transient Conduction: 1D space + time

 If Bi > 0.1 then lumped heat capacitance no longer applies  Consider a plane wall with convection
and we must consider spatial variations in the solid as well. T(x,0) = Ti • Relevant form of HDE:
 Consider case temperature varies in 1D in space and in 1 T  2T

time: T , h T , h  t x 2
C1p T 2T TT    T    T 
C p  k    k   k   g • Boundary conditions:
k t xx 2 xx  y  y  z  z 
• HDE reduces to:
dT
@ x=0: 0
dx
• Solution requires 2 boundary conditions plus 1 initial condition
-L L @ x=L:  k dT  hT ( L, t )  T 
x dx xL

• Initial condition:
T(x,0) = Ti

• Problem is complex if no simplification:

T=T(x, t, k,T, Ti, L, , h) !!
•15
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MECH 4406: Heat Transfer Prof. M. Johnson, Carleton University 4

 Non-Dimensionalize Variables Transient Conduction: 1D space + time

 Need to first simplify math by non-dimensionalizing the variables  Problem is much simplified (now 3 variables instead of 8!):
in the problem  Non-dimensionalized problem has an exact, infinite series
 Define non-dimensional variables: solution:
 T  T t
*   x*  x / L t*   Fo
 *   C n exp  n2 Fo cos n x * 

 i Ti  T L2

 Now recast HDE using these variables: n 1

 T 1 T
2
 2 *  *

4 sin  n

x *2 Fo  where: Cn  (See Table 5.1 to quickly
x 2  t 2 n  sin 2 n 
look these values up as a
and update boundary & initial conditions: function of Biot number)
@ x=0, dT  0 @ x*=0,
 *
0
and:  n tan  n  Bi
dx x * x*0
 *
@ x=L,  k
dT
dx
 hT ( L, t )  T  @ x*=1,
x * x*1
 
  Bi * 1, t *
xL

@ t=0, T(x,0) = Ti @ t*=0,  * x,0   1

 *  f x* , Fo, Bi  (3 independent variables instead of 8 !!)

17 18

• Note footnote to this table Transient Conduction: 1D space + time

and see solution to Problem
5.67 for an example.

• Table footnote states that in

 Problem is much simplified (now 3 variables instead of 8!):
this table Bi is defined using  Non-dimensionalized problem has an exact, infinite series
L*=ro as per Fig. 5.6 rather solution:
than L*=V/As=ro/2 or ro/3
 *   C n exp  n2 Fo cos n x * 

which we typically use to
calculate Bi n 1

4 sin  n
where: Cn 
2 n  sin 2 n 

and:  n tan  n  Bi
 Good news is that if Fourier number, Fo > 0.2, we can get
an accurate solution using only the 1st term of the infinite
series

19
20

MECH 4406: Heat Transfer Prof. M. Johnson, Carleton University 5

 Transient Conduction: 1D space + time Transient Conduction: 1D space + time

 If Fo > 0.2:  Solution Procedure:

 T ( x, t )  T 1. Calculate Biot number
 C1 exp  12 Fo cos 1 x * 
1
*   (1)
(verify Lumped Capacitance not valid!)
i Ti  T
4 sin  1 2. If possible verify Fo>0.2
where: C1  and:  1 tan  1  Bi
2 1  sin 2 1  (otherwise assume and check later)
3. Calculate 1
 Look at solution more closely: (or get value of 1 from Table 5.1, listed as function of Bi)
• At midplane: x*  0 4. Calculate C1
• Midplane temperature:  *  T0,t  T  C exp   2 Fo   (or use Table 5.1, listed as a function of Bi)
Ti  T
0 ,t 1 1
5. Calculate  * ( x*, t*) which automatically gives T(x,t)
• Rewrite (1) above as:  *   * cos  x *
0 ,t 1   6. Calculate Q(t) as necessary
**  Time dependence of T at any location in wall is same as at
the midplane !!  Time variation is independent of space!!

21 22

Transient Conduction: 1D space + time Transient Conduction: 1D space + time

 How to calculate amount of heat transferred, Q?  Solution for Cylindrical Geometries:

• 1st Law over any arbitrary time interval: E  E  E • Infinite cylinder with Fo > 0.2:
in out st
T  T
• For wall, Q = Est = E(t) – E(0): *    
 C1 exp   12 Fo J 0  1 r *
Ti  T 
  * T0,t  T
 0 
Ti  T
r
, r *  
 ro 
0*
 Q  E t   E 0     cT  x, t   Ti dV
2 *
• Defining: Q  cV T  T   1  0 J 1  1 
Q
0 i  Q0 1
 T x, t   Ti  dV 1
 1   dV
• Then: Q
Q0  Ti  T
  *
where:
V V
• J0 and J1 are zero & first order Bessel functions of the first kind
• Finally, if Fo > 0.2: Q sin  1 * J 1  n 
 1  0 ,t • n  Bi (or just get from  from Table)
Q0 1 J 0  n 

23 24

MECH 4406: Heat Transfer Prof. M. Johnson, Carleton University 6

 Transient Conduction: 1D space + time
MECH 4406: Heat Transfer
Part I: Conduction
 Solution for Spherical Geometries:
• Assuming Fo > 0.2:

 *  C1 exp  12 Fo   
1  * T0,t  T r
sin  1 r *  0  T  T , r  r 
*
  r *  i  o 
1
*
0
3 *
 1  30 sin  1    1 cos 1 
Q
Q0 1

where: 1   n cot  n  Bi
6.9 Semi-Infinite Solid Solution
(or just get from  from Table):

25

Semi-Infinite Solid Semi-Infinite Solid Solution

 Another interesting (& surprisingly useful) geometry for

which analytical solutions can be obtained
• Useful idealization for many engineering problems.
– e.g.: Have you ever wondered why if you touch something
metal vs. something wood, the metal feels colder?
– e.g.: Buried pipe…
– e.g.: Heating pavement…

T   T    T    T 
 From HDE: C p  k   k   k   g
t x  x  y  y  z  z 

 1D in x, with no generation: 1 T  2T

 t x 2
• Initial Condition: T(x,0) = Ti
• Internal boundary condition: T(x, t) = Ti Note: Even for non-infinite cases, if t is small
enough, semi-infinite solid
approximation can still be useful
27 28

MECH 4406: Heat Transfer Prof. M. Johnson, Carleton University 7

Transient Heat Conduction Solutions for a Semi-
The Error Function, erf(x)
Infinite Solid

 Gaussian error function:

 
x
erf x    2  exp  u 2 du
  0



erf  x   2

x  x3
31!  5x2!  7x3!  ...
5 7


 1 n
x 2 n 1
 2
  2n  1 n!
n 0

erf () = 1

29 30

Tabulated erf(x) Example: Two solids placed in contact

 1st law surface energy

balance gives:

q s, A  q s, B

 If negligible contact
resistance, single
temperature, Ts at interface
• Ts remains constant

 Using Case 1 solution:

 k A Ts  T A,i  k B Ts  TB ,i 
q s, A    q s, B
 A t 1 / 2  B t 1 / 2
k A  B TA,i  k B  A TB ,i
 Ts 
k A  B  kB  A
31 32

MECH 4406: Heat Transfer Prof. M. Johnson, Carleton University 8

 Summary of Transient Conduction Results Summary of Transient Conduction Results

33 34

6.10 Transient Conduction in 2D or 3D

 Consider a short cylinder  Multi-

• Length and diameter are comparable, so conduction will be in dimensional
2 directions, r and x. With no generation and constant transient
properties, relevant form of the HDE is: conduction as a
1   T   2T 1 T product of 1D
r   transient
r r  r  x 2  t
solutions
• A closed form solution may be obtained using separation of
variables which results in:
T r , x, t   T T x, t   T T r , t   T
 
Ti  T Ti  T plane wall
Ti  T infinite
cylinder

– 2D solution that is a product of 1D solutions.

– See next slide. For anything else, must solve numerically.
•36
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MECH 4406: Heat Transfer Prof. M. Johnson, Carleton University 9