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Thyristor Development
Ranbir Singh
ranbir.singh@genesicsemi.com
GeneSiC Semiconductor Inc.
43670 Trade Center Place
Suite 155, Dulles VA 20166
703-996-8200 (ph)
Outline
2
Why Silicon Carbide Power Devices?
FY07 Phase I SBIR from DoE Started Jul 07
Design of >10kV, 20 KHz switch
Si MOSFET/Schottky Diode
Si IGBT/PiN Diode
Si GTO
Si Thyristor
SiC MOSFET/JFET/Schottky
SiC BJT/IGBT
4
Size and Weight advantages for Naval
SST
Conventional 2.7 MVA transformer
6
High Voltage SiC Epitaxial Design
7
Yield vs Defects Curve
100
Desired
80 Yield
1 .
Yield (%)
60
5
40
10
20 20
30
100 50
0
0 5 10 15 20 25 30 35 40
Device Area (mm2)
8
Epitaxial Design Curves
12000
100m
4H-SiC Assuming
4 0.1361
10000 Ec=1.4408X10 ND
14 -0.7278
BVpp=5.7365X10 ND
Ideal Breakdown Voltage (V)
10 -0.8639
70m W c,pp=7.963X10 ND
8000
6000
40m
4000
15m
2000
8m
0
14 15 16
10 10 10
-3
Doping (cm )
9
2D Device Simulations for Optimum GTO
Thyristor Design
Net Doping
-2
Signed Log
0
17
16
2
Voltage 15
14.65
4
-14.65
6
-17
-18.99
characteristics
8
10
Process:
12
Initial Mesh Design
14
SiC modeling parameters
16
18
Numerical Methods choice
20
Simulation Experiments
22
24
26
-8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
10
Breakdown Voltage Optimization
Electric Field crowding determines
BV
BV near junction, or at the edge
results in premature BV
11
On-State operation of GTO Thyristors
3.5V forward bias taun0=taup0=1 (0.5, 0.25) us
18
10 500
0.34 s
0.76 s
1.28 s
400 0.34 s
1.36 s
electron concentration (cm )
-3
17
10 0.68 s
current (A/cm )
2
300
10
16 200
100
15
10
0
0 20 40 60
2.0 2.5 3.0 3.5 4.0
+ 4000 400
-
3000 300
400K
Turn-Off speed
c u rre n t (A /c m 2 )
v o lta g e (V )
time (s)
13
Cellular and Involute Designs
14
Fabrication Challenges
ideally a double-step sloped edge
anode
n-base
p-base
substrate
15
SEM Pictures of Dry Etching
“Ideal”
Profile
Achieved
Pitting
12o slope
Measured
Trenching
16
Conclusions & Future Work
Extensive 2D device simulation completed
Major Experiments on Fabrication completed
Improved Layouts designed
17