Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
com
COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : LM62B
MODEL: L204WT(L204WT-SFQ.A**BQF)
L204WT(L204WT-BFQ.A**BQF)
( ) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
SPECIFICATIONS ................................................... 2 ADJUSTMENT ...................................................... 13
PRECAUTIONS ....................................................... 4 TROUBLESHOOTING GUIDE .............................. 15
TIMING CHART ....................................................... 8 WIRING DIAGRAM ............................................... 19
DISASSEMBLY ....................................................... 9 EXPLODED VIEW...................................................20
BLOCK DIAGRAM ................................................. 10 REPLACEMENT PARTS LIST ...............................22
DESCRIPTION OF BLOCK DIAGRAM...................11 SCHEMATIC DIAGRAM ......................................... 24
SPECIFICATIONS
1. LCD CHARACTERISTICS 4. MAX. RESOLUTION
Type : TFT Color LCD Module Analog : 1680 x 1050@60Hz
Active Display Area : 20.1 inch diagonal Digital : 1680 x 1050@60Hz
Pixel Pitch : 0.258 (H) x 0.258 (V)
Size : 459.4(H) x 296.4(V) x 21.6(D) 5. POWER SUPPLY
Color Depth : 16.2M(6bit + FRC) colors 5-1. Power Adaptor(Built-in Power)
Electrical Interface : LVDS Input : AC 100-240V~, 50/60Hz, 1.2A
Surface Treatment : Anti-Glare, Hard Coating(3H)
Operating Mode : Normally White 5-2. Power Consumption
Backlight Unit : 6 CCFL
MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR
2. OPTICAL CHARACTERISTICS less than 50 W(max)
2-1. Viewing Angle by Contrast Ratio ≥ 10 POWER ON (NORMAL) ON/ON ACTIVE BLUE
less than 45 W(typ)
Left : +80° min., +85°(Typ) Right : -80° min., -85°(Typ) STAND BY OFF/ON OFF less than 1 W AMBER
Top :+80° min., +85°(Typ) Bottom : -80° min., -85°(Typ) SUSPEND ON/OFF OFF less than 1 W AMBER
2-2. Luminance : 180(Typ) (Typ. ±30)-sRGB DPMS OFF OFF/OFF OFF less than 1 W AMBER
: 230(min), 300(Typ)-6500K POWER S/W OFF - - less than 1 W OFF
: 150(min)-9300K
-2-
Signal Connector Pin Assignment
-3-
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING
• There are some special components used in LCD BE CAREFUL ELECTRIC SHOCK !
monitor that are important for safety. These parts are
• If you want to replace with the new backlight (CCFL) or
marked on the schematic diagram and the
inverter circuit, must disconnect the AC adapter
replacement parts list. It is essential that these critical
because high voltage appears at inverter circuit about
parts should be replaced with the manufacturer’s
650Vrms.
specified parts to prevent electric shock, fire or other
hazard.
• Handle with care wires or connectors of the inverter
• Do not modify original design without obtaining written circuit. If the wires are pressed cause short and may
permission from manufacturer or you will void the burn or take fire.
original parts and labor guarantee.
Leakage Current Hot Check Circuit
AC Volt-meter
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners. Good Earth Ground
such as WATER PIPE,
• Do not press on the panel, edge of the frame strongly CONDUIT etc.
To Instrument's
or electric shock as this will result in damage to the exposed
screen. METALLIC PARTS
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
-4-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this 9. Use with this receiver only the test fixtures specified in
service manual and its supplements and addenda, read this service manual.
and follow the SAFETY PRECAUTIONS on page 3 of this CAUTION: Do not connect the test fixture ground strap
publication. to any heat sink in this receiver.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the Electrostatically Sensitive (ES) Devices
safety precautions on page 3 of this publication, always Some semiconductor (solid-state) devices can be
follow the safety precautions. Remember: Safety First. damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
General Servicing Precautions Devices. Examples of typical ES devices are integrated
1. Always unplug the receiver AC power cord from the AC circuits and some field-effect transistors and
power source before; semiconductor "chip" components. The following
a. Removing or reinstalling any component, circuit techniques should be used to help reduce the incidence of
board module or any other receiver assembly. component damage caused by static by static electricity.
b. Disconnecting or reconnecting any receiver electrical 1. Immediately before handling any semiconductor
plug or other electrical connection. component or semiconductor-equipped assembly, drain
c. Connecting a test substitute in parallel with an off any electrostatic charge on your body by touching a
electrolytic capacitor in the receiver. known earth ground. Alternatively, obtain and wear a
CAUTION: A wrong part substitution or incorrect commercially available discharging wrist strap device,
polarity installation of electrolytic capacitors may which should be removed to prevent potential shock
result in an explosion hazard. reasons prior to applying power to the unit under test.
d. Discharging the picture tube anode. 2. After removing an electrical assembly equipped with
2. Test high voltage only by measuring it with an ES devices, place the assembly on a conductive
appropriate high voltage meter or other voltage surface such as aluminum foil, to prevent electrostatic
measuring device (DVM, FETVOM, etc) equipped with charge buildup or exposure of the assembly.
a suitable high voltage probe. 3. Use only a grounded-tip soldering iron to solder or
Do not test high voltage by "drawing an arc". unsolder ES devices.
3. Discharge the picture tube anode only by (a) first 4. Use only an anti-static type solder removal device.
connecting one end of an insulated clip lead to the Some solder removal devices not classified as "anti-
degaussing or kine aquadag grounding system shield static" can generate electrical charges sufficient to
at the point where the picture tube socket ground lead damage ES devices.
is connected, and then (b) touch the other end of the 5. Do not use freon-propelled chemicals. These can
insulated clip lead to the picture tube anode button, generate electrical charges sufficient to damage ES
using an insulating handle to avoid personal contact devices.
with high voltage. 6. Do not remove a replacement ES device from its
4. Do not spray chemicals on or near this receiver or any protective package until immediately before you are
of its assemblies. ready to install it. (Most replacement ES devices are
5. Unless specified otherwise in this service manual, packaged with leads electrically shorted together by
clean electrical contacts only by applying the following conductive foam, aluminum foil or comparable
mixture to the contacts with a pipe cleaner, cotton- conductive material).
tipped stick or comparable non-abrasive applicator; 7. Immediately before removing the protective material
10% (by volume) Acetone and 90% (by volume) from the leads of a replacement ES device, touch the
isopropyl alcohol (90%-99% strength) protective material to the chassis or circuit assembly
CAUTION: This is a flammable mixture. into which the device will be installed.
Unless specified otherwise in this service manual, CAUTION: Be sure no power is applied to the chassis
lubrication of contacts in not required. or circuit, and observe all other safety precautions.
6. Do not defeat any plug/socket B+ voltage interlocks 8. Minimize bodily motions when handling unpackaged
with which receivers covered by this service manual replacement ES devices. (Otherwise harmless motion
might be equipped. such as the brushing together of your clothes fabric or
7. Do not apply AC power to this instrument and/or any of the lifting of your foot from a carpeted floor can
its electrical assemblies unless all solid-state device generate static electricity sufficient to damage an ES
heat sinks are correctly installed. device.)
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
-5-
General Soldering Guidelines Replacement
1. Use a grounded-tip, low-wattage soldering iron and 1. Carefully insert the replacement IC in the circuit board.
appropriate tip size and shape that will maintain tip 2. Carefully bend each IC lead against the circuit foil pad
temperature within the range or 500。F to 600。F. and solder it.
2. Use an appropriate gauge of RMA resin-core solder 3. Clean the soldered areas with a small wire-bristle
composed of 60 parts tin/40 parts lead. brush. (It is not necessary to reapply acrylic coating to
3. Keep the soldering iron tip clean and well tinned. the areas).
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a "Small-Signal" Discrete Transistor
metal handle. Removal/Replacement
Do not use freon-propelled spray-on cleaners. 1. Remove the defective transistor by clipping its leads as
5. Use the following unsoldering technique close as possible to the component body.
a. Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads
temperature. remaining on the circuit board.
(500。F to 600。F) 3. Bend into a "U" shape the replacement transistor leads.
b. Heat the component lead until the solder melts. 4. Connect the replacement transistor leads to the
c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board
suction-type solder removal device or with solder and crimp the "U" with long nose pliers to insure metal
braid. to metal contact then solder each connection.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil. Power Output, Transistor Device
6. Use the following soldering technique. Removal/Replacement
a. Allow the soldering iron tip to reach a normal 1. Heat and remove all solder from around the transistor
temperature (500。F to 600。F) leads.
b. First, hold the soldering iron tip and solder the strand 2. Remove the heat sink mounting screw (if so equipped).
against the component lead until the solder melts. 3. Carefully remove the transistor from the heat sink of the
circuit board.
c. Quickly move the soldering iron tip to the junction of 4. Insert new transistor in the circuit board.
the component lead and the printed circuit foil, and 5. Solder each transistor lead, and clip off excess lead.
hold it there only until the solder flows onto and 6. Replace heat sink.
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the Diode Removal/Replacement
circuit board printed foil. 1. Remove defective diode by clipping its leads as close
d. Closely inspect the solder area and remove any as possible to diode body.
excess or splashed solder with a small wire-bristle 2. Bend the two remaining leads perpendicular y to the
brush. circuit board.
3. Observing diode polarity, wrap each lead of the new
IC Remove/Replacement diode around the corresponding lead on the circuit
Some chassis circuit boards have slotted holes (oblong) board.
through which the IC leads are inserted and then bent flat 4. Securely crimp each connection and solder it.
against the circuit foil. When holes are the slotted type, 5. Inspect (on the circuit board copper side) the solder
the following technique should be used to remove and joints of the two "original" leads. If they are not shiny,
replace the IC. When working with boards using the reheat them and if necessary, apply additional solder.
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above. Fuse and Conventional Resistor
Removal/Replacement
Removal 1. Clip each fuse or resistor lead at top of the circuit board
1. Desolder and straighten each IC lead in one operation hollow stake.
by gently prying up on the lead with the soldering iron 2. Securely crimp the leads of replacement component
tip as the solder melts. around notch at stake top.
2. Draw away the melted solder with an anti-static 3. Solder the connections.
suction-type solder removal device (or with solder CAUTION: Maintain original spacing between the
braid) before removing the IC. replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
-6-
Circuit Board Foil Repair At Other Connections
Excessive heat applied to the copper foil of any printed Use the following technique to repair the defective copper
circuit board will weaken the adhesive that bonds the foil pattern at connections other than IC Pins. This technique
to the circuit board causing the foil to separate from or involves the installation of a jumper wire on the
"lift-off" the board. The following guidelines and component side of the circuit board.
procedures should be followed whenever this condition is 1. Remove the defective copper pattern with a sharp
encountered. knife.
Remove at least 1/4 inch of copper, to ensure that a
At IC Connections hazardous condition will not exist if the jumper wire
To repair a defective copper pattern at IC connections use opens.
the following procedure to install a jumper wire on the 2. Trace along the copper pattern from both sides of the
copper pattern side of the circuit board. (Use this pattern break and locate the nearest component that is
technique only on IC connections). directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
1. Carefully remove the damaged copper pattern with a of the nearest component on one side of the pattern
sharp knife. (Remove only as much copper as break to the lead of the nearest component on the
absolutely necessary). other side.
2. carefully scratch away the solder resist and acrylic Carefully crimp and solder the connections.
coating (if used) from the end of the remaining copper CAUTION: Be sure the insulated jumper wire is
pattern. dressed so the it does not touch components or sharp
3. Bend a small "U" in one end of a small gauge jumper edges.
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
-7-
TIMING CHART
VIDEO
B
SYNC
D E F
-8-
DISASSEMBLY
#1 #2
#3 #4
#5
Disassemble Connector.
-9-
gm5726H
3.3V
MStarACE LVDS
Line Buffer
Analog I(R/G/B) ADC
Vcc
D-Sub
LVDS 5V
Module
EEPROM Scaler
(EDID)
Tx
TMDS Rx
DVI(TMDS) OSD
DVI-D
EEPROM 1.8V
MCU
SSC
KEY
(EDID)
SDA
- 10 -
/SCL
LIPS
EEPROM
Flash ROM
(System)
BLOCK DIAGRAM
5V 3.3V 3.3V
3.3V
Filter 12V 5V Regulator 1.8V
12V
Inverter(12Lamps)
DESCRIPTION OF BLOCK DIAGRAM
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
12V is provided for inverter, 5V is provided for LCD panel and micom in L194WT/WTM/WTQ case
15V is provided for inverter in L204WT/WTM/WTQ case
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module in L194WT/WTM/WTQ
case.
The inverter converts from DC15V to AC 700Vrms and operates back-light lamps of module in L204WT/WTM/WTQ
case.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and
the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
- 11 -
LIPS Board Block Diagram
15V
50 ~ 60Hz
HVDC 100KHz 5V
EMI INPUT RECTIFIER ENERGY OUTPUT RECTIFIER
COMPONENTS AND FILTER TRANSFER AND FILTER
LINE GND
100 ~ 240V
SIGNAL
PWM PHOTO- Collection
CONTROL COUPLER and
CIRCUIT ISOLATION Feedback
PRIMARY SECONDARY
Operation description_Power
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.
- 12 -
ADJUSTMENT
Windows EDID V1.0 User Manual 2. EDID Read & Write
1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Doesn’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available for LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe
- 13 -
SERVICE OSD
1) Turn off the power switch at the right side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch for 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
IBM 9 6
Video Signal 5 1
Compatible PC 15 11
Generator 10 6
5 1
C
PARALLEL PORT
d
13
se
1
tu
2C
25
No
14
23
RS
OFF ON
5V
EL
Control Line
F
L
C
RAL
PA
VG ON
WE
S 5V
(110V/220V)
PO
E 74LS06
A
T
MO Power LED
CS
NI OFF 4.7K
YN
TO
V-S
R
74LS06
E ST Switch
B
B
F V-Sync On/Off Switch
(Switch must be ON.)
- 14 -
TROUBLESHOOTING GUIDE
1. NO POWER
NO POWER
(POWER INDICATOR OFF)
YES
YES
CHECK IC501
Waveforms
1 P702-#5,6 2 IC601-#2 3 IC602-#2 4 IC501-#108
- 15 -
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
YES
1. CONFIRM BRIGHTNESS
OSD CONTRL STATUS
2 NO 2. CHECK MICOM DIM-ADJ
CHECK P702
3 PIN10 PIN11 PORT
3. CHECK SCALER LAMPADJ
PORT(L204WT/WTM)
YES
CHECK
PULSE AS
CONTACTING PROBE NO
4 TO THE LAMP POWER BOARD (LIPS)
WIRE OF THE
LCD MODULE
YES
- 16 -
3. NO RASTER (OSD IS NOT DISPLAYED) - MAIN
NO RASTER
(OSD IS NOT DISPLAYED)
YES
YES
CHECK IC501
PIN89(H-SYNC) AND NO CHECK CONNECTION
PIN90(V-SYNC). LINE FROM D-SUB TO
IS PULSE APPEARED AT IC501
SIGNAL PINS?
YES
TROUBLE IN CABLE
OR LCD MODULE
Waveforms
1 IC501-#108
- 17 -
4. TROUBLE IN DPM
TROUBLE IN DPM
YES
CHECK NO
1
IC501 PIN89,90 CHECK H/V SYNC LINE
2 SYNC PULSE
YES
TROUBLE IN IC501
Waveforms
1 H-SYNC 2 V-SYNC
- 18 -
WIRING DIAGRAM
30P
6631900109A
11P
6631900034P
6P
6631900030D
- 19 -
120
030
010 020
110
070
100
090
- 20 -
080
EXPLODED VIEW
040
060
050
EXPLODED VIEW PARTS LIST
or 6410TUW002F Power Cord, SP305 IS14 SVT 18AWGX3 CT-12_1.87M_BLK SP-305 IS-14 1.87M - 125V 10A SVT 3XAWG18 BLACK UL CSA N-For Canada, U.S.A
6410TSW003A Power Cord, LP-23A+SAG18N<B10A&LS-13_1.87M_BLK LP-23A LS-13 1.87M - 250V 7.5A GFC-3R 3X0.75MM2 BLACK SAA N-For Australia
- 21 -
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,
READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY Mark
AL ALTERNATIVE PARTS
- 22 -
DATE: 2006. 06. 02. DATE: 2006. 06. 02.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
TRANSISTOR
R722 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
Q502 0TRDI80002A MMBT3904-(F) NPN 6V 60V 40V R723 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
Q503 0TRDI80002A MMBT3904-(F) NPN 6V 60V 40V R726 0RJ0682D677 MCR03EZPJ680 68OHM 5% 1/10W
Q701 0TR390609FA KST3906-MTF PNP -5V -40V -40 R727 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
Q702 0TR390609FA KST3906-MTF PNP -5V -40V -40 R728 0RJ4700D677 MCR03EZPJ471 470OHM 5% 1/10W
R729 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
RESISTORs R730 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
R731 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
R501 0RJ2001D677 MCR03EZPJ202 2KOHM 5% 1/10W R732 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R503 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10 R733 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R504 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W R734 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W
R507 0RJ2702D677 MCR03EZPJ273 27KOHM 5% 1/10W R735 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W
R508 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10 R736 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R509 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W R737 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R511 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10 R738 0RJ0752D677 MCR03EZPJ750 75OHM 5% 1/10W
R514 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W R739 0RJ0752D677 MCR03EZPJ750 75OHM 5% 1/10W
R515 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W R740 0RJ0752D677 MCR03EZPJ750 75OHM 5% 1/10W
R516 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10 R741 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R517 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10 R742 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R518 0RJ2400D677 MCR03EZPJ241 240OHM 5% 1/10W R743 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R519 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10 R751 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R520 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W R752 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R521 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W R753 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R522 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W R761 0RJ1000D677 MCR03EZPJ101 100OHM 5% 1/10W
R523 0RJ0562D677 MCR03EZPJ560 56OHM 5% 1/10W
R524 0RJ0562D677 MCR03EZPJ560 56OHM 5% 1/10W OTHERs
R525 0RJ0562D677 MCR03EZPJ560 56OHM 5% 1/10W
R526 0RJ1001D677 MCR03EZPJ102 1KOHM 5% 1/10W Q601 0TFVI80067A SI3865BDV(E3) N-CHANNEL MOSF
R527 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W X501 6212AA2004F HC-49/U 14.31818MHZ 30PPM 14
R529 0RJ1001D677 MCR03EZPJ102 1KOHM 5% 1/10W
R530 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10 CONTROL BOARD
R531 0RJ1001D677 MCR03EZPJ102 1KOHM 5% 1/10W
R533 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1 LED1 0DLBE0048AA BL-HKBB533B-TRB SUPER YELLOW
R551 0RJ1002D677 MCR03EZPJ103 10KOHM 5% 1/10W C1 0CK104CK56A 0603B104K500CT 100nF 10% 50V
R563 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W C2 0CK104CK56A 0603B104K500CT 100nF 10% 50V
R564 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W R1 0RJ7501D677 MCR03EZPJ752 7.5KOHM 5% 1/10
R571 0RJ5601D677 MCR03EZPJ562 5.6KOHM 5% 1/10 R2 0RJ7501D677 MCR03EZPJ752 7.5KOHM 5% 1/10
R572 0RJ1102D677 MCR03EZPJ113 11KOHM 5% 1/10W R3 0RJ1201D677 MCR03EZPJ122 1.2KOHM 5% 1/10
R573 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1 R4 0RJ1201D677 MCR03EZPJ122 1.2KOHM 5% 1/10
R574 0RJ1001D677 MCR03EZPJ102 1KOHM 5% 1/10W R5 0RJ1801D677 MCR03EZPJ182 1.8KOHM 5% 1/10
R601 0RJ2202D677 MCR03EZPJ223 22KOHM 5% 1/10W SW1 6600R00004C JTP1127WEM 1C1P 15VDC 0.05A
R602 0RX0331K668 RSD02F4J3R30 3.3OHM 5% 2W 12 SW2 6600R00004C JTP1127WEM 1C1P 15VDC 0.05A
R604 0RJ5600D677 MCR03EZPJ561 560OHM 5% 1/10W SW3 6600R00004C JTP1127WEM 1C1P 15VDC 0.05A
R620 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1 SW4 6600R00004C JTP1127WEM 1C1P 15VDC 0.05A
R621 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1 SW5 6600R00004C JTP1127WEM 1C1P 15VDC 0.05A
R704 0RJ4700D677 MCR03EZPJ471 470OHM 5% 1/10W
R705 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R706 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R707 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R708 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R709 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R710 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R711 0RJ4700D677 MCR03EZPJ471 470OHM 5% 1/10W
R712 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R713 0RJ0102D677 MCR03EZPJ100 10OHM 5% 1/10W
R714 0RJ1001D677 MCR03EZPJ102 1KOHM 5% 1/10W
R715 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W
R716 0RJ0000D677 MCR03EZPJ000 0OHM 5% 1/10W 1
R717 0RJ0332D677 MCR03EZPJ330 33OHM 5% 1/10W
R719 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
R720 0RJ0682D677 MCR03EZPJ680 68OHM 5% 1/10W
R721 0RJ4701D677 MCR03EZPJ472 4.7KOHM 5% 1/10
- 23 -
SCHEMATIC DIAGRAM
1. SCALER
- 24 -
2. POWER
- 25 -
3. WAFER
- 26 -
Jun. 2006
P/NO : MFL36713608 Printed in Korea