FIRST CLASS MAIL

US POSTAGE
PAID
Permit No. 490
LIBERTY, MO
 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM 2001/MICROWAVE WEEK
MORNING LUNCHTIME AFTERNOON EVENING
8:00–9:40 AM 10:10–11:50 AM 12:00–1:15 PM 1:20–3:00 PM 3:30–5:10 PM
Sat., Registration 2 to 6 PM
May 19

Registration 7 AM to 6 PM
WSA: State-of-the-Art Filter Design Using EM and Circuit Simulation Techniques
WSB: RF Systems and Circuit Issues of Third Generation Wideband CDMA Systems Like UMTS
WSC: RF and High Speed Applications of Tunnel Devices
May 20, 2001

WSD: Microwave Photonic Component, Integration and System Techniques for Broadband Fiber-fed Wireless
RFIC Reception
Sunday,

WSE: Advanced LTCC Microwave Design and Manufacturing Issues

WSF: New Advances in Nonlinear Circuit Design WSG: High Power RF Si: Devices, Modules and Trends 6 to 10 PM
WSH: Web-based RF and Microwave Education Crowne Plaza
WSI: Advances in RF MEMS: Components, Packaging, Reliability and Microphonics
WSJ: Ferrite Devices and Materials for Millimeter-wave Applications
WSK: Dynamics of the Microwave Workbench
SCSA: Engineering Applications of Fast-MOM and Green Function-based Wavelets
SCSB: RF Power Amplifiers: Classes A–S

Registration 7 AM to 5 PM
RFIC Plenary Session 8 AM to 10 AM — RFIC Technical Sessions 10 AM to 5 PM – Civic Plaza
May 21, 2001

WMA: Linearization for 3G Systems Microwave Journal/

Monday,

WMB: Statistical Design and Modeling Techniques for Microwave CAD MTT-S Reception
WMC: ICs for 40 Gbit/s Data Rate Communications 6 to 8 PM
WMD: Advances in Ceramic Interconnect Technologies for Wireless, RF and Microwave Applications Heard Museum
WME: Ultra-high Speed ICs for Commercial Applications — Present Status and Future Trends
WMF: High Density/Multilayer RF Interconnects PMA: RF CMOS for Bluetooth WMG: High Performance and Emerging Filter Technologies for Wireless
SCMA: Nonlinear Measurement Basics

Registration 7 AM to 5 PM
RFIC Symposium 8:30 AM to 5 PM – Civic Plaza
IMS Exhibition 9 AM to 5 PM; µAPS 12 to 5 PM
TUIF: INTERACTIVE FORUM 2:30 TO 5 PM Rump Session:
Tuesday, May 22, 2001

TU1A: Techniques for System Level RFIC Session TU4A: Low Noise Amplifiers Challenges
Room Room

36–38 room
Tucson Ball-

Nonlinear Analysis and Simulation (LNAs) (Joint IMS/RFIC) and Opportunities

TU1B: Power Combiners/Dividers TU3B: Baluns, Spiral Inductors TU4B: Innovative Structures Facing Microwave CAD
and Directional Couplers and Resonators 7 to 9:30 PM
TU1C: Microwave Photonics TU3C: MEMS for Antenna TU4C: MEMS Control Circuits Hyatt
Tucson
Room

40–41

Applications
TU1D: Frequency Converters TU2A: Plenary Session PTA: One Chip Radio TU3D: Control Devices TU4D: Acoustic Devices
Tucson

Corona Ranch
Room

42–43

for Wireless Communications

and Sensing 5 to 10:00 PM
TU1E: Smart Antennas TU3E: Phased Array Antennas TU4E: Novel Antennas
26–29,
Room

31–34
Yuma

and Applications
TU1F: Biological Effects RFIC Session RFIC Session
Room

21–23
Yuma

and Medical Applications

Registration 7 AM to 5 PM
IMS Exhibition & µAPS 9 AM to 5 PM Industry-hosted Cocktail
WEIF: INTERACTIVE FORUM 2:30 TO 5 PM Reception
Wednesday, May 23, 2001

WE1A: Mode Conversion Between WE2A: Novel Transmission Lines, WE3A: Power Amplifiers WE4A: Next Generation Power 6 to 7:30 PM
Room Room Room

40–41 36–38 room

Tucson Tucson Ball-

Dissimilar Transmission Media Properties and Applications for Wireless Applications Amplifier Techniques Hyatt
WE1B: High Power Amplifiers WE2B: Techniques to Advance Power WE3B: Wideband Communications WE4B: New Technologies for
and Devices Amplifier Linearity and Efficiency Systems Wireless Communications Systems Awards Banquet
WE1C: Non-linear Device WE2C: Nonlinear FET Modeling WE3C: Nonlinear Modeling of WE4C: Wireless Sensors for 7:30 to 10:00 PM
Modeling Silicon Devices and Power Amplifiers Automotive, RFID and Comm. Systems Hyatt
WE1D: Frequency Control Advances WE2D: The NBS/NIST Centennial: PWA: Automotive Radar WE3D: Microwave and Optical WE4D: Internet via Satellites
Tucson
Room

42–43

for Wireless Applications One Hundred Years of RF Metrology PWB: University-Industrial Broadband Internet Access Women in Engineering
and Standards Interactions 5:30 to 7:30 PM
WE1E: Dispersion Properties of WE2E: Leaky-wave Excitation WE3E: CAD with Neural Networks WE4E: CAD Procedures Hyatt
26–29,
Room

31–34
Yuma

Periodic Structures and Uniform and Guidance in Printed and EM Techniques and Optimization
Transmission Lines Transmission Lines
Room

21–23

WE1F: Advances in Time Domain WE2F: Advances in Time-domain WE3F: Applications of Time WE4F: Ferrite and Ferroelectric
Yuma

Methods I Methods II Domain Methods Devices

Registration 7 AM to 3 PM
IMS Exhibition & µAPS 9 AM to 3 PM
THIF: INTERACTIVE FORUM 2:30 TO 5 PM
Thursday, May 24, 2001

TH1A: Microwave Signal Sources TH2A: Millimeter-wave Signal TH3A: Multi-layer Packaging TH4A: Packaging Interconnect
Room

room
Ball-

Sources Techniques Techniques

Tucson Tucson Tucson

TH1B: Active and Tunable Filters TH2B: Active and Planar Filters TH3B: Linear Modeling of Devices TH4B: Frequency Domain EM
Room Room Room

42–43 40–41 36–38

and Components Techniques

TH1C: Passive Filters and TH2C: Passive Filters TH3C: Passive Filters TH4C: Low Noise Components
Multiplexers I and Multiplexers II PTHA: Commercial Exploitation and Multiplexers III and Techniques
TH1D: HF/VHF/UHF Power TH2D: Millimeter-wave of 92–96 GHz Spectrum TH3D: Millimeter-wave Transceiver TH4D: Microwave Applications
Amplifiers Multiplexers and Mixers Elements and Assemblies of Superconductivity
TH1E: Probing and Automated TH2E: Measurements TH3E: Spatial Combining
26–29,
Room

31–34
Yuma

Measurements of Non-linear and Active Antennas

Devices and Systems
TH1F: Al Gross Memorial TH2F: High Speed HBT Technology TH3F: High Performance MMIC
Room

21–23
Yuma

Special Session and Applications Technologies

Workshop Registration 7 AM to 9 AM
May 25, 2001

ARFTG Conference & Exhibition 7:30 AM to 5 PM – Crowne Plaza

Friday,

WFA: Industrial Applications of Electromagnetic (EM) Solvers

WFB: RF Passive Component Evaluation Techniques
SCFA: Introduction to MEMS and RF MEMS
SCFB: Multicarrier Signal Description for Linear Power Amplifiers
 CONTENTS (LISTED ALPHABETICALLY)

Additional Meetings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59

Administrative Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
ARFTG Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
ARFTG Conference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Awards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Crowne Plaza Hotel Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .INSIDE BACK COVER
Exhibition Invitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Exhibitors and Exhibition Hours . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Fellows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Future IMS Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
General Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
Guest Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Historical Exhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Hotel Map and Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10, 67, INSIDE BACK COVER
Housing Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Hyatt Regency Hotel Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
IEEE MTT-S Membership Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Interactive Forum
Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Microwave Application & Product Seminars . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56–57
MTT-S Technical Program Chairs’ Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Panel Sessions
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Monday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Phoenix Civic Plaza Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68, INSIDE BACK COVER
Phoenix Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Plenary Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Registration Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Registration Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
RF and Microwave Education Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
RFIC Chairman’s Message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
RFIC Symposium . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12–13
Rump Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Social Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Special Sessions
Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Special Tuesday Evening Event . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Steering Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
Student Paper Competition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Technical Program Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
Technical Sessions
Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26–31
Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34–41
Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44–51
Transportation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Workshops
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Sunday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14–18
Monday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20–23
Friday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

1
 AN INVITATION TO MICROWAVE WEEK 2001
The Microwave Theory and Techniques Society elected to start
the new millennium with an odyssey to a new frontier. On behalf
of the Steering Committee for the IMS2001, it
is my pleasure and honor to invite you to
Phoenix and the Valley of the Sun. This nev-
er-before trek signifies the new horizons mi-
crowave technologies and applications are
approaching in commercial and civilian ap-
plications. The penetration of RF and mi-
crowave systems, components, circuits, and
technologies into the daily life surrounding
many of us is at an all-time high. This trend
Samir El-Ghazaly will continue, given the steady increase in
telecommunications demand and information superhighway re-
quirements. This phenomenal technical and commercial growth
reflects and manifests itself very well in the status of the Interna-
tional Microwave Symposium.
Last year in Boston, attendance, papers, and exhibits were at
an all-time record high. We are looking forward to hosting you in
Phoenix. We expect IMS2001, in all likelihood, to break new
records again and we want you to be part of it.
In 1993, when Phoenix team started planning for hosting this
symposium, it was projected that less than half of the Civic Plaza
would be enough to accommodate it. As of today, IMS2001 ex-
panded to fill the entire plaza, and would even fill more space if it
MTT-S IMS TECHNICAL PROGRAM
IMS2001 Technical Program Committee (TPC) has put together
an excellent technical program that covers a broad spectrum of
topics that are important to the microwave
community. A record number of 930 papers
were submitted to IMS2001. The student pa-
per submissions have grown to 242 papers,
another new record for IMS. A total of 511
papers (55%) were accepted for presenta-
tions. The quality of the papers submitted
was very good, including some of the papers
we were not able to accommodate in this
year’s symposium.
Vijay Nair In order to accommodate the increased
number of papers, we added one more parallel track to the tradi-
tional five tracks. The Interactive Forum papers will be presented
Tuesday through Thursday in the afternoon. Student papers will
be sprinkled in with the regular session papers. Student paper
contest finalists will be recognized and awards will be presented
at the student award luncheon on Thursday.
Workshops and short courses will be held Sunday, Monday
and Friday. This year we have 20 workshops and five short cours-
es on a wide variety of topics of interest to the microwave com-
munity. In addition, we have five focused sessions, four panel ses-
sions and one rump session to bring you the latest in several
2
were available. More than 860 exhibit spaces have been reserved,
with more companies on the waiting list, which promises the
largest exhibit ever. The IMS and RFIC Technical Program Com-
mittees received a record of more than 1000 papers. The excellent
quality of the submitted papers forced the committees to accept
more than 500 papers, and to expand the symposium into six par-
allel sessions, which are new records. The student paper competi-
tion is more popular than ever, with 242 papers submitted.
For the microwave week to be complete, it must go beyond
technical discussions and new discoveries. Our steering commit-
tee has prepared a very rich and diverse social program for you.
You have the opportunity to visit historical sites, modern elegant
shopping boutiques, hidden valleys of Arizona, and one of the
seven natural wonders of the world, The Grand Canyon. The
southwestern evening at the Corona Ranch and Rodeo Grounds
is a new highlight of the week. The Awards Banquet is another
memorable blend of the microwave and Arizona cultures. The
microwave week is the culmination of eight years of continuous
hard work. I invite you to participate, and enjoy every aspect of it.
From the Grand-Canyon State, I extend this invitation and a
warm welcome to you. I look forward to you sharing this mi-
crowave odyssey with us.
Samir El-Ghazaly
General Chairman
2001 International Microwave Symposium
emerging technology areas. Joint sessions will be held with RFIC
on Monday and with ARFTG on Thursday. These sessions high-
light the areas of interest between IMS and the other symposia
planned for the microwave week.
Historical exhibits will be very special this
year. In addition to traditional microwave
exhibits there will be a collection of exhibits
in memory of Al Gross, who was a visionary
in the early development of wireless com-
munication systems. On Thursday morning
there will be an Al Gross memorial special
session highlighting his impact on the wire-
less communication field. Make sure to at-
Chuck Weitzel tend these special events.
This symposium also provides you an opportunity to make
new contacts, to rekindle old acquaintances and to network with
experts in RF and microwave technology. We have a variety of
social programs throughout the week so that you can enjoy your
visit to the Valley of the Sun.
We look forward to seeing you in Phoenix to experience a
week of Microwave Odyssey!
IMS2001 Technical Program Co-Chairs
Vijay Nair
Chuck Weitzel
RFIC SYMPOSIUM
On behalf of the Technical Program Committee, welcome to
the 2001 IEEE Radio Frequency Integrated Circuits (RFIC) Sympo-
sium. The RFIC Symposium is one of the
foremost IEEE Technical conference dedi-
cated to the latest innovations in monolithic
IC development for wireless and wireline
communications RF and high frequency
components. The RFIC symposium will be-
gin on Sunday with workshops on various
RF designs issues. The plenary session will
start the conference on Monday with a focus
on the next generation of Wireless LAN and
Sayfe Kiaei trends towards CMOS RF IC design. Follow-
ing this plenary session, the regular technical program starts. A
panel session during lunch will allow interactive discussions on
ARFTG CONFERENCE
Welcome to the 57th Conference of the Automatic Radio Fre-
quency Techniques Group (ARFTG), being held on Friday, May
25, 2001 in the Crowne Plaza Hotel. The con-
ference will include technical presentations,
an interactive forum, and an exhibition; all
intended to give one ample opportunity to
interact with some of the top people in the
automated RF and microwave test commu-
nity.
The main conference theme “Best Practices
and Strategies for RF Test” will focus on al-
ternatives, tradeoffs, practical considerations
Charles Wilker and particular examples of industrial mi-
crowave test and measurement methods. Technical considera-
tions (e.g., accuracy, equipment selection, test methodology)
and non-technical issues (e.g., cost of test, cost of equipment,
speed of test) will be discussed in detail by the invited presenta-
tions. In addition, papers concerning traditional ARFTG interests
such as metrology, S-parameter, noise figure and non-linear mea-
surements will be presented.
The invited presentations include Stavros Iezekiel of the Uni-
versity of Leeds discussing lightwave S-parameter measurement
EXHIBITION
The exhibition that is part of Microwave Week gives you the
opportunity to visit displays from more than 450 companies that
will be showing the latest products and services available to our
industry. A number of new companies will be exhibiting this year
in addition to the traditional exhibitors. In addition, the Mi-
crowave Application and Product Seminars (µAPS), which are in
their fifth year, will be held on the show floor. These seminars are
always well received and have been improved and expanded for
this year’s meeting.
3
the merits of CMOS RF design for Bluetooth. Recent advances
and pros and cons of CMOS for RF design will be discussed by
the experts in this area. On Monday afternoon and Tuesday, there
will be over 12 sessions dealing with various aspects of RF mono-
lithic IC development. The RFIC symposium will conclude on
Tuesday with a joint session with IMS.
Thanks to the authors and technical program committee mem-
bers for an exciting RFIC technical program. Please join us for
this symposium and we look forward to seeing you in Phoenix.
Sayfe Kiaei
RFIC Technical Program Chairman
2001 IEEE RFIC Symposium
techniques, John Mahon of M/A-COM on practical test considera-
tions in a production microwave component manufacturing envi-
ronment, and Eric Strid of Cascade Microtech on high-throughput
microwave probing.
An important part of any ARFTG Conference is the opportunity
to interact one-on-one with colleagues, experts and vendors in
the rf and microwave test and measurement community.
Whether your interests include high-throughput production or
one-of-a-kind metrology measurements, complex systems or sim-
ple circuit modeling, small signal S-parameter or large-signal non-
linear measurements, phase noise or noise figure, dc or light-
wave, you will find a kindred spirit or maybe even an expert. The
continental breakfast in the exhibition area, the two exhibition/
interactive forum sessions and the luncheon, offer ample oppor-
tunity for discussion with others facing similar test and measure-
ment challenges. Attendees often find that these interactions are
their best source of ideas and information for their current pro-
jects. So come and join us. You’ll find that the atmosphere is in-
formal and friendly.
Check out ARFTG on the Web at www.arftg.org.
Charles Wilker
Conference Chair
The exhibition is open from 9:00 AM to
5:00 PM on Tuesday and Wednesday and
from 9:00 AM to 3 PM on Thursday. I hope you
will take advantage of this unique chance to
visit the largest group of microwave ex-
hibitors at any show in the world.
Harlan Howe, Jr.
Exhibition Manager
Harlan Howe, Jr.
 PLENARY SESSION
All Microwave Week registrants and guests are invited to at-
tend the IMS 2001 Plenary Session, which will begin at 10:10 AM
on Tuesday, May 22, in the Phoenix Symphony Hall. Welcoming
remarks will be given by Symposium Chairman Samir El-Ghazaly,
Arizona State University President Lattie Coor, and by MTT-S Pres-
ident Charles Jackson, followed by an overview of the technical
program by TPC Chairman Vijay Nair. The Class of 2001 IEEE Fel-
lows will be recognized, and 2000 IEEE President Bruce Eisen-
stein will present the IEEE Electromagnetics Award to Professor
Fawwaz T. Ulaby.
Mr. Dennis A. Roberson, Senior Vice-President and Chief Tech- Fawwaz T. Ulaby Dennis A. Roberson Stephen M. Goodnick
nical Officer of Motorola Inc., will present the keynote address.
Stephen M. Goodnick, Vice Chairman
IMS 2001 Steering Committee

SPECIAL SESSIONS
The IMS2001 technical program committee has organized five
sessions in diverse areas of special interest to many attendees of
the Symposium. All papers in these special sessions were solicit-
ed and invited by the session organizers, and then reviewed and
accepted by the technical program committee. Detailed descrip-
tions of the special sessions can be found on the pages listed af-
ter each session title to the right:
✗ Session WE1D — Frequency Control Advances for Wireless
Applications (See page 43.)
✗ Session WE2D — The NBS/NIST Centennial: One Hundred
Years of RF Metrology and Standards (See page 43.)
✗ Session WE3D — Microwave and Optical Broadband Internet
Access (See page 43.)
✗ Session WE4D — Internet via Satellites (See page 43.)
✗ Session TH1F — Al Gross Memorial Special Session (See
page 53.)

NOTES

4
 WORKSHOPS
(FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2001.ORG)
Number Time Title
Sunday
May 20
WSA 8:00 AM–5:00 PM State-of-the-Art Filter Design Using EM and Circuit Simulation Techniques
WSB 8:00 AM–5:00 PM RF Systems and Circuit Issues of Third Generation Wideband
CDMA Systems Like UMTS
WSC 8:00 AM–5:00 PM RF and High Speed Applications of Tunnel Devices
WSD 8:00 AM–5:00 PM Microwave Photonic Component, Integration and System Techniques
for Broadband Fiber-fed Wireless
WSE 8:00 AM–5:00 PM Advanced LTCC Microwave Design and Manufacturing Issues
WSF 8:00 AM–12:00 PM New Advances in Nonlinear Circuit Design
WSG 1:00 PM–5:00 PM High Power RF Si: Devices, Modules and Trends
WSH 8:00 AM–5:00 PM Web-based RF and Microwave Education
WSI 8:00 AM–5:00 PM Advances in RF MEMS: Components, Packaging,
Reliability and Microphonics
WSJ 8:00 AM–5:00 PM Ferrite Devices and Materials for Millimeter-wave Applications
WSK 1:00 PM–5:00 PM Dynamics of the Microwave Workbench
Monday
WMA 8:00 AM–5:00 PM Linearization for 3G Systems
May 21
WMB 8:00 AM–5:00 PM Statistical Design and Modeling Techniques for Microwave CAD
WMC 8:00 AM–5:00 PM ICs for 40 Gbit/s Data Rate Communications
WMD 8:00 AM–5:00 PM Advances in Ceramic Interconnect Technologies for Wireless,
RF and Microwave Applications
WME 8:00 AM–5:00 PM Ultra-high Speed ICs for Commercial Applications —
Present Status and Future Trends
WMF 8:00 AM–12:00 PM High Density/Multilayer RF Interconnects
WMG 1:00 PM–5:00 PM High Performance and Emerging Filter Technologies for Wireless
Friday
May 25
WFA 8:00 AM–12:00 PM Industrial Applications of Electromagnetic (EM) Solvers
WFB 8:00 AM–12:00 PM RF Passive Component Evaluation Techniques

MTT-S PANEL AND RUMP SESSIONS

In addition to the workshops and special PANEL SESSIONS RUMP SESSION
sessions, the 2001 Symposium will feature Monday, May 21 Tuesday, May 22
five lunchtime (12:00 to 1:15 PM) panel ses- • RF CMOS for Bluetooth • Challenges and Opportunities
sions at the Civic Plaza. Furthermore, an for Microwave CAD
evening rump session will be held on Tues- Tuesday, May 22
day evening, from 7:00 to 9:30 PM at the Hy- • One Chip Radio Detailed descriptions of the panel and
att. These panel and rump sessions provide Wednesday, May 23 rump sessions can be found on pages 24, 33,
attendees with opportunities to hear lively di- • Automotive Radar 43 and 53 for Monday, Tuesday, Wednesday
alog and differing views from a panel of ex- • University-Industry Interactions and Thursday, respectively.
perts on subjects of current interest, while at Participation in the panel and rump ses-
the same time allowing a high level of audi- Thursday, May 24 sions requires separate registration; please
ence interaction. The following topics will be • Commercial Exploitation of 92-96 GHz use the registration form on page 7. Registra-
discussed: Spectrum tion for panel sessions includes a box lunch;
rump session registration includes refresh-
ments.
5
 2001 IEEE MICROWAVE THEORY AND TECHNIQUES SOCIETY
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MEMBERSHIP APPLICATION
(Current and reinstating IEEE members joining MTTS complete areas 1, 2, 8, 9.)
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2001 MTT-S MEMBER RATES

Years in the Profession Since Graduation ■ PE State/Province
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(Pay $40.00 once for “permanent” MTT-S membership
City State/Province for as long as IEEE membership remains current) $40.00 ■
MTT CD-ROM Collection
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Postal Code Country Symposium and RFIC Symposium (Included in membership fee)
Selected Publications of MTT and ED Societies
4. EDUCATION A baccalaureate degree from an IEEE recognized educational
program assures assignment of “Member” grade. For others, additional information and
T-MTT, MGW-L, ED-L, T-ED
Microwave and Guided Wave
(Included in membership fee)

references may be necessary for grade assignment. Letters $118.00 ■ $14.00 ■

A. Transactions on:
Baccalaureate Degree Received Program/Course of Study Applied Superconductivity $118.00 ■ $19.00 ■
Microwave Theory
College/University Campus and Techniques $113.00 ■ $17.00 ■
Journal of Lightwave
State/Province Country Mo./Yr. Degree Received Technology, IEEE/OSA $135.00 ■ $18.00 ■
B. *IEEE membership required or request
*Affiliate application to join MTT Society only. Amount Paid $ __________
Highest Technical Degree Received Program/Course of Study

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Office Fax Home Fax Cardholder 5 Digit Zip Code
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Full signature of applicant using credit card Date

6
 Advance Conference Registration
IEEE MTT-S MICROWAVE WEEK EVENTS
May 20–25, 2001 ✦ Phoenix, AZ ✦ IMS ✦ RFIC ✦ ARFTG
EachEach conference
conference attendee
attendee must submit
must submit a separatea separate registration
registration form.
form. A copy of this form may be used.
ADeadline
copy of for
thisadvance
form may be used.via
registration The
faxdeadline
or mail is for
Apriladvanced registrationdeadline
27, 2001. Registration is May 15, 2000. is May 4, 2001.
via Website
Afterwards, Afterwards,
on-site feeson-site
apply fees
and apply
will be
andapproximately 30% higher.
will be approximately 30% higher.

NAME
Last First
AFFILIATION
Company, Etc. Mail Stop
ADDRESS
Street

City State/Prov. Postal Code Country

e-mail Address
US/CANADA TEL. INT'L TEL.
IEEE MEMBER ■ Yes ■ No IEEE Membership No.* MTT-S MEMBER ■ Yes ■ No
*Must be given to qualify for member discount

Name of Guest ARFTG MEMBER ■ Yes ■ No

For a complimentary badge for plenary session and exhibits
✓ the appropriate boxes and enter corresponding fees in the Remittance column.
To register, check ■
ONLY PAID ATTENDEES WILL BE ADMITTED TO THE WORKSHOPS AND TECHNICAL SESSIONS.
INTERNATIONAL MICROWAVE SYMPOSIUM (Tue, Wed. & Thur.) WORKSHOPS AND SHORT COURSES For paid attendees only.
(INCLUDES EXHIBITS AND LUNCH) IEEE Non- (SEE BACK OF THIS PAGE FOR TITLES.) Student/Retiree/
Member Member Remittance IEEE Member Non-member Life Member
All IMS Sessions (Includes IMS CD ROM and Digest.) ■ $290 ■ $420 $ ___________ Full Day $100 $130 $75
All IMS Sessions (Includes IMS CD ROM, no Digest.) ■ $240 ■ $370 $ ___________ Half Day $170 $190 $55
Single-Day Registration ■ $125 ■ $180 $ ___________ SUNDAY MONDAY FRIDAY
(Includes IMS CD ROM, no Digest.) ■ WSA (Full Day) $____ ■ WMA (Full Day) $____ ■ WFA (Morning) $____
Student, Retiree, Life Member ■ $140 ■ $155 $ ___________ ■ WSB (Full Day) $____ ■ WMB (Full Day) $____ ■ WFB (Morning) $____
(Includes IMS CD ROM, no Digest.) ■ WSC (Full Day) $____ ■ WMC (Full Day) $____
RFIC SYMPOSIUM (Mon. & Tue.) ■ $125 ■ $175 $ ___________ ■ WSD (Full Day) $____ ■ WMD (Full Day) $____
(INCLUDES EXHIBITS, LUNCH, RFIC RECEPTION AND RFIC DIGEST.) ■ WSE (Full Day) $____ ■ WME (Full Day) $____
■ WSF (Morning) $____ ■ WMF (Morning) $____
RFIC Reception Only ■ $250 ■ $450 $ ___________
■ WSG (Afternoon) $____ ■ WMG (Afternoon) $____ WORKSHOPS $ ________
ARFTG–AUTOMATIC RF TECHNIQUES GROUP CONFERENCE (Thur., Fri.) ■ WSH (Full Day) $____ TOTAL
(INCLUDES EXHIBITS, BREAKFAST, LUNCH, ARFTG DIGEST AND ARFTG EXHIBITION.) ■ WSI (Full Day) $____
ARFTG Member ■ $150 $ ___________ ■ WSJ (Full Day) $____
ARFTG Non-member ■ $190 $ ___________ ■ WSK (Afternoon) $____
ARFTG Student, Retiree ■ $170 $ ___________ SHORT COURSES (SEE BACK OF THIS PAGE FOR TITLES.)
ADDITIONAL DIGESTS AND CD ROMS SUNDAY MONDAY FRIDAY
(FOR PICKUP ON-SITE ONLY. SEPARATE DIGESTS AND CD ROMS WILL BE AVAILABLE AFTER THE SYMPOSIUM FROM THE IEEE.) ■ SCSA (Full Day) $____ ■ SCMA (Full Day) $____ ■ SCFA (Full Day) $____
IMS Digest Qty. ___ @ ■ $170 ■ $190 $ ___________ ■ SCSB (Full Day) $____ ■ SCFB (Full Day) $____
IMS CD ROM Qty. ___ @ ■ $120 ■ $130 $ ___________ SHORT COURSES TOTAL $ ________
RFIC Digest Qty. ___ @ ■ $135 ■ $150 $ ___________ Full-day workshops and short courses include continental breakfast, lunch and afternoon
refreshments. Morning workshops include continental breakfast and lunch.
ARFTG Digest Afternoon workshops include lunch and afternoon refreshments.
Member Qty. ___ @ ■ $120 $ ___________ Registration includes Workshop CD ROM.
Workshop presenters’ notes will be available at the workshop.
Non-member Qty. ___ @ ■ $145 $ ___________
GUEST PROGRAMS
PANEL SESSIONS (INCLUDES BOX LUNCH. SEE REVERSE SIDE FOR SCHEDULE.)
PMA: RF CMOS for Bluetooth ■ $10 $ ___________ GSA: Phoenix Valley Area Highlights Qty. ___ @ ■ $127 $________
GSB: Boyce Thompson Arboretum Qty. ___ @ ■ $158 $________
PTA: One Chip Radio ■ $10 $ ___________ GMC: Native American Cultures Tour Qty. ___ @ ■ $138 $________
PWA: Automotive Radar ■ $10 $ ___________ GMD: Desert Botanical Garden Qty. ___ @ ■ $138 $________
PWB: University-Industrial Interactions ■ $10 $ ___________ GTE: Taliesin West Qty. ___ @ ■ $141 $________
PTHA: Commercial Exploitation of 92–96 GHz Spectrum ■ $10 $ ___________ GWF: Phoenix Art Museum Qty. ___ @ ■ $134 $________
GWG: Verde Canyon Train (1st class) Qty. ___ @ ■ $188 $________
RUMP SESSION (TUESDAY EVENING) GWH: Verde Canyon Train (coach) Qty. ___ @ ■ $172 $________
RTA: Challenges & Opportunities Facing Microwave CAD ■ $20 $ ___________ GTHI: Sedona/Montezuma Castle Qty. ___ @ ■ $156 $________
GTHJ: Sedona/Grand Canyon (overnight double occ.) Qty. ___ @ ■ $180 PP$________
AWARDS BANQUET (WEDNESDAY EVENING) Qty. ___@ ■ $40 $ ___________ GTHK: Sedona/Grand Canyon (overnight single occ.) Qty. ___ @ ■ $212 $________
GFL: Grand Canyon (overnight double occ.) Qty. ___ @ ■ $193 PP$________
HYATT REGENCY GFM: Grand Canyon (overnight single occ.) Qty. ___ @ ■ $240 $________
GFN: Grand Canyon via Sedona & Navajo Nation Qty. ___ @ ■ $183 $________
SOCIAL EVENT (TUESDAY EVENING) Qty. ___@ ■ $35 $ ___________
CORONA RANCH AND RODEO GROUNDS GUEST PROGRAM TOTAL $________

The only acceptable forms of payment are check, money order, MasterCard, VISA or American Express.
TOTAL REMITTANCE $ _________________
Make your check or money order (US $ ONLY on a US Bank or Traveler’s Check) payable to: IEEE/MTT-S
INDIVIDUAL PAYMENT MUST ACCOMPANY FORM

■ MasterCard ■ VISA ■ American Express

Card # Exp. Date
Written requests for refunds will be honored if received by April 27, 2001.
Signature _________________________________________ A $25 cancellation fee will be charged for processing.
(Signature must accompany credit card payment)

MAIL COMPLETED FORM AND PAYMENT TO:

MTT-S Registration, 685 Canton Street, Norwood, MA 02062
For information or handicap special needs only (phone registration is not available) (781) 769-9750.

PLEASE FAX (781) 769-5037 OR MAIL; DO NOT FORWARD HARD COPY IF FAXED
R
REGISTRATION IS AVAILABLE ONLINE AT WWW.MTT-SREGISTRATION.COM R

7
 WORKSHOPS
(FOR A MORE DETAILED DESCRIPTION OF ANY OF THE EVENTS ON THIS PAGE, VISIT WWW.IMS2001.ORG)
Number Time Title
Sunday WSA 8:00 AM–5:00 PM State-of-the-Art Filter Design Using EM and Circuit Simulation Techniques
May 20 WSB 8:00 AM–5:00 PM RF Systems and Circuit Issues of Third Generation Wideband CDMA Systems Like UMTS
WSC 8:00 AM–5:00 PM RF and High Speed Applications of Tunnel Devices
WSD 8:00 AM–5:00 PM Microwave Photonic Component, Integration and System Techniques for Broadband Fiber-fed Wireless
WSE 8:00 AM–5:00 PM Advanced LTCC Microwave Design and Manufacturing Issues
WSF 8:00 AM–12:00 PM New Advances in Nonlinear Circuit Design
WSG 1:00 PM–5:00 PM High Power RF Si: Devices, Modules and Trends
WSH 8:00 AM–5:00 PM Web-based RF and Microwave Education
WSI 8:00 AM–5:00 PM Advances in RF MEMS: Components, Packaging, Reliability and Microphonics
WSJ 8:00 AM–5:00 PM Ferrite Devices and Materials for Millimeter-wave Applications
WSK 1:00 PM–5:00 PM Dynamics of the Microwave Workbench
Monday WMA 8:00 AM–5:00 PM Linearization for 3G Systems
May 21 WMB 8:00 AM–5:00 PM Statistical Design and Modeling Techniques for Microwave CAD
WMC 8:00 AM–5:00 PM ICs for 40 Gbit/s Data Rate Communications
WMD 8:00 AM–5:00 PM Advances in Ceramic Interconnect Technologies for Wireless, RF and Microwave Applications
WME 8:00 AM–5:00 PM Ultra-high Speed ICs for Commercial Applications — Present Status and Future Trends
WMF 8:00 AM–12:00 PM High Density/Multilayer RF Interconnects
WMG 1:00 PM–5:00 PM High Performance and Emerging Filter Technologies for Wireless
Friday WFA 8:00 AM–12:00 PM Industrial Applications of Electromagnetic (EM) Solvers
May 25 WFB 8:00 AM–12:00 PM RF Passive Component Evaluation Techniques

PANEL SESSIONS
Monday PMA 12:00 PM–1:15 PM RF CMOS for Bluetooth
Tuesday PTA 12:00 PM–1:15 PM One Chip Radio
Wednesday PWA 12:00 PM–1:15 PM Automotive Radar
Wednesday PWB 12:00 PM–1:15 PM University-Industrial Interactions
Thursday PTHA 12:00 PM–1:15 PM Commercial Exploitation of 92–96 GHz Spectrum

SHORT COURSES
Sunday SCSA 8:00 AM–5:00 PM Engineering Applications of Fast-MOM and Green Function-based Wavelets
Sunday SCSB 8:00 AM–5:00 PM RF Power Amplifiers: Classes A–S
Monday SCMA 8:00 AM–5:00 PM Nonlinear Measurement Basics
Friday SCFA 8:00 AM–5:00 PM Introduction to MEMS and RF MEMS
Friday SCFB 8:00 AM–5:00 PM Multicarrier Signal Description for Linear Power Amplifiers

SOCIAL EVENTS
Sunday 6:00 PM –10:00 PM RFIC Reception
Monday 6:00 PM–8:00 PM Microwave Journal Reception
Tuesday 5:00 PM–10:00 PM Corona Ranch and Rodeo Grounds
Wednesday 5:30 PM–7:30 PM Women in Engineering Reception
Wednesday 6:00 PM–7:30 PM Industry Reception
Wednesday 7:30 PM–10:00 PM Awards Banquet

GUEST PROGRAMS
Sunday GSA 12:30 PM–4:30 PM Phoenix Valley Area Highlights
Sunday GSB 8:30 AM–4:30 PM Boyce Thompson Arboretum
Monday GMC 9:00 AM–2:30 AM Native American Cultures Tour
Monday GMD 8:30 AM–12:00 PM Desert Botanical Garden
Tuesday GTE 8:00 AM–12:00 PM Taliesin West
Wednesday GWF 8:00 AM–12:00 PM Phoenix Art Museum
Wednesday GWG 9:00 AM–6:30 PM Verde Canyon Train (1st class)
Wednesday GWH 9:00 AM–6:30 PM Verde Canyon Train (coach)
Thursday GTHI 8:00 AM–5:30 PM Sedona/Montezuma Castle
Thursday GTHJ 7:30 AM–8:30 PM Sedona/Grand Canyon (overnight double occ.)
Thursday GTHK 7:30 AM–8:30 PM Sedona/Grand Canyon (overnight single occ.)
Friday GFL 7:00 AM–8:30 PM Grand Canyon (overnight double occ.)
Friday GFM 7:00 AM–8:30 PM Grand Canyon (overnight single occ.)
Friday GFN 7:00 AM–8:30 PM Grand Canyon via Sedona & Navajo Nation

8
 CONFERENCE HOUSING
2001 IEEE MTT-S INT’L
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MICROWAVE SYMPOSIUM ATTENDEE
use code
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May 20–25, 2001 • Phoenix, AZ IEEEATTO5O1
MTT-S • ARFTG • RFIC
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1. Check one: ■ Single ■ Double (1 bed) ■ Dbl/Dbl (2 dbl beds) ■ Govt.
ROOM
Arr. Date: ____________________ Dep. Date: ____________________
NO. 3
2. Requests: ■ Smoking ■ Non-Smoking ■ Wheelchair Accessible ■ King

9
 HOTEL INFORMATION

CAMELBA
ACK ROAD N
CAMPBEELLL ROAD
8
INDIAN S
SCHOOL
CHOOL R
ROOAD
7
CLAREND
DON ROAD
D
NOT
6 TO
OSBORN
N ROAD
SCALE

STTREET
TREET
STREET
TREET

STREET
TREET

44th STREET
STREET
TREET

STREET
TREET
STREET
TREET

STREET
STREET
STREET
REET
TREET

TREET
STREET
REET
THOMAS
S ROAD
R 17
4th AVENUE

4th ST
1st ST

7th ST

32nd S
16th S

24th S
2nd S

5th S
3rd S
AVE.

East-West streets
3rd

12 are 1/2 mile apart

13
W 5
16
E North-South streets
are 1/8 mile apart

FILMOREE STREET

3
POLK S
STTREET

VAN BUR
REN
R EN STREEET 10 11
4
MONROEE STREET

2 1 PHOENIX
ADAMS STREET
CIVIC
PLAZA
WASHING
GTON STR
G STREEET 9

JEFFERSON
JEFFERSO
JEFFERS ON STREE
STREETT
**
**3 miles
BUCKEYEE ROAD INT’L AIRPORT from Civic Plaza

UNIVERS
SITY
S TY DRIVE S
*

15 *1.5 miles SE 14
of Airport

2001 IMS CONFERENCE HOTELS

Listed Convention Rates are available only for reservations made by May 3, 2001
Map No. Hotel Single Double
1 Hyatt Regency Hotel $162 $162 Govt Rate $79
2 Crowne Plaza $102 $102
3 Ramada Inn – Downtown $199 $199
4 San Carlos Hotel $109 $109
*5 Best Western Executive Park $199 $199
*6 Quality Inn & Resort $199 $199
*7 Lexington City Square Hotel $199 $199
*8 Holiday Inn Midtown $199 $199 Govt Rate $79
*9 Holiday Inn Select AP $199 $199
*10 Doubletree Suites $112 $112
*11 Wyndham Phoenix Airport $103 $103
*12 Embassy Suites Airport $112 $122
*13 Phoenix Airport Marriott $101 $112
*14 Sheraton Phoenix Airport $109 $109
*15 Wyndham Buttes Resort $140 $140
*16 Radisson Phoenix Airport $199 $199
*17 Phoenix Hilton Suites $159 $159

Check with the Housing Bureau for triple or quadruple occupancy rates.
*Denotes hotels on shuttle routes.
10
 REGISTRATION
REQUIREMENTS ON-SITE REGISTRATION FEES
Registration fees are required of all participants, including ses- IEEE Non-
sion chairs, authors, and workshop and panel session organizers Member Member
and speakers. Int’l Microwave Symposium
ADVANCE REGISTRATION All IMS Sessions $375 $525
Reduced rates are offered for advanced registration when re- (Includes IMS CD ROM and Digest.)
ceived by April 27, 2001. A registration form is available on page All IMS Sessions $325 $465
7 of this program. Each registrant must submit a separate form, (Includes IMS CD ROM, no Digest.)
with payment, to the address shown at the bottom of the registra- Single Day $155 $230
tion form. If using a credit card, then fax and online registration is (Includes IMS CD ROM, no Digest.)
available. When mailing, please mail early to ensure receipt by Student, Retiree, Life Member $50 $60
the deadline; otherwise, on-site fees will apply. (Includes IMS CD ROM, no Digest.)
Individual remittance must accompany the registration form RFIC Symposium $150 $210
and is payable in US dollars only using personal check drawn on RFIC Reception Only $50 $50
a US bank, traveler’s check, international money order or credit
card (MasterCard, VISA or American Express). Personal checks ARFTG Conference
must be encoded at the bottom with the bank number, account ARFTG Member $180 $180
number and check number. Bank drafts, wire transfers and cash ARFTG Non-member $220 $220
are unacceptable and will be returned. Government or company ARFTG Student/Retiree $90 $90
purchase orders will not be accepted and will be returned.
Additional Digests and CD ROMs (on-site pickup only)
GUEST REGISTRATION IMS Digest $70 $90
To preregister your guest, include his or her name on your reg- IMS CD ROM $20 $30
istration form. Guest badges will be included in the envelope that RFIC Digest $35 $50
you will receive upon check-in. On-site guest registration also will ARFTG Digest
be available. ARFTG Member $20 $20
STUDENTS, RETIREES AND LIFE MEMBERS ARFTG Non-member $45 $45
Students, retirees and IEEE Life Members receive a substantial Panel Session $15 $15
discount on the IMS registration fee. Digests are not included. To
qualify as a student, a registrant must be either a student member
Rump Session $25 $25
of IEEE or a full-time student carrying a course load of at least Awards Banquet $40 $40
nine credit hours. ARFTG also provides discounts for students
and retirees. Exhibits Only $10 $10
PRESS REGISTRATION Guest Programs (See page 66 for complete information.)
Credentialed press representatives are welcome to register on- GSA: Phoenix Valley Area Highlights $127
site only at the Exhibitor Counter, without cost and thereby have GSB: Boyce Thompson Arboretum $158
access to technical sessions and exhibits. Digest are not GMC: Native American Cultures Tour $138
included. GMD: Desert Botanical Garden $138
GTE: Taliesin West $141
ON-SITE REGISTRATION GWF: Phoenix Art Museum $134
On-site registration for all Microwave Week events will be avail- GWG: Verde Canyon Train (1st class) $188
able at the Phoenix Civic Plaza. Registration hours are: GWH: Verde Canyon Train (coach) $172
Saturday, May 19 2:00 PM–6:00 PM GTHI: Sedona/Montezuma Castle $156
Sunday, May 20 7:00 AM–6:00 PM GTHJ: Sedona/Grand Canyon (overnight double occ.) $180 PP
Monday,May 21 7:00 AM–5:00 PM GTHK: Sedona/Grand Canyon (overnight single occ.) $212
Tuesday, May 22 7:00 AM–5:00 PM GFL: Grand Canyon (overnight double occ.) $193 PP
Wednesday, May 23 7:00 AM–5:00 PM GFM: Grand Canyon (overnight single occ.) $240
Thursday, May 24 7:00 AM–3:00 PM GFN: Grand Canyon via Sedona & Navajo Nation $183
Friday, May 25 7:00 AM–9:00 AM
Workshops IEEE Non- Student/Retiree
ON-SITE WORKSHOP REGISTRATION Member Member Life Member
On-site registration on Saturday and Sunday is available to Full Day $130 $165 $190
everyone. On-site registration for Friday’s workshops will be avail- Half Day $185 $110 $160
able from 7:00 to 9:00 AM on Friday for those who have not previ-
ously registered. REFUND POLICY
Refund requests received by April 27, 2001 will be honored,
ON-SITE ARFTG REGISTRATION but will be subject to a $25 service charge. For requests post-
Late on-site ARFTG registration will be available at the Phoenix marked after this date, preregistrants will, in lieu of a refund, be
Civic Plaza on Friday from 7:00 to 9:00 AM. If at all possible, please mailed any digests due. This policy applies to registrations for
preregister earlier in the week to reduce the on-site workload. guest programs and the awards banquet as well. Please state the
preregistrant’s name and provide a mailing address for the refund
check. If the registration was paid by credit card, reimbursement
will be through an account credit. Address your requests to:
MTT-S Registration, 685 Canton St., Norwood, MA 02062.

11
 Message from the RFIC General Chairman 2001 RFIC TECHNICAL PROGRAM
Welcome to the 2001 IEEE Radio Frequency Integrated Circuit (RFIC)
Symposium, being held in Phoenix, Arizona at the Phoenix Civic Plaza, MON1A Advances in RF CMOS — Ballroom
May 20-22, 2001. The RFIC Symposium is the lead- RFIC Plenary Session
ing IEEE conference dedicated to the advance- Chair: D. Lovelace, Gain Technology • Co-chair: S. Kiaei, Arizona State Univ.
ment of monolithic IC technologies for RF, wire- 8:30 AM MON1A-1: Invited: Wireless LASN Revolution: From Silicon to Systems
less and broadband communications systems. T.H. Meng, B. McFarland, Atheros Communications Inc.
The Symposium opens on Sunday, May 20 with 9:15 AM MON1A-2: Keynote Paper: Recent Advances in RF CMOS
A. Hajimiri, Cal Tech. University
workshops, and continues on Monday and Tues-
11:00 AM MON2B-3: A Nonlinear Capacitance Cancellation Technique and its
day, May 21 and 22, with technical sessions. The Application to a CMOS Class AB Power Amplifier
Technical Program Committee under the chair- C. Wang, L.E. Larson, P.M. Asbeck, Center for Wireless Communications, La Jolla,
manship of Dr. Sayfe Kaiei has selected 60 papers USA
for presentation during 14 technical sessions and
MON2A W-CDMA Transceivers — Ballroom
an interactive forum. Topics such as Wideband Chair: N. Camilleri, RF & Wireless Design • Co-chair: S. Heinen, Infineon Tech.
David Lovelace CDMA transceivers, RF and microwave power am- 10:20 AM MON2A-1: A W-CDMA Zero-IF Front-end for UMTS in a 75 GHz SiGe
plifiers, frequency generation, next generation front-end design, RF IC BiCMOS Technology
packaging, RF IC passive components and high frequency device model- H. Pretl, Danube Integrated Circuits Eng, Linz, Austria; W. Schelmbauer, L. Maurer,
ing will be presented. There are four invited papers covering topics in low H. Westermayr, R. Weigel, University of Linz, Linz, Austria; B. Klepser, B. Adler,
cost RF CMOS design and GPS for handheld applications. Monday will in- J. Fenk, Infineon Tech, Munich, Germany
clude a lunchtime panel discussion on the topic of RF CMOS for Blue- 10:40 AM MON2A-2: Dual-Band/Tri-Mode Receiver IC for N- and W-CDMA
tooth applications. Systems Using 6"-PHEMT Technology
The technical program is complemented by social activities to relax, B. McNamara, S. Zhang, M. Murphy, Infineon Technologies Corp., Nashua, USA;
meet peers, make new friends and have informal technical discussions. H.M. Banzer, H. Kapusta, E. Rohrer, T. Grave, L. Verweyen, Infineon Technologies AG,
The opportunity to meet informally with colleagues has proven to be an Munich, Germany
important part of past symposia. The RFIC social program includes the 11:00 AM MON2A-3: High-performance Quadrature Modulators for Broadband
traditional reception held on Sunday evening, as well as the Microwave Wireless Communication
Journal Reception on Monday evening. On Tuesday, the RFIC Symposium B. Sam, Analog Devices Inc., Beaverton, USA; P. Halford, Analog Devices, Wilmington,
attendees will also be able to attend the Plenary Session of the USA
MTT-S Symposium and visit over 850 exhibit booths displaying a wide va- 11:20 AM MON2A-4: A Versatile Receiver IC Supporting W-CDMA, CDMA and
AMPS Cellular Handset Applications
riety of RF and microwave products and services.
K. Rampmeier, B. Agarwal, P. Mudge, D. Yates, Conexant Systems Inc., Newport
Once again, on behalf of the Steering Committee, we welcome you to Beach, USA; T. Robinson, Wavecom, Paris, France
the 2001 IEEE RFIC Symposium in Phoenix. 11:40 AM MON2A-5: Fully Integrated W-CDMA IF Chip-set for UMTS Mobiles
David Lovelace W. Thomann, J. Fenk, Infineon Technologies, Munich, Germany; R. Weigel,
General Chairman, 2001 IEEE RFIC Symposium University of Linz, Linz, Austria; R. Hagelauer, University of Linz, Linz, Austria
MON2B Power Amplifiers: Technology & Performance — Tucson 38–39
Chair: B. Thompson, Motorola Inc. • Co-chair:F. Ali, Nokia Mobile Phones
RFIC STEERING COMMITTEE 10:20 AM MON2B-1: A 50% Efficiency InGaP/GaAs HBT Power Amplifier Module
for 1.95 GHz Wide-band CDMA Handsets
T.B. Nishimura, M. Tanomura, K. Azuma, K. Nakai, Y. Hagegawa,
David Lovelace, General Chair H. Shimawaki, NEC Corp., Kawasaki, Japan
Sayfe Kiaei, Technical Program Chair Advisory Board
Fazal Ali 10:40 AM MON2B-2: SiGe-power Amplifiers in Flipchip and Packaged Technology
Luciano Boglione, Digest W. Bischof, M. Alles, S. Gerlach, A. Kruck, A. Schueppen, J. Sinderhauf, H. Wassener,
Natalino Camilleri, Transactions Eliot Cohen
Reynold Kagiwada Atmel Wireless & Microcontrollers, Heilbronn, Germany
Aditya Gupta, Publicity 11:20 AM MON2B-4: Student: RF Power Performance of LDMOSFETs on SOI:
Stephen Lloyd, Secretary Christian Kermarrec
An Experimental Comparison with Bulk Si LDMOSFETs
Jyoti Mondal, Finance Louis Liu J.G. Fiorenza, J.A. del Alamo, Massachusetts Institute of Technology, Cambridge, USA
Joe Staudinger, Local Arrangements Vijay Nair
MON2C Frequency Generation — Tucson 40–41
Chair: A. Jerng, DSP Group • Co-chair: Y. Deval, Laboratoire IXL
10:20 AM MON2C-1: A 0.35 µm CMOS 2.5 GHz Complementary -Gm VCO using
RFIC TECHNICAL PROGRAM COMMITTEE PMOS Inversion Mode Varactors
R.L. Bunch, S. Raman, Virginia Tech, Blacksburg, USA
10:40 AM MON2C-2: HiperLAN 5.4 GHz Low Power CMOS Synchronous Oscillator
Fazal Ali, Nokia Mobile Phones
Y. Deval, J. Begueret, A. Spataro, P. Fouillat, IXL Laboratory, Talence, France; D. Belot,
David Allstot, University of Washington F. Badets, STMicroelectronics, Crolles, France
Kirk Ashby, Microtune 11:00 AM MON2C-3: High Performance Flip-chip Multi-mode, Multi-band VCO IC
Luciano Boglione, Conexant using A Standard Low Cost BiCMOS Process
Natalino Camilleri, RF & Wireless Design Services Inc. D. Lovelace, Gain Technology, Phoenix, USA; R. Disilvestro, Motorola, Tempe, USA
Thomas Cho, Intel/Level 1 11:20 AM MON2C-4: A 5.7 GHz Hiperlan SiGe BiCMOS Voltage-controlled
John Choma, University of Southern California Oscillator and Phase-locked-loop Frequency Synthesizer
Yann Deval, Laboratoire IXL B.H. Klepser, M. Scholz, J.J. Kucera, Infineon Technologies, Munich, Germany
Sherif Embabi, Texas Instruments 11:40 AM MON2C-5: A Fully Integrated PLL Frequency Synthesizer LSI for Mobile
Ian Galton, University of California, San Diego Communication System
Aditya Gupta, Andigics T. Yasunaga, S. Hirano, Y. Miyahara, Matsushita Communication Industrial Co., Ltd.,
Ramesh Harjani, University of Minnesota Yokohama, Japan; M. Maeda, Y. Hiraoka, Matsushita Electronics Corp., Nagaokakyo,
Stefan Heinen, Infineon Technologies Japan
Albert Jerng, DSP Group MON2D Next Generation Front End Design — Tucson 42–43
Reynold Kagiwada, TRW Inc. Chair: K. Ashby, Microtone Inc. • Co-chair: S. Lloyd, Conexant Co.
Sayfe Kiaei, Arizona State University 10:20 AM MON2D-1: A Flexible 10–300 MHz Receiver IC Employing a Bandpass
Kevin Kobayashi, Stanford Micro-devices Sigma-Delta ADC
Bill Kuhn, Kansas State University R. Schreier, J. Lloyd, L. Singer, F. Weiss, B. Sam, D. Paterson, C. Jacobs,
Mahesh Kumar, Lockheed Martin Government Electronic Systems J. Steinheider, M. Timko, J. Zhou, Analog Devices, Wilmington, USA; W. Martin,
Stephen Lloyd, Conexant Systems Inc. Motorola, Ft. Lauderdale, USA
David Lovelace, Gain Technology 10:40 AM MON2D-2: A Completely Integrated 1.8 Volt 5 GHz Tunable Image
Reject Notch Filter
Jyoti Mondal, Motorola Inc.
J.W. Rogers, SiGe Microsystems, Ottawa, Canada; C. Plett, Carleton University,
Vijay Nair, Motorola Inc. Ottawa, Canada
David Ngo, RFMD 11:00 AM MON2D-3: A Monolithic 2-V 950-MHz CMOS Bandpass Amplifier
Joe Staudinger, Motorola Inc. with a Notch Filter for Wireless Receivers
Bruce Thompson, Motorola Inc. C. GUO, A.N. Chan, H.C. Luong, Department of Electrical and Electronic Engineering,
Kowloon, China

12
11:20 AM MON2D-4: Tuned LNA for RFICs using Boot-strapped Inductor
F. Albertoni, B. Neri, E. Sentieri, Università di Pisa, Pisa, Italy; L. Fanucci, Consiglio
Nazionale delle Ricerche, Pisa, Italy
MON3A GPS Special Session — Ballroom
Chair: R. Harjani, University of Minnesota • Co-chair: J. Choma, Univ. of So. CA
1:30 PM MON3A-1: Invited: GPS: Systems Overview
S. Kiaei, Arizona State University, Tempe, AZ
2:00 PM MON3A-2: Invited: A 2/4 GHz CMOS Transceiver for Bluetooth
H. Darbi, S. Khorrahj, E. Chein, M. Pan, S. Wu, S. Moluodi, J. Leete, J. Rael, R. Lee,
B. Ibrahim, M. Rofougaran, R. Rofougaran, Broadcom Corp., El Segundo, USA
2:30 PM MON3A-3: A Highly Integrated GPS Receiver for Cellular Handset
F. Dantoni, A. Holden, S. Fu, D. Sahu, S. Venkatraman, S.H. Embabi, Texas
Instruments, Dallas, USA
MON4A Integrated Bluetooth Transceivers — Ballroom
Chair: B. Kuhn, Kansas State Univ. • Co-chair: D. Allsot, Univ. of Washington
3:50 PM MON4A-2: The First Very Low-IF RX, 2-Point Modulation TX CMOS
System on Chip Bluetooth Solution
C. Dürdodt, M. Friedrich, C. Grewing, M. Hammes, A. Hanke, S. Heinen, J. Oehm,
D. Pham-Stäbner, D. Seippel, S. van Waasen, E. Wagner, Infineon Technologies,
Düsseldorf, NRW; D. Theil, Universität Dortmund, Dortmund, NRW
4:10 PM MON4A-3: A Fully Integrated CMOS Frequency Synthesizer for
Bluetooth
D. Theil, K. Schumacher, University of Dortmund, Dortmund, Germany; C. Dürdodt,
University of Bochum, Bochum, Germany; A. Hanke, S. Heinen, S. van Wasaen,
D. Seippel, D. Pham-Stäbner, Infineon Technologies, Düsseldorf, Germany
4:30 PM MON4A-4: Student-designed Bluetooth Radio in Silicon-on-Sapphire
W.B. Kuhn, Kansas State University, Manhattan, USA
4:50 PM MON4A-5: A 2.5V CMOS Switched-capacitor Channel-select Filter
with Image Rejection and Automatic Gain Control
Y. Chen, Industrial Technology Research Institute, Hsin Chu, ROC; J. Bor, P. Huang,
MediaTek Inc., Hsin Chu, ROC
MON4B RFIC Packaging & Passive Components — Tucson 38–39
Chair: J. Staudinger, Motorola SPS • Co-chair: M. Kumar, Lockheed Martin Govt.
3:30 PM MON4B-1: Design and Modeling of Compact On-chip Transformer/
Balun Using Multi-level Metal Windings for RF Integrated Circuits
T. Liang, J. Gillis, D. Wang, P. Cooper, IBM Microelectronics, Lowell, USA
3:50 PM MON4B-2: A Complete Physical Frequency Dependent Lumped Model
for RF Integrated Inductors
J.J. Sieiro, J.M. Lopez-Villegas, J. Cabanillas, J.A. Sorio, J. Samitier, Universitat de
Barcelona, Barcelona, Spain
4:10 PM MON4B-3: Microwave Filters on a Low Resistivity Si Substrate with a
Polyimide Interface Layer for Wireless Circuits
J. Papapolymerou, The University of Arizona, Tucson, USA; G.E. Ponchak, NASA Glenn
Research Center, Cleveland, USA
4:30 PM MON4B-4: On-board Probing of Broadband RF Amplifiers using CPW
Interconnects
K. Naishadham, Philips Broadband Networks Inc., Manlius, USA
4:50 PM MON4B-5: Modeling of Lead-Frame Plastic CSPs for Accurate prediction
of Their Low-Pass Filter Effects on RFICs
T. Horng, S. Wu, H. Huang, National Sun Yat-Sen University, Kaohsiung, ROC; C. Chiu,
C. Hung, Advanced Semiconductor Engineering Inc., Kaohsiung, ROC
MON4C Active Device Modeling for RFIC Applications — Tucson 40–41
Chair: L. Liu. TRW • Co-chair: V. Nair, Motorola
3:30 PM MON4C-1: RF Circuit Performance Degradation Due to Soft Breakdown
and Hot Carrier Effect in 0.18 mm CMOS Technology
Q. Li, J. Zhang, W. Li, J.S. Yuan, University of Central Florida, Orlando, USA; Y. Chen,
A. Oates, Lucent Technologies, Orlando, USA
3:50 PM MON4C-2: Reduced Intermodulation Distortion of AlGaAs/InGaAs
Doped-channel FETs by Air-bridge Gate Process
H. Chiu/Hsien Chin, F. Chien/Feng Tso, S. Yang/Shih Cheng, Y. Chan/Yi Jen, National
Central University, Chungli, ROC
4:10 PM MON4C-3: Systematic Analysis of RF Distortion in SiGe HBTs
G. Niu, Q. Liang, J.D. Cressler, Auburn University, Auburn, USA; C.S. Webster,
D.L. Harame, IBM Microelectronics, Essex Junction, USA
4:30 PM MON4C-4: Field-modulating Plate (FP) InGaP MESFET with High
Breakdown Voltage and Low Distortion
A. Wakejima, K. Ota, K. Matsunaga, W. Contrata, M. Kuzuhara, NEC Corp., Otsu, Japan
4:50 PM MON4C-5: Large Signal Bias-dependent Modeling of PHEMTs by Pulsed
Measurements
K. Lan, B.L. Ooi, M.S. Leong, P.S. Kooi, National University of Singapore, Singapore,
Singapore
MON4D High Frequency Devices & IC Techniques — Tucson 42–43
Chair: J. Mondal, Motorola Inc. • Co-chair: A. Gupta, ANADIGICS Inc.
3:30 PM MON4D-1: 20-GHz INP-HBT Voltage-controlled Oscillator
with Wide Tuning Range
H. Djahanshahi, N. Saniei, C. Salama, University of Toronto, Toronto, Canada;
S.P. Voinigescu, M.C. Maliepaard, Nortel Networks, Ottawa, Canada
3:50 PM MON4D-2: The Design of CMOS Transimpedance Amplifier Based
on BSIM Large-signal Model
C. Kuo Chin Wei, C. Hsiao Chao Chih, S. Yang Shih Cheng, Y. Chan Yi Jen, National
Central University, Chungli, ROC
13
4:10 PM MON4D-3: Monolithic Ka-band Even-harmonic Quadrature Resistive
Mixer for Direct Conversion Receivers
K.S. Ang, M. Chongcheawchamnan, D. Kpogla, P.R. Young, I.D. Robertson, University
of Surrey, Guildford, UK; D. Kim, M. Ju, H. Seo, Eoncom, Seoul, Korea
4:30 PM MON4D-4: Compensation of MMIC Spread in 60 GHz
Telecommunication Module by Automatic Output Power Control
M. Filleboeck, J. Schroth, EADS Deutschland GmbH, Ulm, Germany
4:50 PM MON4D-5: A 23-GHz Low-noise Amplifier in SiGe Heterojunction
Bipolar Technology
G. Schuppener, Royal Institute of Technology, Stockholm, Sweden; T. Harada, Dept.
of Electronics, Tokyo, Japan; Y. Li, Ericsson Microwave Systems AB, Mölndal, Sweden
TUE3A RF Transceivers — Ballroom
Chair: S. Heinen, Infineon Tech. • Co-chair: N. Camilleri, RF & Wireless Design
1:20 PM TUE3A-1: A Single Chip ASK/FSK 900MHz Transceiver in a Standard
0.25 µm CMOS Technology
W. Schuchter, G. Hofer, G. Krasser, H. Koblmiller, V. Schultheiss, A. Dollinger,
M. Mark, INFINEON Technologies Austria AG, Graz, Austria
1:40 PM TUE3A-2: A Highly Integrated UHF Data Receiver for Vehicle
Applications
D. T. Jobling, D. Frund, Motorola, Geneva, Switzerland; C. Landez, A. Huot, Motorola,
Toulouse, France
2:00 PM TUE3A-3: 1W 900 MHz Direct Conversion CMOS Transmitter for Paging
Applications
D. Gerna, A. Giry, D. Belot, D. Pache, STMicroelectronics, Crolles, France;
D. Manstretta, University of Pavia, Pavia, Italy
2:20 PM TUE3A-4: A One Chip RF Transceiver MMIC for ETC with Surface
Via-hole Isolation Technique
S. Yamamoto, A. Suwa, T. Tanbo, T. Kitazawa, K. Tara, M. Hagio, Matsushita
Electronics Corp., Nagaokakyo, Japan
2:40 PM TUE3A-5: A 1-5 GHz Low-power Single-chip Receiver IC for Optical
Video Distribution System
T. Oka, T. Ikedo, K. Nojima, K. Fujimoto, Matsushita Communication Industrial Co.,
Ltd., Yokohama, Japan
TUE3F Control Circuits for Receivers and Transmitters — Yuma 21–23
Chair: F. Ali, Nokia Mobile Phones • Co-chair: B. Thompson, Motorola Inc.
1:20 PM TUE3F-1: Power Controller for Dual Band TDMA Power Amplifiers
S. Weber, Infineon Technologies, Munich, Germany
1:40 PM TUE3F-2: A 450 MHz CMOS RF Power Detector
S. Ho, Analog Devices Inc., Wilmington, USA
2:00 PM TUE3F-3: Design of an LTCC Switch Diplexer Frond-end Module for
GSM/DCS/PCS Applications
R. Lucero, W. Qutteneh, D. Meyers, A. Pavio, J. Estes, Motorola Labs, Tempe, USA
2:40 PM TUE3F-4: A Monolithic Si PCS-CDMA Power Amplifier with an
Impedance-controllable Biasing Scheme
S. Luo, T. Sowlati, Philips Research, Briarcliff Manor, USA
TUE4A Low Noise Amplifiers (LNAs) — Ballroom
Joint IMS/RFIC Session
Chair: S. Lloyd, Conexant Co. • Co-chair: K. Ashby, Microtune Inc.
3:30 PM TUE4A-1: A Wide Dynamic Range Switched-LNA in SiGe BiCMOS
T. Nakatani, Matsushita Electric Industrial Co., Ltd., Kadoma City, Japan; J. Itoh,
I. Imanishi, O. Ishikawa, Matsushita Electronics Corp., Takatsuki, Japan
3:50 PM TUE4A-2: Dual Bias Feed SiGe HBT Low Noise Linear Amplifier
E. Taniguchi, K. Maeda, N. Suematsu, T. Takagi, Mitsubishi Electric Corp., Kamakura,
Japan; T. Ikushima, K. Sadahiro, K. Itoh, Mitsubishi Electric Corp., Amagasaki, Japan
4:10 PM TUE4A-3: A1.4 dB NF Variable Gain LNA with Continuous Control
for 2 GHz-band Mobile Phone using InGaP Emitter HBT
Y. Aoki, M. Fujii, H. Dodo, H. Hida, NEC Corp., Tsukuba, Japan; S. Ohkubo,
S. Yoshida, T. Niwa, Y. Miyoshi, N. Goto, NEC Corp., Kawasaki, Japan
4:30 PM TUE4A-4: A 1.7 mA Low Noise Amplifier with Integrated Bypass Switch
for Wireless 0.05-6 GHz Portable Applications
H. Morkner, M. Frank, S. Yajima, Agilent Technologies, Newark, USA
TUE4F Building Block Front Ends — Yuma 21–23
Chair: S. Lloyd, Conexant Co. • Co-chair: K. Ashby, Microtone Inc.
3:30 PM TUE4F-1: 1.8V RF AGC and Mixer Implemented with a Novel
Four-terminal HBT (FHBT)
S. Zhou, P. Ma, L. Zhang, J. Li, F. Chang, UCLA, Los Angeles, USA; P. Zampardi,
Conexant, Newbury Park, USA
3:50 PM TUE4F-2: Design and Performance of a Highly Integrated Wideband
Active Downconverter MMIC
C.F. Campbell, J.M. Beall, TriQuint Semiconductor, Richardson, USA
4:10 PM TUE4F-3: A 2.5 GHz Low Noise High Linearity LNA/Mixer IC in SiGe
BiCMOS Technology
D. Wang, IBM Microelectronics, Lowell, USA; K. Krishnamurithi, Maxim Integrated
Products, Chelmsford, USA; S. Gibson, J. Brunt, Ericsson Mobile Communications,
Baingstoke, UK
4:30 PM TUE4F-4: A 1.9 GHz Double-balanced Subharmonic Mixer for Direct
Conversion Receivers
K. Nimmagadda, G.M. Rebeiz, The University of Michigan, Ann Arbor, USA
4:50 PM TUE4F-5: A 1GHz-band Low Distortion Up-converter with a Linear in dB
Control VGA for Digital TV Tuner
Y. Youn, C. Kim, N. Kim, H. Yu, Electronics and Telecommunications Research
Institute (ETRI), Taejon, Korea
SUNDAY
SUNDAY WORKSHOPS
WSA: STATE-OF-THE-ART FILTER DESIGN
EM AND CIRCUIT SIMULATION TECHNIQUES
USING
Date & Time: Sunday, May 20; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Applications of Space Mapping Optimization Technology to
Filter Design , John Bandler, Bandler Corp.
✗ Filter Design Using Fast Planar EM Simulations
Radek Biernacki, Agilent EEsof EDA
✗ Direct Global Electromagnetic Optimization of Microwave
Filters, Stephane Bila, IRCOM, France
✗ Direct EM Design of a Class of Rectangular Waveguide Dual
Mode Filters, Marco Guglielmi, ESA ESTEC, The Netherlands
✗ Filters and Multiplexers for Space Application – Design
Methods, Dietmar Schmitt, Bosch, Germany
✗ Synthesis of Filters with Frequency-Variable Couplings (FVC)
Dick Snyder, RS Microwave Co.
✗ Fast Analysis and Optimization of Coupled Line Filters Using
FEM, Dan Swanson, Bartley RF Systems
✗ Advanced Simulation/Design Techniques for Microwave
Filters, Ming Yu, COM DEV International
✗ Circuit Elements/Coupling Matrix Conversion to Physical
Filter Dimensions Using EM Simulations
Kawthar Zaki, University of Maryland
Organizers: John Bandler, Bandler Corporation
Dick Snyder, RS Microwave
Sponsors: MTT-1, Computer-Aided Design
MTT-8, Filters and Passive Components
Technical Level: Tutorial and Advanced
Significant advances in computational electromagnetics con-
tinue to be made. They have been implemented in widely avail-
able commercial software as well as dedicated in-house software.
They are applied to microwave filter simulation, modeling, syn-
thesis and design, and EM validation. They are accompanied by
novel modeling and design concepts involving parameterization
of arbitrary geometries, space mapping and surrogate modeling,
the adjoint sensitivity method, reduced-order modeling and
equivalent circuit extraction, artificial neural network representa-
tion, genetic algorithms and fast frequency sweeps.
Optimal design more closely and automatically integrates EM
and circuit simulations directly into the design and manufactur-
ing process in a manner increasingly transparent to the designer.
This workshop will address the state of the art from component
modeling to multiplexer design. Expectations of using EM simula-
tors as effective tools in an automated design environment con-
tinue to be raised based on considerable work currently in
progress. We emphasize optimization methodologies as a corner-
stone in simulation, modeling, design and manufacturing.
This workshop will draw upon the popularity and success of re-
cent workshops involving electromagnetics and CAD. A balance
between theory, implementation and practical discussions of
computational and design issues will be struck so that the work-
shop will have wide appeal.
WSB: RF SYSTEMS AND CIRCUIT ISSUES OF THIRD GENERATION
WIDEBAND CDMA SYSTEMS LIKE UMTS
Date & Time: Sunday, May 20; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Spread Spectrum and CDMA Techniques
R. Weigel, University of Linz, Austria
14
✗ 3GPP System Specifications
L. Maurer, University of Linz, Austria
✗ 3GPP and its RF-Related Specifications and Test Cases
B. Adler, Infineon Technologies, Munich, Germany
✗ 3GPP RF System Simulation
L. Eichinger, Agilent Technologies, Munich, Germany
✗ Evolution from 2G to 3G Transceiver Architectures
J. Fenk, Infineon Technologies, Munich, Germany
✗ Commercial BiCMOS RFIC Transceivers
W. Thomann, DICE Danube Integrated Circuit
Engineering, Linz, Austria
✗ SiGe RFIC Zero-IF Receiver Front-ends Designed for 3GPP
Applications, H. Pretl, DICE Danube Integrated Circuit
Engineering, Linz, Austria
✗ 3GPP Transceiver Concepts Using RF CMOS Technology
Q. Huang, Swiss Federal Institute of Technology (ETH)
Zurich, Switzerland
Organizers: Robert Weigel, University of Linz
Josef Fenk, Infineon Technologies
Sponsor: MTT-2 Microwave Acoustics
MTT-6, Microwave and Millimeter Wave ICs
MTT-11, Microwave Measurements
MTT-16, Microwave Systems
MTT-17, HF/VHF/UHF Technology
MTT-20, Wireless Communications
Technical Level: Tutorial and Advanced
Just as second generation digital wireless systems such as GSM
or cdmaOne have been widely deployed, work is well underway
to develop third generation (3G) wireless networks which are
called International Mobile Telecommunications (IMT-2000), and
in Europe, Universal Mobile Telecommunication System (UMTS).
These networks will add broadband data to support video, Inter-
net access, and other high-speed data services for untethered de-
vices. This workshop provides comprehensive fundamental and
practical technical information about the RF-related system and
RFIC issues of 3G W-CDMA systems like UMTS, cdma2000 etc.,
technologies that will play a major role in the future of wireless
telecommunications. The information presented here is targeted
at RF engineering professionals and wireless practitioners.
This workshop will begin by introducing spread spectrum and
CDMA basics. The second Section gives a description of the 3GPP
system specifications. Sections 3 and 4 will deal in detail with RF-
related 3GPP test cases and simulation issues. Here, pertinent RF
system requirements derived from the 3GPP test cases such as du-
plexing, transmit frequency stability, output power dynamics, ad-
jacent channel leakage ratio, modulation accuracy, maximum
and minimum input signal levels, adjacent channel selectivity,
and blocking and intermodulation characteristics are presented.
Moreover, 3GPP-related simulation scenarios are discussed and
simulation results for various system issues like dependence of
bit error rate from adjacent channel selectivity or influence of
transmitter characteristics on error vector magnitude are present-
ed. Section 5 will focus on the evolution from 2G to 3G transmit-
ter and receiver architectures (e.g., Tx heterodyne and direct up-
conversion, Rx heterodyne and homodyne, etc.). The pros and
cons of various concepts will be investigated both from the per-
formance and the economical point of view. In particular, the RF
front-end challenges associated with multimode and multiband
systems (concerning antennas, switches, filters, power amplifiers,
frequency synthesizers) are addressed. In Sections 6 and 7, BiC-
MOS and SiGe RFICs successfully designed for commercial appli-
cations using Infineon semiconductor processes will be present-
ed. Finally, in Section 8 the feasibility of UMTS transceivers fabri-
cated from CMOS technologies in the 2 GHz band are
investigated. Here, the linearity of the baseband filters and sec-
ond-order intermodulation of the mixers play an important role.

SUNDAY WORKSHOPS
WSC: RF AND HIGH SPEED APPLICATIONS OF TUNNEL DEVICES
Date & Time: Sunday, May 20; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Overview of Tunnel Diode Applications for High Speed
Integrated Circuits, Gianfranco Manes, University
of Florence, Italy, Vijay Nair, Motorola Inc.
✗ The Physics of Resonant Tunneling Diodes
Aldo Di Carlo, University of Rome, Italy
✗ Noise Suppression in Heterostructure Tunneling Devices
Elliot Brown, UCLA
✗ Tunnel Diode Device Simulation and Process Integration
Nada El-Zein, Motorola Inc.
Mandar Deshpande, Motorola Inc.
✗ Stability and Tradeoffs of Tunnel Diodes and their Microwave
Applications, Alessandro Cidronali, Univ. of Florence, Italy
✗ Integrated Millimeter-wave Quantum-Barrier Mixers
D. Paul Steenson, The University of Leeds, UK
✗ Active Antennas For RF Applications Using Heterostructure
Interband Tunneling Devices
Samir El-Ghazaly, Arizona State University
✗ Sb-Heterostructure Quantum Tunnel Diodes for Millimeter
Wave Radiometry and Passive Imaging
Joel Schulman, Hughes Research Labs
✗ A/D Converter using Resonant Tunneling Diodes
Toshihiro Itoh, NTT Electronics Corporation, Japan
✗ Tunnel Diodes for RF and Digital Applications
Allen Seabaugh, University of Notre Dame
Organizers: Vijay Nair, Motorola Inc.
Prof. Gianfranco Manes, U. of Florence – Italy
Mandar Deshpande, Motorola Inc.
Sponsor: MTT-6, Microwave and Millimeter-Wave ICs
Technical Level: Tutorial
In recent years personal mobility and the attraction for portable
devices have led to an explosive growth in wireless communica-
tion products. The requirements of flexibility and fast accesses to
data are the driving forces for the introduction of advanced appli-
cations at higher and higher frequencies. These applications make
severe demands on the technology required to implement them,
with current solutions involving a mixture of technologies.
One proposed new technology is the use of Tunnel Devices.
Quantum mechanical tunneling is a transport process that domi-
nates as device dimensions get smaller and smaller. A tunnel
diode is arranged so that electron-tunneling rate is reduced in a
certain range of biases, leading to a negative differential resis-
tance (NDR) characteristic. A tunnel diode can be integrated
with a transistor resulting in a novel, multifunctional device.
The non-linear and unique NDR characteristic of a tunnel device
is useful for both digital and RF applications and is the defining fea-
ture of this new technology. Many circuits that utilize tunnel de-
vices have been proposed and demonstrated for both digital and
Analog/MMIC applications (like adders, SRAMs, XNORs, A/D con-
verters, oscillators, frequency multipliers, amplifiers, mixers, re-
ceivers and antennas). Novel and innovative circuit ideas and
topologies have made effective use of the enhanced functionality
of the tunnel devices making this new technology attractive.
Advantages of this technology include:
✗ reduction in circuit complexity and die size
✗ multifunctional ICs with superior performance
✗ low power and low voltage operation (down to less than 1.0 volt)
The device technology must be optimized to meet the specific
performance requirements and properties of each circuit. Recent
15
SUNDAY
advances in materials research have enabled tunnel diodes to
meet these challenges. Heterostructure band-gap engineering has
led to the achievement of tunnel diodes with high peak current
densities and good peak-to-valley current ratios.
This workshop will present a comprehensive overview of this
new tunnel device technology and its applications in RF and digi-
tal circuits. The current status of tunnel diode physics and model-
ing will be reviewed along with measurement techniques and
noise suppression. Tunnel device growth and issues in integrating
it with other semiconductor devices and circuits will be dis-
cussed. A variety of MMIC applications such as VCOs, amplifiers,
mixers, receivers, antennas, mm wave radiometry and imaging
applications, and A/D circuits will be presented. Circuit and sys-
tem level specifications and considerations will be discussed.
WSD: MICROWAVE PHOTONIC COMPONENT, INTEGRATION
AND SYSTEM TECHNIQUES FOR BROADBAND FIBER-FED WIRELESS
Date & Time: Sunday, May 20; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Fibre-fed Broadband Wireless Access Networks
Alwyn Seeds, University College London, UK
✗ WDM Optical Network Infrastructure for 3G
Kam Lau, University of California, Berkeley
✗ MMIC-based Optically-Controlled Self-Oscillating Mixers for
Remote Upconversion Fiber Radio Picocells
Neil Bourhill, University of Leeds
✗ Low Cost Fiber Radio Antenna Modules
Dalma Novak, University of Melbourne, Australia
✗ Phase Coherency of Local Oscillators in Fiber Optic
Distribution Networks, Afshin S. Daryoush, Drexel Univ.
✗ mm-Wave Photoreceivers and Optoelectronic Integrated
Circuits (OEICs), Andreas Umbach, u2t Innovative
Optoelectronic Components GmbH, Berlin, Germany
✗ mm-Wave Polymer-based Modulators with Applications to
Fiber Radio, H. Fetterman, UCLA
✗ Millimeterwave Electroabsorption Modulators, Dieter Jäger,
Gerhard-Mercator Universität Duisburg, Germany
✗ Hybrid Integration Technology using Silica Planar Lightwave
Circuit Platform
T. Kitagawa, NTT Photonics Laboratories, Japan
Organizer: Dr. Stavros Iezekiel, The University of Leeds
Sponsor: MTT-3, Lightwave Technology
MTT-16, Microwave Systems
MTT-20, Wireless Communications
Technical Level: Tutorial and Advanced
The explosive growth in communications has been driven by
two complementary technologies: optical fiber and wireless com-
munications. Fiber provides the massive bandwidth potential that
has fuelled the rise in Internet traffic, whilst wireless techniques
confer mobility. The two technologies are starting to converge
into fiber-radio systems, in which broadband services such as
video on demand will be delivered over fiber to mm-wave pico-
cells. In tandem with this, fiber communications is entering the
era of Tb/s data rates.
This workshop will provide an overview of microwave photon-
ic component technology and its system application in fiber-ra-
dio systems. It will begin with a tutorial introduction to fiber radio
systems, followed by talks on state-of-the-art approaches to distri-
bution of mm-waves over fiber and remote up-conversion tech-
niques. Attention will then turn to the component integration
technologies that will be needed for low cost fiber-radio mod-
ules, including: multichip modules, MMICs, OEICs and silicon mi-
cromachining/MEMs for passive fiber alignment.
SUNDAY
SUNDAY WORKSHOPS
WSE: ADVANCED LTCC MICROWAVE DESIGN
AND MANUFACTURING ISSUES
Date & Time: Sunday, May 20; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Advanced LTCC Front-End Modules and Processes for New
Mobile Communication Standards
H. Flühr, Ch. Block, Ch. Hoffmann, EPCOS OHG,
Deutschlandsberg, Austria
✗ Development of EM-based Component Libraries for LTCC
and Related Multilayer Processes
R.H. Jansen, G. Kahmen, P. Stöhr, A. Noculak, Jansen
Microwave and RWTH Aachen, Aachen, Germany
✗ RF Characterization and Designing of Embedded Passives
into LTCC Substrate, Harufumi Mandai, Yasuhiro Fujiki,
Murata Manufacturing Co. Ltd., Tokyo, Japan
✗ LTCC as a Passive Integration Technology,
V.T. Zaspalis, D. Hennings, M. Kammerer, R. Mauczok,
B. Schreinemacher, Philips Research Labs, Aachen,
Germany
✗ Advanced LTCC Applications for Handsets, Ch. Baratt,
M. Garin, SOREP-ERULEC, Chateaubourg, France
✗ Communication Systems Requirements on LTCC
Dr. Steve Marsh, Marconi Ltd. UK
✗ Complex Circuit Design and Manufacturing Aspects of LTCC
Vincent Milano, Raytheon Co.
✗ LTCC Thermal Management
W. Kinzy Jones, Florida International University
✗ LTCC Material, Vern Styger, Ferro Corp.
✗ LTCC Circuit Manufacturing
Ray Brown, National Semiconductor Corp.
✗ Thermal Management of High Power Components for Base
Stations , Mahesh Shah, Motorola Inc.
✗ Modeling Techniques for Thermal considerations
Quan Li, ASE
Organizer: Rolf H. Jansen, Aachen Univ. of Technology
Jeanne Pavio, Motorola Inc.
Frank Sullivan, Raytheon Systems Company
Sponsor: MTT-12, Microwave and Millimeter Wave
Packaging/Manufacturing
Technical Level: Tutorial and Advanced
During the past few years, LTCC (Low Temperature Cofired Ce-
ramics) has become an enabling technology for wireless applica-
tions from GSM, CDMA, TDMA, Bluetooth and Wireless LAN at
the lower microwave frequency end up to the millimeter wave re-
gion for such applications as LMDS at 30 GHz etc. This technolo-
gy is able to provide cost-effective hardware solutions suitable for
high volume manufacturing into multimillion production quanti-
ties. The LTCC circuit medium allows reduced development cy-
cles and thus short time-to-market. It is capable of complexities
up to systems in a package and has been demonstrated to be
competitive in terms of excellent high frequency performance,
high power handling, innovative compact 3D structures like
baluns, couplers etc. and thus miniaturization.
Advanced LTCC issues include the use of mixed dielectric con-
stants, low loss materials, photo patterned conductors, high den-
sity buried or passive circuit elements and the reach-out towards
applications at 40 GHz and beyond.
The workshop will bring together contributors from LTCC de-
sign and manufacturing groups worldwide. It will focus on the
still unsolved 3D multilayer design issues in close relation to vol-
ume manufacturing issues and the trends towards innovative ma-
16
terials, high resolution patterning, buried non-ideal ground
planes, higher frequencies and improved thermal management.
WSF: NEW ADVANCES IN NONLINEAR CIRCUIT DESIGN
Date & Time: Sunday, May 20; 8:00 AM to 12:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ New Advances in Nonlinear Circuit Design
Adalbert Beyer, Gerhard-Mercator-University Duisburg
✗ New Developments in Mixer Design
Steven A. Maas, Nonlinear Technologies Inc.
✗ Transient Circuit Simulation Using Wavelets
Michael B. Steer, North Carolina State University
✗ Introduction to Measurement-based Mathematical Modeling of
Nonlinear Devices and Components for Large-Signal Circuit
Simulation, David Root, Agilent Technologies Santa Rosa
✗ Overview of Large-signal Measurements Based Equivalent
Circuit and Behavioural Modeling Techniques with Regard
to Non-linear Circuit Design Enhancement
Dominique Schreurs, K.U. Leuven, Belgium
Adalbert Beyer, Gerhard-Mercator-University Duisburg
Steven A. Maas, Nonlinear Technologies Inc.
Sponsor: MTT-1, Computer-Aided Design
Technical Level: Tutorial and Advanced
In the last decade, a rapidly increasing demand in the develop-
ment of microwave, millimeterwave and wireless communica-
tion systems can be observed. There are few other areas in which
such enormous changes like those of nonlinear network design
can be recognized. In the past, the active devices and their tech-
nology have moved from classical solutions to solid state perfor-
mances and their integration. Currently, the monolithic integrat-
ed circuit designs become predominant, and following this, the
classical circuit design has been shifted to advanced techniques
both in time, frequency and mixed domains.
This workshop will present in depth tutorial discussion as well
as new developments in techniques for analyzing nonlinear cir-
cuits. It will provide discussions on problems of new ideas like
application of wavelets in nonlinear network design or funda-
mental aspects of circuit - simulation aspects.
Furthermore, this workshop will supply a forum for discussion
on present important topics and possible new developments in
the future. This event will also provide a platform for participants
to introduce their results or suggestions by presenting their trans-
parencies and explaining their point of view.
WSG: HIGH POWER RF SI: DEVICES, MODULES AND TRENDS
Date & Time: Sunday, May 20; 1:00 PM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Overview of RF MOSFET Devices
Dr. John Walker, Semelab plc
✗ High-Power Silicon Technologies for High-Frequency
Amplifier and Switching Applications
Krishna Shenai, PhD, University of Illinois at Chicago
✗ High-Power LDMOS Transistors for Wireless Applications
Wayne R. Burger, PhD, Motorola Inc.
✗ High-Power Modules and Transistors for Telecommunications,
Nagaraj Dixit, Ericsson Microelectronics
Organizer: Murat Eron, MPD
Sponsor: MTT-5, Microwave High-Power Techniques
MTT-17, HF/VHF/UHF Technology

SUNDAY WORKSHOPS
Technical Level: Tutorial and Advanced
Not only at low level designs but also at high power levels Si
continues to be the work horse of high power solid state applica-
tions. Device design improvements, new packaging concepts and
new high volume manufacturing approaches have pushed Si far
ahead of any other competing technology when it comes to pow-
er. In fact, Si competes with itself with BJT and MOSFET designs,
from SiGe to SiC cousins, racing to fill the need created by the
wireless telecommunications boom.
Speakers who specialize in various aspect of device design,
modeling, manufacturing and testing, will review the state of the
art in Si RF power technology, mechanical and electrical limita-
tions, cost drivers, reliability issues and new packaging approach-
es. We will try to identify fundamental limitations to performance
and cost. We will ask application experts to predict and rational-
ize future trends in power, frequency and integration.
WSH: WEB-BASED RF AND MICROWAVE EDUCATION
Date & Time: Sunday, May 20; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Web-Based Education: Positioning the IEEE
Peter Wiesner, IEEE Educational Activities Department
✗ Multimedia Assets and Interactive Modules in Web-Based
Microwave Education, Magdy Iskander, University of Utah
✗ Concept Modules for Web Based RF and Microwave
Education, K.C. Gupta, R. Ramadoss, H. Zhang,
University of Colorado
✗ Multi-media Virtual Laboratory Modules based on USF’s
Laboratory, Larry Dunleavy, University of South Florida
✗ E-Book as a Tool for Web Based Microwave Instruction
Afshin Daryoush, S. Tofigi, Drexel University
✗ WEB-ED: One University’s Approach to Web-based
Microwave Education
Robert H. Caverly, Kevin Buckley, Villanova University
✗ E-modeling – The Third Pillar of Microwave Education
Poman So, Wolfgang Hoefer, Univ. of Victoria, Canada
✗ Visualization and Involvement: A Key to the Intuitive
Understanding of Electromagnetics and Antenna Theory
Natalia Georgieva, McMaster Univ., Canada
Organizer: K.C. Gupta, University of Colorado
Sponsor: MTT-S Education Committee
Technical Level: Tutorial
Recent developments in information technology, in general,
and internet technology in particular are changing the functional-
ity of our society, and are likely to change current education and
continuing-education enterprise in profound ways. Today, the
courses offered at various universities are often supplemented by
a supporting website and continuing education is becoming in-
creasingly web-based. RF and microwave education and continu-
ing education need to take advantage of these technological ad-
vances in order to (i) attract more students to RF and microwave
areas, and (ii) to help young MTT-S members in their early career
development through conveniently delivered continuing educa-
tion. Recognizing the urgency of this need, MTT Society has spon-
sored development of multimedia educational tools at two U.S.
universities, and is planning a special issue and an electronically
published supplement of IEEE Transactions on Microwave Theo-
ry and Techniques dedicated to “RF and Microwave Tutorials” in
2002. These are the first steps by MTT Society in making web-
based RF and microwave tutorials available to MTT-S members.
17
SUNDAY
The goal of this workshop is to discuss what is available today
in web-based and web-assisted RF and microwave education,
what needs to be done, and how could educators in RF and mi-
crowave area could make use of web technology for benefiting
MTT-S membership. Participants are encouraged to bring a cou-
ple of viewgraphs to express their viewpoints and share their
thoughts.
WSI: ADVANCES IN RF MEMS: COMPONENTS, PACKAGING
TECHNIQUES, RELIABILITY AND MICROPHONICS
Date & Time: Sunday, May 20; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ MEMS-Based System Requirements for Radar Systems
Vince Sieracki, J.K. Smith, DARPA
✗ Very Low Loss X-Band Phase Shifters and Packaging
Techniques, Jeff DeNatale, Rockwell Science Center
✗ RF MEMS Circuits; Recent Developments, Packaging, and
Reliability , Chuck Goldsmith, Raytheon
✗ Brownian, Acceleration and Microphonic Noise in RF MEMS
Circuits, Gabriel M. Rebeiz, University of Michigan
✗ X-Band MEMS Phase Shifters: Development and Phase Noise
Measurements, Clifton Quan, HRL/Raytheon
✗ RF MEMS Series Switch: Development, Packaging and
Reliability, Juergen Foerstner, Motorola Inc.
✗ Development of MEMS Switches and Tunable Systems in
Korea, Y. Kwon, Seoul National Univ., Korea
✗ High Power RF MEMS Switches
Bernd Schauwecker, DaimlerChrysler Research, Germany
✗ RF MEMS Switch Development and Packaging Using a Wafer
Transfer Process
Veljko Milanovic, Univ. of California – Berkeley
One hour of the workshop will be reserved to the latest an-
nouncements. Interested parties should contact Prof. Rebeiz
(rebeiz@umich.edu) for scheduling information.
Organizers: Gabriel M. Rebeiz, Univ. of Michigan
John K. Smith, DARPA
Sponsor: MTT-21, RF MEMS and Micromachining
Technical Level: Tutorial and Advanced
The MEMS area is quickly developing and new devices such as
low loss phase shifters, high-Q varactors, tunable filters, re-config-
urable antennas and low-phase noise oscillators are being devel-
oped using this technology. The purpose of this workshop is to
give the audience an overview of the latest results obtained in US
and international laboratories and to emphasize the new re-
search/development directions (packaging, reliability, power
handling issues, Brownian noise, acceleration noise, etc..) need-
ed for the success of this field.
The full day workshop will be cover a wide range of areas,
such as MEMS phase shifters, MEMS tunable filters, MEMS pack-
aging techniques using MEMS switches and varactors. Also, the
effect of Brownian, acceleration, and microphonic noise on
MEMS circuits will be considered in this workshop. The work-
shop will conclude with a discussion on the reliability and failure
modes of MEMS-based devices.
SUNDAY
SUNDAY WORKSHOPS
WSJ: FERRITE DEVICES AND MATERIALS
FOR MILLIMETER-WAVE APPLICATIONS
Date & Time: Sunday, May 20; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Introduction to mm-Wave Ferrite Devices and Materials
Douglas Adam, Northrop Grumman
✗ mm-Wave Characteristics and Applications of Hexagonal
Ferrite Ceramics and Non-collinear Antiferromagnets
Karen N. Kocharyan, Renaissance Electronics Corp.
✗ Materials and Techniques for Fabricating Self-biased mm-
Wave Circulators , Steven A. Oliver, Northeastern Univ.
✗ Characterization of Ferrites at Millimeter Wavelengths
Mohammed N. Afsar, Tufts Univ.
✗ Radiation Loss of mm-Wave Easy-plane Ferrite Devices
Ernst Schloemann, Consultant
✗ Some New Results of Ferrite Devices for Millimeter Wave
Purposes
Adalbert Beyer, Gerhard-Mercator University Duisburg
✗ High Power Ferrite Switches for Spacecraft Millimeter Wave
Hopping Spot Beam Antennas
Todd Vaughn, EMS Technologies Inc.
✗ A High Power W-band Duplexer for Wideband Radar
Applications , Jeffrey McHarg, MIT Lincoln Laboratory
✗ Phase Shifters for Broadband Applications
Badawy El-Sharawy, Arizona State Univ.
✗ mm-Wave Phase Shifters
Steven Stitzer, Northrop Grumman
✗ Semiconductor Junction Circulators for mm-Wavelengths
Lionel Davis, UMIST
Organizers: Douglas Adam, Northrop Grumman Corp;
Lionel Davis, UMIST
Sponsor: MTT-13, Microwave Ferrites
Technical Level: Tutorial
Improved phase shifters and nonreciprocal devices are re-
quired to support the increasing utilization of the mm-wave spec-
trum for commercial and defense applications. Existing defense
applications, e.g. missile seekers, are typically narrow band and
improvements are aimed at reduced cost, size and insertion loss.
However, future high data rate (SATCOM and short-range) com-
munications applications and army radars will require increased
bandwidth and improved producibility. The properties, charac-
terization and fabrication of mm-wave ferrite materials for mm-
wave device applications will be reviewed. The development
and applications of high power control components for wide-
band radar and satellite communications will be described. Com-
pact mm-wave ferrite devices will require significant improve-
ments in performance and integration into low cost RF packaging
and planar phase shifter configurations suitable for LTCC fabrica-
tion will be discussed. Alternatives to ferrite devices are also un-
der development and cooled semiconductors are candidates for
some very high frequency non-reciprocal device applications.
Ferroelectric materials and MEMS are also candidates for mm-
wave phase shifters and their performance will be compared
with the equivalent ferrite devices. Commercial and defense sys-
tems requirements for ferrite control components, the current
state of the art, potential for future device and materials develop-
ments and comparisons with non-ferrite approaches will be re-
viewed in detail.
18
WSK: DYNAMICS OF THE MICROWAVE WORKBENCH
Date & Time: Sunday, May 20; 1:00 PM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Introduction to Dynamics of the Microwave Workbench
Joseph L. Tauritz, University of Twente
✗ Discovery and Resolution of Simulation Challenges for
Wireless Transmitter and Receiver Hardware
Lawrence P. Dunleavy, University of South Florida
✗ Trends in RF Power Device Concepts for Future Wireless
Communications
John Gajadharsing, Philips Semiconductors
✗ Design and Verification Infrastructure for 3G Wireless RFICs
Nick Kuhn, Agilent Technologies
✗ Multi-disciplinary Design Method for Second and Third
Generation Mobile Communication Systems
Reza Mahmoudi, Univ. Twente/Philips Semiconductors
✗ Design Verification of 3G and Beyond IMT-2000 CDMA
Transmitters and Power Amplifiers
Upkar Dhaliwal, QUALCOMM
✗ Accurate Hardware Testing with Software “In-The-Loop”
Kurt Matis, Applied Wave Research Corp.
✗ Load Pull Measurement Issues and Trends Within the
Context of the Total Design Process
Gary R. Simpson, Maury Microwave Corp.
Organizer: Prof. Joseph Tauritz, University of Twente
Sponsor: MTT-9, Digital Signal Processing
MTT-11, Microwave Measurements
MTT-16, Microwave Systems
MTT-20, Wireless Communications
Technical Level: Tutorial and Advanced
The growing use of digital communication systems has compli-
cated RF circuit design. The complexity of modern communica-
tion systems confronts designers with the non-trivial task of inter-
preting and translating system demands into circuit specifica-
tions.
Additionally, verification of simulated with measured results is
an indispensable part of the design procedure. To excite the RF
circuit one can make use of commercially available instruments.
The signals generated are, however, not readily accessible to the
simulator in use and form a significant bottleneck for the verifica-
tion. Furthermore, these instruments are limited to the generation
of a limited set of complex digital signals, while the designer of-
ten requires a broader selection of complex digital signals com-
bined with for example noise, phase-noise or pre-correction infor-
mation.
This workshop examines the trends in simulation at the system
and circuit level, including the link to hardware realization, mod-
eling and test with specific attention being paid to aspects of stan-
dardization in software and hardware design.
NOTES

19
 MONDAY WORKSHOPS
WMA: LINEARIZATION FOR 3G SYSTEMS
Date & Time: Monday, May 21; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Wideband CDMA System Linearity Requirements
Kenneth Weller, Conexant Systems Inc.
✗ EDGE Systems and Linearization Requirements
Stephan Schell, Tropian Inc.
MONDAY
✗ Linearization Techniques Overview for 3G Systems
Ed Niehenke, Niehenke Consulting
✗ Predistortion Techniques Applied to Wireless Handsets
Joe Staudinger, Motorola Inc.
✗ How to Reduce and Eliminate Distortion in Power Amplifiers
Using Linearization, Allen Katz, The College of New Jersey
✗ 3G Transmitter Linearization, A Systems Approach
Richard Ranson, Filtronic plc
Organizers: Edward C. Niehenke, Niehenke Consulting
Douglas W. Maki, Conexant Systems Inc.
Bernard D. Geller,
Mitsubishi Electric & Electronics USA
Sponsors: MTT-6, Microwave and Millimeter Wave
Integrated Circuits
MTT-20, Wireless Communications
Technical Level: Tutorial and Advanced
3G systems are essential to provide more access to wireless
communication with higher data rates. High data rates with Inter-
net access are the objectives of these 3G systems. Modulation for-
mats are needed with greater bandwidth efficiency and high data
rates are required without losing phone capacity or features.
Wideband CDMA as well as Edge for GSM systems are being de-
veloped to meet these challenges. With these 3G systems, more
demands are being made on the linearity of systems to meet the
specifications.
This workshop will first focus on the wideband CDMA and
EDGE systems describing their operation and linearity require-
ments. Next the various linearization techniques will be de-
scribed and compared. These include predistortion, feedback,
and feed forward including DSP adaptive techniques. Other lin-
earization issues will be discussed. Finally speakers will address
the latest linearization methods for 3G systems showing imple-
mentation as well as results.
WMB: STATISTICAL DESIGN AND MODELING TECHNIQUES
FOR MICROWAVE CAD
Date & Time: Monday, May 21; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Space Mapping Technology with Applications in EM-based
Device Modeling and Statistical Design
John Bandler, Bandler Corporation
✗ Using Neural Networks to Develop Measurement-based
Nonlinear Device Models, K.C. Gupta, University of
Colorado
✗ Multi-threaded Electromagnetic Modeling Paradigm
for Multi-processor Platforms
Wolfgang Hoefer, University of Victoria
✗ Statistical Construction of a Representative CAD Model from
a Measured Population for RF Design Applications
Bill Leiker, Philips Broadband Networks Inc.
20
✗ The Role of Exact Synthesis, Statistical Design, Modeling
Techniques and Post-Manufacturing Tuning for Waveguide
Components, Mauro Mongiardo, University of Perugia, Italy
✗ Design of Experiments (DOE) and it’s Application
to Microwave Circuits
Krishna Naishadham, Philips Broadband Networks Inc.
✗ Monte Carlo Methods in Statistical Design
John Purviance, University of Idaho
✗ Space Mapping Based Neuromodeling
Jose E. Rayas-Sanchez, McMaster University
✗ Space Mapping Models for RF Components
Jan Snel, Philips Semiconductors
✗ Towards Automation of Model Generation
Q.J. Zhang, Carleton University
Organizers: John Bandler, Bandler Corporation
Krishna Naishadham,
Philips Broadband Networks
Q.J. Zhang, Carleton University
Sponsors: MTT-1, Computer-Aided Design
MTT-15, Microwave Field Theory
Technical Level: Tutorial and Advanced
There have been extraordinary advances in EM-based model-
ing capabilities, mixed linear/nonlinear field/circuit simulation,
applications of wavelets, and space mapping and knowledge
based artificial neural network (ANN) technology for enhanced
empirical modeling and CAD. These technologies address in-
creased complexity of VLSI, RF and microwave circuits to fulfill
the industrial demand for faster design cycle and reducing time
to market for electronic products. Competition within the fast
growing EDA market must lead to incorporation of these tech-
nologies in future releases of commercial software.
An objective of this workshop is a tutorial review of the state-of-
the-art and discussion of implementable methodologies, strate-
gies and software. It will be substantially physically and electro-
magnetically oriented. It will also highlight advances in ANNs as
an unconventional alternative to modeling and design tasks in RF
and microwave CAD. ANN computation is very fast and ANNs
can learn and generalize from data allowing model development
even when component formulas are unavailable. Initiatives in in-
tegration of ANN capabilities into circuit optimization, statistical
design, global modeling, and computational electromagnetics
are being made.
With the increase in geometrical and physical complexity of
RF, microwave and high-speed digital circuits, techniques to im-
prove the yield and reduce the design cycles continue to grow in
importance. An objective of this workshop is to present the theo-
ry and application of statistical design tools applicable to RF/mi-
crowave circuit design, manufacturing and experimental re-
search. By considering component tolerances in terms of a statis-
tical distribution around the nominal value instead of a range, we
can apply Monte Carlo methods and other optimization tech-
niques over a large sample space. Thus, we can study the influ-
ence of random variations of significant factors and their interac-
tions upon the circuit performance. Monte Carlo and space-do-
main statistical optimization techniques for yield maximization
will be discussed.
We will consider characterization of random measurement er-
rors, parametric effects and their interactions on the outcome of
an experiment. A statistical design tool called Design of Experi-
ments (DOE) provides a powerful methodology to systematically
characterize the influence of main effects and their interactions.
We will briefly cover the theory of DOE and apply it to some
RF/microwave problems in the experimental arena.
 MONDAY WORKSHOPS
WMC: ICS FOR 40 GBIT/S DATA RATE COMMUNICATIONS
Date & Time: Monday, May 21; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Toward 40 Gbit/s and Beyond: Challenges for Systems,
Devices and Technologies – An Overview
Michael Rozmann, Multilink Technology Corporation
✗ A SiGe Chipset for 43Gb/s DWDM Data Transmission
Ernst Müllner,
Siemens Information and Communication Networks
✗ Mixed-Signal Issues for 40-Gbit/s Class InP-based
Multiplexer/Demultiplexer ICs
Taiichi Otsuji, Kyushu Institute of Technology
✗ Technologies of mm-Wave (30+GHz) Travelling-wave
Modulation, Rob Walker, Marconi Caswell Limited
✗ Limiting Amplifiers, Robert Pflieger, MITEQ Inc.
✗ Decision Circuits, Jean Godin, OPTO+, France Telecom
✗ Beyond 40 Gb/s?
Y. Baeyens, Lucent Technologies – Bell Laboratories
Organizers: Dr. Steve Marsh, Marconi Caswell Limited
John A Pierro, Miteq Inc.
Sponsors: MTT-6, Microwave and Millimeter Wave
Integrated Circuits
Technical Level: Tutorial and Advanced
Digital communications systems are already developing rapid-
ly, and with the explosion in Internet and mobile phone traffic,
the demand for high data rate links is likely to rise exponentially.
Current high capacity trunk links use fiber-optic cables and data
rates defined by the synchronous digital hierarchy (SDH) and
synchronous optical network (SONET) systems. Most of these in-
cumbent systems operate at STM-16 or 2.5 Gbit/s, with only the
most recent systems operating at STM-64 or 10 Gbit/s data rates.
The huge upsurge in demand means that bit rates in long-haul
systems are expected to rise to STM-256 or 40 Gbit/s soon after the
year 2000.
At these data rates the transmitted signal spectrum is extremely
broadband and contains components from as low as 30 kHz,
through microwave frequencies, up as high as mm-wave frequen-
cies (40GHz). This presents an interesting challenge to the IC de-
signer who must multiplex up numerous low data rate signals
into one 40 Gbit/s signal, drive the optical devices to send the sig-
nal down the optical fiber, amplify the detected signal at the far
end, extract a clean clock signal and 40 Gbit/s data stream and
de-multiplex it down into lower data rate signals. Digital engi-
neers are challenged by the non square-wave shape of the high
data rate signal and the need to consider transmission line ef-
fects, whilst analogue designers are challenged by jitter specifica-
tions and the need for time domain analysis.
The aim of this workshop is to debate the mixed-signal issues
involved with integrated circuit design for 40 Gbit/s data rate
communications systems, and expand on the technology and
techniques being used by industry leaders within this field.
21
WMD: ADVANCES IN CERAMIC INTERCONNECT TECHNOLOGIES
FOR WIRELESS, RF, AND MICROWAVE APPLICATIONS
Date & Time: Monday, May 21; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Topics & Speakers:
✗ Low Temperature Co-fired Ceramic Systems for Low GHz
Frequencies
Dr. Peter Barnwell, Heraeus Circuit Materials Division
MONDAY
✗ Electrical Properties of Low Loss Green Tape at 77+ GHz
Dan Amey, DuPont Microcircuit Materials
✗ Electronic Product Design System (EPDeS) Initiative, Status
Report, Don Brown, IWPC
✗ Design of LTCC Integrated RF Front End Modules
Chris Barrat, SOREP-ERULEC
✗ Effect of Surface Roughness on Microwave Loss of LTCC
Systems, Liang Chai, Ferro Electronic Materials
✗ A Simplified Method for the Design of 3D Integrated Passive
RF Functions in LTCC
Dongmei Cao, Raymond Brown, National Semiconductor
✗ LTCC Enhances Microwave Module Packaging
Bob Hunt, C-MAC MicroTechnology
✗ Modeling, Development, and Reliability Testing of a Side
Interconnect for Low Temperature Co-Fired Multilayer
Ceramic Integrated Circuits, Tom Wetteroth, Motorola Labs
✗ Investigation of Ring-Resonators on Multilayer LTCC
Reinhard Kulke, IMST
✗ RF Electrical Characteristics for a Pure Copper Metalization
System over Low Loss Ceramic Materials
Jeff Kramer, Zecal Technology LLC
Organizers: Dr. Peter Barnwell,
Heraeus Circuit Materials Division
Dr. Samuel J. Horowitz,
DuPont Microcircuit Materials
Sponsors: MTT-12, Microwave and Millimeter Wave
Packaging/Manufacturing
Technical Level: Tutorial and Advanced
The purpose of the workshop will be to acquaint engineers
with the capabilities of ceramic technologies for realizing wire-
less and microwave circuits and systems. For the year 2001, in-
creased emphasis will be placed on more advanced design tech-
niques and applications.
The reason for running the workshop is that ceramic technolo-
gies are generally less familiar to design engineers and yet offer
significant benefits in terms of circuit performance, weight and
reliability. These benefits need to be communicated to design en-
gineers to allow them to realize appropriate circuit and system so-
lutions. Newer technologies are advancing these benefits further,
while at the same time driving costs down.
 MONDAY WORKSHOPS
WME: ULTRA-HIGH SPEED ICS FOR COMMERCIAL APPLICATIONS – WMF: HIGH DENSITY/MULTILAYER RF INTERCONNECTS
PRESENT STATUS AND FUTURE TRENDS
Date & Time: Monday, May 21; 8:00 AM to 12:00 PM
Date & Time: Monday, May 21; 8:00 AM to 5:00 PM
Location: Phoenix Civic Plaza
Location: Phoenix Civic Plaza
Topics & Speakers:
Topics & Speakers:
✗ Circuits and Antennas for RF Front Ends
✗ An Overview of Electronics for 40+ Gb/s Transmission Linda Katehi, University of Michigan
Mehran Mokhtari, HRL Labs ✗ Coupling Between Closely Spaced RF Transmission Lines
✗ SiGe HBT/BiCMOS Technology and Multigigabit ICs and Methods to Alleviate Problems
MONDAY

Katsuyoshi Washio, Hitachi Ltd. George Ponchak, NASA Glenn Research Center
✗ InP-based HBT Circuits for High-speed Lightwave and Emmanouil M. Tentzeris, Georgia Institute of Technology
Millimeterwave Applications John Papapolymerou, University of Arizona
Yves Baeyens, Lucent Technologies ✗ Embedded Passive Components/Devices Within High
✗ VHSICs for ETDM transmission in InP DHBT Technology Frequency Circuit Implementations
Agnieszka Konczykowska, OPTO+, France Telecom R&D A. Elshabini, University of Arkansas
✗ InP HEMT ICs for 40-Gbit/s Optical Fiber Communication F.D. Barlow, University of Arkansas
Systems, Koichi Murata, NTT Labs ✗ Thin-film Approach for Multi-chip Modules at Frequencies
✗ High Speed Analog-to-Digital Conversion for RF and Digital Beyond 20 GHz
Receiver Applications Dr. Wolfgang Heinrich,
Joseph Jensen, Robert Walden, HRL Labs. Ferdinand Braun Institute, Germany
✗ Optical Networking: Matching Technology to System ✗ Thick-Film Technology Reduces Cost and Improves
Requirements, Ira Deyhimy, Vitesse Semiconductor Repeatability at Millimeter-Wave Frequencies
✗ High-speed Electrical Crosspoint Switches for Optical Sebastiano Nicotra, MITEL SRL, Italy
Crossconnect Systems, Charles Chang, Conexant Systems
✗ Design Considerations for Multigigabit IC Package Organizers: George E. Ponchak,
Mohamed Megahed, Conexant Systems NASA Glenn Research Center
John Papapolymerou, University of Arizona
Organizers: Debabani Choudhury, HRL Labs
Alwyn Seeds, University College London Sponsors: MTT-12, Microwave and Millimeter Wave
Packaging/Manufacturing
Sponsors: MTT-3, Lightwave Technology
MTT-7, Microwave and Millimeter-wave Technical Level: Tutorial and Advanced
Solid State Devices There is a growing need to reduce the size and cost of RFICs
MTT-9, Digital Signal Processing and highly integrated RF systems on a chip for smaller consumer
products and to enable their insertion into microwave and mil-
Technical Level: Tutorial and Advanced limeter-wave phased array antennas. To satisfy this goal, circuits
The current worldwide trend is to exploit the ultrahigh trans- and packages are now incorporating multiple layers of wiring.
mission capacity of lightwave communication technology to Furthermore, more functions than simple routing are being per-
meet the ever-increasing bandwidth demand of long-haul com- formed in these multilayer circuits through the incorporation of
munications as well as internet traffic. A large number of indus- embedded passive elements and multiple interconnects between
tries and academic institutes are investing resources and efforts layers. This workshop will present the challenges, state of the art,
to increase the data rate in communication and signal processing and possibilities of multilayer circuits. Presentations will describe
systems. The bandwidth of the transmission is dictated by the multilayer circuits fabricated with micromachined Si wafers, thin
high-speed electronics, which are used for transmission, recep- film technologies, and thick film technologies.
tion and switching.
The recent advancement in the various semiconductor tech-
nologies opened up the possibility to achieve the required multi-
gigabit IC performance. While 10 Gbit/s systems are commercial-
ly deployed and 40 Gbit/s systems are demonstrated at the labo-
ratory level, several research teams are working on 100 Gb/s and
beyond.
This workshop will bring several experts from around the
world working in this area of technology. The presentations will
describe the latest information on design, fabrication, measure-
ment, applications and product development.
The workshop will start with an overview of the ultra-high
speed ICs for commercial applications. The speakers will then
present multigigabit circuits implemented with various state-of-
the-art integrated circuit technologies like, InP HBT, SiGe HBT,
InP HEMT, etc. The workshop will also cover presentations on sig-
nal processing including multi GS/s analog-to-digital conversion,
optical networking as well as switching VHSICs and embed-
ding/MCM issues of multigigabit systems.

22
 MONDAY WORKSHOPS MONDAY PANEL SESSION
WMG: HIGH PERFORMANCE PMA: RF CMOS FOR BLUETOOTH
AND EMERGING FILTER TECHNOLOGIES FOR WIRELESS
Date & Time: Monday, May 21; 12:00–1:15 PM
Date & Time: Monday, May 21; 1:00 PM to 5:00 PM
Location: Civic Plaza,
Location: Phoenix Civic Plaza
Organizer: Sayfe Kiaei, Arizona State University
Topics & Speakers:
Moderator: Sayfe Kiaei
✗ RF Filtering for Cellular Radio Systems
Ian Hunter, Filtronic plc Panelists: Chris Hull, Silicon Wave
✗ Trends and Evolution of High-Performance Filters Stephen Heinen, Infineon

MONDAY
Jerry Fiedziuszko, Space Systems LORAL Dalton Walsh, Philips Semiconductors
✗ Current Status and Future Trends in Acoustic Filters and KC Murphy, Broadcom
Their Wireless Applications, Clemens Ruppel, Siemens AG Vladimir Prodanov, Lucent Technologies
✗ Bulk Acoustic Resonators and Filters for Wireless Michael McCullagh, Parthus Technologies
Ken Lakin, TFR Technologies Inc. Teresa Meng, Atheros Communications
✗ Superconducting Filters for Basestations in the USA Advances in IC technologies have brought new opportunities
Greg Hey-Shipton, Superconductor Technologies Inc. to the modern-day wireless industry.
✗ A 2-GHz-Band Cryogenic Receiver Front-End for IMT-2000 These include new wireless LAN methods such as 802.11a,
Toshio Nojima, NTT DoCoMo Inc. Home RF, and Bluetooth. A new age of wireless LAN will be built
✗ Comparison Matrix for Filter Technologies on a combination of breakthroughs in wireless communication
Daniel Swanson, Bartley RF Systems Inc. methods and RF processes. However, there are many challenges
facing implementers of low-cost silicon RF solutions. The focus of
Organizers: Gregory Lyons, MIT Lincoln Laboratory this panel discussion will be on:
Daniel Swanson, Bartley RF Systems Inc. ✗ Technological barriers to implementing low cost
transceivers. Is CMOS the right solution?
Sponsors: MTT-16, Microwave Systems
✗ What is the most appropriate system partitioning for
MTT-18, Microwave Superconductivity
implementing Bluetooth in the cellular handset? Single Chip,
MTT-20, Wireless Communications
Module, or an integrated component inside the transceiver
Technical Level: Tutorial and Advanced baseband?
Wireless applications are growing at a tremendous rate and
high-performance filters are an integral part of wireless communi-
cation systems. Evolution of existing filter technologies and new
emerging filter technologies fundamentally influence system im-
plementation. New third-generation wireless requirements are
even more demanding than those in existing networks, in part be-
cause of the high data rates required for many envisioned appli-
cations, such as Internet access. This workshop begins by
overviewing present and future filter requirements for wireless
systems. Recent evolution of traditional filter technologies will be
summarized, including dielectric, cavity, ceramic, waveguide,
and SAW filters. New emerging filter technologies will be intro-
duced and described, including microelectromechanical sys-
tems (MEMS), ferroelectric, micromachined (thin) film bulk-
acoustic resonator (FBAR), and high-temperature superconduc-
tive (HTS) filter technologies. Some aspects of the workshop will
be tutorial. The goal is to provide an interactive forum in which
the attendees gain a comprehensive understanding of the various
filter technologies. At the conclusion of the workshop, a technol-
ogy matrix will be presented to compare capabilities of the vari-
ous technologies. A particular emphasis will be placed on
changes to this matrix that have effectively occurred in the past
three years. The matrix will include, for example, a comparison
of SAW, ceramic, and FBAR technologies for wireless
handset/mobile applications. The workshop will then close with
an interactive discussion of the filter technology matrix.

23
NOTES

24
 MTT-S STUDENT PAPER COMPETITION
The MTT-S Student Paper Competition encourages and recog-
nizes excellence in research in microwave science and technol-
ogy. Two hundred and forty-two student papers were submitted
to the competition this year. Among these submissions, 140
were accepted for presentation, and the technical program
committee selected 26 semifinalists. All accepted student pa-
pers will be presented at their appropriate paper sessions. In ad-
dition, the 26 semifinalists will also present their papers at the
Student Paper Competition Interactive Forums on Tuesday, May
22 and Wednesday, May 23 from 2:30 to 5 PM. All Symposium at-
tendees are welcome to attend these Student Paper Competi-
tion Interactive Forum sessions where final presentation and
judging will occur.
A Novel Adaptivity for EM Time Domain Methods : Scale Adaptive
Time Steps (SATS) (WE1F-5) IF-WE
A. Rennings, Gerhard Mercator University Duisburg, Duisburg, Germany
Development and Application of an Efficient FDTD/Haar MRTD
Numerical Interface (WE1F-4) IF-WE
C. Sarris, University of Michigan, Ann Arbor, USA
An Approach for Knowledge-Aided-Design (KAD) of Microwave
Circuits using Artificial Neural Networks (WE3E-2) IF-TU
R. Zingg, University of Colorado at Boulder, Boulder, USA
Exact Adjoint Sensitivity Analysis for Neural Based Microwave
Modeling and Design (WE3E-3) IF-TU
J. Xu, Carleton University, Ottawa, Canada
An Improved Behavioral Modeling Technique for High Power
Amplifiers with Memory (WE2C-5) IF-TU
N. Le Gallou, The University of Limoges, France
Improved Large-Signal Model and Model Extraction Procedure
for InGaP/GaAs HBTs Under High Current Operations (WE1C-3)
IF-
S. Cherepko, Lehigh University, Bethlehem, USA
Comparison of Wavelet- and Time-Marching-Based Microwave
Circuit Transient Analyses (TUIF-13) IF-WE
C.E. Christoffersen, North Carolina State University, Raleigh, USA
A Novel CPW Structure for High-speed Interconnects
(WE2A-3) IF-WE
S. Yoon, KJIST, Gwangju, South Korea
A Novel Low-Loss Slow-Wave CPW Periodic Structure for Filter
Applications (TU4B-3) IF-WE
J. Sor, University of California, Los Angeles, USA
Development of Vertical Planar Coil Inductors Using Plastic
Deformation Magnetic Assembly (PDMA) (TU3B-3) IF-WE
J. Zou, Univ. of Illinois, Urbana, USA
A Novel Nonreciprocal Ferrite Image Guide (WE4F-3) IF-TU
A.S. Akyol, UMIST, Manchester, UK
2 and 4-Bit DC-16 GHz Microstrip MEMS Distributed Phase
Shifters (TU3C-3) IF-WE
J.S. Hayden, University of Michigan, Ann Arbor, USA
Tunable Lumped Components with Applications to Reconfigurable
MEMS Filters (TU4C-6) IF-WE
D. Peroulis, University of Michigan, Ann Arbor, USA.
IF-TU: Interactive Forum presentation takes place Tuesday, May 22
IF-WE: Interactive Forum presentation takes place Wednesday, May 23
25
Prizes will be awarded to the six best papers among the final-
ists. All student semifinalists will be given certificates and compli-
mentary registration to IMS2001. Cash awards in the amount of
$2800 have been donated by MTT-S, and additional prizes for this
year’s contest have been provided through generous donations
from Motorola SPS Inc. Travel subsidies to the Symposium for all
the finalists were sponsored by the National Science Foundation
and MTT-S.
A student awards luncheon will be held at the Hyatt Regency
Hotel on Thursday of IMS Week during which the awards will be
presented. All student participants, including authors and co-au-
thors of submitted papers, have been invited.
Following is a listing of the semifinalists’ papers, student lead
authors and their respective institutions:
185 GHz Monolithic Amplifier in InGaAs/InAlAs Transferred-
Substrate HBT Technology (TH2F-6) IF-WE
M. Urteaga, University of California, Santa Barbara, Santa Barbara, USA
A Full Waveguide Band MMIC Tripler for 75-110 GHz
(TU1D-6) IF-TU
M. Morgan, California Institute of Technology, Pasadena, USA
TUESDAY
A 1W CMOS Power Amplifier for GSM-1800 with 55% PAE
(WE3A-1) IF-TU
C. Fallesen, Technical University of Denmark, Copenhagen, Denmark
High Power Broadband AlGaN/GaN HEMT MMICs on SiC
Substrates (WE4A-2) IF-TU
B.M. Green, Cornell University, Ithaca, USA
Ultra-Linear Distributed Class-AB LDMOS RF Power Amplifier
for Base Stations (WEIF-42) IF-WE
M.P. van der Heijden, Delft University of Technology, Delft, The
Netherlands
Integrated Electro-Thermal Probe (TH1E-1) IF-WE
R.M. Reano, University of Michigan, Ann Arbor, USA
A Microwave Radio for Doppler Radar Sensing of Vital Signs
(TU1F-8) IF-TU
A.D. Droitcour, Stanford University, Stanford, USA
A Novel Millimeter-Wave Beam-Steering Technique Using a
Dielectric-Image-Line-Fed Grating Film (TU3E-3) IF-WE
C.T. Rodenbeck, Texas A&M University, College Station, USA
A Novel Planar Array Smart Antenna System with Hybrid
Analog-Digital Beamforming (TU1E-1) IF-TU
S. Jeon, University of California, Los Angeles, Los Angeles, USA
A Compact LTCC Ku-Band Transmitter Module with Integrated
Filter for Satellite Communication Applications (WE3B-1) IF-TU
C. Lee, Georgia Institute of Technology, Atlanta, USA
A Highly-Integrated Low-Power Direct Conversion Receiver MMIC
for Broadband Wireless Applications (WE4B-2) IF-TU
B. Matinpour, Georgia Institute of Technology, Atlanta, USA
A Reconfigurable Active Retrodirective/Direct Conversion Receiver
Array for Wireless Sensor Systems (WE4C-4) IF-TU
R.Y. Miyamoto, University of California, Los Angeles, Los Angeles, USA
In-band Optical Crosstalk in Fiber-radio WDM Networks
(WE3D-4) IF-TU
D. Castleford, University of Melbourne, Australia
 TUESDAY, MAY 22, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 8:00–9:40 AM
TU1A Techniques for System Level Nonlinear TU1B Power Combiners/Dividers TU1C Microwave Photonics
Analysis and Simulation and Directional Couplers
Chair: P. Draxler, QUALCOMM, Inc. Chair: C. Buntschuh, Microwave Engineering Chair: P. Yu, UCSD
Co-chair: S. Kenney, Georgia Institute of Tech. Co-chair: E. Rezek, TRW
BALLROOM TUCSON 36–38 TUCSON 40–41

TU1B-1: A Novel 3-way Hybrid Combiner/Divider for High TU1C-1: Three-dimensional Millimeter-wave Photonic
TU1A-1: Analysis of CDMA Spectral Regrowth and Waveform Power C-class Microwave Amplifiers Integrated Circuits on Si
Quality M. Catoiu, Raytheon, Canada, Waterloo, Canada T. Minotani, Y. Royter, H. Ishii, A. Hirata, K. Machida, A. Sasaki,
8:00 AM

V. Aparin, QUALCOMM, Inc., San Diego, CA T. Nagatsuma, NTT Telecommunication Energy Laboratories,
Atsugi, Japan

TU1B-2: A Novel Design of 1 to 8 Power Divider/Combiner

X. Jiang, S. Ortiz, A. Mortazawi, NC State, Raleigh, NC
8:10 AM

TU1A-2: Generalized Autocorrelation Analysis of Spectral TU1B-3: A Low-loss Serial Power Combiner using Novel TU1C-2: Wide Bandwidth Traveling-wave InGaAsP/InP
Regrowth from Bandpass Nonlinear Circuits Suspended Stripline Couplers Electroabsorption Modulator for Millimeter-wave Applications
K. Gard, QUALCOMM Inc., San Diego, CA; L.E. Larson, Y. Tahara, H. Oh-hashi, T. Ban, K. Totani, M. Miyazaki, G. Li, W.S. Chang, P.K. Yu, UC San Diego, La Jolla, CA;
8:20 AM

University of California San Diego, San Diego, CA; M.B. Steer, Mitsubishi Electric Corp., Kamakura, Japan S.A. Pappert, C.K. Sun, SPAWAR Systems Center, San Diego, CA
North Carolina State University, Raleigh, NC

TU1B-4: A Compact Coaxial Waveguide Combiner Design

for Ultra-broadband Power Amplifier
P. Jia, R.A. York, University of California, Santa Barbara, CA
8:30 AM

TU1A-3: Application of Polyspectral Techniques to Nonlinear TU1C-3: High-power Photonic Microwave Generation
Modeling and Compensation at K- and Ku-bands using a Uni-traveling-carrier Photodiode
C.P. Silva, A.A. Moulthrop, M.S. Muha, C.J. Clark, H. Ito, H. Fushimi, Y. Muramoto, T. Furuta, T. Ishibashi, NTT
8:40 AM

The Aerospace Corp., El Segundo, CA Photonics Labs, Atsugi, Japan

TU1A-4: Estimation of Error Vector Magnitude using Two-tone TU1B-5: Broadband Lumped-element 180-degree Hybrids
Intermodulation Distortion Measurements Utilizing Lattice Circuits
H. Ku, J.S. Kenney, Georgia Institute of Technology, Atlanta, GA K. Tadashi, K. Yoshihio, O. Isao, Himeji Institute of Technology,
8:50 AM

Himeji-shi, Japan

TU1A-5: Investigation of Behavioral Model Accuracy using a TU1C-4: Direct Opto-electronic Synthesis of mW-level
State-space and Convolution-based Transient Simulator Millimeter-wave Signals using an Optical Frequency Comb
A. Zhu, T.J. Brazil, University College Dublin, Dublin, Ireland Generator and a Uni-traveling-carrier Photodiode
9:00 AM

S. Fukushima, Y. Muramoto, NTT Photonics Labs, Atsugi-City,

Japan, C.F. Silva, A.J. Seeds, University College London,
London; England

TU1B-6: Design of High Directivity Directional Couplers in

Multilayer Ceramic Technologies LTCC/HTCC
S. Al-taei, P. Lane,University College London, London, UK;
9:10 AM

G. Passiopoulos,Nokia Networks, Camberley, UK

TU1A-6: Efficient Circuit-level Analysis of Large Microwave TU1C-5: Photodetection, Photonic Feeding Coplanar Patch
Systems by Krylov-subspace Harmonic Balance Antenna and Transmitting Experiment for Radio-on-fiber System
V. Rizzoli, A. Lipparini, D. Masotti University of Bologna, K. Li, M. Izutsu, CRL, Japan, Koganei-shi, Japan
9:20 AM

Pontecchio Marconi (BO), Italy; F. Mastri, University

of Bologna, Bologna, Italy

TU1C-6: Experimental Reduction of Dispersion-induced Effects

in Microwave/Millimeter-wave Optical Systems Employing SOA
Boosters
9:30 AM

F. Ramos, J. Herrera, J. Marti, Universidad Politecnica de

Valencia, Valencia, Spain

26
 TU1D Frequency Converters TU1E Smart Antennas TU1F Biological Effects
and Medical Applications
Chair: M. Madihian, NEC Chair: M. Thursby, SkyCross Inc. Chair: J. Pribetich, University of Lille
Co-chair: L. Reynolds, RF Micro Devices Co-chair: B. Perlman, CECOM Co-chair: P. Yu, University of California
TUCSON 42–43 YUMA 26–28, 31–33 YUMA 21–23

TU1D-1: RF Mixers using Standard Digital CMOS 0.35 µm TU1E-1: A Novel Planar Array Smart Antenna System TU1F-1: Temperature Rise for the Human Head for Cellular
Process with Hybrid Analog-digital Beamforming Phones and for Peak SARs Prescribed in Safety Guidelines
V. Geffroy, ACCO, Saint-Germain-En-Laye, France; G. De Astis, S. Jeon, Y. Wang, Y. Qian, T. Itoh, University of California, O.P. Gandhi, Q. Li, G. Kang, University of Utah,
8:00 AM

ATMEL, Rousset, France; E. Bergeault, Ecole Nationale Los Angeles, Los Angeles, CA Salt Lake City, UT
Superieure des Telecommunications, Paris, France

TU1D-2: Broadband and Compact SiBJT Balanced Up-converter

MMIC using Si 3-D MMIC Technology
K. Nishikawa, T. Nakagawa, B. Piernas, K. Araki, NTT Network
8:10 AM

Innovation Laboratories, Yokosuka-shi, Japan; K. Kamogawa,

NTT DoCoMo Inc., Yokosuka-shi, Japan

TU1D-3: A Highly Linear Single Balanced Mixer Based TU1E-2: Digital Beamforming for Smart Antennas TU1F-2: Power Absorption and Temperature Elevations Induced
on Heterojunction Interband Tunneling Diode T. W. Nuteson, G.S. Mitchell, The Aerospace Corp., in the Human Head by Dual-band Phones
A. Cidronali, G. Collodi, G. Manes, C. Toccafondi, Chantilly, USA P. Bernardi, M. Cavagnaro, S. Pisa, E. Piuzzi, University
8:20 AM

Univ of Florence, Florence, Italy; M. Deshpande, N. El-Zein, “La Sapienza” of Rome, Rome, Italy
H. Goronkin, V. Nair, Phys Sciences Res Lab, USA

TUESDAY
TU1F-3: Miniature Sensor for Measurement and Control of
Temperatures by Microwave Radiometry in Medical Applications
C. Vanoverschelde, L. Dubois, V. Thomy, J. Sozanski, J. Camart,
8:30 AM

M. Chive, J.P. Pribetich, Université des Sciences &

Technologies de Lille – IEMN, Villeneuve D’Ascq, France

TU1D-4: A 60 GHz Uniplanar MMIC 4X Subharmonic Mixer TU1E-3: Smart Lens Antenna Arrays TU1F-4: Analysis of Planar Strip Array Antenna for MRI
M.W. Chapman, S. Raman, Virginia Polytechnic Institute J.E. Vian, MIT Lincoln Labs, Lexington, MA; Z. Popovic, R.F. Lee, GE Corporate R&D, Niskayuna, USA; C.R. Westgate,
and State University, Blacksburg, VA University of Colorado, Boulder, CO Johns Hopkins University, Baltimore, MD
8:40 AM

TU1D-5: A Monolithic HEMT Diode Balanced Mixer TU1E-4: Adaptive Beamforming of ESPAR Antenna TU1F-5: Resonant Slot Antennas as Transducers of DNA
for 100–140 GHz using Sequential Perturbation Hybridization: A Computational Feasibility Study
M. Morgan, California Institute of Technology, Pasadena, CA; J. Cheng, Y. Kamiya, T. Ohira, ATR Adaptive Communications C. Wichaidit, J.R. Peck, Z. Lin, R.J. Hamers, S.C. Hagness, D.W.
8:50 AM

S. Weinreb, Jet Propulsion Laboratory, Pasadena, CA Research Laboratories, Soraku-gun, Japan van der Weide, University of Wisconsin – Madison, Madison, WI

TU1D-6: A Full Waveguide Band MMIC Tripler for 75–110 GHz

M. Morgan, California Institute of Technology, Pasadena, CA;
S. Weinreb, Jet Propulsion Laboratory, Pasadena, CA
9:00 AM

TU1D-7: High Gain PHEMT Frequency Doubler for 76 GHz TU1E-5: Microwave Device Combining Filtering and Radiating TU1F-6: A Zeeman-Stark/Markov Model Approach to Study the
Automotive Radar Functions for Telecommunication Satellites EM Exposure of a Potassium Channel
A. Werthof, H. Tischer, T. Grave, Infineon Technologies AG, H. Blondeaux, D. Baillargeat, P. Leveque, S. Verdeyme, S. Bruna, S. Giordano, E. Moggia, B. Bianco, University of
9:10 AM

Munich, Germany P. Vaudon, P. Quillon, IRCOM, Limoges, France; A. Carlier, Genoa, Genoa, Italy; M. Liberti, G. D’Inzeo, University of Rome,
Y. Cailloce, Alcatel Space Industries, Toulouse, France Rome, Italy

TU1D-8: A Stability Ensuring Design Approach for Frequency TU1E-6: An Internet Controlled Calibration System for TDMA TU1F-7: Non-invasive Measurement of Blood Sugar Level by
Triplers Smart Antenna Wireless Base Stations Millimeter Waves
B. Bunz, G. Kompa, University of Kassel, Kassel, Germany J.H. Sinsky, Bell Laboratories – Lucent Technologies, Y. Nikawa/Yoshio, D. Someya/Daisuke, Kokushikan University,
9:20 AM

Holmdel, USA Setagaya, Japan

TU1D-9: A Family of Q, V and W-band Monolithic Resistive TU1F-8: A Microwave Radio for Doppler Radar Sensing
Mixers of Vital Signs
M. Kimishima, T. Ataka, H. Okabe, Advantest Corp., A.D. Droitcour, Stanford University, Stanford, USA; V.M.
9:30 AM

Gyoda, Japan Lubecke, J. Lin, O. Boric-Lubecke, Lucent Technologies, Murray

Hill, NJ

27
 TUESDAY, MAY 22, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 1:20–3:00 PM
TU3B Baluns, Spiral Inductors TU3C MEMS for Antenna Applications TU3D Control Devices
and Resonators
Chair: A. Fathy, Sarnoff Corp. Chair: S. Barker, University of Virginia Chair: M. Goldfarb, Analog Devices
Co-chair: George Ponchak, NASA Glenn Research Co-chair: T. Weller, University of South Florida Co-chair: S. Brozovich, Filtronics Solid State
TUCSON 36–38 TUCSON 40–41 TUCSON 42–43

TU3B-1: Sandwich Type Ferromagnetic RF Integrated Inductor TU3C-1: 2-D Mechanical Beam Steering Antenna Fabricated TU3D-1: A Novel Digital Phase Shifter Design at X-band
M. Yamaguchi, M. Baba, K. Arai, Tohoku University, Sendai, using MEMS Technology J. Zhang, S. Ortiz, A. Mortazawi, North Carolina State
Japan C. Baek, S. Song, Y. Kim, Y. Kwon, Seoul National University, University, Raleigh, NC
1:20 PM

Seoul, Korea, South; C. Cheon, University of Seoul, Seoul,

Korea, South

TU3D-2: An Ultra Broad Band Reflection Type 180 degree Phase

Shifter with Series and Parallel LC Circuits
K. Miyaguchi, M. Hieda, K. Nakahara, M. Kasahara, T. Takagi,
1:30 PM

Mitsubishi Electric Corp, Kamakura, Japan; H. Kurusu,

Mitsubishi Electric Corp, Itami, Japan; M. Nii, Mitsubishi
Electric Corp, Amagasaki, Japan

TU3B-2: Improved Three-dimensional GaAs Inductors TU3C-2: Microelectromechanical Systems (MEMS) Actuators
B. Piernas, K. Nishikawa, T. Nakagawa, K. Araki, NTT Network for Antenna Reconfigurability
Innovation Laboratories, Yokosuka-shi, 239-0847 Japan; R.N. Simons, Dynacs Engineering Company Inc./NASA Glenn
1:40 PM

K. Kamogawa, NTT DoCoMo Inc., Yokosuka-shi, 239-8536 Japan Research Center, Cleveland, OH; D. Chun, L.P. Katehi,
University of Michigan, Ann Arbor, MI

TU3D-3: A High-performance GaAs SP3T Switch for Digital

Cellular Systems
Z. Gu, S. Zhang, D. Johnson, S. Belletete, M. Ayvazian,
1:50 PM

D. Fryklund, Alpha Industries, Woburn, MA

TU3B-3: Development of Vertical Planar Coil Inductors TU3C-3: 2 and 4-bit DC-16 GHz Microstrip MEMS Distributed TU3D-4: High Isolation V-band SPDT Switch MMIC for High
using Plastic Deformation Magnetic Assembly (PDMA) Phase Shifters Power Use
J. Zou, J.G. Nickel, D. Trainor, C. Liu, J.E. Schutt-Aine, J.S. Hayden, G.M. Rebeiz, University of Michigan, Ann Arbor, T. Shimura, Y. Mimino, K. Nakamura, Y. Aoki, S. Kuroda,
2:00 PM

Univ. of Illinois, Urbana, IL MI; A. Malczewski, J. Kleber, C.L. Goldsmith, Raytheon Systems Fujitsu Quantum Devices Limited, Hachiohji-shi, Japan
Corp, Dallas, TX

TU3B-4: A Low-loss Planar Microwave Balun

with an Integrated Bias Scheme for Push-pull Amplifiers
J. Lee, K.J. Webb, Purdue University, West Lafayette, USA
2:10 PM

TU3B-5: Graphical Design of Air-gap Stacked Marchand Balun TU3C-4: MEMS X-band Low Loss Quad Time Delay Unit TU3D-5: Switches with Capacitor Cancelled Parasitic
G. Ryu, LG Electronics Institute of Technology, Seoul, Korea; H.N. Fudem, L. Chen, R.J. March, R.C. Tranchini, D.E. Crockett, Inductance of FET
D. Kim, J. Lee, K. Seo, Seoul National University, Seoul, Korea J.W. Gipprich, J.E. Kositz, G.K. Sinon, Northrop Grumman K. Kazuhiko, K. Miyaguchi, M. Hieda, T. Takagi, Mitsubishi
2:20 PM

Corp., Baltimore, MD Electric Corp., Kamakura, Japan; H. Kurusu, Mitsubishi Electric

Corp., Hyogo, Japan

TU3B-6: High-Q Frequency Stable Dual-mode Whispering

Gallery Sapphire Resonator
M.E. Tobar, E.N. Ivanov, J.G. Hartnett, University of Western
2:30 PM

Australia, Crawley, Australia; D. Cros, University of Limoges,

Limoges, France

TU3C-5: Lifetime Characterization of Capacitive RF MEMS TU3D-6: A V-band MMIC SPDT Passive HEMT Switch
Switches using Impedance Transformation Networks
C. Goldsmith, J. Ehmke, A. Malczewski, B. Pillans, S. Eshelman, Y. Wang, K. Lin, H. Wang, National Taiwan University, Taipei,
2:40 PM

Z. Yao, J. Brank, M. Eberly, Raytheon Company, Dallas, TX ROC; D. Niu, Chung-Shan Institute of Science and Technology,
Tai-Yuan, ROC
2:50 PM

28
 NOTES
TU3E Phased Array Antennas

Chair: K. Chang, Texas A&M University

Co-chair: R. Sudbury, MIT Lincoln Laboratory
YUMA 26–28, 31–33

TU3E-1: New Phase Shifter and Phased Antenna Array Designs

Based on Ferroelectric Materials and CTS Technologies
M.F. Iskander, Z. Zhang, Z. Yun, R. Isom, M. Hawkins, Univ.
1:20 PM

of Utah, Salt Lake City, UT; R. Emrick, B. Bosco, Motorola Inc.,

Chandler, AZ; J. Synowczynski, B. Gersten, US Army Res Lab,
Aberdeen Proving Ground, USA
1:30 PM

TU3E-2: A Bi-directionally Steering Phased Array Antenna

Controlled by Dual Piezoelectric Transducers
T. Yun, K. Chang, Texas A&M University, College Station, TX
1:40 PM

TUESDAY
1:50 PM

TU3E-3: A Novel Millimeter-wave Beam-steering Technique

using a Dielectric-image-line-fed Grating Film
C.T. Rodenbeck, M. Li, K. Chang, Texas A&M University,
2:00 PM

College Station, TX
2:10 PM

TU3E-4: A Method for Determining Noise Coupling in a Phased

Array Antenna
J.P. Peeters Weem, A. Popovic, University of Colorado, Boulder,
2:20 PM

CO
2:40 PM

TU3E-5: Performance of Thinned Antenna Arrays using

Nonlinear Processing in DBF Radar Applications
C. Metz, L.C. Stange, A.F. Jacob, Institut für
2:40 PM

Hochfrequenztechnik, Braunschweig, Germany; E. Lissel,

Volkswagen AG, Wolfsburg, Germany
2:50 PM

29
 TUESDAY, MAY 22, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 3:30–5:10 PM
TU4A Low Noise Amplifiers (LNAs) TU4B Innovative Structures TU4C MEMS Control Circuits
Joint IMS/RFIC Session
Chair: S. Lloyd, Conexant Co. Chair: J. Owens, Auburn University Chair: C. Goldsmith, Raytheon Company
Co-chair: K. Ashby, Microtune Inc. Co-chair: C. Nguyen, University of Michigan
BALLROOM TUCSON 36–38 TUCSON 40–41

TU4A-1: A Wide Dynamic Range Switched-LNA in SiGe BiCMOS TU4B-1: Passive Electromagnetic Compensation of Permittivity TU4C-1: MEMS Single-pole Double-throw (SPDT) X and K-band
T. Nakatani, Matsushita Electric Industrial Co., Ltd., Kadoma Changes in Microwave Circuits Switching Circuits
City, Japan; J. Itoh, I. Imanishi, O. Ishikawa, Matsushita J. Hesselbarth, R. Vahldieck, ETH, Zurich, Switzerland S.P. Pacheco, D. Peroulis, L. Katehi, University of Michigan,
3:30 PM

Electronics Corp., Takatsuki, Japan Ann Arbor, MI

.

TU4C-2: DC-26 GHz MEMS Series-shunt Absorptive Switches

G. Tan, G.M. Rebeiz, University of Michigan, Ann Arbor, MI
3:40 PM

TU4A-2: Dual Bias Feed SiGe HBT Low Noise Linear Amplifier TU4B-2: 360-degree Linear Analog Phase Shifter Design using TU4C-3: MEMS High Q Microwave Inductors using Solder
E. Taniguchi, K. Maeda, N. Suematsu, T. Takagi, Mitsubishi Tunable Short-circuit Terminated Combline Filters Surface Tension Self-assembly
Electric Corp, Kamakura, Japan; T. Ikushima, K. Sadahiro, S. Shin, R.V. Snyder, E. Niver, New Jersey Institute G.W. Dahlmann, E.M. Yeatman, Imperial College, London, UK;
3:50 PM

K. Itoh, Mitsubishi Electric Corp, Amagasaki, Japan of Technology, Newark, NJ P.R. Young, I.D. Robertson, S. Lucyszyn, University of Surrey,
Guildford, UK

TU4C-4: Micromachined Frequency-variable Impedance Tuners

using Resonant Unit Cells
S. Jung, K. Kang, J. Park, Y. Kim, Y. Kwon, Seoul National
4:00 PM

University, Seoul, Korea; K. Chung, WAVICS Co. Ltd., Seoul,

Korea

TU4A-3: A 1.4 dB NF Variable Gain LNA with Continuous TU4B-3: A Novel Low-loss Slow-wave CPW Periodic Structure
Control for 2 GHz-band Mobile Phone using InGaP Emitter HBT for Filter Applications
Y. Aoki, M. Fujii, H. Dodo, H. Hida, NEC Corp., Tsukuba, Japan; J. Sor, Y. Qian, T. Itoh, UCLA Microwave Electronics Laboratory,
4:10 PM

S. Ohkubo, S. Yoshida, T. Niwa, Y. Miyoshi, N. Goto, NEC Corp., Los Angeles, CA

Kawasaki, Japan

TU4C-5: A Reconfigurable Double-stub Tuner using MEMS

Devices
K.L. Lange, Raytheon Co., Tucson, AZ; J. Papapolymerou,
4:20 PM

he University of Arizona, Tucson, AZ; C.L. Goldsmith,

A. Malczewski, J. Kleber, Raytheon Co., Dallas, TX

TU4A-4: A 1.7 mA Low Noise Amplifier with Integrated Bypass TU4B-4: Overlapping, Multiple CPW Stub Structures for High
Switch for Wireless 0.05-6 GHz Portable Applications Density MMICs
H. Morkner, M. Frank, S. Yajima, Agilent Technologies, Newark, K. Hettak, C.J. Verver, M.G. Stubbs, Communications Research
4:30 PM

NJ Centre, Ottawa, Canada

TU4C-6: Tunable Lumped Components with Applications to

Reconfigurable MEMS Filters
D. Peroulis, S. Pacheco, K. Sarabandi, L.P. Katehi, University
4:40 PM

of Michigan, Ann Arbor, MI

TU4B-5: LTCC-MLC Balun for WLAN/Bluetooth

C. Tang, Industrial Technology Research Institute, Chutung,
Taiwan
4:50 PM

TU4C-7: A Micromachined Tunable CPW Resonator

T. Ketterl, T. Weller, University of South Florida, Tampa, FL;
D. Fries, University of South Florida, St. Petersburg, FL
5:00 PM

30
 TU4D Acoustic Devices for Wireless
Communications and Sensing
Chair: R. Weigel, University of Linz
Co-chair: C.C.W. Ruppel, EPCOS, Munich
TUCSON 42–43
TU4D-1: Invited: SAW Filter Solutions to the Needs of 3G
Cellular Phones
G. Fischerauer, T. Ebner, P. Kruck, K. Morozumi, R. Thomas,
3:30 PM
M. Pitschi, Epcos, 81617 Munich, Germany
3:40 PM
TU4D-2: Optimized Design and Fabrication of a Wireless
Pressure and Temperature Sensor Unit Based on SAW
Transponder Technology
3:50 PM
G. Schimetta, R. Weigel, Johannes Kepler University, Linz,
Austria; F. Dollinger, G. Scholl,Siemens Corporate Research,
Munich, Germany
4:00 PM
TU4D-3: Spurious Suppression Technique of Edge-trap-type SAW
Resonators and Their Applications to 1-GHz Wide-band
SAW-VCOs for Mobile Communications
4:10 PM
T. Kachi, A. Isobe, K. Asai, M. Hikita, Central Research
Laboratory, Hitachi, Ltd., Kokubunji-sho, Japan; A. Sumioka,
Hitachi Kokusai Electric Inc., Kodaira-shi, Japan
TU4D-4: The Application of Dielectric Thin Films to Enhance
the Properties of SAW Devices
F.S. Hickernell, Motorola Inc., and the University of Arizona,
4:20 PM
Phoenix, AZ
TU4D-5: A Film Bulk Acoustic Resonator (FBAR) Duplexer
for USPCS Handset Applications.
P.D. Bradley, R. Ruby, Y. Oshmyansky, Agilent Technologies,
4:30 PM
Newark, NJ; J.D. Larson, Agilent Technologies, Palo Alto, CA
4:40 PM
TU4D-6: FBAR Dispersion Relation and Laser Measurements
P.T. Tikka, Nokia Mobile Phones Ltd., Helsinki, Finland;
G.G. Fattinger, Johannes Kepler University, Linz, Austria
4:50 PM
5:00 PM
TU4E Novel Antennas and Applications
Chair: W. Shiroma, University of Hawaii
Co-chair: D. McQuiddy, Triquint Inc.
YUMA 26–28, 31–33
TU4E-1: Silicon Based Reconfigurable Antennas
A.E. Fathy, A. Rosen, H. Owen, S. Kanamaluru, F. Mcginty,
D. Mcgee, G. Taylor, P.K. Swain, S. Perlow, Sarnoff Corp.,
Princeton, USA; M. ElSherbiny, Future Technology Inc.,
Irvine, CA
TU4E-2: Hilbert Curve Fractal Antennas with Reconfigurable
Characteristics
K.J. Vinoy, K.A. Jose, V.K. Varadan, V.V. Varadan,
The Pennsylvania State University, University Park, PA
TU4E-3: Active Antenna using Multi-layer Ceramic-polyimide
Substrates for Wireless Communication Systems
T. Seki, H. Yamamoto, T. Hori, M. Nakatsugawa, Nippon
Telegraph and Telephone Corp., Yokosuka, Japan
TU4E-4: A Ka-band High-efficiency Dielectric Lens Antenna
with a Silicon Micromachined Microstrip Patch Radiator
U. Sangawa, K. Takahashi, H. Yabuki, Kawasaki, Japan;
T. Urabe, H. Ogura, Kadoma, Japan
TU4E-5: A Multifunctional Antenna for Terrestrial and Satellite
Radio Applications
S.M. Lindenmeier, J.F. Luy, DaimlerChrysler Research
and Technology, Ulm, Germany; P. Russer, Technische
Universitaet Muenchen, Munich, Germany
31
A LSO
O C CU R R I N G
Tuesday, May 22, 5:00–10:00 PM
MTT-S Special Tuesday Evening Event,
Corona Ranch & Rodeo Grounds
MTT-S 2001 will sponsor a unique southwestern event
on Tuesday evening. We have reserved a fleet of buses
that will transport you to Corona Ranch and Rodeo
Grounds, located in the shadow of South Mountain. As you
exit your bus, you will be greeted by Mariachis and Mar-
garitas. Once inside the grounds, the reception will start
with a variety of hors d’hourves and libations to celebrate
the spirit of the southwest. Walk around the grounds and
participate in several Cowboy events: See how long you
can ride the bucking barrel (er, we mean “bull”)! Our
cowboys will provide roping lessons, after which you will
test your new found skills by roping a mechanical “calf.”
And, of course, the activities would not be complete with-
out lessons in the quick draw – after which, you will get to
try out your fast draw against your fellow conference at-
tendees! A Country & Western band will keep you rockin’
throughout the night.
This special event will include a Rodeo Show that high-
TUESDAY
lights the most exciting portions of both Western Rodeo
and Mexican Charreada. The Charreada will demonstrate
riding, roping, accuracy, and style. The Western Rodeo
showcases wild bull riding and western style wild bronco
riding. Other activities will include precision high speed
horse maneuvers, trick roping, the women’s formation
drill team and much more! We will also have two very spe-
cial Audience Participation rodeo events set aside for
MTT-S attendees! This is one of the best parts of the
Rodeo and promises to be a hilarious event.
After the Rodeo, the feast begins…our Cowboy cui-
sine includes mesquite grilled top sirloin paired with BBQ
chicken and western ribs. Mixed greens, baked beans,
corn-on-the-cob, fabulous dessert and coffee will round
out the dinner. Our buses will whisk you back to your ho-
tel at the end of the evening.
There will be plenty of fun, games and prizes. Tickets
are limited. Get ‘em early or miss out on one of the best
events of this year’s Symposium! Transportation will be-
gin boarding at the Civic Plaza at 5:00 PM.
 TUESDAY, MAY 22, 2001 • INTERACTIVE FORUM • 2:30–5:00 PM
PHOENIX CIVIC PLAZA, PHOENIX ROOM
TUIF-1: LDMOS Electro-thermal Model Validation from Large-signal Time-domain
Measurements
R. Gaddi, J. Benedikt, P.J. Tasker, School of Engineering, Cardiff University, Cardiff, UK;
J.A. Pla, Motorola, Tempe, AZ
TUIF-2: Tunnel Diode Non-linear Model for Microwave Circuits and Active Antennas
M.R. Deshpande, V. Nair, N. El-Zein, H. Goronkin, Motorola Inc., Tempe, AZ; K. Liu,
S.M. El-Ghazaly, Arizona State University, Tempe, AZ; A. Cidronali, G. Manes, University of
Florence, Firenze, Italy
TUIF-3: A Simple Bias Dependent LF Noise Model for CAD
I.M. Angelov, R.S. Kozhuarov, H.H. Zirath, Chalmers Univ., Goteborg, Sweden
TUIF-4: Temperature-dependent Modeling of High Power MESFET using Thermal FDTD
Method
W. Wojtasiak, D. Gryglewski, Institute of Radioelectronics, Warsaw, Poland
TUIF-5: Full Wave Analysis of FET Fingers using Various Semiconductor Physical Models
S. Goasguen, M. Tomeh, S. El-Ghazaly, Arizona State University, Tempe, AZ
TUIF-6: Generation of Multicarrier Complex Lowpass Models of RF ICs
P. Dobrovolny, P. Wambacq, G. Vandersteen, S. Donnay, M. Engels, I. Bolsens, IMEC, Leuven,
Belgium
TUIF-7: A Measurement Based Distributed Low Frequency Noise HEMT Model: Application
to Design of Millimeter Wave Automotive Radar Chip Sets
A. Laloue, A. Lyoubi, J. Nallatamby, M. Prigent, J. Obregon, University of Limoges, Brive La
Gallarde, France; M. Camiade, UMS-SAS, Orsay, France
TUIF-8: Pulse Characterization of Trapping and Thermal Effects of Microwave GaN Power
FETs
S. Augaudy, R. Quéré, J. Teyssier, IRCOM CNRS, Brive, France; M. di Forte Poisson,
S. Cassette, B. Dessertenne, S. Delage, Thomson CSF, Orsay, France
TUIF-9: Thermal Transients in Microwave Active Devices and Their Influence
on Intermodulation Distortion
S. David, W. Batty, A.J. Panks, R.G. Johnson, C.M. Snowden, Institut of Microwaves
and Photonics, University of Leeds, Leeds, UK
TUIF-10: A Krylov-subspace Technique for the Global Stability Analysis of Large Nonlinear
Microwave Circuits
V. Rizzoli, E. Furini, A. Costanzo, University of Bologna, Pontecchio Marconi (BO), Italy;
F. Mastri, University of Bologna, Bologna, Italy
TUIF-11: Two-tone Intermodulation Distortion Simulations in the Time Domain
using a Quasi-2D Physical pHEMT Model
P.J. Rudge, R. Miles, C. Snowden, University of Leeds, Leeds, UK; M. Steer, North Carolina
State University, Raleigh, NC
TUIF-12: Nonlinear Analysis of a Microwave Synthesizer Based on a Sampling-phase Detector
S. Sancho, S. Ver Hoeye, A. Suarez, J. Chuan, A. Tazon, Universidad de Cantabria, Santander,
Spain
TUIF-13: Comparison of Wavelet- and Time-marching-based Microwave Circuit Transient
Analyses
C.E. Christoffersen, M.B. Steer, North Carolina State University, Raleigh, NC
TUIF-14: Efficient Algorithm for Steady-state Stability Analysis of Large Analog/RF Circuits.
P. Bolcato, C.S. Rumolo, R. Larcheveque, ANACAD-MGC, Meylan, France; J. Nallatamby,
M.A. Prigent, J.J. Obregon, IRCOM, Brive, France
TUIF-15: Novel Artificial Frequency Mapping Techniques for Multi-tone Simulation of Mixers
N.B. de Carvalho, J.C. Pedro, Universidade de Aveiro, Aveiro, Portugal
TUIF-16: New System-level Simulation of Noise Spectra Distortion in FM-CW Autonomous
Cruise Control Radars.
A. Laloue, J. Nallatamby, M. Prigent, J. Obregon, University of Limoges, Brive La Gaillarde,
France; M. Camiade, UMS S.A.S., Orsay, France
TUIF-17: Spectrum Management of Pulse Transmission Line by High-cut Filter
using Magnetic Loss
T. Miura, TDK Techno Corp., Ichikawa, Japan; S. Nakagawa, TDK Corp., Ichikawa, Japan
TUIF-18: Null Pattern Synthesis of Ferroelectric Smart Antennas
J. Modelski, Y. Yashchyshyn, Warsaw University of Technology, Warszawa, Poland
TUIF-19: Ferroelectric Thin-film Based Electrically Tunable Ku-band Coplanar Waveguide
Components
G. Subramanyam, N. Mohsina, A.A. Zaman, University of Dayton, Dayton, OH;
F.W. Van Keuls, R.R. Romanofsky, F.A. Miranda, J.D. Warner, NASA Glenn Research Center,
Cleveland, OH
TUIF-20: Performance and Modeling of Saw Tooth Edge Mode Isolators
A.H. Aly, B. Elsharawy, Arizona State University, Tempe, AZ
TUIF-21: Possibility of Ultra Fine Isolator for Portable Phone
S. Takdeda, Hitachi Metals, Ltd., Tokyo, Japan; Y. Kishimoto, H. Itoh, Hitachi Metals, Ltd.,
Tottori, Japan; K. Ichikawa, Hitachi Metals Ltd., Kumagaya, Japan
TUIF-22: Modeling Coplanar Waveguide Structures Constructed of Ferromagnetic Metal
N. Cramer, U. of Colorado, Colorado Springs, Colorado Springs, CO; D.K. Walker, National
Institute of Standards and Technology (NIST), Boulder, CO
TUIF-23: Planar Ka-band High Temperature Superconducting Filters for Space Applications
C. Lascaux, F. Rouchaud, V. Madreangeas, M. Aubourg, P. Guillon, IRCOM, Limoges, France;
B. Theron, M. Maignan, Alcatel Space Industries, Toulouse, France
TUIF-24: Multi-stage Dual-mode Cross-slotted Superconducting Filters for Telecommunication
Application
A. Cassinese, R. Vaglio, Università di Napoli, Napoli, Italy; M. Barra, Università di Napoli,
Napoli, Italy; G. Panariello, Università di Cassino, Cassino, Italy
TUIF-25: Design of an Image-type Dielectric Resonator to Measure Surface Resistance
of a High-TC Superconductor Film
Y. Kobayashi, T. Hashimoto, Saitama University, Urawa, Japan
32
TUIF-26: Planar Superconducting Lumped Element Bandpass Filter with Spiral Inductors
A.E. Barinov, S.A. Zhgoon, Moscow Power Engineering Institute, Moscow, Russia
TUIF-27: Performance of a Superconducting Detector Circuit using a Schottky Barrier Diode
for Bandwidth Modulation +
M.W. Hosking, University of Portsmouth, Portsmouth, UK
TUIF-28: Bias Circuits for GaAs HBT Power Amplifiers
E. Jarvinen, S. Kalajo, Nokia Mobile Phones, Helsinki, Finland; M. Matilainen,
Nokia Research Center, Helsinki, Finland
TUIF-29: High-efficiency Low-IM Microwave PA Design
P. Colantonio, F. Giannini, E. Limiti, Università di Roma Tor Vergata, Roma, Italy; G. Leuzzi,
Università de L’Aquila, L’Aquila, Italy
TUIF-30: Highly Linear CMOS RF MMIC Amplifier using Multiple Gated Transistors
and its Volterra Series Analysis
B. Kim, K. Lee, Korea Advanced Institute of Science and Technology, Taejon, ROK; J. Ko,
Samsung Electronics, Suwon, ROK
TUIF-31: A Novel High Efficiency Multioctave Amplifier using Cascaded Reactively
Terminated Single-stage Distributed Amplifiers for EW System Applications
A.S. Virdee, Filtronic Components Ltd., Milton Keynes, UK; B.S. Virdee, University of North
London, London, UK
TUIF-32: A 2.4 GHz Integrated CMOS Power Amplifier with Micromachined Inductors
E. Chen, Y. Yoon, J. Laskar, M. Allen, Georgia Institute of Technology, Atlanta, GA
TUIF-33: Monolithic 6W Ka-band High Power Amplifier.
R.M. Emrick, Motorola Labs/Motorola Inc., Chandler, USA
TUIF-34: A Novel Method for Closed-loop Error Correction Microwave and Millimeter Wave
QPSK Modulator
A. Madjar, Rafael, Haifa, Israel; T. Blum, M. Namer, I. Itzkovic, B. Zusmanovic, Technion,
Haifa, Israel
TUIF-35: Micromachined Sub-millimeter and Millimeter Wave Variable Polarisation
Compensator
T.D. Drysdale, R.J. Blaikie, University of Canterbury, Christchurch, New Zealand;
H.M. Chong, D.R. Cumming, University of Glasgow, Glasgow, Scotland
TUIF-36: Membrane-supported Copper E-plane Circuits
W. Liu, D.P. Steenson, M.B. Steer, University of Leeds, Leeds, UK
TUIF-37: Suppression of Parasitic Substrate Modes in Flip-chip Packaged Coplanar W-band
Amplifier MMICs
A. Tessmann, W.H. Haydl, S. Kudszus, Fraunhofer Institute (IAF), Freiburg, Germany;
T.V. Kerssenbrock, P. Heide, Siemens AG, Munich, Germany
TUIF-38: A 60 GHz Circular Horn Antenna Excited with Quasi-Yagi Antenna
M. Sironen, Y. Qian, T. Itoh, UCLA, Los Angeles, CA
TUIF-39: Design of a Nonradiative Dielectric Rotman Lens in the Millimeter Wave Frequency
J. Lee, J. Lee, H. Tae, Hongik Univ., Seoul, Korea
TUIF-40: Nonlinear Distortion Suppression in Directly Modulated DFB Lasers by Sidemode
Optical Injection
S. Jun-Hyuk/Seo, S. Young-Kwang/Seo, C. Woo-Young/Choi, Yonsei University, Seoul,
Korea (South)
TUIF-41: A New, Compact Model for High-speed Electro-optic Modulators Fully Integrated
Within a Microwave CAD Environment
P. Zandano, M. Pirola, G. Ghione, Politecnico di Torino, Torino, Italy
TUIF-42: Electromagnetic and Thermal Modeling of the Lucite Cone Applicator for Superficial
Hyperthermia
T. Samaras, J.N. Sahalos, Aristotle University of Thessaloniki, Thessaloniki, Greece;
P.J. Rietveld, G.C. van Rhoon, AZR-Daniel, Rotterdam, The Netherlands
TUIF-43: Conformal Imaging with a Non-contacting Microwave Antenna Array
D. Li, P.M. Meaney, K.D. Paulsen, Dartmouth College, Hanover, NH
TUIF-44: A Low-power Direct Conversion Receiver Module for C-band Wireless Applications
B. Matinpour, A. Sutono, J. Laskar, Georgia Tech, Atlanta, GA
TUIF-45: A GaAs HBT 5.8 GHz OFDM Transmitter MMIC Chip Set
A. Raghavan, E. Gebara, C. Lee, S. Chakraborty, D. Mukherjee, J. Bhattacharjee, D. Heo,
J. Laskar, Georgia Institute of Technology, Atlanta, GA
TUIF-46: A 2.5 V CMOS Differential Active Inductor with Tunable L and Q
for Frequencies up to 5 GHz
M. Grözing, A. Pascht, M. Berroth, University of Stuttgart, Stuttgart, Germany
TUIF-47: Temperature Dependence of Intermodulation and Linearity in GaN Based Amplifiers
A. Ahmed, S. Islam, M. Anwar, University of Connecticut, Storrs, CT
TUIF-48: A New ‘T’ Circuit Topology for the Broadband Modelling of Symmetric Inductors
Fabricated in CMOS Technology
W. Tatinian, P. Pannier, Institut Charles Fabry, Marseille, France; R.A. Gillon, Alcatel
Microelectronics, Oudenaarde, Belgium
TUIF-49: Modeling of Inductors and Transformers
S.R. Kythakyapuzha, W.B. Kuhn, Kansas State University, Manhattan, KS
TUIF-50: 15 GHz Wideband Amplifier with 2.8 dB Noise Figure in SiGe Bipolar Technology
H. Knapp, D. Zoeschg, T. Meister, K. Aufinger, S. Boguth, L. Treitinger, Infineon
Technologies AG, Munich, Germany
TUIF-51: 40-Gbit/s D-type Flip-flop and Multiplexer Circuits using InP HEMT
T. Suzuki, H. Kano, Y. Nakasha, T. Takahashi, K. Imanishi, H. Ohnishi, Y. Watanabe, Fujitsu
Laboratories Ltd., Atsugi, Japan
TUIF-52: A Direct Ku-band Linear Subharmonically Pumped BPSK and I/Q Vector Modulator
in Multi-layer Thin-film MCM-D
G. J. Carchon, B. Nauwelaers, K.U.Leuven, Leuven, Belgium
 TUESDAY PANEL SESSION TUESDAY RUMP SESSION
PTA: ONE CHIP RADIO RTA: CHALLENGES AND OPPORTUNITIES FOR MICROWAVE CAD
Date & Time: Tuesday May 22; 12:00–1:15 PM Date & Time: Tuesday May 22; 7:00–9:30 PM
Location: Civic Plaza, Location: Hyatt

Sponsor: MTT-12 Microwave and Millimeter-Wave Organizer: Peter Blakey, ON Semiconductor

Packaging Technical Committee
Moderator: Peter Blakey
Organizers: Joy Laskar, Georgia Institute of Technology
Panelists: C. Mueth, Agilent
Anh-Vu Pham, Clemson University
Z. Cendes, Ansoft
Moderators: Joy Laskar, (PANEL) Anh-Vu Pham, S. Maas, Applied Wave Research
Mike Harris, and Wolfgang Heinrich P. Ladbrooke, GaAs Code
(AUDIENCE) The challenges and opportunities for Microwave CAD encom-
Panelists: Rao Tummula, Georgia Institute of Technology pass a wide range of business issues and technical issues. The
Frank Chang, panel members, who represent a range of companies involved in
Microwave CAD, will discuss these issues. The questions that will
University of California, Los Angeles
be addressed include:
Rob Christ, Triquint
✗ Do CAD companies capture an appropriate fraction of the
Sanjay Moghe, RF Solutions
value provided by CAD tools?
Lawrence Larson, IBM Research
✗ What is the anticipated evolution in business models and
Kare Gustafsson, Ericsson Radio Systems AB
licensing trends?

What is one-chip radio? Is this a reality in today’s technology or
in the future? Where is the System on Chip (SOC) appropriate:
WLAN, CDMA, Bluetooth or ever? What module technologies, if
any, will provide System on Package (SOP) solutions? This panel
will debate the potential of these integration paradigms from vari-
ous perspectives including:
✗ Technology mix: RF, MEMS, passive components, DSPs
and sensors
✗ Time to market, yield and cost
✗ Device technologies: SiGe, GaAs, CMOS and BiCMOS
✗ Reusable functional blocks
✗ Integral and embedded passive components
✗ System architectures and testing
✗ On-chip and off-chip components
✗ Communication standards and frequency
✗ Applications and examples of SOC and SOP
TUESDAY SPECIAL SESSION
TU4D: ACOUSTIC DEVICES FOR WIRELESS COMMUNICATIONS
AND SENSING
Room: Tucson 42–43
Time: 3:30–5:00 PM
Session Chair: R. Weigel, University of Linz, Austria
Session Co-Chair: C.C.W. Ruppel, EPCOS, Munich, Germany
Description:
This Focused Session deals with surface acoustic wave (SAW)
and bulk acoustic wave (BAW) devices for wireless applications.
An Invited Paper reports on novel SAW solutions for wideband
CDMA mobiles followed by the demonstration of a SAW-based
passive wireless pressure and temperature sensor system for ve-
hicular applications, a new SAW resonator technique for wide-
band VCOs, and an investigation of thin films to improve SAW
device fidelity. The BAW part of the session incorporates two
contributions dealing with a film bulk acoustic wave resonator
(FBAR) duplexer for PCS applications and the characterization
and simulation of FBAR devices.
TUESDAY
✗ What new CAD tools are needed to meet emerging technical
needs?
✗ What new simulation techniques will be more
comprehensive, more efficient, or easier to use than those
that are presently available?
✗ Will microwave CAD companies seek take advantage of a
trend towards the convergence of microwave CAD and
high-speed digital CAD, to obtain a slice of the much larger
ECAD pie?
A L S O O C CU R R I N G
Tuesday, May 22, 12:00–1:15 PM
RF and Microwave Education Forum
“Changes in Academic Research”
Organizer: Prof. Madhu S. Gupta
The Forum, held during the International Microwave Symposium, is an annual gathering
of educators from around the world who have professional interests in RF and microwave
engineering. It serves as a platform for discussing novel ideas and proposals in a collegial
environment; a vehicle for disseminating and sharing information, and provides an opportu-
nity for meeting and networking among colleagues with common interests. A different theme
is selected each year for the Forum, on which the discussions are centered, so as to allow an
in-depth examination of issues despite the short duration.
In RF and microwave engineering, as in most other engineering disciplines, research in
the universities has traditionally differed from that carried out in an industrial environment
in such characteristics as its longer time horizon; emphasis on understanding rather than
circumventing problems; reliance on theoretically rather than empirically based information;
and isolation of an idealized problem unencumbered with practical details rather than one
mired with real-world constraints and limitations. In recent years, however, a shift appears
to be taking place in the nature of research in RF and microwave engineering, in part due to
the growing importance of civilian work over defense-related work, with its concomitant em-
phasis on high volume applications such as wireless communication; cost sensitivity and
tradeoff with performance; competitiveness and resulting shorter time scales; and global or
system-level, rather than local or component-level, optimization. These changes may, in turn,
influence the academic researchers in a variety of ways such as in the selection of research
problems, dissemination of results in view of proprietary considerations, consideration of
the context of a problem for its optimal solution, and the design of curricula that incorporate
research results and serve the needs of learners preparing for such diverse careers as re-
search and industrial practice. The community of educators in RF and microwave fields will
need both awareness and preparedness in order to identify strategies for dealing with such
an environment.
This year, the RF and Microwave Education Forum will focus on the changing nature of
academic research in our discipline. It will feature brief remarks by speakers who will ex-
plore the changes that may be expected, suggest new and possibly controversial ways for
dealing with them, recount from their experience the problems encountered and attempted
solutions, and propose insightful viewpoints to put the coming changes in perspective. Atten-
dees are also invited to participate in the discussion and share their observations; those who
wish to address the gathering briefly are urged to bring an overhead transparency summariz-
ing the gist of their remarks.
For efficient use of discussion time, the Forum attendees will be provided boxed lunch-
es. Although there is no formal registration for this event, an email confirmation of an inter-
est in attending the Forum will help the organizers to be better prepared for the event.
Please direct all inquiries and communications regarding the 2001 Forum to its organizer,
Prof. Madhu S. Gupta, at mgupta@mail.sdsu.edu
Hyatt Regency Hotel, Ballroom D

33
 WEDNESDAY, MAY 23, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 8:00–9:40 AM
WE1A Mode Conversion between Dissimilar WE1B High Power Amplifiers and Devices WE1C Non-linear Device Modeling
Transmission Media
Chair: C.P. Wen, CPW Consulting Chair: J. Schellenberg, Schellenberg Associates Chair: J Hwang, Lehigh University
Co-chair: E. Godshalk, Maxim Corp. Co-chair: S. Patel, Northrop Grumman
BALLROOM TUCSON 36–38 TUCSON 40–41

WE1A-1: Novel Design for Coplanar Wave Guide to Microstrip WE1B-1: High-voltage GaAs Pwer-HBTs for Base-station WE1C-1: Nonlinear III-V HBT Compact Models: Do We Have
Transition Amplifiers What We Need?
A.M. Safwat, K.A. Zaki, C.H. Lee, University of Maryland P. Kurpas, F. Brunner, R. Doerner, B. Janke, P. Heymann, J.B. Scott, Agilent Technologies, Santa Rosa, CA
8:00 AM

at College Park, College Park, MD; W.B. Johnson, Laboratory A. Maasdorf, J. Würfl, W. Heinrich, Ferdinand-Braun-Institut
for Physical Sciences, College Park, MD (FBH), Berlin, Germany; W. Doser, H. Blanck, UMS GmbH,
Ulm, Germany; P. Auxemery, D. Pons, UMS Orsay, Orsay
8:10 AM

WE1A-2: Microstrip Fed Coplanar Stripline Tee Junction using WE1B-2: A Power pHEMT Device Technology for Broadband WE1C-2: Global Electro-thermal CAD of Complex Non Linear
Coupled Coplanar Stripline Wireless Access 3-D Systems Based on a Fully Physical Time-dependent Compact
Y. Suh, K. Chang, Texas A&M University, College Station, TX M. Miller, B. Peatman, R. Hooper, Motorola, Tempe, AZ Thermal Model
8:20 AM

W. Batty, S. David, A.J. Panks, R.G. Johnson, C.M. Snowden,

University of Leeds, Leeds, UK; C.E. Christoffersen, M.B. Steer,
North Carolina State University (NCSU), Raleigh, NC

WE1A-3: Novel Lumped-element Coplanar WE1B-3: Silicon Carbide Performances and Application in
Waveguide-to-coplanar Stripline Transitions Broadcast Power Amplifiers
Y. Lin, C. Chen, National Taiwan University, Taipei, ROC F. Temcamani, P. Pouvil, ENSEA, Cergy, France; O. Noblanc,
8:30 AM

C. Brylinski, THOMSON-CSF LCR, Orsay, France; P. Bannelier,

B. Darges, J. Prigent, THOMCAST, Conflans Sainte Honorine,
France

WE1C-3: Improved Large-signal Model and Model Extraction

Procedure for InGaP/GaAs HBTs Under High Current Operations
S. Cherepko, M. Shirokov, J.C. Hwang, Lehigh University,
8:40 AM

Bethlehem, USA; A. Brandstaedter, Anadigics Inc., Warren, USA

WE1A-4: Integrated Transition of Coplanar and Rectangular WE1B-4: A 240 W Power Heterojunction FET with High
Waveguides Efficiency for W-CDMA Base Stations
D. Deslandes, K. Wu, Ecole Polytechnique de Montreal, I. Takenaka, K. Ishikura, K. Takahashi, K. Hasegawa,
8:50 AM

Montreal, Canada H. Takahashi, F. Emori, N. Iwata, NEC Corp., Otsu, Japan;

K. Kishi, Y. Ogasawara, NEC Yamagata Ltd., Higashiokishi-Gun,
Japan

WE1C-4: Waveform Characterization and Modeling of Dynamic

Charge Behavior of InGaP-GaAs HBTs
C. Wei, S. Sprinkle, H. Chung, B. Mitchell, P. Dicarlo, D. Bartle,
9:00 AM

Alpha Industries Inc., Woburn, MA; J. Hu, Network Device Inc.,

Sunnyvale, CA

WE1A-5: A Novel Microstrip Mode to Waveguide Mode WE1B-5: A Ultra Broad Band 300 W GaAs Power FET WE1C-5: Scalable Large-signal Device Model for High
Transformer and Its Applications for W-CDMA Base Stations Power-density AlGaN/GaN HEMTs on SiC
N. Jain, Anokiwave, San Diego, CA; N. Kinayman, M/A-COM, K. Ebihara, K. Inoue, H. Haematsu, F. Yamaki, H. Takahashi, J. Lee, S. Lee, K.J. Webb, Purdue University, West Lafayette,
9:10 AM

Lowell, MA J. Fukaya, Fujitsu Quantum Devices Ltd., Nakakoma-gun, Japan USA

WE1B-6: High Power S-band Solid-state Amplifiers for WE1C-6: On the Gunn Effect in GaAs HBTs
Surveillance and Traffic Control Radars M. Rudolph, R. Doerner, P. Heymann, Ferdinand-Braun-Institut
T. Murae, K. Fujii, T. Matsuno, Japan Radio Co., Ltd., Mitaka, fuer Hoechstfrequenztechnik, Berlin, Germany
9:20 AM

Japan

WE1A-6: Design of HNRD Guide to E-plane Waveguide WE1B-7: Ku-band Quadri-SSPA for Stentor Satellite Transmit
Transitions and Directional Couplers by Transverse Resonance Active Antenna
Technique D. Roques, H. Chane-Kee-Sheung, F. Dubos, B. Cogo, J. Cazaux,
9:30 AM

M. Kishihara, K. Yamane, Okayama Prefectural University, Alcatel Space Industries, Toulouse, France
Soja, Japan; I. Ohta, Himeji Institute of Technology, Himeji,
Japan

34
 WE1D Frequency Control Advances
or Wireless Applications
Chair: R. Newgard, Rockwell Collins
Co-chair: S. Wetenkamp, Micro Lamba
TUCSON 42–43
WE1D-1: Invited: Nonlinear Effects in Oscillators
and Synthesizers
U.L. Rohde, Synergy Microwave Corp., Paterson, USA
8:00 AM
8:10 AM
WE1D-2: PLL Synthesizers: PLL Switching Speed and Speed-up
Mechanisms
B. Goldberg, VITCOM Corp., San Diego, CA
8:20 AM
8:30 AM
WE1D-3: An Agile Stored SD Sequence Fractional-N Synthesiser
R. Walkington, P. Brennan, University College London,
London, UK
8:40 AM
8:50 AM
WE1D-4: 6.7 GHz Frequency Synthesizer in 0.8 µm Silicon
Bipolar Production Technology
G. Ritzberger, H. Knapp, J. Boeck, M. Rest, L. Treitinger,
9:00 AM
Infineon Technologies AG, Munich, Germany; A.L. Scholtz,
University of Technology, Vienna, Austria
WE1D-5: GSM 900/DCS 1800 Fractional-N Frequency
Synthesizer with Very Fast Settling Time
B. Neurauter, G. Maerzinger, R. Weigel, University of Linz,
9:10 AM
Linz, Austria; T. Lueftner, DICE Danube Integrated Circuits
Engineering, Linz, Austria; M. Scholz, V. Mutlu, J. Fenk,
Infineon AG, Munich, Germany
WE1D-6: Phase Decrement Type Direct Frequency Synthesizer
Driven by a DDS
K. Tajima, M. Tsuru, Y. Isota, O. Ishida, Mitsubishi Electric Co.,
9:20 AM
Kamakura, Japan; H. Ikematsu, Mitsubishi Electric Co.,
Amagasaki, Japan; K. Itoh, Mitsubishi Electric Co., Amagasaki,
Japan
9:30 AM
WE1E Dispersion Properties of Periodic
Structures and Uniform Transmission Lines
Chair: P.Lampariello, University of Rome
Co-chair: J. Zehentner, Technical University,
YUMA 26–28, 31–33
WE1E-1: Effect of Losses on the Spectral Transition of Modal
Poles between the Improper and the Proper Riemann Sheets
A.H. Kamel, RITSEC, Cairo, Egypt, A.S. Omar, University
of Magdeburg, Magdeburg, Germany
WE1E-2: Low-frequency Dispersion Features of a New Complex
Mode for a Periodic Strip Grating on a Grounded Dielectric Slab
P. Burghignoli, P. Baccarelli, F. Frezza, A. Galli, P. Lampariello,
Università “La Sapienza” di Roma, Roma, Italy; A.A. Oliner,
Polytechnic University of Brooklyn, New York, NY
WE1E-3: Guided-wave Properties of Synthesized Non-radiative
Dielectric Waveguide for Substrate Integrated Circuits (SICs)
K. Wu, Ecole Polytechnique, Montreal, Canada; F. Boone,
University of Sherbrooke, Sherbrooke, Canada
WE1E-4: Slow-wave Propagation of Microstrip Consisting
of Electric-magnetic-electric (EME) Composite Metal Strips
C. Wu, C.C. Tzuang, National Chiao Tung University, Hsinchu,
Taiwan
WE1E-5: TEM Properties of Shielded Homogeneous
Multiconductor Transmission Lines with PEC and PMC Walls
A. Borji, S. Safavi-Naeini, S.K. Chaudhuri, University
of Waterloo, Waterloo, Canada
WE1E-6: Explicit Eigenvalue Approach to the Efficient
Determination of the Hybrid Spectrum of Ferrite-loaded Circular
Waveguide
L. Pierantoni, A. Camicia, T. Rozzi, University of Ancona,
Ancona, Italy
35
WE1F Advances in Time Domain Methods I
Chair: P. Russer, Technical University of M
Co-chair: W. Gwarek, Warsaw University of Tech
YUMA 21–23
WE1F-1: Envelope-finite Element (EVFE) Technique – 2-D
Guided Wave Examples
Y. Wang, T. Itoh, UCLA, Los Angeles, CA
WE1F-2: Evaluation and Enhancement of Supraconvergence
Effects on Nonuniform and Conformal FDTD meshes
M. Celuch-Marcysiak, Warsaw Univ. of Technology, Warsaw,
Poland
WE1F-3: Fundamental Gridding Related Dispersion Effects
in Multiresolution Time Domain Schemes
C. Sarris, L. Katehi, University of Michigan, Ann Arbor, MI
WEDNESDAY
WE1F-4: Development and Application of an Efficient
FDTD/Haar MRTD Numerical Interface
C. Sarris, L. Katehi, University of Michigan, Ann Arbor, MI
WE1F-5: A Novel Adaptivity for EM Time Domain Methods:
Scale Adaptive Time Steps (SATS)
A. Rennings, V. Toni, P. Waldow, I. Wolff, Gerhard Mercator
University Duisburg, Duisburg, Germany; Y. Qian, T. Itoh,
University of California, Los Angeles, Los Angeles, CA
 WEDNESDAY, MAY 23, 2001
WE2A Novel Transmission Lines,
Properties, and Applications
Chair: M. Dydyk, Motorola Inc.
Co-chair: Ching-Kuang Tzuang, National Chiao T
BALLROOM
IEEE MTT-S IMS TECHNICAL SESSIONS 10:20 AM–12:00 PM
WE2B Techniques to Advance Power Amplifier WE2C Nonlinear FET Modeling
Linearity and Efficiency
Chair: A. Katz, The College of New Jersey Chair: M Mallavarpu, Raytheon Co.
Co-chair: E. James Crescenzi, Jr., UltraRF Co-chair: M Calcatera, AF Research Lab
TUCSON 36–38 TUCSON 40–41

WE2A-1: Transmission Line Noise from Standard WE2B-1: Efficient Baseband/RF Feedforward Linearizer WE2C-1: A GaAs MESFET Transient Model Capable
and Proton-implanted Si through a Mirror Power Amplifier using Software-defined Radio of Predicting Trap-induced Memory Effects Under Complex
10:20 AM

K.T. Chan, A. Chin, C.M. Kwei, Hsinchu, Taiwan; D.T. Shien, and Quadrature Digital Up-conversion Digital Modulation
W.J. Lin, Inst. of Nuclear Energy Research, Hsinchu, Taiwan E.G. Jeckeln, F.M. Ghannouchi, M.M. Sawan, Ecole F. Wang, W.D. Jemison, Lafayette College, Easton, USA;
Polytechnique de Montréal, Montreal, Canada; F. Beauregard, J.C. Hwang, Lehigh University, Bethlehem, USA
Amplix Wireless & Satcom, Montreal, Canada

WE2A-3: Dielectric Properties of Oxidized Porous Silicon WE2B-2: Adaptive RF Cartesian Predistorter Based on the Low
in a Low Resistivity Substrate Frequency Even Order IM Terms
10:30 AM

R.L. Peterson, Princeton University, Princeton, USA; Y. Yang, Y.Y. Woo, B. Kim, POSTECH, Pohang, Korea
R.F. Drayton, University of Minnesota, Minneapolis, MN

WE2A-3: A Novel CPW Structure for High-speed Interconnects WE2C-2: Intermodulation Distortion Simulation using Physical
S. Yoon, KJIST, Gwangju, South Korea; J. Yook, Y. Kim, Yonsei GaAs FET Model
10:40 AM

Univ., Seoul, South Korea; O. Seo, K. Lim, S. Cho, S. Lee, W. Contrata, Y. Ando, M. Kuzuhara, NEC Corp., Otsu, Japan;
Samsung Electronics, Suwon, South Korea Y. Hori, NEC Corp., Kawasaki, Japan

WE2B-3: A High Efficiency Feedforward Amplifier with a Series

Diode Linearizer for Cellular Base Stations
10:50 AM

K. Horiguchi, M. Nakayama, Y. Sakai, K. Totani, H. Senda,

Y. Ikeda, O. Ishida, Mitsubishi Electric Corp., 5-1-1 Ofuna,
Japan

WE2A-4: Small-size Delay Line Based on a Periodically Loaded WE2C-3: Full Extraction of pHEMT State Functions using Time
Waveguide Domain Measurements
11:00 AM

J. Hesselbarth, R. Vahldieck, Swiss Fed. Inst. of Technology, D.G. Morgan, P. Tasker, Cardiff University School
Zurich, Switzerland of Engineering, Cardiff, Wales; G. Edwards, A. Phillips, Marconi
Caswell Ltd., Towcester, England

WE2A-5: Frequency Dependence of Bloch Impedance WE2B-4: A Gain/Phase Imbalance Minimization Technique
in a Periodic Transmission Line Structure for LINC Transmitter
11:10 AM

E. Takagi, Toshiba Corp. R&D Center, Kawasaki, Japan X. Zhang, P. Nanawa, L.E. Larson, P.M. Asbeck, University
of California, San Diego, La Jolla, CA

WE2A-6: A Photonic Crystal Seam (PCS) for Metallic WE2C-4: Large-signal Look-up Table Model for InP HEMTs
Waveguides Including Non-quasi-static and Impact Ionisation Effects
11:20 AM

J.L. Hesler, University of Virginia, Charlottesville, VA D. Schreurs, K.U.Leuven, Leuven, Belgium; A. Orzati,
L. Pergola, H. Benedickter, O. Homan, W. Baechtold, Swiss
Federal Institute of Technology, Zurich, Switzerland

WE2B-5: A Novel DSP Architecture of Adaptive Feedforward WE2C-5: Nonlinear Noise Modeling of a pHEMT Device through
Linearizer for RF Amplifiers Residual Phase Noise and Low Frequency Noise Measurements
11:30 AM

Y. Wang, T. Itoh, UCLA, Los Angeles, CA O. Llopis, J. Juraver, J. Graffeuil, LAAS-CNRS, Toulouse, France;
B. Tamen, F. Danneville, A. Cappy, IEMN, Lille, France;
M. Chaubet, CNES, Toulouse, France
11:40 AM

WE2B-6: The Novel Programmable RF Predistortion Linearizer WE2C-6: Intrinsic Noise Currents in Deep Submicron MOSFETs
J. Sun, M.Y. Chia, National University of Singapore, Singapore, C. Chen, J.M. Deen, McMaster University, Hamilton, Canada;
11:50 AM

Singapore Y. Cheng, M. Matloubian, Conexant Systems Inc., Newport

Beach, USA

36
 WE2D The NBS/NIST Centennial: One Hundred WE2E Leaky-wave Excitation and Guidance WE2F Advances in Time-domain Methods II
Years of RF Metrology and Standards in Printed Transmission Lines
Chair: K. Remley, NIST Chair: N.K. Das, Polytechnic University Chair: A. Beyer, University of Duisburg
Co-chair: C. Weil, NIST Co-chair: A.S. Omar, University of Magdeburg Co-chair: V. Fouad-Hanna
TUCSON 42–43 YUMA 26–28, 31–33 YUMA 21–23

WE2D-1: NIST: Responding to Basic Needs, Responding WE2E-1: Behavioral Feature of Fast-wave Modes WE2F-1: A Generalized Approach to Wide-band S-parameter
to Special Needs on Printed-circuit Transmission Lines of Open Extraction from FD-TD Simulations Applicable to Evanescent
10:20 AM

L.A. Greenhouse, National Institute of Standards and and Packaged Types Modes In Inhomogeneous Guides
Technology, Gaithersburg, USA M. Tsuji, H. Shigesawa, Doshisha University, Kyotanabe, Japan W.K. Gwarek, M. Celuch-Marcysiak, Warsaw University
of Technology, Warsaw, Poland
10:30 AM

WE2D-2: Radio-frequency Metrology from NBS to NIST, the WE2E-2: Structural Conditions for Offering High-performance WE2F-2: Modified Yee’s Cell for Finite-difference Time-domain
Legacy Printed-circuit Devices in Millimeter-wave Range Modeling of Periodic Boundary Guiding Structure
10:40 AM

D.S. Friday, NIST, Boulder, CO H. Shigesawa, M. Tsuji, Doshisha University, Kyotanabe, Japan H. Lee, J. Kim, Korea Advanced Institute of Science
and Technology, Yusong, Korea
10:50 AM

WE2D-3: Primary Atomic Frequency Standards at NIST WE2E-3: High Frequency Leaky-mode Excitation on Microstrip WE2F-3: A New Multiresolution Near-field to Near-field
D.B. Sullivan, National Institute of Standards and Technology, Line Transform Suitable for Multi-region FDTD Schemes
11:00 AM

Boulder, CO F. Mesa, D.R. Jackson, University of Houston, Houston, TX; A.V. Laisne, R. Gillard, INSA/RER, Rennes, France; G. Piton,
M. Freire, University of Seville, Seville, Spain CNES, Toulouse, France

WEDNESDAY
WE2F-4: A Global Modeling Approach using Interpolating
Wavelets
11:10 AM

S. Goasguen, M. Tomeh, S. El-Ghazaly, Arizona State

University, Tempe, AZ

WE2D-4: Broadband Josephson Voltage Standards WE2E-4: Spurious Radiation from a Practical Source on a Leaky
C.A. Hamilton, S.P. Benz, National Institute of Standards Covered Microstrip Line
11:20 AM

and Technology, Boulder, CO W.L. Langston, J.T. Williams, D.R. Jackson, University
of Houston, Houston, TX; F. Mesa, University of Seville,
Seville, Spain

WE2F-5: Performance of Three-dimensional Graded ADI-FDTD

Algorithm
11:30 AM

E. Hu, W.J. Hoefer, Department of Electrical & Computer

Engineering, Victoria, Canada

WE2D-5: The Electronic Kilogram WE2E-5: Proper Definition of Voltage for a Leaky Two-layer WE2F-6: Reconstruction of Microwave Structures
M.H. Kelley, National Institute of Standards and Technology, Stripline Consistent with its Characteristic Impedance using Two-dimensional Inverse TLM (Transmission Line
11:40 AM

Gaithersburg, USA N. Das, Polytechnic University, Farmingdale, 11735 Matrix) Method

W.A. de Souza, L.R. de Menezes, Universidade de Brasilia,
Brasilia, Brazil
11:50 AM

37
 WEDNESDAY, MAY 23, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 1:20–3:00 PM
WE3A Power Amplifiers WE3B Wideband Communication Systems WE3C Nonlinear Modeling of Silicon Devices
for Wireless Applications and Power Amplifiers
Chair: D. Teeter, RF Micro Devices Chair: H.C. Huang, AMCOM Communications Chair: S Goodnick, Arizona State University
Co-chair: A. Platzker, Raytheon RF Components Co-chair: L. Raffaelli, LYNX Inc.
BALLROOM TUCSON 36–38 TUCSON 40–41

WE3A-1: A 1W CMOS Power Amplifier for GSM-1800 WE3B-1: A Compact LTCC Ku-band Transmitter Module WE3C-1: RF LDMOS Characterization and Its Compact
with 55% PAE with Integrated Filter for Satellite Communication Applications Modeling
C. Fallesen, Nokia Denmark, Copenhagen, Denmark; P. Asbeck, C. Lee, A. Sutono, S. Han, J. Laskar, Georgia Institute J. Jang, K. Banerjee, Z. Yu, R.W. Dutton, Stanford University,
1:20 PM

Technical University of Denmark, Lyngby, Denmark of Technology, Atlanta, GA Stanford, USA; O. Tornblad, Ericsson Inc., Morgan Hill, USA;
T. Arnborg, Q. Chen, Ericsson Microelectronics, Stockholm,
Sweden
1:30 PM

WE3A-2: A High Efficiency 0.25-µm CMOS PA with LTCC WE3B-2: A Microwave Frequency Generation Unit for Space WE3C-2: Direct Extraction and Modeling Method
Multi-layer High-Q Integrated Passives for 2.4 GHz ISM Band Applications for Temperature Dependent Large Signal CAD Model of Si-BJT
D. Heo, A. Sutono, Y.E. Chen, E. Gebara, S. Yoo, Y. Suh, L. Dayaratna, L.G. Ramos, M.K. Hirokawa, Lockheed Martin Y. Suh, D. Heo, A. Raghavan, E. Gebara, S. Nuttnick, K. Lim,
1:40 PM

J. Laskar, E.M. Tentzeris, Georgia Institute of Technology, Communications and Power Center, Newtown, USA J. Laskar, Georgia Institute of Technology, Atlanta, GA
Atlanta, GA

WE3A-3: Variable Gain Power Amplifier for Mobile WCDMA

Applications
V.T. Vintola, S.J. Kalajo, E.A. Järvinen, Nokia Mobile Phones,
1:50 PM

Helsinki, Finland; M.J. Matilainen, Nokia Research Center,

Helsinki, Finland

WE3B-3: Low Cost Ka-band Transmitter Modules for LMDS WE3C-3: An Accurate Large-signal Model for a High-efficient
Equipment Mass Production Si Bipolar GSM Power Transistor
G. Torregrosa-Penalva, A. Asensio-López, F.J. Ortega-González, R.M. Heeres, M. Versleijen, Philips Semiconductors, Nijmegen,
2:00 PM

J. Lluch-Ladrón-de-Guevara, Grupo de Microondas y Radar, The Netherlands; H. Visser, Philips Semiconductors,

Madrid, Spain Sunnyvale, CA

WE3A-4: A Single Supply High Performance PA MMIC

for GSM Handsets using Quasi-enhancement Mode PHEMT
W. Abey, R. Hajji, W. Kennan, H. Dang, Fujitsu Compound
2:10 PM

Semiconductor Inc., San Jose, CA; T. Moriuchi, T. Nakamura,

Y. Nonaka, E. Mitani, Fujitsu Quantum Devices Ltd.,
Showa-chou, Japan

WE3A-5: E-pHEMT, Single Supply, High Efficient Power WE3B-4: A Complete Integrated TX/RX Front-end Combining 3D WE3C-4: Analysis of Low Frequency Memory and Influence
Amplifiers for GSM and DCS Applications Topologies and Global Synthesis. on Solid State HPA Intermodulation Characteristics
S. Zhang, Alpha Industries Inc., Woburn, MA; J. Cao, Broadcom T. Le Nadan, C. Person, J. Coupez, LEST-ENST Bretagne, Brest, N. Le Gallou, H. Buret, Alcatel Space Industries, Toulouse,
2:20 PM

Corp., El Segundo, CA; R. Mcmorrow, Analog Devices Inc., France France; E. Ngoya, J.M. Nebus, University of Limoges, Limoges,
Wilmington, USA France

WE3A-6: An Extended Doherty Amplifier with High Efficiency WE3B-5: Design and Characterization of a Low Cost ISM-band
Over a Wide Power Range Sub Carrier Multiplexed Broadband Digital Microwave Radio
M. Iwamoto, A. Williams, A.G. Metzger, C. Wang, L.E. Larson, Link
2:30 PM

P.M. Asbeck, University of California at San Diego, La Jolla, CA; A.P. Chio, B.H. Galang, R.C. Guevarra, A.A. Manlapat,
P. Chen, Global Communication Semiconductors, Torrence, CA C.G. Santos, N.G. Toledo, I.C. Wong, D.M. Sabido, Advanced
Science and Technology Institute, Quezon City, Philippines

WE3A-7: Analysis and Experimental Study of an L-band New WE3C-5: An Improved Behavioral Modeling Technique
Topology Doherty Amplifier for High Power Amplifiers with Memory
S. Bousnina, F.M. Ghannouchi, Ecole Polytechnique de N. Le Gallou, H. Buret, Alcatel Space Industries, Toulouse,
2:40 PM

Montreal, Montreal, Canada France; E. Ngoya, D. Barataud, J. Nebus, IRCOM, University

of Limoges, Limoges, France

WE3A-8: Current Mode Class-D Power Amplifiers

for High Efficiency RF Applications
H. Kobayashi, Fuji Electric Co., Ltd., Matsumoto, Japan;
2:50 PM

J. Hinrichs, P. Asbeck, UCSD, La Jolla, CA

38
 WE3D Microwave and Optical Broadband WE3E CAD with Neural Networks WE3F Applications of Time Domain Methods
Internet Access and EM Techniques
Chair: C. Cox, MIT and Photonic Systems Inc. Chair: A. Sharma, TRW Chair: R. Vahldieck, ETH Zurich
Co-chair: R. Biernacki, Agilent EEsof EDA Co-chair: L. Roselli, University of Perugia
TUCSON 42–43 YUMA 26–28, 31–33 YUMA 21–23

WE3D-1: Invited: Broadband Access Networks: Evolution WE3E-1: Neural Inverse Space Mapping EM-optimization WE3F-1: Efficient FDTD Modeling of Irises/Slots in Microwave
and Convergence Implications for Equipment Providers J.W. Bandler, M.A. Ismail, J.E. Rayas-Sanchez, McMaster Structures
T.J. Brophy, Motorola, Horsham, USA University, Hamilton, Canada; Q. Zhang, Carleton University, A. Rong, A.C. Cangellaris, University of Illinois at Urbana
1:20 PM

Ottawa, Canada Champaign, Urbana, IL; H. Yang, Southeast University,

Nanjing, P.R. China
1:30 PM

WE3E-2: An Approach for Knowledge-aided-design (KAD) WE3F-2: Time Domain Characterization of Multichip Module
of Microwave Circuits using Artificial Neural Networks Elements
R. Zingg, K.C. Gupta, University of Colorado at Boulder, W. Dressel, L. Vietzorreck, P. Russer, TU Muenchen,
1:40 PM

Boulder, CO Muenchen, Germany

WE3D-2: Invited: Wireless Aspects of Broadband Access

K. Warble, J. Locke, B. Bishop, Motorola, Tempe, AZ
1:50 PM

WE3E-3: Exact Adjoint Sensitivity Analysis for Neural Based WE3F-3: Full-wave Analysis and Model-based Parameter
Microwave Modeling and Design Estimation Approaches for Y-matrix Computation of Microwave
J. Xu, M.C. Yagoub, Q. Zhang, Carleton University, Ottawa, Distributed RF Circuits
2:00 PM

Canada V. Chtchekatourov, F. Coccetti, P. Russer, Technische

Universitaet Muenchen, Muenchen, Germany

WEDNESDAY
WE3F-4: Analysis of Signal Integrity in High-speed Digital ICs
by Combining MOSFET Modeling and the LE-FDTD Method
F. Alimenti, G. Stopponi, P. Placidi, R. Sorrentino, Università di
2:10 PM

Perugia, Perugia, Italy; P. Ciampolini, Università di Parma,

Parma, Italy

WE3D-3: A Combined Optical-wireless Broadband Internet WE3E-4: New Technique using Poles and Modes Derivatives
Access: Transmission Challenges for Frequency and Geometry Parameterization of Microwave
T. Marozsak, E. Udvary, T. Berceli, Budapest University Structures
2:20 PM

of Technology and Economics, Budapest, Hungary A. Gati, V.F. Hanna, University of Paris 6, Paris, France;
M. Wong, France Telecom R&D, Paris, France

WE3F-5: Interpolating Wavelet Galerkin Model of Time

Dependent Inhomogeneous Electrically-large Optical Waveguide
Problems
2:30 PM

M. Fujii, W.J. Hoefer, University of Victoria, Victoria, Canada

WE3D-4: In-band Optical Crosstalk in Fiber-radio WDM WE3E-5: Extending Spice-like Analog Simulator
Networks with a Time-domain Full-wave Field Solver
D. Castleford, A. Nirmalathas, D. Novak, R. Tucker, Australian T. Li, Cadence Design Systems, New Providence, USA; W. Sui,
2:40 PM

Photonics Cooperative Research Centre, Photonics Research Conexant Systems, Chelmsford, MA

Laboratory, Melbourne, Australia

WE3F-6: Time Domain Optical Response of Electro-optic

Modulator using FDTD
M.M. Tomeh, S. Goasguen, S.M. El-Ghazaly,
2:50 PM

Telecommunications Research Center, Tempe, AZ

Wednesday, May 23, 5:30–7:30 PM A LSO OC

IEEE Women in Engineering Reception CU R R I N G
Hyatt Regency, Cassidy Room
Meet and interact with a panel of distinguished professionals from academia and industry who share common interests in promoting the Women in Engineering Forum. Build connections with
peers, share your background, thoughts and experiences of common interest to women in engineering. Admission not restricted to women. If you’d like to attend and/or would like to know
more details, please email Kavita Goverdhanam at kavitag@lucent.com or Katherine J. Herrick at Katherine_J_Herrick@rrfc.raytheon.com.

39
 WEDNESDAY, MAY 23, 2001
WE4A Next Generation
Power Amplifier Techniques
Chair: J. Heaton, BAE Systems
Co-chair: P. Asbeck, UCSD
BALLROOM
WE4A-1: A 6 GHz 50 Watts Low Distortion Push-pull GaAs
Power FET Optimized for 12V Class-AB Operation
T. Yamamoto, S. Sano, K. Naito, T. Igarashi, J. Fukaya, Fujitsu
3:30 PM
Quantum Devices Limited, Nakakoma-Gun,Showa-Chou, Japan
3:40 PM
WE4A-2: High Power Broadband AlGaN/GaN HEMT MMICs
on SiC Substrates
B.M. Green, V. Tilak, H. Kim, J. Smart, J.R. Shealy,
3:50 PM
L.F. Eastman, Cornell University, Ithaca, NY; S. Lee, K. Webb,
Purdue University, West Lafayette, USA
4:00 PM
WE4A-3: New Design Method of Non-uniform Distributed
Power Amplifiers. Application to a Single Stage
(1 W/4.5–18 GHz) pHEMT MMIC.
4:10 PM
C. Duperrier, M. Campovecchio, R. Quere, University
of Limoges, Faculty of Sciences, Limoges, France; L. Roussel,
M. Lajugie, Thomson TCM, Massy, France
4:20 PM
WE4A-4: 20–30 GHz Broadband MMIC Power Amplifiers
with Compact Flat Gain pHEMT Cells
S. Yoshinobu, K. Hitoshi, H. Takayuki, S. Susumu, M. Yasuo,
4:30 PM
Mitsubishi Electric Corp., Itami, Japan
WE4A-5: X-band MMIC Power Amplifier with an On-chip
Temperature Compensation Circuit
Y. Kazuhisa, I. Yoshitada, Y. Mamiko, I. Yukio, T. Tadashi,
4:40 PM
Mitsubishi Electric Corp., Kamakura, Japan
WE4A-6: A Novel Base Feed Design for High Power,
High Frequency Heterojunction Bipolar Transistors.
M.L. Salib, H. Hahn, J. Zingaro, A. Ezis, A.K. Gupta, Northrop
4:50 PM
Grumman Corp., Baltimore, MD
WE4A-7: High Efficiency S-band Class AB Push-pull Power
Amplifier with Wide Band Harmonic Suppression
C.Y. Hang, Y. Qian, T. Itoh, University of California
5:00 PM
at Los Angeles, Los Angeles, CA
IEEE MTT-S IMS TECHNICAL SESSIONS
WE4B New Technologies for Wireless
Communications Systems
Chair: H. Ogawa, Communications Research Lab
Co-chair: J.K. McKinney, Dura Sales
TUCSON 36–38
WE4B-1: A Flexible Multiband Frontend for Software Radios
using High IF and Active Interference Cancellation
W. Schacherbauer, A. Springer, R. Weigel, University of Linz,
Linz, Austria; T. Ostertag, C.C. Ruppel, Siemens AG, Munich,
Germany
WE4B-2: A Highly-integrated Low-power Direct Conversion
Receiver MMIC for Broadband Wireless Applications
B. Matinpour, J. Laskar, Georgia Tech, Atlanta, GA
WE4B-3: High Speed Low Cost Direct Conversion Digital
Receiver
J. Gagné, J.J. Gauthier, K. Ke Wu, R.G. Renato, G. Bosisio, École
Polytechnique de Montréal, Montreal, Canada
WE4B-4: A 156 Mbps Compact FSK Modulator Module
for 38 GHz Wireless LANs
Z. Wen, M. Akiyama, Oki Electric Ind. Co., Ltd., Hachioji, Japan;
Y. Hase, Communications Research Laboratory, MPT,
Yokosuka, Japan
WE4B-5: An Electromagnetic Characterization of Indoor Radio
Environment in Microwave WLAN Systems
P.I. Bernardi, R. Cicchetti, O. Testa, University of Rome
“La Sapienza,” Rome, Italy
A L S O O C CU R R I N G
Wednesday 7:30–10:00 PM
Awards Banquet
Hyatt Regency
This evening will consist of an elegant
dinner, an MTT-S awards presentation and
entertainment. The banquet will feature Native
American Dancers and an after dinner
performance by comedian Paula Poundstone.
Paula’s ability to create humor on the spot is
legendary and with her casual air, impeccable
timing and razor-sharp wit, she raises stand-up
to an art form. As a performer, Paula enjoys a
40
3:30–5:10 PM
WE4C Wireless Sensors for Automotive,
RFID and Communications Systems
Chair: H. Kondoh, Hitachi, Central Research
Co-chair: R. Camisa, Sarnoff Corp.
TUCSON 40–41
WE4C-1: A Low Profile 77 GHz Three Beam Antenna for
Automotive Radar
F. Kolak, C. Eswarappa, M/A-COM, Lowell, MA
WE4C-2: Proposal of Millimeter-wave Holographic Radar with
Antenna Switching
Y. Asano, S. Ohshima, T. Harada, M. Ogawa, K. Nishikawa,
Toyota Central Research and Development Laboratories Inc.,
Nagakute, Japan
WE4C-3: Fully Integrated Automotive Radar Sensor
with Versatile Resolution
C. Metz, J. Grubert, J. Heyen, A.F. Jacob, L.C. Stange, Institut
für Hochfrequenztechnik, Braunschweig, Germany; S. Janot,
G. Oberschmidt (now with: Rhode & Schwarz), München,
Germany; E. Lissel, Volkswagen AG, Wolfsburg, Germany
WE4C-4: A Reconfigurable Active Retrodirective/Direct
Conversion Receiver Array for Wireless Sensor Systems
R.Y. Miyamoto, Y. Qian, T. Itoh, University of California,
Los Angeles, Los Angeles, CA
WE4C-5: A Novel Card-type Transponder Designed
using Retrodirective Antenna Array
S.J. Chung, T.C. Chou, Y.N. Chiu, National Chiao Tung
University, Hsinchu, Taiwan, ROC
uniquely intimate rapport with her audience.
Her relaxed, comfortably humorous
wanderings from topic to topic turn each show
into a brilliant stream-of-consciousness
experience, with no two performances being
exactly alike. Her off-kilter view of the world
and her complete honesty strike a receptive
chord, which has led to an impressive list of
achievements.
In keeping with Arizona’s southwest
traditions, the audience will also be delighted
by the performance of Native American Hoop
Dancers.
 WE4D Internet Via Satellites WE4E CAD Procedures and Optimization WE4F Ferrite and Ferroelectric Devices

Chair: R.K. Gupta, Lockheed Martin Global Chair: K.C. Gupta, University of Colorado Chair: D. Webb, Naval Research Laboratory
Co-chair: B. Geller, Mitsubishi Electric & El. Co-chair: M. Mongiardo, University of Perugia, Co-chair: B. Elsharawy, Arizona State University
TUCSON 42–43 YUMA 26–28, 31–33 YUMA 21–23

WE4D-1: Satellite Systems for Multimedia and Internet Traffic WE4E-1: Expanded Space Mapping Design Framework WE4F-1: UHF Frequency Selective Limiters
P. Chitre, R. Gupta, Lockheed Martin Global Exploiting Preassigned Parameters J.D. Adam, S.N. Stitzer, R.M. Young, Northrop Grumman Corp.,
Telecommunications, Clarksburg, USA J.W. Bandler, Bandler Corp., Dundas, Canada; M. Ismail, Baltimore, MD
3:30 PM

J.E. Rayas-Sanchez, McMaster University, Hamilton, Canada

3:40 PM

WE4D-2: Ka-band Satellite System Architecture for Local Loop WE4E-2: Multi-level Passive Order Reduction of Interconnect WE4F-2: Very Low Loss Wideband Isolators for mm-wavelengths
Internet Access Networks N.R. Erickson, University of Massachusetts, Amherst, MA
A.E. Atia, Orbital Sciences Corp., Germantown, USA R. Khazaka, M. Nakhla, Carleton University, Ottawa, Canada
3:50 PM
4:00 PM

WE4D-3: User Terminal Antennas for Broadband NGSO Satellite WE4E-3: Fast Analysis and Optimization of Combline Filters WE4F-3: A Novel Nonreciprocal Ferrite Image Guide
Communications Systems using FEM A.S. Akyol, L.E. Davis, UMIST, Manchester, UK
R. Kreutel, Teledesic, Bellevue, USA D.G. Swanson, Jr., Bartley R.F. Systems Inc., Amesbury, USA;
4:10 PM

R.J. Wenzel, Wenzel/Erlinger Associates, Agoura Hills, USA

WEDNESDAY
WE4F-4: A Ultra Miniature Isolator with Broadband Isolation
using Ferrite Gyrator
T. Okada, T. Makino, S. Shinmura, S. Hino, T. Nakada, H. Asai,
4:20 PM

Murata Manufacturing Co., Ishikawa-gun, Japan

WE4D-4: Outdoor Units for Ka/Ku band Satellite Interactive WE4E-4: Integrated CAD Procedure for Iris Design WE4F-5: A Method of Effective Use of Ferrite for Microwave
Terminals in a Multi-mode Waveguide Environment Absorber
J.L. Fikart, A. Chan, Norsat International Inc., Burnaby, Canada W. Steyn, R. Lehmensiek, P. Meyer, University of Stellenbosch, Y. Kotsuka, M. Amano, Tokai University, Hiratuka, Japan
4:30 PM

Stellenbosch, South Africa

WE4F-6: Phase Shifters using (Ba,Sr) TiO3 Thin Films

on Sapphire and Glass Substrates
B. Acikel, Y. Liu, A.S. Nagra, T.R. Taylor, P.J. Hansen,
4:40 PM

J.S. Speck, R.A. York, University of California at Santa Barbara,

Santa Barbara, CA

WE4D-5: Performance of Multi-carrier 16 QAM WE4E-5: Decomposition Synthesis Approach to Design

over a Linearized TWTA Satellite Channel of RF and Microwave Active Circuits
R. Schornstaedt, N. Rozario, C. Hayes, J. Sietner, Lockheed L.I. Babak, Tomsk State University of Control Systems
4:50 PM

Martin Commercial Space Systems, Newtown, USA; A. Katz, and Radioelectronics, Tomsk, Russia
The College of New Jersey, Ewing, NJ

WE4F-7: MOS Varactors with Ferroelectric Films

S. Gevorgian, S. Abadei, H. Berg, Chalmers University
of Technology, Gothenburg, Sweden; H. Jacobsson, Ericsson
5:00 PM

Microwave Systems, Gothenburg, Sweden

41
 WEDNESDAY, MAY 23, 2001 • INTERACTIVE FORUM • 2:30–5:00 PM
PHOENIX CIVIC PLAZA, PHOENIX ROOM
WEIF-1: Waveguiding Properties of a Line of Periodically Arranged Passive Dipole Scatterers
S. Tretyakov, A. Viitanen, Helsinki University of Technology, Espoo, Finland
WEIF-2: New Type of Millimeter Wave Antenna by using the NRD Guide with LSE Mode
Transmission
F. Kuroki, M. Yamaguchi, K. Seto, Kure National College of Technology, Kure, Japan
WEIF-3: Efficient Method for Solving 3D Dielectric Planar Circuit with Parabolic Equation
Method
T. Anada, R. Sawada, T. Hiraoka, J. Hsu, Kanagawa University, Yokohama, Japan
WEIF-4: Design of Surface-wave Band-gaps for Planar Integrated Circuits using Multiple
Periodic Metallic Patch Arrays
R. Leone, H. Yang, Univ. of Illinois at Chicago, Chicago, IL
WEIF-5: Space Leakage of Power from the Slotline
J. Zehentner, J. Machac, P. Lorenz, Czech Technical University, Prague 6, Czech Republic
WEIF-6: Derivation of Analytical Dyadic Green’s Function Modifications for Microstrip
Attenuation in Transmission Layered Structures
C.M. Krowne, Naval Research Laboratory, Washington, DC
WEIF-7: On the Penetration of the Longitudinal Component of EM Fields into Metals.
R.I. Tzontchev, A.E. Chubykalo, J.M. Rivera-Ju’arez, Universidad Aut’onoma de Zacatecas,
Zacatec, Mexico; V.V. Onoochin, Sirius, Moscow, Russia
WEIF-8: Modal Cutoff in Coaxial Transmission Lines of Conical and Cylindrical Geometries
C.M. Weil, B.F. Riddle, D.R. Novotny, R.T. Johnk, NIST, Boulder, CO
WEIF-9: Full Wave Analysis of Transverse and Longitudinal Couplings in Silicon RFIC Effect
of Buried Diffusions.
WEDNESDAY
S. Wane, H. Baudrand, ENSEEIHT, Toulouse, France; D. Bajon, SUPAERO, Toulouse, France;
P. Gamand, Philips, Caen, France
WEIF-10: Frequency/Time-domain Modeling of Microstrip Circuits by a Modified Spectral
Domain Approach
P. Arcioni, M. Bressan, G. Conciauro, University of Pavia, Pavia, Italy
WEIF-11: Efficient Analysis of Waveguide-to-microstrip and Waveguide-to-coplanar Line
Transitions
L. Greda, R. Pregla, University of Hagen, Hagen, Germany
WEIF-12: A 3-D Method of Moments for the Analysis of Real Life MMICs
M. Farina, T.E. Rozzi, University of Ancona, Ancona, Italy
WEIF-13: Generalized Polygonal Basis Functions for the Electromagnetic Simulation
of Complex Geometrical Planar Structures
L. Knockaert, J. Sercu, Agilent Technologies, Ghent, Belgium; D. De Zutter, Ghent University,
Ghent, Belgium
WEIF-14: FD-FD GSM Technique for the CAD and Optimization of Combline Filters
R. Lotz, F. Arndt, University of Bremen, Bremen, Germany
WEIF-15: Electromagnetic Modeling of Multi-layer Microwave Circuits by the Longitudinal
Decomposition Approach
A. Kirilenko, D. Kulik, L. Rud, V. Tkachenko, Institute for Radiophysics and Electronics,
National Academy of Sciences of Ukraine, Kharkov, Ukraine; P. Pramanick, Salisbury State
University, Salisbury, USA
WEIF-16: A Novel Cold-FET Method for Determining Extrinsic Capacitances
using a Capacitive Transmission Line Model
Y. Lai, C. Chen, Feng Chia University, Taichung, Taiwan
WEIF-17: Modeling of 3-D Planar Conducting Structures on Lossy Silicon Substrate in High
Frequency Integrated Circuits
J. Zheng, J. Li, A. Weisshaar, Oregon State University, Corvallis, OR
WEIF-18: Modeling and Investigation of Instabilities in Heterojunction Interband Tunnel
Diodes for Microwave Applications
A. Cidronali, G. Collodi, G. Manes, C. Toccafondi, University of Florence, Florence, Italy;
M. Deshpande, N. El-Zein, H. Goronkin, V. Nair, Physical Sciences Research Laboratory,
Tempe, AZ
WEIF-19: MOSFET Bulk Effect Behaviour and Estimation for Microwave-frequency Modeling
R.V. Reynisson, T.E. Kolding, T. Larsen, Aalborg University, Aalborg, Denmark
WEIF-20: A New Analytical Small-signal Model of Dual-gate GaAs MESFET
M.M. Ibrahim, B.A. Syrett, Carleton University, Ottawa, Canada; J. Bennett, Nortel Networks,
Ottawa, Canada
WEIF-21: Measurement-based Extrinsic Modeling of RF Components
K. Naishadham, Philips Broadband Networks Inc., Manlius, USA
WEIF-22: Design and Implementation of Micromachined Lumped Quadrature Hybrids
L. Lu, S. Mohammadi, P. Bhattacharya, L.P. Katehi, University of Michigan, Ann Arbor, MI,
G.E. Ponchak, NASA Glenn Research Center, Cleveland, OH
WEIF-23: Q-enhancement of Spiral Inductor with N+ Diffusion Patterned Ground Shields
E. Chen, D. Heo, J. Laskar, Georgia Institute of Technology, Atlanta, GA; D. Bien, National
Semiconductor Corp., Tucson, AZ
WEIF-24: A Design Mapping Formula of Asymmetrical Multi-element Coupled Line
Directional Couplers
J.B. Kil, C.S. Kim, K.S. Choi, J.S. Park, D. Ahn, Soonchunhyang Univ., Asan, ROK
WEIF-25: A General Design Formula of Multi-section Power Divider Based on Singly
Terminated Filter Design Theory
S. Lee, C. Kim, K. Choi, J. Park, A. Dal, Soonchunhyang Univ., Asan, ROK
WEIF-26: A New Balanced Amplifier using 6-Port Power Divider
J. Lim, J. Han, S. Kim, D. Lee, S. Nam, Seoul National University, Seoul, ROK; S. Eom,
Electronics and Telecommunications Research Institute, Taejon, ROK
WEIF-27: 60 GHz Coplanar Waveguide Couplers and Slotline Transition on Polished
Beryllium Oxide.
B. Lakshminarayanan, T. Weller, M. Oldenburg, University of South Florida, Tampa, FL
42
WEIF-28: Integration of Optimized Low-pass Filters in Band-pass Filters for Out-of-band
Improvement.
C. Quendo, E. Rius, C. Person, M. Ney, LEST, Brest, France
WEIF-29: Non-adjacent Resonators Effects on Coupling and Resonant Frequency
in Combline Filters
M.A. El Sabbagh, K.A. Zaki, University of Maryland at College Park, College Park, MD; M. Yu,
ComDev, Inc, Cambridge, Canada
WEIF-30: Evanescent-mode Bandpass Filters Based on Ridged Waveguide Sections
and Inductive Strips
A. Kirilenko, L. Rud, V. Tkachenko, D. Kulik, Institute for Radiophysics and Electronics,
National Academy of Sciences of Ukraine, Kharkov, Ukraine
WEIF-31: A Compact Elliptic-function BPF using Triple-mode Cavities for Terrestrial Digital
Television Transmitters
K. Konno, M. Kubota, Y. Iwamoto, Antenna Giken Co. Ltd., Ohmiya, Japan
WEIF-32: Circular-to-rectangular Waveguide Diplexers
T. Shen, K.A. Zaki, University of Maryland, College Park, MD; T.G. Dolan, K&L Microwave
Inc., Salisbury, USA
WEIF-33: K-band Monolithic Double-balanced Resistive Mixer with Integrated Balanced
Oscillator
K.S. Ang, I.D. Robertson, University of Surrey, Guildford, UK; D. Kim, M. Ju, H. Seo, Eoncom,
Seoul, Korea
WEIF-34: Fundamental Limitations of Conversion Loss and Output Power on an Even
Harmonic Mixer with Junction Capacitance
K. Itoh, Mitsubishi Electric Corp., Amagasaki, Japan; M. Shimozawa, Mitsubishi Electric
Corp., Kamakura, Japan
WEIF-35: A K-band Subharmonic Down-converter in a GaAs Metamorphic HEMT Process
B. Matinpour, N. Lal, J. Laskar, Georgia Tech, Atlanta, GA; R.E. Leoni, C. Whelan, Raytheon,
Andover, MA
WEIF-36: Performance Comparison of Single and Dual Stage MMIC Limiters
J.M. Carroll, TriQuint Semiconductor Texas, Richardson, TX
WEIF-37: Novel Frequency Doubler using Feedforward for Fundamental Frequency
Component Suppression
N. Siripon, M. Chongcheawchamnan, I.D. Robertson, University of Surrey, Guildford, UK
WEIF-38: A Compact T/R Switching Circuit using Quadrature Couplers
and Drain-driven HPAs
H. Uchida, M. Nii, Y. Tsukahara, M. Miyazaki, Y. Itoh, Mitsubishii Electric Corp., Kamakura,
Japan
WEIF-39: Comparison of Different Adaptation Algorithms for Adaptive Digital Predistortion
based on EDGE Standard
K.C. Lee, P. Gardner, University of Birmingham, Birmingham, UK
WEIF-40: An Internally Matched LTCC 3G WCDMA LDMOS 180 W Power Amplifier
J. Rstes, P. Piel, G. Shapiro, A. Pavio, J. Call, G. Funk, Motorola, Tempe, AZ
WEIF-41: Effect of Efficiency Optimization on Linearity of LINC Amplifiers with CDMA Signal
J. Yi, Y. Yang, B. Kim, Pohang University of Science and Technology, Pohang, ROK
WEIF-42: Ultra-linear Distributed Class-AB LDMOS RF Power Amplifier for Base Stations
M.P. van der Heijden, H.C. de Graaff, L. de Vreede, J.N. Burghartz, Delft University
of Technology, Delft, The Netherlands; J.R. Gajadharsing, Philips Semiconductors, Nijmegen,
The Netherlands
WEIF-43: Experimental Investigation on Efficiency and Linearity of Microwave Doherty
Amplifier
Y. Yang, J. Yee, Y.Y. Woo, B. Kim, POSTECH, Pohang, Korea
WEIF-44: Numerical Investigation of Vertical Contactless Transitions for Multilayer Circuits
P. Moretti, L. Manholm, B. Svensson, Ericsson Microwave Systems, 431 84 Mölndal, Sweden;
P.J. Starski, Chalmers University of Technology, 412 96 Gothenburg, Sweden
WEIF-45: Direct Conversion Receiver for Digital Beamforming at 8.45 GHz
K. Mori, H. Arai, Yokohama National University, Yokohama, Japan; Y. Qian, T. Itoh,
University of California, Los Angeles, Los Angeles, CA
WEIF-46: Reflective Antenna Arrays Based on Shorted Ring Slots
A.E. Martynyuk, J.I. Martinez, Facultad de Ingenieria, Universidad Nacional Autonoma de
Mexico, Mexico, Mexico
WEIF-47: Analysis and Design of Active Antenna Arrays
K. Liu, S.M. El-Ghazaly, Telecommunication Research Center, Tempe, AZ; V. Nair,
M. Deshpande, N. El-Zein, H. Goronkin, PSRL, Motorola Labs, Tempe, AZ
WEIF-48: Direction Finding using Spectral Estimation with Arbitrary Antenna Arrays
T. Do-Hong, W. Fisch, P. Russer, Technische Universität München, München, Germany
WEIF-49: Broadband Planar Antenna with Low Side Lobes Levels Capabilities
and High Cross-polarisation Rejection for DBS Reception
L. Bekraoui, University of Paderborn, Paderborn, Germany
WEIF-50: A Low Noise Active Integrated Antenna Receiver for Monopulse Radar Applications
S. Lin, Y. Qian, T. Itoh, University of California Los Angeles, Los Angeles, CA
WEIF-51: A Quasi-optical Linearizer
K.Y. Sung, B. Elamaran, W.A. Shiroma, University of Hawaii at Manoa, Honolulu, HI
WEIF-52: Study of Design Parameters in Waveguide-based Spatial Power Combining Amplifier
Arrays using FDTD
M. Ozkar, G. Lazzi, A. Mortazawi, North Carolina State University, Raleigh, NC
WEIF-53: Broadband Analysis of a D-band Holographic Power Combining Circuit
M. Hoeft, R. Judaschke, Technical University of Hamburg-Harburg, Hamburg, Germany;
J. Weinzierl, University Erlangen-Nuernberg, Erlangen, Germany
 WEDNESDAY SPECIAL SESSIONS WEDNESDAY PANEL SESSIONS
WE1D: FREQUENCY CONTROL ADVANCES FOR WIRELESS APPLICATIONS PWA: AUTOMOTIVE RADAR
Room: Tucson 42–43 Date & Time: Wednesday May 23, 12:00–1:15 PM
Time: 8:00–10:00 AM Location: Civic Plaza
Session Chair: R. Newgard, Rockwell Collins
Organizers: Mohammad Madihian, NEC USA Inc.
Co-Chair: S. Wetenkamp, Micro Lamba
Hiroshi Kondoh, Hitachi
Description:
As the demand for more complex wireless systems grows to meet Moderator: Mohammad Madihian, NEC USA Inc.
the seemingly insatiable appetite of the consumer marketplace, the Panelists: Josef Wenger, DaimlerChrysler
pressure on the LO sources has kept pace. This session presents a Takao Matsumura, NEC
variety of approaches and discussions of problem areas that the de-
Tatsuya Hirose, Fujitsu
sign engineer faces in his quest for the perfect signal source.
Ralph Rasshofer, Infineon
WE2D: THE NBS/NIST CENTENNIAL: Frank Kolak, Tyco Electronics
ONE HUNDRED YEARS OF RF METROLOGY AND STANDARDS Hiroshi Kondoh, Hitachi
Room: Tucson 42–43
This panel discusses circuit and antenna technologies that can
Time: 10:30 AM–12:00 PM be used for automotive radars, and tries to clarify the features that
Session Chair: K. Remley, NIST Boulder, CO must be met by these components. The panel will address the fol-
Co-Chair: C. Weil, NIST Boulder, CO lowing questions:
✗ What functions should an automotive radar be equipped
Description:
with, now and in the future?
NIST, the successor to the former National Bureau of Standards ✗ What is the best automotive radar scheme?
(NBS), celebrates its centennial year. Five NIST speakers will de- ✗ What device and circuit technologies will be most
tail significant NBS/NIST contributions in measuring such funda-
appropriate?
mental quantities as frequency, time, power, resistance, voltage,
and mass. Recent developments in primary NIST standards, such ✗ What antenna technologies will be most appropriate?
as the cesium fountain atomic clock, the Josephson AC voltage ✗ What issues still need to be addressed and solved?
standard, and the “electronic kilogram” will also be highlighted. PWB: UNIVERSITY–INDUSTRY INTERACTIONS
WE3D: MICROWAVE AND OPTICAL BROADBAND INTERNET ACCESS Date & Time: Wednesday May 23, 12:00–1:15 PM
Room: Tucson 42–43 Location: Civic Plaza
Time: 1:30–3:00 PM
Organizers: Mike Golio, Rockwell Collins

Session Chair: C. Cox, MIT and Photonic Systems Inc.
Description:
The first and still dominant commercial market for microwave
photonics, is the distribution (unidirectional data flow) such as in
cable television (CATV) services. However, there is a large mar-
ket (potentially larger than CATV distribution) in the communica-
tion (bi-directional data flow) of high speed digital data. The mar-
ket driving this application is the internet, which has been grow-
ing at what can only be described as an explosive rate. For
example, internet traffic is doubling every 100 days; e-mail traffic
alone has reached 95 million per month. Providing broadband
access via the existing coax, optical and/or wireless plants means
upgrading the present plants in two ways: 1. converting it to be
addressable from a broadcast network, and 2. implementing bi-
directional information flow instead of the present unidirectional
flow. The technologies that are being developed to provide
broadband access are coax cable, optical fiber and fixed or mo-
bile wireless communications. This session will explore each of
these approaches and their combination via invited speakers
who are actively working in the field.
WE4D: INTERNET VIA SATELLITES
Room: Tucson 42–43
Time: 3:30–5:00 PM
Session Chair: R.K. Gupta, Lockheed Martin Global Telecoms
Co-Chair: B. Geller, Mitsubishi Electric & Electronics
Description:
A number of satellite systems have been proposed for broad-
band global/regional multimedia and internet services via satel-
lites. Many of these systems are at an advanced stage of develop-
ment with projected deployment in 2003 to 2005 time frames. The
topics to be addressed in this special session include satellite sys-
tems for multimedia, Ka-Band satellite architectures, Ku/Ka-Band
interactive terminals for geostationary and non-geostationary satel-
lites and performance issues for a linearized TWTA satellite chan-
43
WEDNESDAY
Peter Blakey, ON Semiconductor
Moderator: Mike Golio
Panelists: L. Dunleavy, University of South Florida
C. Snowden, Filtronics
R. Trew, Case Western Reserve University
J. Costa, ON Semiconductor
Universities offer digital and VLSI design courses routinely at
both the undergraduate and graduate levels. The availability of
high-frequency analog, RF, microwave and millimeter-wave de-
sign courses is far less pervasive. This panel will discuss the ways
in which universities and industry can work together to increase
the supply of engineers who can design circuits for wireless and
broadband applications. Questions that will be discussed include
the following:
✗ Is industry handicapped by a real and persistent shortage of
RF and microwave designers?
✗ What difficulties do universities face in establishing RF and
microwave design courses?
✗ What does the microwave industry need from universities?
✗ What do universities need from the microwave industry?
✗ What different forms of collaboration between industry and
universities are being deployed?
✗ What are the advantages and disadvantages of each form of
collaboration?
✗ Should government play a role in promoting interactions
between industry and universities?
✗ What new approaches to collaboration can meet the needs
of both industry and universities?
 THURSDAY, MAY 24, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 8:00–9:40 AM
TH1A Microwave Signal Sources TH1B Active and Tunable Filters TH1C Passive Filters and Multiplexers 1

Chair: Johann-F. Luy Chair: M. Guglielmi, Chair: R.V. Snyder, RS Microwave

Co-chair: O. Llopis Co-chair: P. Guillon, IRCOM Co-chair: Chi Wang, Radio Frequency Systems Inc.
BALLROOM TUCSON 36–38 TUCSON 40–41

TH1A-1: Low Phase Noise, Fully Integrated Monolithic VCO In TH1B-1: Compact High-order Planar Ring-resonator Filters TH1C-1: Design of CT and CQ Filters using Approximation
X Band Based on HBT Technology Optimized in Noise in Coplanar Technology and Optimization
Z. Oaurch, M. Camiade, UMS-SAS, Orsay, France; F. Arlot, L. Nénert, L. Billonnet, B. Jarry, P. Guillon, IRCOM –- University R. Levy, R.Levy Associate, La Jolla, CA; P. Petre, HRL
8:00 AM

M. Prigent, University of Limoges, Brive La Gaillarde, France; of Limoges, Limoges, France; C. Quendo, E. Rius, G. Tanné, Laboratories, Malibu, CA
M. Borgarino, L. Bary, University of Toulouse, Toulouse, France LEST – University of Brest, Brest, France

TH1B-2: Tunable Active Filters Having Multilayer Structure

using LTCC
K. Kageyama, K. Saito, H. Utaki, Sumitomo Metal (SMI)
8:10 AM

Electronics Devices Inc., Amagasaki, Japan; H. Murase, T.

Yamamoto, Sumitomo Metal Industries Ltd., Amagasaki, Japan

TH1A-2: Conditions for Broadband MMIC Voltage-controlled TH1B-3: Full Wave Analysis and Design of RF Tunable Filters TH1C-2: A Method for the Direct Synthesis of General Sections
Oscillators Based on Theory and Experiments J. Xu, X. Liang, K. Shamsaifar, Paratek Microwave Inc., T.B. Reeves, C.W. Rossiter, Trilithic Inc., Indianapolis, IN; N.D.
A. Megej, H.L. Hartnagel, Darmstadt University of Technology, Columbia, MD van Stigt, Northeastern Microwave, Halifax, Canada
8:20 AM

Darmstadt, Germany; K. Beilenhoff, United Monolithic

Semiconductors, Orsay, France
8:30 AM

TH1A-3: Solid State High Power RF Oscillator TH1B-4: Tunable RF Filters using Thin Film Barium Strontium TH1C-3: Temperature Characteristics of Combline Resonators
D. Gitsevich, D. Kirkpatrick, L. Dymond, Jr., Fusion Lighting, Titanate Based Capacitors and Filters
Rockville, USA A. Tombak, A. Mortazawi, F.T. Ayguavives, J. Maria, A.I. Kingon, H. Yao, A.E. Atia, Orbital Sciences Corp., Germantown, 20874
8:40 AM

North Carolina State University, Raleigh, NC; G.T. Stauf, ATMI

Inc., Danbury, CT

TH1B-5: Hybrid Resonator Microstrip Line Electrically Tunable TH1C-4: Periodic Structures for Original Design of Voluminous
Filter and Planar Microwave Filters
X. Liang, Y. Zhu, Paratek Microwave Inc., Columbia, MD B. Lenoir, D. Baillargeat, S. Verdeyme, P. Guillon, IRCOM,
8:50 AM

Limoges, France; J. Puech, C. Zanchi, CNES, Toulouse, France

TH1A-4: High Power AlGaN/GaN FET-Based VCO Sources TH1C-5: A Design of Planar Elliptic Bandpass Filter using SMD
J.B. Shealy, J.A. Smart, J.R. Shealy, RF Nitro Communications Type Partially Metallized Rectangular Dielectric Resonators
Inc., Charlotte, NC H.Y. Hwang, S.W. Yun, I.S. Chang, Sogang University, Seoul,
9:00 AM

ROK

TH1B-6: Design of Tunable Ferroelectric Filters with a Constant TH1C-6: Full-wave Design of Canonical Waveguide Filters
Fractional Band Width by Optimization
I. Vendik, O. Vendik, V. Pleskachev, A. Svishchev, St. Petersburg T. Shen, K.A. Zaki, University of Maryland, College Park, MD;
9:10 AM

Electrotechnical University, St. Petersburg, Russia; R. A.E. Atia, Orbital Sciences Corp., Germantown, USA
Woerdenweber, Forschungszentrum Juelich, Juelich, Germany

TH1A-5: Reduced Flicker Noise in Microwave Oscillators using TH1C-7: Length Reduction of Evanescent-mode Ridge
Feedforward Amplifiers Waveguide Filters
J.K.A. Everard, C.D. Broomfield, University of York, Heslington, T. Shen, K.A. Zaki, University of Maryland, College Park, MD
9:20 AM

UK

TH1A-6: A Wideband Voltage-tunable Dielectric Resonator TH1C-8: Zolotarev Bandpass Filters

Oscillator Controlled by a Piezoelectric Transducer H.C. Bell, HF Plus, Chatsworth, USA
T. Yun, K. Chang, Texas A&M University, College Station, TX;
9:30 AM

R.S. Tahim, RST Scientific Research Inc., Anaheim, CA

44
 TH1D HF/VHF/UHF Power Amplifiers TH1E Probing and Automated Measurements TH1F Al Gross Memorial Session
Joint IMS/ARFTG Session
Chair: F.H. Raab, Green Mountain Radio Research Chair: E. Strid, Cascade Microtech V. Nair, Motorola Inc.
Co-chair: M. Eron, Ericsson Amplifier Technology Co-chair: B. Szendrenyi, Agilent Technologies
TUCSON 42–43 YUMA 26–28, 31–33 YUMA 21–23

TH1D-1: Current Status and Emerging Trends in RF Power FET TH1E-1: Integrated Electro-thermal Probe TH1F: Al Gross Memorial Session
Technologies R.M. Reano, K. Yang, J.F. Whitaker, L.P. Katehi, University Invited Speakers
K. Shenai, University of Illinois at Chicago, Chicago, IL of Michigan, Ann Arbor, MI
8:00 AM
8:10 AM

TH1D-2: 7-MHz, 1.1-kW Demonstration of the New E/F2, TH1E-2: Calibrating Electro-optic Sampling Systems
Odd Switching Amplifier Class D.F. Williams, P.D. Hale, T.S. Clement, J.M. Morgan, NIST,
S.D. Kee, I. Aoki, D. Rutledge, California Institute Boulder, CO
8:20 AM

of Technology, Pasadena, CA
8:30 AM

TH1D-3: High-efficiency Inductor-coupled SEPIC for Use in TH1E-3: A Three-port Vector Network Analyzer-measurement
Dynamic Envelope Tracking CDMA RF Power Amplifiers System, Calibration and Results
D.R. Anderson, W.H. Cantrell, Motorola Research and T. Chu, W. Deng, National Taiwan University, Taipei, ROC
8:40 AM

Development Center, Fort Worth, TX

TH1E-4: Microwave On-wafer Characterization of Three-port

Devices using Shield-based Test-fixtures
T.E. Kolding, M.B. Jenner, S. Laursen, RISC Group Denmark,
8:50 AM

Aalborg, Denmark

THID-4: Electronically Tunable Class-E Power Amplifier TH1E-5: Accurate Transmission Line Characterization on High
F.H. Raab, Green Mountain Radio Research, Colchester, USA and Low-resistivity Substrates
G.J. Carchon, B. Nauwelaers, K.U. Leuven, Heverlee, Belgium
9:00 AM

THURSDAY
9:10 AM

TH1D-5: A GSM-EDGE High Power Amplifier Utilising Digital TH1E-6: Automatic Test and Tuning System for Microwave
Linearisation Filters
P.B. Kenington, M. Cope, R.M. Bennett, J. Bishop, Wireless P.A. Harscher, R. Vahldieck, ETH Zurich, Zurich, Switzerland;
9:20 AM

Systems International Ltd., Bristol, UK S. Amari, RMC Canada, Kingston, Canada

9:30 AM

45
 THURSDAY, MAY 24, 2001
TH2A Millimeter-wave Signal Sources
Chair: J.H. Kuno, Quinstar Inc.
Co-chair: R. Alm, Raytheon Co.
BALLROOM
TH2A-1: Low Phase-noise GaInP/GaAs-HBT MMIC Oscillators
up to 36 GHz
10:20 AM
H. Kuhnert, F. Lenk, J. Hilsenbeck, J. Würfl, W. Heinrich,
Ferdinand-Braun-Institut (FBH), Berlin, Germany
10:30 AM
TH2A-2: Monolithic 38 GHz Coplanar Feedback VCOs
Fabricated by a Production pHEMT Technology
10:40 AM
H.J. Siweris, H. Tischer, E. Rohrer, Infineon Technologies,
Munich, Germany
10:50 AM
TH2A-3: Low Phase-noise pHEMT-based MMIC VCOs for LMDS
Applications
11:00 PM
A. Boudiaf, ATN Microwave, Billerica, MA; M. Ahdjoudj, Philips,
Mans, France; P. Pouvil, ENSEA, Cercy, France
11:10 PM
TH2A-4: Coplanar and Microstrip Oscillators in SiGe SIMMWIC
Technology
11:20 PM
K.M. Strohm, C.N. Rheinfelder, J. Luy, DaimlerChrysler, Ulm,
Germany; P. Nuechter, T. Hess, EADS, Ulm, Germany;
W. Heinrich, H. Kuhnert, Ferdinand-Braun-Institut, Berlin,
Germany; M. Nadarassin, C. Warns, W. Menzel, University of
Ulm, Ulm, Germany
TH2A-5: Low Jitter Silicon Bipolar Based VCOs for Applications
in High Speed Communication Systems.
11:30 PM
A. Khanna, E. Topacio, E. Gane, Agilent Technologies, Santa
Clara, CA; D. Elad, Rafael, Haifa, Israel
11:40 PM
TH2A-6: Push-push Oscillators for 94 and 140 GHz Applications
using Standard Pseudomorphic GaAs HEMTs
11:50 PM
S. Kudszus, W.H. Haydl, A. Tessmann, W. Bronner,
M. Schlechtweg, Fraunhofer IAF, Freiburg, Germany
IEEE MTT-S IMS TECHNICAL SESSIONS
TH2B Active and Planar Filters
Chair: D.G. Swanson, Jr., Bartley RF Systems
TUCSON 36–38
TH2B-1: Negative Resistance Optimized in Noise for Losses
Compensation in Microstrip Resonators
A. Zaitsev, B. Kapilevitch, Siberia State University
of Telecommunication & Informatics, Novosibirsk, Russia;
L. Billonnet, B. Jarry, P. Guillon, IRCOM - University
of Limoges, Limoges, France
TH2B-2: Using a Negative Capacitance to Increase the Tuning
Range of a Varactor Diode in MMIC Technology
B. Delacressonniere, J.L. Gautier, ENSEA, Cergy Pontoise,
France; S. Kolev, Corning Inc., Avon, France
TH2B-3: Compact MMIC Active Inductor
G. Avitabile, B. Chellini, Politecnico di Bari, Bari, Italy;
E. Limiti, F. Giannini, Università di Roma 2 “Tor Vergata,”
Roma, Italy
TH2B-4: Microstrip Miniaturized Loop-filters with High
Out-of-band Rejection for Future Mobile Terminals
Y. Toutain, J. Coupez, C. Person, LEST-ENST Bretagne, Brest
Cedex, France
TH2B-5: Wideband Bandpass Filter Design with Three-line
Microstrip Structures
J. Kuo, E. Shih, National Chiao Tung University, Hsinchu,
Taiwan
TH2B-6: A 60 GHz-band Planar Dielectric Waveguide Filter
for Flip-chip Modules
M. Ito, K. Maruhashi, K. Ohata, NEC Corp., Otsu, Japan;
K. Ikuina, T. Hashiguchi, NEC Corp., Kawasaki, Japan;
S. Iwanaga, NEC Kansai, Ltd., Otsu, Japan
46
10:20 AM–12:00 PM
TH2C Passive Filters and Multiplexers 2
Chair: J. Modelski, Warsaw University of Tech.
Co-chair: H. Clark Bell, HF Plus
TUCSON 40–41
TH2C-1: Design of Coupled Resonators Group Delay Equalizers
H. Hsu, K. Zaki, University of Maryland, College Park, MD;
H. Yao, A. Atia, Orbital Science Corp., Germantown, USA
TH2C-2: High Power C-band Dielectric Resonator Filters
for Output Multiplexers
Y. Latouche, D. Gasperoni, J.J. Herren, Alcatel Space Industries,
Toulouse, France
TH2C-3: Analysis of Power Handling Capacity of Band Pass
Filters
C. Wang, Radio Frequency Systems Inc., Marlboro, MA;
K.A. Zaki, University of Maryland, College Park, MD
TH2C-4: Low-loss Filters in Rectangular Waveguide with
Rigorous Control of Spurious Responses Through a Smart Modal
Filter
F. Alessandri, University of Perugia, Perugia, Italy;
M.C. Comparini, F.M. Vitulli, Alenia Spazio, Rome, Italy
TH2C-5: Observations on the Stopband Performance of Tapped
Line Filters
R.J. Wenzel, Wenzel/Erlinger Associates, Agoura Hills, USA;
D.G. Swanson, Jr., Bartley RF Systems Inc., Amesbury, USA
TH2C-6: Stop-band Improvement of Rectangular Waveguide
Filters using Different Width Resonators: Selection of Resonator
Widths
M. Morelli, Filtronic plc, Shipley, UK; I. Hunter, R. Parry,
V. Postoyalko, University of Leeds, Leeds, UK
TH2C-7: Diplexer Design using Pre-synthesized Waveguide
Filters with Strongly Dispersive Inverters
S. Amari, J. Bornemann, University of Victoria, Victoria,
Canada; W. Menzel, University of Ulm, Ulm, Germany;
F. Alessandri, University of Perugia, Perugia, Italy
TH2C-8: Filter Topologies with Minimum Peak Stored Energy
C. Ernst, Lorch Microwave, Salisbury, USA; V. Postoyalko,
University of Leeds, Leeds, UK; R. Parry, Filtronic plc, Shipley,
UK; I. Hunter, Filtronic plc, Shipley, UK
 TH2D Millimeter Wave Multipliers and Mixers
Chair: D. Choudhury, HRL Laboratories
Co-chair: P. Saunier, TriQuint Semiconductor
TUCSON 42–43
TH2D-1: 2.7 THz Waveguide Tripler using Monolithic
Membrane Diodes
10:20 AM
F. Maiwald, S. Martin, J. Bruston, A. Maestrini, T. Crawford,
P.H. Siegel, JPL, Pasadena, CA
TH2D-2: Fabrication of 200 to 2700 GHz Multiplier Devices
using GaAs and Metal Membranes
10:30 AM
S.C. Martin, B.J. Nakamura, A. Fung, J. Bruston, A.E. Maestrini,
F. Maiwald, P.H. Siegel, E. Schlecht, I. Mehdi, Caltech-Jet
Propulsion Laboratory, Pasadena, CA; R.P. Smith, Cree Inc.,
Durham, NC
TH2D-3: A 200-300 GHz SIS Mixer-preamplifier with 8 GHz IF
Bandwidth
10:40 AM
E.E. Lauria, A.R. Kerr, M.W. Pospieszalski, S. Pan, J.E. Effland,
National Radio Astronomy Observatory, Charlottesville, VA;
A.W. Lichtenberger, University of Virginia, Charlottesville, VA
10:50 AM
TH2D-4: 200, 400 and 800 GHz Schottky Diode “Substrateless”
Multipliers: Design and Results
11:00 AM
E.T. Schlecht, G. Chattopadhyay, A. Maestrini, A. Fung,
S. Martin, D. Pukala, I. Mehdi, Jet Propulsion Laboratory,
Pasadena, CA; J. Bruston, ESA ESTEC, Noordwijk, Netherlands
11:10 AM
TH2D-5: An I-Q Mixer at 76.5 GHz using Flip-chip Mounted
Silicon Schottky Diodes
11:20 AM
M.M. Kaleja, A.J. Herb, E.M. Biebl, Technische Universität
München, München, Germany; R.H. Rasshofer, Infineon
Technologies AG, München, Germany
11:30 AM
TH2D-6: Performance of a 1.2 THz Frequency Tripler
using a GaAs Frameless Membrane Monolithic Circuit
11:40 AM
A. Maestrini, D. Pukala, S. Martin, I. Mehdi, Jet Propulsion
Laboratory, Pasadena, CA; J. Bruston, ESA, Noordwijk, The
Netherlands
TH2D-7: A 5 mW-290 GHz Heterostructure Barrier Tripler
in a Waveguide Configuration
11:50 AM
T. David, D. Lippens, S. Arscott, T. Akalin, J. Carbonell,
P. Mounaix, Institut d’Electronique et de Microélectronique du
Nord, Villeneuve d’Ascq, France; M. Guillon, A. Maestrini,
B. Lecomte, G. Beaudin, Observatoire de Paris, Paris, France;
M. Chaubet, Centre National d’Etudes Spatiales, Cedex, France
TH2E Measurements of Non-linear
Devices and Systems — Joint IMS/ARFTG Session
Chair: J. Barr, Agilent Technologies
Co-chair: L. Dunleavy, University of South Florida
YUMA 26–28, 31–33
TH2E-1: A Method to Compare Vector Nonlinear Network
Analyzers
K.A. Remley, D.C. DeGroot, J.A. Jargon, National Institute
of Standards and Technology, Boulder, CO; K.C. Gupta,
University of Colorado, Boulder, CO
TH2E-2: Analysis and Measurement of Multi-tone
Intermodulation Distortion of Microwave Frequency Converters
J.C. Pedro, N.B. de Carvalho, Universidade de Aveiro, Aveiro,
Portugal
TH2E-3: NPR & Co-channel Distortion Ratio:
A Happy Marriage?
A.J. Geens, Y. Rolain, W.R. Van Moer, Vrije Universiteit Brussel,
Brussels, Belgium
TH2E-4: Linearity Optimization of a Distributed Base Station
Amplifier using an Automated High-speed Measurement Protocol
M.P. van der Heijden, B. Rejaei, L.C. de Vreede, Delft University
of Technology, Delft, The Netherlands; J.R. Gajadharsing,
Philips Semiconductors, Nijmegen, The Netherlands
TH2E-5: Ultra-linear Power Amplifier Characterization
using Dynamic Range Extension Techniques
R. Hassun, N. Kuhn, Agilent Technologies, Santa Rosa, CA;
R. Posner, R. Sweeney, B. Vassilakis, Powerwave Technologies,
Irvine, CA
TH2E-6: Direct Measurement of the Maximum Operating
Region in GaAs HBTs for RF Power Amplifiers
A. Inoue, S. Suzuki, K. Yamamoto, T. Shimura, R. Hattori,
Y. Mitsui, Mitsubishi Electric Corp., Itami, Japan; S. Nakatsuka,
Miyoshi Electronics Corp., Miyoshi, Japan
47
TH2F High Speed HBT Technology
and Applications
Chair: L. Kushner, PhotonEx
Co-chair: H.A. Hung, GTS/ARL
YUMA 21–23
TH2F-1: Benefits of SiGe over Silicon Bipolar Technology
for Broadband Mixers with Bandwidth above 10 GHz
S. Hackl, M. Wurzer, J. Boeck, T.F. Meister, H. Knapp,
K. Aufinger, S. Boguth, L. Treitinger, Infineon Technologies AG,
Munich, Germany; A.L. Scholtz, University of Technology,
Vienna, Austria
TH2F-2: 40 Gb/s 4:1 Multiplexer and 1:4 Demultiplexer IC
Module using SiGe HBTs
T. Masuda, N. Shiramizu, E. Ohue, K. Oda, R. Hayamai,
M. Kondo, K. Washio, Central Res Lab, Hitachi, Ltd., Kokubunji,
Japan; K. Ohhata, H. Shimamoto, Hitachi Device Eng, Co. Ltd.,
Kokubunji, Japan; T. Harada, Device Development Center,
Tokyo, Japan
TH2F-3: 40-Gb/s Analog IC Chipset for Optical Receiver –
AGC Amplifier, Full-wave Rectifier and Decision Circuit –
Implemented using Self-aligned SiGe HBTs
K. Ohhata, F. Arakawa, Hitachi Device Engineering Co. Ltd.,
Kokubunji, Japan; T. Masuda, N. Shiramizu, K. Washio, Hitachi
Ltd., Kokubunji, Japan
TH2F-4: Low Frequency Noise and Phase Noise Behavior
of Advanced SiGe HBTs
L. Bary, G. Cibiel, J. Ibarra, O. Llopis, R. Plana, J. Graffeuil,
LAAS-CNRS, Toulouse, France; G. Niu, J. Cressler, Z. Jin,
S. Zhang, AMSTC, Auburn, USA, A. Joseph, IBM, Essex
Junction, USA
TH2F-5: Power SiGe Heterojunction Bipolar Transistors (HBTs)
Fabricated by Fully Self-aligned Double Mesa Technology
L. Lu, S. Mohammadi, Z. Ma, P.K. Bhattacharya, L.P. Katehi,
Univ. of Michigan, Ann Arbor, MI; G.E. Ponchak, S.A. Alterovitz,
NASA Glenn Res. Cen., Cleveland, OH; K.M. Strohm, J. Luy,
DaimlerChrysler Res. Cen., Ulm, Germany
THURSDAY
TH2F-6: 185 GHz Monolithic Amplifier in InGaAs/InAlAs
Transferred-substrate HBT Technology
M. Urteaga, D.W. Scott, T. Mathew, P. Krishnan, Y. Wei,
M.J. Rodwell, University of California, Santa Barbara, Santa
Barbara, CA
 THURSDAY, MAY 24, 2001
TH3A Multi-layer Packaging Techniques
Chair: K. Varian, Raytheon Co.
Co-chair: J. Pavio, Motorola Inc.
BALLROOM
TH3A-1: A New Via Fence Structure for Crosstalk Reduction
in High Density Stripline Packages
J.W. Gipprich, D.A. Stevens, Northrop Grumman Corp.,
1:20 PM
Baltimore, MD
1:30 PM
TH3A-2: Coupling between Microstrip Lines Embedded
in Polyimide Layers for 3D-MMICs on Si
G.E. Ponchak, NASA Glenn Research Center, Cleveland, OH;
1:40 PM
E. Tentzeris, Georgia Institute of Technology, Atlanta, GA;
J. Papapolymerou, University of Arizona, Tucson, AZ
1:50 PM
TH3A-3: Silicon Substrate Coupling Noise Modeling, Analysis
and Experimental Verification for Mixed Signal Integrated
Circuit Design
2:00 PM
W. Jin, Y. Eo, J. Shim, Hanyang University, Ansan, South Korea;
W.R. Eisenstadt, University of Florida, Gainesville, FL; M. Park,
H. Yu, ETRI, Taejon, South Korea
2:10 PM
TH3A-4: RF-microwave Multi-layer Integrated Passives
using Fully Organic System on Package(SOP) Technology
M.F. Davis, A. Sutono, K. Lim, Microelectronics Res. Cen.,
2:20 PM
Atlanta, GA; J. Laskar, School of ECE, Atlanta, GA; V. Sundaram,
J. Hobbs, G. White, R. Tummala, Packaging Res. Cen., Atlanta,
GA
TH3A-5: Design of Embedded High-Q Inductors in MCM-L
Technology
S. Dalmia, W. Kim, S.H. Min, M. Swaminathan, V. Sundaram,
2:30 PM
F. Liu, G. White, R. Tummala, Georgia Institute of Technology,
Atlanta, GA
TH3A-6: A Highly Integrated Transceiver Module for 5.8 GHz
OFDM Communication System using Multi-layer Packaging
Technology
2:40 PM
K. Lim, A. Obatoyinbo, A. Sutuno, S. Chakraborty, C. Lee,
E. Gebara, A. Raghavan, J. Laskar, Georgia Institute
of Technology, Atlanta, GA
2:50 PM
IEEE MTT-S IMS TECHNICAL SESSIONS
TH3B Linear Modeling of Devices
and Components
Chair: M. Megahed, Conexant Co.
Co-chair: R.W. Jackson, University of Massachusetts
TUCSON 36–38
TH3B-1: EM-based Multidimensional Parameterized Modeling
of General Passive Planar Components
T. Dhaene, Agilent Technologies, Ghent, Belgium; J. De Geest,
D. De Zutter, Ghent University, Ghent, Belgium
TH3B-2: Using Efficient Multivariate Adaptive Sampling
by Minimizing the Number of CEM Analyses Needed to Establish
Accurate Interpolation Models of Microwave Circuits
R. Lehmensiek, P. Meyer, University of Stellenbosch,
Stellenbosch, South Africa
TH3B-3: Accurate Closed-form Expressions for the
Frequency-dependent Line Parameters of On-chip Interconnects
on Lossy Silicon Substrate
A. Weisshaar, H. Lan, Oregon State University, Corvallis, OR
TH3B-4: Microstrip Line on Ground Plane with Closely Spaced
Perforations - Simple CAD Formulas by Synthetic Asymptote
Y.L. Chow, K. Wan, City University of Hong Kong, Kowloon,
China; T.K. Sarkar, Syracuse University, Syracuse, NY;
B. Kolundzija, University of Belgrade, Belgrade, Yugoslavia
TH3B-5: An Extrinsic-inductance Independent Approach
for Direct Extraction of HBT Intrinsic Circuit Parameters
T. Horng, J. Wu, H. Huang, National Sun Yat-Sen University,
Kaohsiung, ROC
TH3B-6: Consistent Small-signal and RF-noise Parameter
Modelling of Carbon Doped InP/InGaAs HBT
M. Agethen, S. Schueller, P. Velling, W. Brockerhoff,
F.J. Tegude, Gerhard-Mercator-University Duisburg, Duisburg,
Germany
48
1:20–3:00 PM
TH3C Passive Filters and Multiplexers 3
Chair: D. Schmitt, BOSCH SatCom
Co-chair: J.J. Herren, Alcatel Space
TUCSON 40–41
TH3C-1: Dual-mode and Quad-mode Moebius Bandpass Filters
J.M. Pond, Naval Research Lab., Washington, USA; S. Liu,
N. Newman, Arizona State University, Tempe, AZ
TH3C-2: Analysis and Design of Mass-producible Cross-coupled,
Folded E-plane Filters
E. Ofli, R. Vahldieck, Swiss Fed. Inst. of Technology, Zurich,
Switzerland; S. Amari, Royal Military College, Kingston, Canada
TH3C-3: Modified Conductor Loaded Cavity Resonator
with Improved Spurious Performance
H. Salehi, R.R. Mansour, University of Waterloo, Waterloo,
Canada; V. Dokas, COM DEV Ltd., Cambridge, Canada
TH3C-4: A Practical Triple-mode Monoblock Bandpass Filter
for Base Station Applications
C. Wang, W. Wilber, B. Engst, Radio Frequency Systems Inc.,
Marlboro, USA
TH3C-5: Low-cost Dual-mode Asymmetric Filters in Rectangular
Waveguide
M. Guglielmi, ESTEC, Noordwijk, Netherlands; O. Roquebrun,
P. Jarry, E. Kerherve, Univ. Bordeaux, Bordeaux, France;
M. Capurso, M. Piloni, Siemens, Milano, Italy
TH3C-6: Analysis and Design of Grooved Circular Waveguide
Dual-mode Filters
N. Yoneda, M. Miyazaki, Mitsubishi Electric Corp., Kamakura,
Japan
TH3C-7: Small Filters Based on Slotted Cylindrical Ring
Resonators
R. Mostafavi, D. Mirshekar-Syahkal, Y. Lim, University of Essex,
Colchester, UK
TH3C-8: Dual-mode Filters for Cellular Base Stations using
Metallized Dielectric Resonators
M. Fumagalli, G. Resnati, Forem s.r.l., Agrate Brianza, Italy;
G. Macchiarella, Politecnico di Milano, Milano, Italy
 TH3D Millimeter Wave Transceiver Elements
and Assemblies
Chair: E.C. Niehenke, Niehenke Consulting
Co-chair: F. Sullivan, Raytheon Systems Co.
TUCSON 42–43
TH3D-1: 65145 GHz InP MMIC HEMT Medium Power
Amplifiers
L.A. Samoska, Caltech-Jet Propulsion Lab, Pasadena, CA;
1:20 PM
Y.C. Leong, Univ. of Massachusetts, Amherst, MA
1:30 PM
TH3D-2: A New Direct Millimeter Wave Six Port Receiver
S.O. Tatu, E. Moldovan, R.G. Bosisio, École Polytechnique,
Poly-Grames Laboratory, Montréal, Canada
1:40 PM
1:50 PM
TH3D-3: Wireless Multi-channel TV-signal Distribution System
by using NRD Guide Transmitter and Receiver at 60 GHz
F. Kuroki, S. Shinke, M. Yamaguchi, Kure National College
2:00 PM
of Technology, Kure, Japan; E. Suematsu, H. Sato, Sharp Co.,
Tenri, Japan; T. Yoneyama, Tohoku Institute of Technology,
Sendai, Japan
2:10 PM
TH3D-4: Wideband Low-phase-noise High-power W-band Signal
Sources
E.W. Bryerton, D.L. Thacker, K.S. Saini, R.F. Bradley, National
2:20 PM
Radio Astronomy Observatory, Charlottesville, USA
2:30 PM
TH3D-5: 155 Mbit/s Data Transmission at 60 GHz using a 1×4
Patch Array Antenna with Variable Optical Delay Lines
G.H. Grosskopf, R. Eggemann, D. Rohde, M.S. Choi, Heinrich
2:40 PM
Hertz Institut, Berlin, Germany
2:50 PM
TH3E Spatial Combining and Active Antennas
Chair: J. Harvey, Army Research Laboratory
Co-chair: Z. Popovic, University of Colorado
YUMA 26–28, 31–33
TH3E-1: Fault Tolerance Analysis and Measurement of a Spatial
Power Amplifier
S.C. Ortiz, M. Ozkar, M. Steer, A. Mortazawi, North Carolina
State University, Raleigh, NC; A. Yakovlev, University
of Mississippi, Oxford, MS
TH3E-2: A K-band Full-duplex Transmit-receive Lens Array
M.A. Forman, J. Vian, Z. Popovic, University of Colorado,
Boulder, CO
TH3E-3: Quasi-optical Power Amplifier using TEM Waveguide
Concept
M. Belaid, K. Wu, Poly-Grames Research Center, École
Polytechnique, Montreal, Canada
TH3E-4: A 16-element Reflection Grid Amplifier with Improved
Heat Sinking
A. Guyette, R. Swisher, F. Lecuyer, A. Al-Zayed, A. Kom, S. Lei,
M. DeLisio, Univ. of Hawaii, Honolulu, HI; K. Sato, A. Oki,
A. Gutierrez-Aitken, R. Kagiwada, TRW, Redondo Beach, CA;
J. Cowles, Analog Devices, Beaverton, OR
TH3E-5: A 1-watt, 38-GHz Monolithic Grid Oscillator
B.C. Deckman, Agilent Technologies, Santa Rosa, CA;
D. Rutledge, Caltech, Pasadena, CA; J. Rosenberg, Harvey Mudd
College, Claremont, USA, E. Sovero, Vitesse Semiconductor,
Camarillo, USA, D. Deakin, Rockwell Science
TH3E-6: A 94-GHz Overmoded-waveguide Oscillator with Gunn
Diodes
J. Bae, M. Fujita, K. Mizuno, Tohoku University, Sendai, Japan
TH3E-7: A Retrodirective Diode Grid Array using Four-wave
Mixing
W. Ding, Agilent Technologies, Santa Rosa, CA; S.C. Lei,
M.P. DeLisio, University of Hawaii, Honolulu, HI
TH3E-8: An Experimental and Theoretical Characterization
of a Broadband Arbitrarily-polarized Rectenna Array
J. A. Hagerty, Z. Popovic, University of Colorado, Boulder, CO
TH3E-9: 5.8 GHz Circular Polarized Rectifying Antenna
for Microwave Power Transmission
B.H. Strassner, K. Chang, Texas A&M University, College
Station, TX
49
TH3F High Performance MMIC Technologies
Chair: Z. Bardai, Raytheon
Co-chair: T. Lee, Boeing Satellite Systems
YUMA 21–23
TH3F-1: A 1–10 GHz 0.18 µm-CMOS Chipset for Multi-mode
Wireless Applications
M. Madihian, NEC USA Inc., Princeton, USA; H. Fujii,
H. Yoshida, H. Suzuki, T. Yamazaki, NEC Electron Devices,
Sagamihara, Japan
TH3F-2: A 0.18 & #61549; µm Foundry RF CMOS Technology
with 70 GHz fT for Single Chip System Solutions
H.M. Hsu, J.Y. Chang, C.C. Tsai, C.W. Chen, J.M. Huang,
S.C. Wong, C.H. Chen, T.H. Yeh, C.H. Lin, Y.C. Sun, Taiwan
Semiconductor Manufacturing Company, HsinChu, ROC;
J.G. Su, C.Y. Chang, National Chiao-Tung University
TH3F-3: Deep Trench Guard Technology to Suppress Coupling
between Inductors in Silicon RF ICs
C. Kim, P. Park, J. Park, N. Hwang, H. Yu, ETRI, Taejon, Korea
TH3F-4: Physics and Compact Modeling of SOI Substrates with
Buried Ground Plane (GPSOI) for Substrate Noise Suppression
S. Stefanou, University of Southampton, Southampton, UK; J.S.
Hamel, University of Waterloo, Waterloo, Canada; M. Bain, P.
Baine, B. Armstrong, H.S. Gamble, The Queen’s University of
Belfast, Belfast, UK
TH3F-5: Low-loss Passive Components on BCB-based 3-D MMIC
Technology
K. Nishikawa, B. Piernas, K. Araki, NTT Network Innovation
Laboratories, Yokosuka-shi, Japan; S. Sugitani, T. Ishii, NTT
Photonics Laboratories, Atsugi-shi, Japan; K. Inoue, NTT
Intellectual Property Department, Chiy; K. Kamogawa, NTT
DoCoMo Inc., Kanagawa, Japan
THURSDAY
TH3F-6: Microwave Noise and Power Performance
of Metamorphic InP Heterojunction Bipolar Transistors (HBTs)
S. Halder, Y.Z. Xiong, G.I. Ng, H. Wang, H. Zheng,
K. Radhakrishnan, Nanyang Technological University,
Singapore, Singapore; J.C. Hwang, Lehigh University,
Bethlehem, USA
 THURSDAY, MAY 24, 2001 IEEE MTT-S IMS TECHNICAL SESSIONS 3:30–5:10 PM
TH4A Packaging Interconnect Techniques TH4B Frequency Domain EM Techniques TH4C Low Noise Components and Techniques

Chair: J. Laskar, Georgia Institute of Technology Chair: R. Sorrentino, University of Perugia Chair: P. Smith, BAE Systems
Co-chair: M. Harris, Georgia Institute of Technology Co-chair: J. Rautio, Sonnet Software Inc. Co-chair: L. Boglione, Conexant Systems
BALLROOM TUCSON 36–38 TUCSON 42–43

TH4A-1: Broadband Time-domain Characterization of Multiple TH4B-1: MoM/BI-RME Analysis of Boxed Microwave Circuits TH4C-1: A 183 GHz Low Noise Amplifier Module 7.1 dB Noise
Flip-chip Interconnects Based on Arbitrarily Shaped Elements Figure for the Conical-scanning Microwave Imager (CMIS)
P. Li, K. Chin, New Jersey Institute of Technology, Newark, NJ; M. Bozzi, L. Perregrini, G. Conciauro, Univ. of Pavia, Pavia, Program
3:30 PM

H. Wu, Bell Labs, Murray Hill, USA; T. Li, Cadence Design Italy; A. Alvarez Melcon, Tech Univ. of Carthagene, Carthagene, B. Osgood, M. Barsky, M. Sholley, R. Quon, G. Barber, P. Liu,
Systems, New Providence, USA; W. Sui, Conexant Systems, Spain; M. Guglielmi, European Space Res. and Tech. Cen., P. Chin, R. Lai, M. Nishimoto, R. Raja, TRW, Redondo Beach,
Chelmsford, MA ESA-ESTEC, Noordwijk, The Netherlands CA; F. Hinte, AIL Systems, Deer Park, USA
3:40 PM

TH4A-2: Ka band Power pHEMT Technology for Space Power TH4B-2: Fast Electromagnetic Analysis of Dense Shielded TH4C-2: Low Noise Amplifiers in InP Technology for Pseudo
Flip-chip Assembly Integrated Circuits using the Adaptive Integral Method (AIM) Correlating Millimeter Wave Radiometer
E. Rogeaux, S. George, Alcatel , Toulouse, France; D. Pons, V.I. Okhmatovski, A.C. Cangellaris, Univ. of Illinois at P. Kangaslahti, N. Hughes, T. Cong, Ylinen Elect, Kauniainen,
3:50 PM

P. Fellon, D. Geiger, United Monolithic, Ors, France; D. Theron, Urbana-Champaign, Urbana, IL Finland; P. Kangaslahti, Helsinki Univ of Tech, Espoo, Finland;
N. Haese, Institut d’Electronique, Cedex, France; S. Verdeyme, J. Tuovinen, T. Karttaavi, MilliLab, Espoo, Finland; T. Gaier,
R. Quere, D. Baillargeat, R. Ngoya, Institute de Recherche, D. Dawson, S. Weinreb, Jet Prop. Lab, Pasadena, CA; P. Sjöman,
Cedex, France; S. Long, L. Escotte, Laboratoire, Cedex, France Metsahovi Radio Ob., Kirkkonummi, Finland
TH4A-3: Design and Analysis of Low Cost IC Package Solution
for 10 Gbit/s Applications
M.A. Megahed, P. Zilaro, M. Khaw, Conexant Systems Inc.,
4:00 PM

Newport Beach, VA

TH4B-3: Full Wave Analysis of Electromagnetic Coupling TH4C-3: Simple Model for Dynamic Range Estimate of GaAs
in Realistic RF Multilayer PCB Layouts using Cascaded Parallel Transistors
Plate Waveguide Model Z. M. Nosal, Warsaw University of Technology, Warsaw, Poland
4:10 PM

M.R. Abdul-Gaffoor, H.K. Smith, Motorola, Harvard, USA;

A.A. Kishk, A.W. Glisson, University of Mississippi,
University, MS

TH4A-4: LTCC as MCM Substrate: Design of Strip-line

Structures and Flip-chip Interconnects
F.J. Schmückle, A. Jentzsch, W. Heinrich,
4:20 PM

Ferdinand-Braun-Institut (FBH), Berlin, Germany; J. Butz,

M. Spinnler, Bosch SatCom GmbH, Backnang, Germany

TH4A-5: Vertical Transitions in Low Temperature Co-fired TH4B-4: A New Global-analysis Model for Microwave Circuits TH4C-4: Modeling of Low-frequency Noise in GaInP/GaAs
Ceramics for LMDS Applications with Lumped Elements Hetero-bipolar Transistors
A. Panther, J.S. Wight, Carleton University, Ottawa, Canada; C. Wang, H. Wang, C. Chen, National Taiwan University, Taipei, P. Heymann, M. Rudolph, R. Doerner, F. Lenk,
4:30 PM

C. Glaser, M.G. Stubbs, Communications Research Centre, ROC Ferdinand-Braun-Institut (FBH), Berlin, Germany
Ottawa, Canada

TH4A-6: Characterization of High-density Micromachined TH4B-5: Analysis of Multi-layer Integrated Inductors with Wave
Interconnects Concept Iterative Procedure(WCIP)
J.L. Haley, University of Illinois, Urbana, IL; R.F. Drayton, S. Akatimogool, D. bajon, ENSAE(SUPAERO), Toulouse,
4:40 PM

University of Minnesota, Minneapolis, MN France; H. Baudrand, INP(ENSEEIHT), Toulouse, France

TH4A-7: Design and Optimization for Coaxial-to-microstrip TH4B-6: Numerical Cost of Gradient Computation TH4C-5: Microwave Noise and Small-signal Parameters Scaling
Transition on Multilayer Substrate within the Method of Moments and its Reduction using a Novel of InP/InGaAs DHBT with High DC Current Gain
H. Liang, J. Laskar, Georgia Institute of Technology, Atlanta, Boundary-layer Concept Y. Xiong, G. Ng, H. Wang, C. Law, R.K., Nanyang Tech. Univ.,
4:50 PM

GA; H. Barnes, D. Estreic, Agilent Technologies, Santa Rosa, CA S. Amari, Royal Military College of Canada, Kingston, Canada Singapore, Singapore

TH4A-8: Temperature Compensated Planar Narrow-band Notch TH4B-7: Automated Intelligent Mode Selection for Fast Mode
Filter with Fully Automated Laser-trimming Matching Analysis of Waveguide Discontinuities
M. Schallner, Marconi Communications GmbH, Backnang, C.A. Vale, P. Meyer, Stellenbosch University, Stellenbosch,
5:00 PM

Germany South Africa

9:40 AM

50
 THURSDAY, MAY 24, 2001
TH4D Microwave Applications INTERACTIVE FORUM • 2:30–5:00 PM
of Superconductivity
Chair: C. Jackson, TIA Mobile PHOENIX CIVIC PLAZA, PHOENIX ROOM
Co-chair: M. Nisenoff, M. Nisenoff Associates
TUCSON 42–43 THIF-1: Generalized Multi-gridding Technique for the TLM Method using the Symmetrical
Super-condensed Node (SSCN)
G.N. Mulay, Maharashtra Institute of Technology, Pune, India; D.S. Jog, Government College
of Engineering, Pune, India
TH4D-1: An All-cryogenic Low Phase Noise Hybrid K-band
Oscillator for Satellite Communication THIF-2: A Novel Adaptive Approach to Modeling MEMS Tunable Capacitors using MRTD
S. Vitusevich, I.S. Ghosh, N. Klein, Forschungszentrum Juelich and FDTD Techniques
3:30 PM

GmbH, Juelich, Germany; K. Schieber, M. Spinnler, Bosch N.A. Bushyager, M.M. Tentzeris, Georgia Institute of Technology, Atlanta, GA; L.J. Gatewood,
SatCom GmbH, Backnang, Germany Rockwell Collins, Cedar Rapids, IA; J.F. DeNatale, Rockwell Science Center, Thousand Oaks,
CA
THIF-3: A Multi-threaded Time Domain TLM Algorithm for Symmetric Multi-processing
Computers
P.P. So, W.J. Hoefer, University of Victoria, Victoria, Canada
THIF-4: Construction of Solutions to Electromagnetic Problems in Terms of Two Co-linear
3:40 PM

TH4D-2: Dual 5 MHz PCS Receiver Front End
E.R. Soares, K.F. Raihn, J.D. Fuller, Superconductor
Technologies Inc., Santa Barbara, CA
3:50 PM
Vector Potentials
N. Georgieva, McMaster University, Hamilton, Canada
THIF-5: Analysis of Lumped Element Transistor Structures using MRTD: The Equivalent
Source Method
R.L. Robertson, L.P. Katehi, University of Michigan, Ann Arbor, MI
THIF-6: Efficient Time-domain Electromagnetic Analysis using CDF Biorthogonal Wavelet
Expansion

T. Dogaru, L. Carin, Duke University, Durham, USA

THIF-7: A Wavelet-based FDTD-multigrid-method
M. Walter, P. Waldow, I. Wolff, Universitaet Duisburg, Duisburg, Germany
THIF-8: Analysis and Design of a Planar Antenna for a Millimetre-wave Emitter using TLM
K.P. Heppenheimer, L. Vietzorreck, P. Russer, TU Muenchen, Muenchen, Germany
THIF-9: Analysis of Differential Vias in a Multilayer Parallel Plate Environment
4:00 PM

using a Physics-based CAD Model

TH4D-3: Compact Quasi-lumped Element HTS Microstrip Filters
H.T. Su, F. Huang, M.J. Lancaster, The University
of Birmingham, Birmingham, UK
4:10 PM
R. Abhari, G.V. Eleftheriades, E. van Deventer-Perkins, University of Toronto, Toronto,
Canada
THIF-10: 3D-FDTD Subgridding Technique Applied to Radiating Structures
M. Bonilla, G. Alquie, V. Fouad Hanna, Universite Pierre et Marie Curie, Paris, France;
M. Wong, J. Wiart, France Telecom R&D, Issy les Moulineaux, France
THIF-11: Enhanced Forward Coupling Phenomena between Microstrip Lines on Periodically

Patterned Ground Plane

C. Chang, Y. Qian, T. Itoh, University of California Los Angeles, Los Angeles, CA
THIF-12: Coupled TLM-thermal Analysis in the Time Domain
W. Liu, P.P. So, W.J. Hoefer, University of Victoria, Victoria, Canada
THIF-13: Lumped and Distributed Device Embedding Techniques in Time Domain TLM Field
Models
J. Park, P.P. So, W.J. Hoefer, Department of Electrical and Computer Engineering,University
4:20 PM

of Victoria, Victoria, Canada

TH4D-4: Optoelectronic RF Harmonic Generation and Mixing
in High-Tc Superconducting Film
A.H. Majedi, S.K. Chaudhuri, R. Mansour, S. Safavi-Naeini,
4:30 PM
THIF-14: Analysis of Multiport Waveguide Structures by a Higher-order FDTD Methodology
Based on Non-orthogonal Curvilinear Grids
N.V. Kantartzis, T.I. Kosmanis, T.D. Tsiboukis, Aristotle University of Thessaloniki,
Thessaloniki, Greece; M. Gatzianas, Arizona State University, Tempe, AZ
THIF-15: FDTD Study of Resonance Processes in Microstrip Ring Resonators with Different

University of Waterloo, Waterloo, Canada
TH4D-5: Novel Method for Calculation and Measurement of
Excitation Geometries
E. Semouchkina, W. Cao, Penn State Univ., University Park, PA; R. Mittra, Penn State Univ.,
University Park, PA
THIF-16: An Unconditionally Stable Finite Element Time Domain Solution of Active
Nonlinear Microwave Circuits using Perfectly Matched Layers

Unloaded Q-factor of Superconducting Dielectric Resonators
M.V. Jacob, J. Mazierska, K. Leong, James Cook University,
4:40 PM
THURSDAY
H. Tsai, Y. Wang, T. Itoh, University of California, Los Angeles, Los Angeles, CA
THIF-17: Optimal Shape Design of Dielectric Structure using FDTD and Topology

Townsville, Australia; J. Krupka, Politechniki Warszawskiej, Optimization

Koszykowa 75, Poland Y. Chung, C. Cheon, University of Seoul, Seoul, Korea
4:50 PM
5:00 PM

51
 THURSDAY, MAY 24, 2001 • INTERACTIVE FORUM (cont) • 2:30–5:00 PM
THIF-18: Electronic Design Assistance Tool for Circuit Optimization. Application
to Microwave Power Amplifiers.
C. Duperrier, M. Campovecchio, J. Rousset, R. Quere, University of Limoges, Faculty
of Sciences, Limoges, France; S. Mons, A. Mallet, L. Lapierre, CNES, Toulouse, France
THIF-19: Nonlinear Statistical Modeling of Large-signal Device Behavior
W. Stiebler, F. Rose, J. Selin, Raytheon Commercial Electronics, Andover, USA
THIF-20: A Computer Aided Design Technique for Hybrid and Monolithic Microwave
Amplifiers Employing Distributed Equalizers with Lumped Discontinuities
A. Aksen, B. Yarman, ISIK University, Istanbul, Turkey
THIF-21: Statistical Construction of a Representative CAD Model from a Measured Population
for RF Design Applications
W. Leiker, K. Naishadham, Philips Broadband Networks Inc., Manlius, 13104
THIF-22: SMX - A Novel Object-oriented Optimization System
M.H. Bakr, University of Victoria, Victoria, Canada; J.W. Bandler, Bandler Corp., Dundas,
Canada; Q.S. Cheng, M.A. Ismail, J.E. Rayas-Sanchez, McMaster University, Hamilton,
Canada
THIF-23: A Robust Algorithm for Automatic Development of Neural Network Models
for Microwave Applications
V.K. Devabhaktuni, M.C. Yagoub, Q. Zhang, Carleton University, Ottawa, Canada
THIF-24: Steady-state Determination for RF Circuits using Krylov-subspace Methods in SPICE
M.A. Kleiner, M.N. Afsar, Tufts University, Medford, MA
THIF-25: Interactive “Visual” Design of Matching and Compensation Networks for Microwave
Active Circuits
L.I. Babak, M.V. Cherkashin, Tomsk State University of Control Systems
and Radioelectronics, Tomsk, Russia
THIF-26: Efficient Sensitivity Analysis of Lossy Multiconductor Transmission Lines
with Nonlinear Terminations
A. Dounavis, R. Achar, M. S. Nakhla, Carleton University, Ottawa, Canada
THIF-27: Software Tool for the Design of Narrow Band Band-pass Filters
A. García-Lampérez, M. Salazar-Palma, ETSI Telecomunicación, Univ. Politécnica de Madrid,
Madrid, Spain; M. Padilla, I. Hidalgo-Carpintero, Alcatel Espacio, Tres Cantos, Spain
THIF-28: Optimization of Waveguide Diplexers using Shadow Specifications
D.A. Cargill, University of Saskatchewan, Saskatoon, Canada; T. Dolan, P. Pramanick,
K&L Microwave Inc., Salisbury, USA
THIF-29: Micromachined RF MEMS Tunable Capacitors using Piezoelectric Actuators
J.Y. Park, Y.J. Yee, J.U. Bu, LG Electronics Institute of Technology, Seoul, Korea
THIF-30: Digitally Controllable Variable High-Q MEMS Capacitor for RF Applications
N.D. Hoivik, Y.C. Lee, K.C. Gupta, V.M. Bright, University of Colorado at Boulder, Boulder, CO
THIF-31: Nonlinear Electro-mechanical Modeling of MEMS Switches
THURSDAY
J.B. Muldavin, G.M. Rebeiz, University of Michigan, Ann Arbor, MI
THIF-33: An Electromechanical Model for MEMS Switches
D. Mercier, P. Blondy, D. Cros, P. Guillon, IRCOM, Limoges France
THIF-34: Digital Generation of RF Signals for Wireless Communications with Band-pass
Delta-Sigma Modulation
J.S. Keyzer, J.M. Hinrichs, A.G. Metzger, M. Iwamoto, I. Galton, P.M. Asbeck, University
of California, San Diego, La Jolla, CA
THIF-35: A CMOS 6-bit, 1 GHz ADC for IF Sampling Applications
K. Uyttenhove, M. Steyaert, K.U. Leuven, Heverlee, Belgium
THIF-36: A Silicon-on-insulator 28-V RF Power LDMOSFET for 1-GHz Integrated Power
Amplifier Applications
E.A. McShane, K. Shenai, University of Illinois at Chicago, Chicago, IL; S. Leong, PolyFET RF
Devices Inc., Camarillo, CA
THIF-37: Receiving Weak Signals with a Software GPS Receiver
D.M. Lin, J.B. Tsui, Air Force Research Laboratories, Sensors Directorate, WPAFB, USA
THIF-38: Simple Design Equations for Broadband Class E Power Amplifiers with Reactance
Compensation
A. Grebennikov, M/A-COM, Cork, Ireland
THIF-39: Multi-harmonic Tuning Behavior of MOSFET RF Power Amplifiers
Y. Zhang, C. Salama, University of Toronto, Toronto, Canada
THIF-40: Study of Self-heating Effects in GaN HEMTs
S. Nuttinck, E. Gebara, J. Laskar, Georgia Institute of Technology, Atlanta, GA; M. Harris,
Georgia Tech Research Institute, Atlanta, GA
THIF-41: InGaP PHEMTs for Wireless Power Applications
E.Y. Lan, B. Pitts, O. Hartin, Semiconductor Product Sector, Motorola Inc., Tempe, AZ;
M. Mikhov, Semiconductor Product Sector, Motorola Inc., Tempe, AZ
THIF-42: Novel Asymmetric Gate-recess Fabrication Technique for Sub-millimeter-wave
InP-based HEMTs
K. Shinohara, T. Matsui, Communications Research Laboratory, Koganei, Japan; T. Mimura,
Fujitsu Laboratories Ltd., Atsugi, Japan; S. Hiyamizu, Osaka University, Toyonaka, Japan
THIF-43: A Calibrated RF/IF Monolithic Vector Analyzer
J.C. Cowles, B. Gilbert, Analog Devices - Northwest Labs, Beaverton, OR
THIF-44: Design Techniques of Reducing Chip Area and Highly Integrated MMIC for W-band
Application
Y. Mimino, K. Nakamura, K. Sakamoto, Y. Aoki, S. Kuroda, T. Tokumitsu, Fujitsu Quantum
Devices Limited, Hachiohji-shi, Japan
52
THIF-45: A Novel Accurate Design Method for the Hairpin Type Coupled Line Bandpass Filters
J.S. Yun, J.S. Park, D. Ahn, K.S. Choi, Soonchunhyang Univ., Asan, ROK; J. Kim, Betheltronix
Inc., Cerritos, USA
THIF-46: Hairpin Filters with Tunable Transmission Zeros
C. Tsai, S. Lee, C. Tsai, National Cheng Kung University, Tainan, Taiwan
THIF-47: Adjustment of a Temperature Compensated Ka-band Ring Resonator VCO
using Fully Automated Laser-trimming
M. Schallner, W. Konrath, Marconi Communications GmbH, Backnang, Germany
THIF-48: Monolithic Quantum Tunnel Diode-based C-band Oscillator and LNA
J.I. Bergman, S. Han, J. Laskar, Georgia Institute of Technology, Atlanta, GA; N. El-Zein,
S. Ageno, M. Deshpande, V. Nair, Motorola Inc., Tempe, AZ
THIF-49: Calibrated Linear and Nonlinear Pulsed RF Measurements on an Amplifier
P. Vael, Y. Rolain, Vrije Universiteit Brussel, Brussel, Belgium; C. Gaquiere, H. Gerard, IEMN,
Villeneuve d’Ascq Cedex, France
THIF-50: Measurement of Group Velocities of Various Microwave Transmission Lines via FM
Reflectometry
Y. Park, J. Lee, H. Tae, Hongik Univ., Seoul, Korea
THIF-51: Millimeter Wave Measurements of Temperature Dependence of Complex
Permittivity of GaAs Plates by a Circular Waveguide Method
T. Shimizu, Y. Kobayashi, Saitama University, Urawa, Japan
THIF-52: Infrared Temperature Characterization of High Power RF Devices
M. Mahalingam, E.C. Mares, Motorola, Tempe, AZ
THIF-53: Near-field Microwave Microscopy of Thin Film Resonators
J. Herbsommer, H. Safar, P.L. Gammel, B.P. Barber, M. Zierdt, Lucent Technologies,
Murray Hill, USA
THIF-54: 28 GHz LMDS Channel Measurements and Modeling for Parameterized Urban
Environments
C. Briso, UPM, Madrid, Spain; M. Vazquez, Universidad Carlos III, Leganes, Spain; J.I. Alonso,
UPM, Madrid, Spain
THIF-55: C/Ku-band Pulsed Transmitters for Poseidon 2 Altimeter
A. Darbandi, G. Michaud, H. Buret, J. Touchais, J. Fourcroy, J. Bulgarelli, Alcatel Space,
Toulouse, France
THIF-56: The RF Module Design for W-CDMA/GSM Dual Band and Dual Mode Handset
X.W. Zhu, W. Hong, J.Y. Zhou, L. Tian, Southeast University, Nanjing, P.R. China
THIF-57: Bias Control Technique for CDMA Driver Amplifier to Decrease Current
J. Ko, H. Kim, S. Yang, B. Kim, B. Park, Samsung Electronics Co, Suwon, Korea
THIF-58: Multi-carrier Microwave Breakdown in Air-filled Components
U. Jordan, D. Anderson, M. Lisak, Chalmers Univ. of Tech., Göteborg, Sweden; T. Olsson,
Allgon Systems AB, Täby, Sweden; V.E. Semenov, Inst. of Applied Physics, Russian Academy
of Sciences, Nizhny Novgorod, Russia
THIF-59: Analysis of Proposals to Reduce SAR Levels from GSM Terminals
V. Ferrer Perez, Ericsson Spain, Madrid, Spain; L. Nuño Fernandez, J. Balbastre Tejedor,
Technical University of Valencia, Valencia, Spain
THIF-60: High-accuracy Digital 5-bit 0.8-2 GHz MMIC RF Attenuator for Cellular Phones
N. Kinayman, M. Bonilla, M. Kelcourse, J. Redus, K. Anderson, M/A-COM, Lowell, MA
THIF-61: Micromachined 60 GHz GaAs Power Sensor with Integrated Receiving Antenna
K. Mutamba, A. Megej, E. Genc, A. Fleckenstein, H. L. Hartnagel, Darmstadt Univ. of Tech.,
Darmstadt, Germany; K. Beilenhoff, United Monolithic Semiconductors, Orsay, France;
R. Doerner, P. Heyman, Ferdinand-Braun-Institut, Berlin, Germany; J. Dickmann, C. Woelk,
DaimlerChrysler, Ulm, Germany
THIF-62: A Sensor System Based on SiGe MMICs for 24 GHz Automotive Applications
C.N. Rheinfelder, S.M. Lindenmeier, J.F. Luy, DaimlerChrysler Res and Tech, Ulm, Germany;
C. Willner, DaimlerChrysler Corp., Rochester Hills, USA; A. Schüppen, Temic
Semiconductors, Heilbronn, Germany
THIF-63: Acoustic Sensing using Radio Frequency Detection and Capacitive Micromachined
Ultrasonic Transducers
S.T. Hansen, A.S. Ergun, B.T. Khuri-Yakub, Edward L. Ginzton Laboratory, Stanford, USA
THIF-64: Millimeter-wave Printed Circuit Antenna System for Automotive Applications
V.V. Denisenko, A.G. Shubov, A.V. Majorov, Joint-Stock Co. Radiophyzika, Moscow, Russia;
E.N. Egorov, Res. Technological Cen. REIS, Moscow, Russia; N.K. Kashaev, Res. Inst.
of Microdevices, Moscow, Russia
THIF-65: Spectrum Correlation of Beat Signals in the FM-CW Radar Level Meter
and Application for Precise Distance Measurement
J.C. Chun, T.S. Kim, Uiduk University, Kyung-Ju, ROK; J.M. Kim, Z.S. Lim, RIST, Pohang,
ROK; W.S. Park, POSTECH, Pohang, ROK
THIF-66: K-band Direct Detect MMIC SI Micromachined Radiometer
M. Smith, J. Culver, B.S. Roeder, Raytheon, St. Petersburg, FL; T. Weller, C. Trent, J. Naylor,
University of South Florida, Tampa, FL
THIF-67: A Rugged Active Sensor for Microwave Aquametry
G. Avitabile, N. Sottani, Politecnico di Bari, Bari, Italy; G. Biffi Gentili, University of Florence,
Florence, Italy
 THURSDAY PANEL SESSION THURSDAY SPECIAL SESSIONS
PTHA: COMMERCIAL EXPLOITATION OF 92–96 GHZ SPECTRUM TH1F: AL GROSS MEMORIAL SPECIAL SESSION
Date & Time: Thursday, May 24; 12:00–1:15 PM Room: Yuma 21–23
Location: Civic Plaza, Time: 8:00–10:00 AM
Organizer: Michael Marcus, FCC Session Chair: Vijay Nair, Motorola Labs, Motorola Inc.
Moderator: Michael Marcus, FCC Description:
Panelists: John Reddick, Al Gross is considered the “founding father” of wireless com-
Raytheon Commercial Electronics munications. In 1938, while only in his teens, he invented a hand-
Al Lawrence, TRW Space Electronics Group held mobile radio operating above 200 MHz, an unexplored part
Shey Hakasui, Harmonix Corp. of the radio frequency spectrum at that time. Other ham radio op-
erators, commenting on Al Gross’ habit of walking and talking at
Donnie Burt, e-xpedient/CAVU Inc.
the same time, inspired the name of his invention: “Walkie
Douglas Lockie, Endgate Corp. Talkie.”
Randall Olsen, Trex Enterprises Corp. The US Department of Defense recruited Al Gross to the Office
Jonathan Wells, DMC Wave of Strategic Services (OSS) in late 1930. He helped develop a
The FCC is planning an initiative to remove existing regulatory ground-to-air battery operated radio that could transmit up to 30
barriers to commercial use at 92–95 GHz, an area where MIMIC- miles. With the outbreak of World War II Al helped design the
developed device technology exists. Panelists will discuss what highly secretive, “Joan-Eleanor,” the ultra-high frequency minia-
commercial applications are possible, and what the regulatory ture two-way radio system. This “Joan-Eleanor” was considered
framework should be. This will be a rare opportunity to partici- one of the most spectacular radio developments during the
pate in the creation of a new commercial band for microwave wartime. After the war Al Gross started his own company to de-
technology. velop the hand held radio technology. He created a citizen’s
band radio. He also invented a prototype pager in 1949. One of
his inventions, the two-way wrist watch radio, was immortalized
in Chester Gould’s famous cartoon strip, Dick Tracy
In this session speakers will discuss several of Al Gross’ inven-
tions and the impact of these inventions in today’s wireless com-
munication system.

THURSDAY

53
 FRIDAY WORKSHOPS
WFA: INDUSTRIAL APPLICATIONS WFB: RF PASSIVE COMPONENT EVALUATION TECHNIQUES
OF ELECTROMAGNETIC (EM) SOLVERS
Date & Time: Friday, May 25; 8:00 AM to 12:00 PM
Date & Time: Friday, May 25; 8:00 AM to 12:00 PM
Location: Phoenix Civic Plaza
Location: Phoenix Civic Plaza
Topics & Speakers:
Topics & Speakers:
✗ RF Passive Component Evaluation Techniques
✗ Applications of Commercial Time Domain Electromagnetic Greg Amorese, Agilent Technologies
Solvers, Eric Holzman, Telaxis Communications ✗ Demonstration of Modeling and Compensation Processes
✗ Industrial Applications of Electromagnetic Solvers Shegeki Tanaka, Agilent Technologies
Steven Gellar, AIL Systems
Joseph Levy, LayerOne Wireless Organizer: Greg Amorese, Agilent Technologies
✗ Successful Applications of Electromagnetic Simulation Pat Tiedeman, Agilent Technologies
Masayuki Nakajima, Motorola Japan Research Lab Sponsors: MTT-11, Microwave Measurements
Prof. Shigeo Kawasaki, Tokai University, Japan MTT-20, Wireless Communications
✗ Electromagnetic Solvers Applied to Millimeter Wave
Transceivers, Edward Niehenke, Niehenke Consulting Technical Level: Tutorial
✗ (EM Field-Solvers: Issues and Applications Today’s wireless electronic equipment is continuing to place
Daniel Swanson, Bartley R.F. Systems more stringent requirements on RF components. The advent of
new technology RF components is giving circuit designers the
Organizers: Barry E. Spielman, Washington University
ability to meet their requirements if they can verify how those
Wolfgang Hoerfer, University of Victoria components actually will work in their designs.
Sponsors: MTT-6, Microwave and Millimeter Wave This workshop will cover impedance measurements including
Integrated Circuits definitions, measurement technique selection, compensation
and error-correction, and fixturing. The impedance portion will
MTT-15, Microwave Field Theory
close with a discussion and measurement examples of RF induc-
Technical Level: Tutorial and Advanced tors and capacitors. The workshop will also review basic 2-port
device evaluation with an emphasis on RF filters.
This workshop will explore the extent to which electromagnet-
ic (EM) solvers are being successfully used in industrial applica-
tions. The workshop will attempt to identify the successful uses,
the practical ramifications of solver limitations, and identify those
areas where solver developers need to focus their future work.
Accordingly, the workshop will have a three-fold focus as follows:
1. To learn about the successful applications of EM solvers to
problems faced by the industrial community. It is anticipated
that frequency-domain solvers are more mature and are find-
ing their way into use. We want to learn about these success-
es. However it will also be of considerable interest to learn
whether industry has made progress in applying time-domain
solvers. It will be of interest to learn whether EM solvers are
being used to study EM interactions of circuit features that are
supposed to be isolated within packages
2. To learn about how the time- (and possibly storage-) intensive
nature of these computations is limiting the application of EM
solvers in the industrial setting. It will be of interest to learn
how this affects the types of problems for which industrial
users find them valuable. It will be of interest to learn whether
industry is making use of the ability of time-domain EM solvers
to address nonlinear behavior in components.
3. To learn about those aspects of EM solvers that industrial users
would like to see improved. Are solvers as user-friendly as
they need to be? To what extent can a traditional RF or mi-
crowave design engineer make use of these solvers without
dedicating their career to becoming the guru on this subject
within their company? What kind of advancements need to
FRIDAY

be made in the state of commercially available EM solvers?

For which computing platforms and operating systems is it de-
sired to have EM solvers available?

54
 F ARFTG 57th MICROWAVE MEASUREMENTS CONFERENCE
R T
A G BEST PRACTICE AND STRATEGIES FOR RF TEST

AUTOMATIC RF TECHNIQUES GROUP

We welcome you to our 57th Conference being held at the Crowne Plaza Hotel on
Friday, May 25. The main conference theme “Best Practices and Strategies for RF Test”
CONFERENCE STEERING COMMITTEE will focus on alternatives, tradeoffs, practical considerations and particular examples
Conference Chair
of industrial microwave test and measurement methods. Technical considerations
Charles Wilker (e.g., accuracy, equipment selection, test methodology) and non-technical issues (e.g.,
DuPont cost of test, cost of equipment, speed of test) will be discussed in detail by the invited
T (302) 999-3075 F (302) 999-2928
charles.wilker!usa.dupont.com presentations. In addition, papers concerning traditional ARFTG interests such as
Technical Program Chair metrology, S-parameter, noise figure and non-linear measurements will be presented.
John Barr The invited presentations include Stavros Iezekiel of the University of Leeds dis-
Agilent Technologies cussing lightwave S-parameter measurement techniques, John Mahon of M/A-COM on
T (707) 577-2350 F (707) 577-6014
john_barr@agilent.com practical test considerations in a production microwave component manufacturing en-
David Walker vironment, and Eric Strid of Cascade Microtech on high-throughput microwave
NIST probing.
T (303) 601-1580 F (503) 601-1601
dwalker@boulder.nist.gov
You may register for this conference using the IMS Conference Registration or on Fri-
Exhibits Chair
day, May 25 at the ARFTG registration site. The ARFTG registration fee includes a con-
Leonard Hayden ference digest, continental breakfast, luncheon and one-year ARFTG membership.
Cascade Microtech Inc.
T (503) 601-1508 F (503) 601-1601
leonard@cmicro.com LOCATION
ARFTG EXECUTIVE COMMITTEE
The 57th ARFTG Conference will be held in the Grand Ballroom of the Crown
Plaza Hotel, 101 North 1st Street, Phoenix, AZ 85004, (602)-333-0000. This hotel is
Robert M. Judish, President located two blocks from the Phoenix Civic Plaza. You may reserve your room us-
NIST
Charles Wilker, Vice-President
ing the IMS Conference Housing Form. Visit www.arftg.org for more information.
DuPont Superconductivity
Dr. Edward M. Godshalk, Secretary SCHEDULE
Maxim Integrated Products
Ken Wong, Treasurer Friday, May 25 Activity Crowne Plaza Hotel
Agilent Technologies
Leonard Hayden, Exhibits 7:00 AM – 4:00 PM Registration Grand Ballroom Foyer
Cascade Microtech
Raymond W. Tucker, Membership
7:00 AM – 4:00 PM Exhibition Grand Ballroom South
Air Force Research Lab 7:00 AM – 8:00 AM Continental Breakfast Grand Ballroom South
J. Gregory Burns, Publications
Northrop Grumman 7:00 AM – 8:00 AM Speaker’s Breakfast Hopi Room B
John Cable, Standards 8:00 AM – 10:00 AM Technical Session 1 Grand Ballroom North
Honeywell FM&T
Dr. Dylan Williams, Technical Coordinator
10:00 AM – 11:00 AM Exhibition/Poster Session Grand Ballroom South
NIST 11:00 AM – 12:00 NOON Technical Session 2 Grand Ballroom North
Brian Pugh, E-communication
SiliconWave
12:00 NOON – 1:30 PM Luncheon Pueblo Room
Kate Remley, Publicity 1:30 PM – 3:00 PM Technical Session 3 Grand Ballroom North
NIST
3:00 PM – 4:00 PM Exhibition/Poster Session Grand Ballroom South
David Walker, Education
NIST 4:00 PM – 5:00 PM Technical Session 4 Grand Ballroom North
EX-OFFICIO MEMBERS
Dr. Roger Pollard, ARMMS Liaison
University of Leeds EXHIBITS
Dr. Roger Marks, MTT-S Liaison
NIST The 57th ARFTG Conference also offers an outstanding exhibition opportunity.
Jim L. Taylor, Executive Secretary Please contact our Exhibits Chair directly for further information.

R
www.arftg.org R

55
 µAPS Microwave Application
& Product Seminars
µAPS are technical, product-oriented seminars presented
on the trade show floor adjacent to the exhibition booths.

MESSAGE FROM THE 2001 µAPS CHAIRMAN

The µAPS are in their sixth year serving as a forum for ex-
hibitors. The µAPS provide technical information related to com- 2001 µAPS SCHEDULE
mercially available state-of-the-art products of interest to the mi-
The 2001 Microwave Application & Product Seminars will
crowave community. The products seminars will cover CAD
be held on Tuesday, Wednesday and Thursday, May 22–23,
tools, simulation tools and techniques, active and passive com-
2001 in conjunction with the 2001 International Microwave
ponents and system applications. Individual presentations will be
Symposium at the Phoenix Civic Plaza. The series of individ-
20 minutes long including questions and answers. Provisions are
ual presentations is open to any exhibition or conference at-
made for presenters to display and share product literature relat-
tendee.
ed to their presentations. The µAPS are open to all technical con-
ference and exhibit attendees. The seminars will be held on the
exhibit floor in the Phoenix Civic Plaza on Tuesday, Wednesday Tuesday, May 22, 2001 1:00–5:00 PM
and Thursday, May 22–24, in conjunction with IMS 2001. Wednesday, May 23, 2001 9:30 AM–4L20 PM
Mali Mahalingam Thursday, May 24, 2001 9:00 AM–2:00 PM
µAPS Chair

µAPS — MICROWAVE APPLICATION & PRODUCT SEMINARS — TECHNICAL PROGRAM

TUESDAY, May 22, 2001 — EXHIBITION FLOOR, PHOENIX CIVIC PLAZA

A New Family of Si LDMOS Power Devices for 3G Communications Applications

E. James Crescenzi, Jr., UltraRF Company 1:00–1:20 PM
High Voltage Silicon Device Structures Increase Peak Power Capability
Bob Davidson, Motorola Inc. 1:20–1:40 PM
Application of Digital Predistortion to RF LDMOS Power Amplifiers
for Narrow-band CDMA Systems
David Runton, Chris Thron and Emmanuel Roy, Motorola Inc. 1:40–2:00 PM
Characterization of 125 Watt Single-ended Power Discrete LDMOS Device
for W-CDMA Base Station Amplifier Application
Antoine Rabany, Long Nguyen and John Kinney, Motorola Inc. 2:00–2:20 PM
LDMOS vs. VDMOS — How to Choose
S.K. Leong, Polyfet RF Devices 2:20–2:40 PM Session 1
Commercial MMIC Solutions for Broadband Wireless Access 1:00–5:00 PM
and Optoelectronic Applications
G.D. Edwards, R.J. Cleaver, A.S. Cornelius, M.W. Green, Marconi Caswell 2:40–3:00 PM
Silicon Carbide (SiC) MESFET Power Transistors — Ideal for 3G Systems Devices, PAs
Tom Dekker, Cree 3:00–3:20 PM
Plastic, A New Packaging Option for High Power RF Devices
Darin Wagner, Alex Elliot, Antoine Rabany, Long Nguyen, Motorola Inc. 3:20–3:40 PM
RF Components for Multi-band Mobile Phones
Shigeru Kemmochi, Hitachi Metals, Ltd. 3:40–4:00 PM
MHPA19120 — LDMOS Power Amplifier for 1.9 GHz CDMA Applications
Jeffrey Jones, Motorola Inc. 4:00–4:20 PM
CATV Power Amplifiers — Improved Performance with GaAs PHEMT
Scott Craft, Motorola Inc. 4:20–4:40 PM
High Power Pulse Amplifiers Using LDMOS
Douglas M. Macheel, Lee B. Max, Staff Consultant, Zeta 4:40–5:00 PM
56
 WEDNESDAY, May 23, 2001 — EXHIBITION FLOOR, PHOENIX CIVIC PLAZA

QuickWave Electromagnetic Software

Malgorzata Celuch, QWED 9:00–9:20 AM
IE3D 8.0 — Memory and Time Efficient Electromagnetic Simulator
for Open and Boxed Structures
Jian-X. Zheng, Seland Software Inc. 9:20–9:40 AM
MDSPICE 2.0 — A Robust S-0 parameter SPICE Simulator Meets
the Causality Condition
Jian-X. Zheng, Seland Software Inc. 9:40–10:10 AM
MEFiSTo-3D Pro — A Multipurpose Electromagnetic Field Simulation Tool Session 1
with Powerful Global Modeling Features 9:30–11:50 AM
Wolfgang J.R. Hoefer, Poman P.M. So, Faustus Scientific Corp. 10:00–10:20 AM
EMPIRE — 3D EM Field Solver — New Speed-up Techniques
for FDTD Algorithm EM Simulation
Andreas Wien, Andreas Lauer, IMST GmbH 10:20–10:40 AM
Coplanar Circuit Design with COPLAN for ADS
Anreas Bettray, Rudiger Follmann, IMST GmbH 10:40–11:00 AM
Efficient Modeling of Helix Antennas Using Micro-stripes
David Johns, R. Aitmehdi, Flomerics 11:00–11:20 AM
emPiCASSO™: An Advanced Design Tool for Multilayer Printed
Microwave Circuits and Antennas
K.F. Sabet, EMAG Technologies Inc. 11:20–11:40 AM

TOPAS — A Non-linear FET Model and the Extraction Software

Rudiger Follmann, IMST GmbH 1:00–1:20 PM Session 2
High Power LDMOS Performance Prediction Using a Nonlinear Model 1:00–2:20 PM
Pascal Gola, Jean-Christophe Nanan, Motorola Inc. 1:20–1:40 PM
Developing Neural Models for Linear-Nonlinear Microwave Design
Non-linear Models,
Q.J. Zhang, Carleton University 1:40–2:00 PM
Circuit/System Simulation
CONCERTO — 3D Microwave and RF Design Software
Cris Emson, Jonathan Oakley, David Carpenter, Vector Fields Ltd. 2:00–2:20 PM

Active Load Pull System for the Characterization of Power Devices

Andrea Ferrero, Gary Simpson, Surinder Bali, Maury Microwave Corp. 2:20–2:40 PM
Automated Tuner System (ATS) for Fundamental and Independent Harmonic
Load Pull Measurements for Device Modeling
Gary Simpson, Surinder Bali, Maury Microwave Corp. 2:40–3:00 PM
Techniques for Accurate Measurement of Error Vector Magnitude Session 3
Kurt Matis, Applied Wave Research Corp. 3:00–3:20 PM 2:20–4:20 PM
DSP Techniques Perform Accurate Analyses of Hardware Distortion
Joel Kirshman, Applied Wave Research Corp. 3:20–3:40 PM Measurements
Mode Stirrer Method Measurement of Shield Effectiveness
for Microwave Coaxial Cable
Wayne Love, Storm Products 3:40–4:00 PM
Measurement of the Dielectric Constant of a Glass Bead
Bruce Bullard, Kaman Instrumentation 4:00–4:20 PM

THURSDAY, May 24, 2001 — EXHIBITION FLOOR, PHOENIX CIVIC PLAZA

Enhanced Thermal Performance Cu/W Flanges for Next Generation Session 1
Power Packaging 9:00–9:40 AM
Brian Simmons, Juan L. Sepulveds, Zentrix Technologies Inc. 9:00–9:20 AM
Low Loss Green Tape™ for Wireless, Microwave and Fiber Optic Applications
D.I. Amey, S.J. Horowitz, R.R. Draudt, P.C. Donohue, M.A. Smith, DuPont Microcircuit 9:20–9:40 AM Materials

Fast Response Detector for Wide-band Input Noise

Yoav Koral, ELISRA Ltd. 9:40–10:10 AM
Phase Invariant Attenuators
George Apsley, GT Microwave Inc. 10:00–10:20 AM
Power Splitter with Excellent Amplitude and Phase Accuracy Session 2
over a Wide Temperature Range 9:40–11:40 AM
D. Kother, G. Pautz, G. Mollenbeck, P. Uhlig, U. Gollor, W. Poppelreuter, IMST GmbH 10:20–10:40 AM
Modularity and Miniaturization — The New MMBX Connector
Jack Nee, Huber+Suhner Inc. 10:40–11:00 AM Passive Components
The Design of Three Ports OMT Network with Dual Polarization Receiving
M.H. Chen, R.C. Hsieh, Victory Industrial Corp. 11:00–11:20 AM
Roll-Rings: A High Performance Alternative to Slip Rings
Peter E. Jacobson, Roltran Inc. 11:20–11:40 AM

High Linearity Direct Launch RF Quadrature Modulator in SOS CMOS

Dan Nobbe, Peregrine Semiconductor 1:00–1:20 PM Session 3
Latching RF MEMs Microrelay Based on 5 V Thermal Actuation 1:00–2:00 PM
Vivek Agrawal, JDS Uniphase Co. 1:20–1:40 PM
A Novel MMIC High Frequency Oscillator Modulator, MEMs, Oscillator
J.T. Harvey, A.C. Young, Mimix Broadband 1:40–2:00 PM
57

The MTT-S Exhibition is an annual event that has taken place since 1970. It com-
prises more than 400 microwave, subassembly, component, device, material, instru-
ment and design software suppliers and each year draws approximately 10,000 to
10,200 microwave engineers involved in the design of systems, subsystems, compo-
nents and devices.
A-Alpha Waveguide
AC Microwave
Accumet Engineering
ACE Technology
Advance Reproductions
Advanced Chemical Co.
Advanced Control Comp.
Advanced Electromagnetics
Advanced Switch Tech
Aeroflex
Aeroflex Circuit Tech
Aeroflex Comstron
Aeroflex Lintek
Aeroflex MIC Technology
Aeroflex RDL
Aerowave Inc.
Aethercomm Inc.
Agilent Technologies
Air Precision / Sivers
AKON Inc.
Alan Industries Inc.
Aliner Industries Inc.
Alpha Industries
AMCOM Communications
American Technical Ceramics
Ametek Specialty Metal Prod.
AMITRON
Amkor Technology
AMOTECH Co., Ltd.
Amphenol RF
Amplifier Research
Amplifonix Corp.
Anadigics
Analog Devices Inc.
Anaren Microwave Inc.
Anritsu Company
Ansoft Corp.
API Delevan Inc.
Aplac Solutions Corp.
Applied Engineering Prod.
Applied Microwave & Wireless
Applied Specialties Inc.
Applied Thin-Film Products
Applied Wave Research Inc.
AR Kalmus
ARC Technologies
Arcom Inc.
Arlon - M.E.D.
Arrow RF Vision
Artech House
Assemblies Inc.
Astrolab Inc.
Atlantic Microwave
Atmel Wireless & Microcontrollers
ATN Microwave Inc.
Avnet Electronics Marketing
AVX Corp.
BAE Systems
Barry Industries
Belden Wire & Cable Company
Besser Associates Inc.
Bird Electronics
Bliley Electric Company
Boonton Electronics Corp.
Bradley University
Brush Wellman
C-MAC MicroTechnology
C.E. Precision Assemblies
CAD Design Services Inc.
Cal Crystal Lab Inc.
California Eastern Labs
Cambridge Products
Carleton University
Cascade Microtech
Celeritek Inc.
Cernex Inc.
Channel Microwave Corp.
Circuits Processing Tech
Cirqon Technologies
CITEL Inc.
Clarisay Inc.
ClearComm Technologies
CMC Wireless Components
CMP Media Inc.
CMR Circuits
Coilcraft
Communication Tech Inc. (CTI)
Communications & Power-Canada
ComNav Engineering
Compac Development Corp.
Compel Electronics Spa
Compel Electronics Inc.
Compex Corp.
Component Distributors
COMSOL Inc.
Comtech PST
Conec Corp.
Conexant
Connecting Devices Inc.
Connectronics Inc.
Continental Microwave & Tool
CoorsTek
Cottonwood Technology Group
Cougar Components
Coventor Inc. (Microcosm)
CRC Press
Credence Systems
Cree Inc.
Cronos, A JDS Uniphase Co.
CSIRO Australia
CST of America
CTT Inc.
Cuming Microwave Corp.
Custom Cable Assemblies
Daico Industries Inc.
DB Products
Delta Electronics Mfg. Corp.
Dexter Magnetic Technologies
Diamond Antenna
Dielectric Labs Inc. (DLI)
Discovery Semiconductors
Ditom Microwave Inc.
DML Microwave, Ltd.
Dorado International Corp.
Dow-Key Microwave
DRC - Metrigraphics
Ducommun Technologies Inc.
DuPont Microcircuit Materials
DuPont Superconductivity
Dynawave Inc.
Eagleware Corp.
Ecliptek Corp.
EDO - AIL
EE - Evaluation Engineering
EiC Corp.
Elcom Technologies
Electromagnetic Tech Inc.
Elisra Electronic Systems
Elva-1 Ltd.
EMAG Technologies
EMC Technology Inc.
Emerson & Cuming Microwave
EMF Systems
Emhiser Micro-Tech
EMS Technologies Inc.
Ericsson Microelectronics
Excelics Semiconductor
EZ Form Cable Corp.
F&K Delvotec Inc.
Farran Technology, Ltd.
Faustus Scientific Corp.
FCT Electronics LP
Film Microelectronics Inc.
Filtel Microwave Inc.
Filtran Microcircuits Inc.
Filtronic Components - Ferretec
Filtronic Compound Semiconductor
Filtronic Sigtek Inc.
Filtronic Solid State
First Technology
Flann Microwave Inc.
Flexco Microwave Inc.
Flomerics
Florida RF Labs, Smiths Inds
Focus Microwaves Inc.
Foranne Mfg.
Fotofabrication (Fotofab)
Fox Electronics
Frequency Management
FSY Microwave Inc.
Fujitsu Compound Semiconductor
Fujitsu Microelectronics
G.T. Microwave
GaAs Code Ltd.
Gaiser Tool Co.
Galtronics
Gavish Inc.
GEL-PAK
General Microwave Corp.
Georgia Institute of Tech
GGB Industries Inc.
GHz Technology Inc.
Giga Solution Tech Co.
Giga-tronics
Gigatech Co., Ltd.
GIL Technologies
Gilbert Engineering Co.
Charles E. Gillman Co.
Gold Conn. LTD
W. L. Gore & Associates
Gowanda Electronics
Gradient Technologies
Habia Cable Inc.
Harbour Industries
Haverhill Cable & Mfg. Co.
HD Communications Corp.
HEI Inc.
Heraeus Inc.
Herley-MDI
Herotek Inc.
Hexawave Inc.
Hitachi Metals America
Hitachi Semiconductor
Hittite Microwave
Holl Technologies Co.
Honeywell
HTA Photomask
Huber + Suhner Inc.
Hybond Inc.
Hypertronics Corp.
Hytronics Corp.
IBM
IFR
IMI Inc.
IMS Connector Systems
IMST GmbH
In Phase Technologies
Infineon Technologies
EXHIBITORS
The 2001 Exhibition will be held in the Phoenix Civic Plaza. Exhibition hours are
Tuesday, May 22 and Wednesday, May 23 from 9:00 AM to 5:00 PM, and Thursday, May
24 from 9:00 AM to 3:00 PM. Following is a list of exhibiting companies. The list is com-
plete as of press time, but may not include all companies.
Inmet Corp. Morgan Electro Ceramics SIWARD International Inc.
Insulated Wire Inc. Motorola SPS Smiths Group Plc
Integra Technologies MRSI Sonnet Software Inc.
Integrated Microwave Corp. MTI - Milliren Technologies Sonoma Scientific Inc.
International Crystal Mfg. Murata Electronics N.A. Sophia Wireless
International Manufacturing MVS-Microwave & Video Systems Southwest Microwave
Ion Beam Milling Inc. MWTG Telecom Spectra-Mat Inc.
IQE Plc Nagano Japan Radio Co. Spinner North America
ITT Industries Microwave Sys. Nanowave Inc. SPM
Janco Electronics Inc. Narda (L-3 Communications) Sprague-Goodman Electronics
JCA Technology Narda DBS SRC Cables
JFW Industries Inc. Narda West SRI Connector Gage Co.
Johanson Manufacturing National Instruments SSI Cable Corp.
Johanson Technology Inc. National Semiconductor SSPA Microwave Corp.
Johnson Components Inc. NEL America (NTT Electronics) Stanford Microdevices Inc.
Jye Bao Co., Ltd. Net Shape Technologies State Of The Art Inc.
K & L Microwave Inc. Netcom Inc. Stealth Microwave
Kaman Instrumentation Nextec Microwave & RF Stetco Inc.
Karl Suss NJR Corp. STI
KDI/Triangle Corp. Noble Publishing Corp. STMicroelectronics
Keithley Instruments Inc. Noise Com Storm Products
Kevlin (Chelton Gp) NTK Technical Ceramics StratEdge Corp.
KMW USA Inc. Nurad Technologies Sumitomo Electric
Knowledge*on Inc. Octagon Communications SV Microwave Inc.
Korea Sangshin Electric Co. OEA International Inc. C. W. Swift & Associates
Krytar Inc. Olin Aegis Synergy Microwave
KW Microwave Corp. Ophir RF Inc. T-Tech Inc.
Kyocera America Inc. Optotek Ltd. TCI (TRAK Ceramics Inc.)
Kyocera Industrial Ceramics Orbit/FR Inc. Tecan Components
L-3 Communication/Celerity Osprey Metals Ltd. Tecdia Inc.
Labtech Pacific Aerospace & Electronics Tech Time
Laser Processing Tech Palomar Technologies Inc. Tech-Ceram Corp.
Laser Services Inc. Paratek Microwave Inc. Technical Research & Mfg.
Laserage Technology Corp. PAWANET Tecom Industries
Lehman Chambers PC Dynamics/Performance Interconnect Tegam Inc.
Litton Airtron PCB Engineering Inc. Tektronix Inc.
Litton Electron Devices Penn Engineering Components Teledyne Electronic Tech
Litton Winchester/Retconn Penton Media Inc. Teledyne Microelectronics
Logus Microwave Corp. Peregrine Semiconductor Teledyne Microwave Comp.
Lorch Microwave Photofabrication Engineering Teledyne Relays
LPKF Laser & Electronic Piconics Inc. Teledyne Wireless
M/A-COM Picosecond Pulse Labs Inc. Telegartner Inc.
M2 Global Technology Piezo Technology Inc. (PTI) Telephus Inc.
Marconi Caswell Ltd. Pletronics Inc. Temex Electronics
Maryatt Technologies Polaris Electronics Corp. Temptronic Corp.
Maury Microwave Corp. Polese Company Tensolite
MCE Companies Inc. Poly Circuits TestMart
Mega Circuit Inc. Polyfet RF Devices Thales Microwave
Mega Industries Polyflon Company Thermax/CDT Inc.
MegaPhase Cable Polyphaser Corp. Thin Film Concepts Inc.
Meggitt Safety Systems Poseidon Scientific Instruments Thunderline-Z
MEMSCAP Inc. Precision Ferrites & Ceramics Times Microwave Systems
Merrimac Industries Precision Photo-Fab Inc. TLC Precision Wafer Tech
Metclad International Precision Tube Toshiba America Electronic
Metelics Corp. Prentice Hall TRAK Ceramics Inc.
Metropole Products Inc. Presidio Components Inc. TRAK Communications Inc.
MH&W Int’l Corp./Thermal Pulsar Microwave Corp. TRAK Europe
MI Technologies Q Microwave TRAK Microwave
MI.TEL SRL Q-Tech Corp. Trans-Tech
MICA Microwave Corp. Quasar Microwave Technology Transcom Inc.
Mician QUEST Microwave Inc. Trilithic
Micralyne Questech Services Corp. TriQuint Semiconductor
Micro Hybrid Dimensions QuinStar Technology Inc. Tronser Inc.
Micro Lambda Inc. QWED Tru-Connector Corp.
Micro Metalsmiths R & K Company Limited TRW
Micro Metrics Inc. Radio Frequency Investigation TTE Inc,
Micro Networks/Andersen Labs Radio Waves A.J. Tuck Co.
Micro Substrates Corp. Raytheon RF Components Ube Electronics, Ltd.
Micro-Chem Inc. RDL UltraRF
Micro-Coax Inc. Reactel Inc. UltraSource Inc.
Microelectronics Capacitors RelComm Technologies United Monolithic Semiconductors
Micromanipulator Co. Inc. REMEC United Satcom Inc.
Micronetics Remtec United Western Enterprises
Microsemi Corp. Renaissance Electronics Unity Wireless Systems Corp.
Microsource Inc. Res-Net Microwave Universal Microwave Corp.
Micross Components Corp. Resin Systems University Of California, UCLA
Microtech Inc. RF Depot.com University of Massachusetts
Microwave Applications Group RF Design UTE Microwave Inc.
Microwave Circuits RF Industries Vacuum Engineering & Materials
Microwave Comm. & Components RF Micro Devices ValPey Fisher Corp.
Microwave Communications Labs RF Nitro Communications Vari-L Company Inc.
Microwave Concepts Inc. RF Solutions Inc. Vector Fields Inc.
Microwave Development Co. Richardson Electronics Vectron International
Microwave Development Labs RJR Polymers Inc. Verticom Inc.
Microwave Device Technology RLC Electronics Victory Industrial Corp.
Microwave Devices Inc. Robinson Laboratories Voltronics Corp.
Microwave Dynamics Rogers Corp. VXI Technology Inc.
Microwave Engineering Europe H. Rollet & Co. Ltd. A.T. Wall Company
Microwave Journal Roos Instruments Inc. Wavetronix
Microwave Solutions Limited Rosenberger of North America Weinschel Corp.
Microwave Technology Sabritec Wenzel Associates Inc.
Microwave Test Solutions Sage Labs (Filtronic plc) Werlatone Inc.
Microwaves & RF Salisbury Engineering Inc. Wessex Electronics Ltd.
Mid Atlantic RF Systems San-Tron Inc. West Bond Inc.
Midcom Inc. SaRonix John Wiley & Sons Inc.
Millitech, LLC Sawtek Inc. Williams Advanced Materials
Milmega Schwarzkopf Technologies Corp. WIN Semiconductors
Mimix Broadband Scientific Microwave Corp. Wireless Design & Dev.
Mini-Circuits SDP Components Inc. Wireless Systems Design
Mini-Systems Inc. Semflex Inc. WJ Communications
Mission Telecom Co. Ltd. Semi Dice Inc. Xemod
MITEQ Shadow Technologies Inc. XL Microwave Inc.
Mitsubishi Electronics Sheldahl Inc. Xpedion Design Systems
MMCOMM Inc. SierraCom Yageo America
Modco Inc. Sierratherm Production Furnaces Zeland Software Inc.
Modular Components/Maryland MPC Sigma Systems Corp. Zentrix Technologies
Molex RF/Microwave Connector Signal Technology Corp. Zeta, Division Of Sierra Tech
Morgan Advanced Ceramics Sinclair Manufacturing Co. ZIFOR Enterprise Co., Ltd.
58
 HISTORICAL EXHIBIT
The Microwave Theory and Techniques Society Historical Ex-
hibit will be located at the Phoenix Civic Plaza. Symposium atten-
dees are encouraged to visit the Historical Exhibit during the reg-
ular exhibition hours, Tuesday through Thursday.
The Historical Exhibit includes the MTT-S library collection of
books and documents with descriptions of early theoretical and
experimental achievements in microwaves. A collection of histor-
ical artifacts will be on display, including electron devices from
the early 1930s (klystrons, magnetrons, traveling-wave tubes),
modern MMIC chips and T/R modules. There will also be sched-
uled showings of videotapes describing historic developments in
microwaves.
SPECIAL EXHIBIT ON THE INVENTIONS OF AL GROSS
The Phoenix symposium will also feature a special exhibit of
the inventions of Al Gross, who is recognized for his contribu-
tions as a pioneer in the field.
The role that Al Gross played in
the development of miniatur-
ized, portable communication
devices, as a forerunner of the
communication revolution will
be recognized in the exhibition.
The first invention that Al devel-
oped in 1938 was the walkie-
talkie, a small hand-held radio
with two-way communication
features. This device is still in use today, used by law enforce-
ment, firefighters etc. In addition, he developed a two-way air-to-
ground communications system used in World War II.
NIST CENTENNIAL:
CELEBRATING ADVANCES IN RF TECHNOLOGY
In addition, there will be an exhibit from the National Institute
of Standards and Technology (NIST) celebrating its centennial.
NIST, the successor to the former National Bureau of Standards
(NBS), celebrates its centennial this year. This exhibit contains ar-
tifacts, photographs, seminal papers, and descriptions of seven
important NIST contributions to RF metrology: This includes the
Six-Port Network Analyzer, Microcalorimeter for Power Measure-
ment, Reentrant Cavity for Dielectric Measurements, Waveguide
Below Cut-off Attenuation Standard, Cryogenic Primary Noise
Standard, On-wafer TRL Calibration and Near-Field Antenna Mea-
surements
Learn more about both NIST history and current technological
advances in Special Session WE-2D “The NBS/NIST Centennial:
One Hundred Years of RF Metrology and Standards,” Wednesday
at 10:10 AM.
HISTORICAL ELECTRONICS MUSEUM
The Historical Electronics Museum is the permanent home of
the MTT-S Historical Collection between Symposia. The Museum
holds many microwave-related items besides the MTT-S Collec-
tion, including parts of the SCR-270 (Pearl Harbor) radar and a
complete SCR-584 radar, which was used with the proximity fuze
in World War II. It also contains an impressive library of over
7,000 books and 11,000 journals. The Museum is located near Bal-
timore-Washington International Airport, and is approximately 20
minutes from the downtown Baltimore. Additional information
on the Museum can be found on its Web site at http://www.
erols.com/radarmus, or call (410) 765-2345.

ADDITIONAL MEETINGS (Check www.ims2001.org for updates.)

Saturday, May 19 8:00 AM–11:30 AM
1:00 PM–5:30 PM
6:00 PM–8:30 PM
8:00 PM–11:00 PM
Sunday, May 20 7:00 AM–8:30 AM
7:00 AM–8:30 AM
7:00 AM–8:00 AM
7:00 AM–5:30 PM
12:00 PM–1:00 PM
8:00 AM–5:30 PM
12:00 PM–1:30 PM
7:00 PM–10:00 PM
Monday, May 21 7:00 AM–9:00 AM
7:00 AM–8:00 AM
7:00 AM–9:00 AM
7:00 AM–5:30 PM
12:00 PM–1:00 PM
6:00 PM–8:00 PM
Tuesday, May 22 7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–5:30 PM
12:00 PM–1:30 PM
12:00 PM–1:30 PM
4:30 PM–6:30 PM
5:00 PM–10:00 PM
7:00 PM–9:30 PM
Wednesday, May 23 7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–5:30 PM
12:00 PM–1:30 PM
6:00 PM–7:30 PM
7:30 PM–10:00 PM
Thursday, May 24 7:00 AM–9:00 AM
7:00 AM–9:00 AM
7:00 AM–5:30 PM
12:00 PM–1:30 PM
12:00 PM–1:00 PM
Friday, May 25 7:00 AM–8:00 AM
7:00 AM–9:00 AM
7:00 AM–5:30 PM
12:00 PM–1:00 PM
AdCom Budget Committee Hyatt
AdCom Long Range Planning Hyatt
AdCom Reception and Dinner Hyatt
AdCom Meeting Hyatt
Speakers’ Breakfast Hyatt
AdCom Breakfast Hyatt
Workshops Breakfast Symphony Terrace
Speakers’ Preparation Civic Plaza, Yuma 29
Workshops Lunch Symphony Terrace
AdCom Meeting Hyatt
AdCom Lunch Hyatt
RFIC Reception Crowne Plaza
Speakers’ Breakfast Hyatt
Workshops Breakfast Symphony Terrace
Members’ Breakfast Symphony Terrace
Speakers’ Preparation Civic Plaza, Yuma 29
Workshops Lunch Symphony Terrace
Microwave Journal Reception Hyatt
Speakers’ Breakfast Hyatt
Members’ Breakfast Symphony Terrace
Speakers’ Preparation Civic Plaza, Yuma 29
RF and Microwave Education Forum Civic Plaza, Flagstaff 2–5
TCC Meeting Hyatt
Chapter Chairman’s Reception & Meeting Hyatt
Corona Ranch Event Corona Ranch & Rodeo Grounds
Rump Session Hyatt
Speakers’ Breakfast Hyatt
Members’ Breakfast Symphony Terrace
Speakers’ Preparation Civic Plaza, Yuma 29
2002 IMS TPC Lunch Hyatt
Industry-hosted Cocktail Reception Hyatt
MTT-S Awards Banquet Hyatt
Speakers’ Breakfast Hyatt
Members’ Breakfast Symphony Terrace
Speakers’ Preparation Civic Plaza, Yuma 29
2001/2002 IMS Steering Committee Lunch Hyatt
Students Awards Luncheon Hyatt
Workshops Breakfast Symphony Terrace
Speakers’ Breakfast Hyatt
Speakers’ Preparation Civic Plaza, Yuma 29
Workshops Lunch Symphony Terrace

59
 2001 MTT-S AWARDS
2001 DISTINGUISHED SERVICE AWARD
The Distinguished Service Award is presented to recognize an individual who has giv-
en outstanding service for the benefit and advancement of the Microwave Theory and
Techniques Society.
This year’s recipient is Dr. Reynold Kagiwada.
Citation:
“FOR HIS OUTSTANDING AND DEDICATED SERVICE TO THE SOCIETY.”
2001 DISTINGUISHED EDUCATOR AWARD
This award was inspired by the untimely death of Prof. F.J. Rosenbaum (1937–1992),
an outstanding teacher of microwave science and a dedicated Administrative Committee
Member and contributor. The award recognizes a distinguished educator in the field of
microwave engineering and science who best exemplifies the special human qualities of
Fred Rosenbaum who considered teaching a high calling and demonstrated his dedica-
tion to the Society through tireless service.
This year’s recipient is K.C. Gupta.
Citation:
“FOR OUTSTANDING ACHIEVEMENTS AS AN EDUCATOR, MENTOR AND ROLE
MODEL OF MICROWAVE ENGINEERS AND ENGINEERING STUDENTS.”
2001 MICROWAVE PIONEER AWARD
The Microwave Pioneer Award recognizes an individual or a team not exceeding three
persons having made outstanding pioneering technical contributions that advance mi-
crowave theory and techniques and described in an archival paper published at least 20
years prior to the year of the award.
This year’s recipient is Prof. Om P. Gandhi.
Citation:
“FOR CONTRIBUTIONS TO DOSIMETRY OF ELECTROMAGNETIC RADIATION AND
RESULTING REVISIONS OF RF/MICROWAVE SAFETY STANDARDS.”
2001 MICROWAVE PRIZE
The Microwave Prize recognizes, on an annual basis, the most significant contribution
by a published paper to the field of interest of the Microwave Theory and Techniques So-
ciety. Papers under consideration are those published during the period January 1 to De-
cember 31 of the year preceding the Fall Meeting of the Administrative Committee at
which the award is considered.
This year’s recipients are Dan Anderson, Mitek Lisak, Ulf Jordan, Torbjörn Olsson,
and Mats Ahlander.
Citation:
“FOR A SIGNIFICANT CONTRIBUTION TO THE FIELD OF ENDEAVOR OF THE IEEE
MTT SOCIETY IN THE PAPER ENTITLED, “MICROWAVE BREAKDOWN IN RESONATORS AND
FILTERS,” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, MTT-48,
PP. 2547–2556 (1999)”
2001 N. WALTER COX AWARD
The N. Walter Cox Award has been established in recognition of the qualities of N.
Walter Cox and his service to the MTT Society prior to his untimely death in 1988. It is giv-
en to a Society volunteer whose efforts on behalf of MTT-S best exemplify Walter’s spirit
and dedication.
This year’s recipient is John W. Wassel.
Citation:
“FOR EXEMPLARY SERVICE, GIVEN IN A SPIRIT OF SELFLESS DEDICATION AND
COOPERATION.”
2001 IEEE ELECTROMAGNETICS AWARD
The IEEE Electromagnetics Award was established in 1996, and is presented to an in-
dividual for outstanding contributions to electromagnetics in the areas of theory, appli-
cation or education. The Award consists of a bronze medal, certificate and a cash prize.
This year’s recipient is Fawwaz Ulaby.
Citation:

2001 APPLICATION AWARD “FOR CONTRIBUTIONS TO MICROWAVE REMOTE SENSING AND TECHNOLOGY,
The Microwave Application Award recognizes an individual or team for outstanding ITS GEOSCIENTIFIC APPLICATIONS, AND RELATED EDUCATION.”
application of microwave theory and techniques. This year’s recipient is James C. Rautio.
Citation:
“FOR DEVELOPMENT OF WIDELY-USED FULL-WAVE ELECTROMAGNETIC
SOLUTION SOFTWARE FOR THE COMPUTATION OF PRINTED CIRCUIT
CHARACTERISTICS.”

IEEE FELLOWS: CLASS OF 2001

The Member Grade of fellow is conferred in recognition of unusual and outstand- Raafat R. Mansour For contributions to the development of high
ing professional distinction. It is awarded at the initiative of the IEEE Board of Direc- temperature superconductive filters and multiplexers.
tors following a rigorous nomination and evaluation process. Individuals receiving
this distinction have demonstrated extraordinary contributions to one or more fields
Wolfgang S. Menzel For contributions to the development of microwave
of electrical engineering, electronics, computer engineering and related sciences.
fin-line circuits.
This Grade is not conferred automatically on nomination; only a fraction of those
nominated are elected.
Fifteen MTT-S Members who were evaluated by our society were elected to the Jozef Wieslaw Modelski For contributions to microwave semiconductor phase
Grade of Fellow, effective 1 January 2001: modulators and phase shifters.
NAME CITATION
Martin Nisenoff For leadership in the application of high temperature
superconductivity and cryogenics to microwave
Charles Howard Cox, III For contributions to the analysis, design components and systems.
and implementation of analog optical links.

Edward Anthony Rezek For contributions to GaAs and InP monolithic microwave
Samir M. El-Ghazaly For contributions to the analysis and simulations integrated circuits and optoelectronic devices.
of microwave devices and circuits.

Arvind Kumar Sharma For contributions to active device and passive

Pierre Guillon For contributions to the theory and applications component modeling, and design of high power
of dielectric resonators and to computer aided design monolithic millimeter-wave integrated circuits.
of microwave passive and active devices.

Peter H. Siegel For contributions to the field of millimeter and

Aditya Kumar Gupta For contributions to the advancement of microwave submillimeter-wave radiometry, technology and
monolithic integrated circuit technology and leadership spaceborne instruments.
in the development of manufacturable processes.

Wai-Cheung Tang For contributions to the miniaturization of microwave

Wojciech Kazimierz Gwarek For contributions to the theory and applications of filters and multiplexers for satellite applications.
electromagnetic modeling

Ke Wu For contributions to hybrid integration of planar and

Dieter Stefan Jäger For contributions to the development of device non-planar microwave and millimeter-wave circuits and
concepts in microwaves and photonics. guided-wave structures.
60
 In addition, the following twelve MTT-S Members of the Class of 2001 Fel-
lows were evaluated by other Societies:
John D. Cressler For contributions to the understanding and optimization
of silicon and silicon-germanium bipolar transistors.
Daniel De Zutter For the application of Maxwell’s equations and for the
development of numerical solution methods in electromagnetic
scattering, antennas, and microwave circuits.
Ronald Dale Esman For contributions to the development of fiber optic systems
for microwave applications and optical fiber research.
Peter S. Hall For contributions to the development and application of
microstrip antennas and active integrated antenna arrays.
Jian-Ming Jin For contributions to computational electromagnetics
and its applications to antennas, radar scattering,
microwave circuits, and biomedical technology.
Kei May Lau For contributions to III-V compound semiconductor
heterostructure materials and devices.
GENERAL INFORMATION
Information Booth: Pamphlets and information on the
Phoenix area will be available at a booth centrally located in
Lobby I of the Civic Plaza. Representatives of the Phoenix Con-
vention and Visitors Bureau will man the booth. The Hospitality
Suite is located in the Sundance Room of the Hyatt Hotel.
IEEE/MTT-S Memberships: An IEEE/MTT-S membership booth
will be located in Lobby II. (In addition, a membership applica-
tion is provided on page 6 of this program.) Those who apply
for membership on site will be eligible for the discounted mem-
ber rates on registration fees. IEEE members (or on-site appli-
cants) who register for the full Symposium and have not been
MTT-S members in the past year will be offered a free basic
MTT-S membership good until the end of the year, which will
include admission to the MTT-S members’ breakfasts.
NOTES
61
Krzysztof A. Michalski For the development of numerical solution methods in
electromagnetic scattering, antennas, and microwave circuits.
Donald Ralph Pflug For contributions to the development and promotion of
electromagnetic analysis code validation.
Roberto G. Rojas For contributions to the understanding of high
frequency electromagnetic radiation and scattering.
Krishna Shenai For contributions to the understanding, development
and application of power semiconductor devices and circuits.
Toshiyuki Shiozawa For contributions to engineering-oriented relativistic
electromagnetic theory and theoretical study of free-electron
lasers.
Winston I. Way For contributions in applying subcarrier multiplexing techniques
to lightwave technologies for hybrid fiber-coax access systems.
Drinks and Refreshments: Free coffee and soft drinks will be
available during mid-morning and mid-afternoon breaks in the
refreshment areas in the exhibition hall.
Smoking: Smoking is not permitted in the Civic Plaza. Many
restaurants in Phoenix are completely smoke-free but, general-
ly, if there is a lounge attached, some smoking is permitted. It is
best to inquire when making reservations.
Recruiting: Businesses do not send their personnel to the IMS to
be recruited by other businesses. To ensure that these meetings
continue in the future, IEEE policy insists that recruiting does
not occur at the Symposium.
Recording of Technical Presentations: The recording of
technical presentations by video or audio recorders or cameras
is not allowed without the permission of the speaker and notifi-
cation of the session organizer.
 2001 IEEE MTT-S TECHNICAL PROGRAM COMMITTEE

Mohamed Abouzahra Ravindra Goel Olivier Llopis Paul Saunier

Douglas Adam Jitendra Goel Stephen Lloyd James Schellenberg
Fazal Ali Marc Goldfarb David Lovelace Manfred Schindler
David Allstot Charles Goldsmith Johann Luy Dietmar Schmitt
Roberto Alm Mike Golio Gregory Lyons Franco Sechi
Fritz Arndt Stephan Goodnick Stephen Maas Alwyn Seeds
Peter Asbeck Anand Gopinath Mohamad Madihian John Sevic
Kirk Ashby Mark Gouker Asher Madjar Arvind Sharma
John S. Atherton Ed Griffin Raghu Mallavarpu Tsugumichi Shibata
Ali Atia Marco Guglielmi Donald Malocha Wayne Shiroma
Inder Bahl Pierre Guillon Raafat Mansour Bernard Sigmon
John Bandler K.C. Gupta Edgar Martinez Zbynek Skvor
Rajeev Bansal Madhu S. Gupta Mehran Matloubian Phillip Smith
Zaher Bardai Ramesh Gupta J.K. McKinney Chris Snowden
Scott Barker Aditya Gupta David McQuiddy Richard Snyder
John Barr Wojciech Gwarek Mohamed Megahed Harold Sobol
H. Clark Bell Ron Ham David Meharry Elissa Sobolewski
Adalbert Beyer Ramesh Harjani James Mink Moise Solomon
Sarjit Bharj Mike Harris koji Mizuno Roberto Sorrentino
Radek Biernacki James Harvey Jozef Modelski Emilio Sovero easovero
Luciano Boglione John Heaton Jyoti Mondal Richard A. Sparks
Jens Bornemann Patric Heide Mauro Mongiardo Barry Spielman
Hermann Boss Stefan Heinen Amir Mortazawi Peter Staecker
Ali Boudiaf Wolfgang Heinrich Vijay Nair Joe Staudinger
Tom Brazil George Heiter Krishna Naishadham Michael Steer
Gailon Brehm Rudolf E. Henning Brad Nelson Steven Stitzer
Klaus Breuer Peter Herczfeld David NGO Eric Strid
Steve Brozovich Wolfgang J.R. Hoefer Edward Niehenke Roger W. Sudbury
Charles Buntschuh Kazuhiko Honjo Martin Nisenoff Frank Sullivan
Mark Calcatera Derry Hornbuckle Toshio Nishikawa Dan Swanson
Edmar Camargo John B. Horton Michal Odyniec Bela Szendrenyi
Natalino Camilleri Charles Huang Hiroyo Ogawa Salvador Talisa
Raymond Camisa Ho Huang Aaron Oki Wai-Cheung Tang
Richard Campbell H. Alfred Hung Arthur Oliner Douglas Teeter
Andreas Cangellaris James Hwang Abbas Omar Bruce Thompson
Kenneth Carr Kiki Ikossi John Owens Michael Thorburn
Christopher Chang Tatsuo Itoh Terry Oxley Mike Thursby
Kai Chang Ferdo Ivanek John Papapolymerou Yevgeniy Tkachenko
Frank Change David Jackson Don Parker Kiyo Tomiyasu
Thomas Cho Robert W. Jackson Suman Patel Robert J. Trew
John Choma Charles Jackson Anthony Pavio James Tsui
Debabani Choudhury Dieter Jaeger Jeanne Pavio Ching-Kuang Tzuang
Terry Cisco Rolf H. Jansen Song-Tsuen Peng Yohtaro Umeda*
Eliot Cohen George Jerinic Barry Perlman Ruediger Vahldieck
James Crescenzi Albert Jerng John Pierro André Vander Vorst
Nirod Das Reynold Kagiwada Aryeh Platzker Karl Varian
Lionel Davis Sridhar Kanamaluru Roger D. Pollard Kikuo Wakino
John Davis Linda Katehi George Ponchak Chi Wang
James Degenford Allen Katz Jeffrey Pond Denis Webb
Michael DeLisio Roger Kaul Zoya Popovic Robert Weigel
Edgar Denlinger Steve Kenney Marian Pospieszalski Claude Weil
Yann Deval Amarpal Khanna Reinhold Pregla Sander Weinreb
Norman Dietrich Sayfe Kiaei Sam Pritchett Andreas Weisshaar
Guglielmo D’Inzeo Marek Kitlinski Frederick Raab Charles Weitzel
Rahul Dixit Reinhard Knerr Lamberto Raffaelli Thomas Weller
Paul Draxler Kevin Kobayashi Richard Ranson Cheng P. Wen
Lawrence Dunleavy Hiroshi Kondoh James Rautio Scott Wetenkamp
Michael Dydyk Youji Kotsuka Gabriel Rebeiz James Whelehan
Samir El-Ghazaly Chandra Kudsia Don Reid Larry Whicker
Badawy Elsharawy Bill Kuhn Kate Remely Lawrence Williams
Sherif Embabi Mahesh Kumar Leonard D. Reynolds Dylan Williams
Murat Eron H. John Kuno Edward Rezek Ke Wu
Ronald Esman Larry Kushner Alfy Riddle HungYu David Yang
Aly Fathy Paolo Lampariello Vittorio Rizzoli Tsukasa Yoneyama
S. Jerry Fiedziuszko Mike Lancaster David Root Robert York
Victor Fouad Hanna Joy Laskar Luca Roselli Paul Yu
Ian Galton Timothy Lee Arye Rosen Kawthar Zaki
Carol Gee Chi Lee Peter Russer Jan Zehentner
Bernard Geller Ralph Levy Magdalena Salazar-Palma David Zimmermann
Ed Godshalk Guo-Chun Liang Tapan Sarkar

62
 2001 IEEE MTT-S IMS STEERING COMMITTEE
General Chair Transportation Chuck Weitzel, Vice-Chair Workshop
Samir El-Ghazaly Marcel Tutt, agbp70@email.sps.mot.com Badawy El-Sharawy,
sme@asu.edu Sub-Committee Chair T 480-413-5406 Sub-Committee Chair
T 480-965-5322 r44854@email.sps.mot.com F 480-413-4453 elsharawy@asu.edu
F 480-965-8325 T 480-413-6671 Publications (CD-ROM, Digest) T 480-965-8591
Stephen Goodnick, Vice-Chair F 480-413-4453 Bernard Sigmon, Digest Editor Tarek Ismail, Sub-Committee
stephen.goodnick@asu.edu Murray Sirkis, Consultant b.sigmon@IEEE.org Vice-Chair
T 480-965-6410 murray.sirkis@asu.edu T 480-545-4096 tarek.ismail@philips.com
F 480-965-3837 T 480-967-2738 F 480-545-4096 T 480-752-6462
Adolfo Reyes, Secretary Audio/Visual Rudy Emrick, Co-Editor F 480-752-6122
r10895@email.sps.mot.com Gary Sadowniczak, rudy.emrick@motorola.com Gamal Fahmy, Web Master
T 480-413-5110 Sub-Committee Chair T 480-732-6938 Gamal.Fahmy@asu.edu
F 480-413-4453 rp5431@email.sps.mot.com F 480-732-6550 T 480-804-0591
Joe Staudinger, Liaison, RFIC T 480-413-6625 Steve Rockwell, Co-Editor Mohamed Megahed, Member
ryym70@email.sps.mot.com F 480-413-6744 s.rockwell@motorola.com mohamed.megahed
T 480-413-4456 Polka Lesley, Member T 480-732-6948 @conexant.com
F 480-413-4034 lesley.a.polka@intel.com F 480-732-5559 T 949-483-7244
Michael Majerus, T 480-554-1728 Debabani Choudhury, Deborah Dendy, Member
Liaision, ARFTG F 480-554-7615 CD-ROM Editor Bill Agar, Member
ryxg50@email.sps.mot.com Signs dchoudhury@hrl.com bagar@usmonolithics.com
T 480-413-3461 Tom Post, Sub-Committee Chair T 310-317-5584 T 480-539-2553
F 480-413-4453 tompost@home.com F 310-317-5450 Ken Buer, Member
Finance VIP Arrangements & Gifts Rashaunda Henderson, Interactive Forum
Rodolfo Diaz, Chair Ellen Lan, Sub-Committee Chair CD-ROM Co-Editor Peter Okrah,
rudydiaz@asu.edu a635aa@email.sps.mot.com rashaunda.henderson Sub-Committee Chair
T 480-965-4281 T 480-413-4128 @motorola.com rp5597@email.sps.mot.com
F 480-965-1384 F 480-413-4453 T 480-413-5374 T 480-413-6414
George Norris, Consultant Daybook F 480-413-7918 F 480-413-6780
rxzt70@email.sps.mot.com Ric Uscola, Sub-Committee Chair Panel/Rump Sessions ARFTG Conference
T 480-413-3958 r.uscola@motorola.com Peter Blakey, Dave Lovelace, Chair
F 480-413-6744 T 480-413-5966 Sub-Committee Chair dlovelace@gain.com
Local Arrangements F 480-413-4453 T 480-413-4225 T 480-759-0200 x213
Howard Patterson, Chair Publicity George Pan, F 480-704-1500
rzaw10@email.sps.mot.com Trevor Thornton, Chair Sub-Committee Vice-Chair Robert Grondin
T 480-413-5537 t.thornton@asu.edu GEORGE.PAN@asu.edu Bob.Grondin@asu.ed
F 480-413-4433 T 480-965-3808 Special Sessions T 480-965-1750
Michael Majerus, Vice-Chair F 480-965-8058 Mike Golio, Irving Kaufman
ryxg50@email.sps.mot.com Web site Sub-Committee Chair Irving.Kaufman@asu.edu
T 480-413-3461 Siham El-Ghazaly, Webmaster m.golio@ieee.org T 480-965-5974
F 480-413-4453 sihamabd@home.com T 319-295-3926
F 319-295-2751 Exhibition
Echo Farrell, Consultant Neil Tracht, Member Harlan Howe, Chair
efarrell@destinationechoes.com rwrt20@email.sps.mot.com Student Paper hhowe@mwjournal.com
T 480-607-9990 T 480-413-4999 John Papapolymerou, T 781-769-9750
F 480-607-9995 F 480-413-4453 Sub-Committee Chair F 781-769-5037
Mary Young, Consultant Eric M. Johnson, Member papapol@ece.arizona.edu
T 520-621-4462 Kristen Dednah, Member
MYEvents@aol.com rzal90@email.sps.mot.com kdednah@mwjournal.com
T 480-968-7559 T 480-413-4673 F 520-626-3144
T 781-769-9750
F 480-968-7560 F 480-413-4453 Navid Yazdi, Sub-Committee F 781-769-5037
Special Events Jeff Pond, Member Vice-Chair
yazdi@asu.edu Program Publication
Deborah Patterson, pond@chrisco.nrl.navy.mil Keith Moore
Sub-Committee Chair T 202-767-2862 T 480-965-4456
kmoore@mwjournal.com
dpatterson@flipchip.com F 202-767-0455 Transactions Special Issue T 781-769-9750
T 602-431-6020 x212 Technical Program Constantine Balanis, Co-Editor F 781-769-5037
F 602-431-6021 Vijay Nair, Chair balanis@asu.edu
T 480-965-3909 At-Large Members
Monica C. de Baca, Member v.nair@ieee.org Howard Ellowitz, Member
ryvr20@email.sps.mot.com T 480-755-5590 Michael Dydyk, Co-Editor hellow@compuserve.com
T 480-413-4536 F 480-755-5002 p03251@email.sps.mot.com T 781-769-9750
F 480-413-4453 T 480-441-2074 F 781-769-5037

63
 IEEE MTT-S ADMINISTRATIVE COMMITTEE

2001 OFFICERS
President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .C.M. Jackson
Vice President . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.T. Barr, IV
Treasurer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J.S. Kenney
Secretary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .W. Shiroma

ELECTED ADCOM MEMBERS

2001 2002 2003
R.B. Marks J.T. Barr, IV S.M. El-Ghazaly
J. Modelski M.D. DeLisio M. Harris
S.J. Fiedziuszko K.C. Gupta K. Honjo
F.J. Sullivan C.M. Jackson J.S. Kenney
R.J. Trew M.J. Schindler J.M. Pond
S. Wetenkamp K.V. Varian R. Sorrentino
G. Thoren

IMMEDIATE PAST PRESIDENTS

2000 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .R.W. Sudbury
1999 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .E.A. Rezek
1998 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .R.D. Pollard

HONORARY LIFE MEMBERS

A.C. Beck A.A. Oliner K. Tomiyasu
S.B. Cohn T.S. Saad L. Young
T. Itoh

FUTURE IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIA

2002 — SEATTLE, WA — JUNE 3–7, 2002

General Chairman Operations Chairman Technical Program Technical Program
Donn Harvey Tom Raschko Ed Godshalk Eric Strid
Metawave Seaport Technical Sales Maxim Cascade Microtech
Tel (425) 702-5816 Tel (425) 391-6714 Tel (503) 641-3737, ext. 1633 Tel (503) 601-1223
donnh@matawave.com tomseaport@seanet.com edg@mxim.com eric@cmicro.com
Finance Local Arrangements Publications Publicity/Web Master
Steve Peters Jim Freeman Rob Hamilton Garth Sundberg
Radio Frames Networks Boeing Consultant OSU
Tel (425) 844-9307 Tel (253) 657-9110 rhamilton@tqs.com sundberg@ece.orst.edu

2003—PHILADELPHIA, PA 2005—LONG BEACH, CA 2007—HONOLULU, HI

June 8–13, 2003 June 12–17, 2005 June 2007
Chairman Chairman Chairman
Richard Snyder Charlie Jackson Mike DeLisio
RS Microwave TRW University of Hawaii
Tel (973) 492-1207 Tel (310) 812-0283 Tel (808) 956-7898 • Fax (808) 956-3427
r.snyder@ieee.org c.jackson@ieee.org delisio@ieee.org

2004—FORT WORTH, TX 2006—SAN FRANCISCO, CA 2008—ATLANTA, GA

June 6–11, 2004 June 11–16, 2006 June 2008
Chairman Co-Chairmen Chairman
Karl Varian Jerry Fiedziuszko John T. Barr, IV Joy Laskar
Raytheon Space Systems/LORAL Hewlett-Packard Georgia Tech
Tel (972) 344-2616 Tel (650) 852-6868 Tel (707) 577-2350 Tel (404) 894-5268 • Fax (404) 894-0222
k.varian@ieee.org fiedziuszko.jerry@ssd.loral.com j.barr@ieee.org joy.laskar@ece.gatech.edu

64
 PHOENIX INFORMATION
TRAVEL TO PHOENIX
Due to the summer heat, Phoenix was more of a seasonal destination in years past
and airport crowds were winding down in late May. Now the city has grown so much that
it is a popular destination year-round. A number of airlines serve the Phoenix area with
both national and international arrivals. If you travel with America West Airlines, the offi-
cial airline of the IMS2001, and the one with the most direct flights into Phoenix, you will
fly into Sky Harbor International Airport at Terminal 4 which also serves Southwest Air-
lines. There are two other terminals at the airport, numbered 2 and 3 (there is no termi-
nal 1) which serve the other airlines. As you exit the passenger areas of the terminals
and follow the signs to baggage claim you will see rental car counters and courtesy
phones with which to arrange hotel transportation. Taxis can be hailed outside the termi-
nals, usually on the north side. Phoenix is very spread out and it is not easy to walk to any
but the closest destinations, especially if the weather is very hot. The local committee
has addressed transportation needs by arranging shuttle buses between distant hotels,
the convention center, and special event destinations. City buses are also available and
the downtown area has a “DASH” shuttle locally, but a rental car is recommended for
those who would like to see more of the city. Parking is abundant and inexpensive any-
where in the city, quite unlike many older cities in the United States. Take advantage of
the convenience of a car if you can.
The area around the convention center is called “Copper Square” and reflects the
historic importance of copper mining in the development of Arizona. Maps are available
in the main lobby of the convention center and at the concierge desks of the hotels to in-
form you of parking areas, attractions, dining, etc. Walking distances downtown are
smaller than in other parts of the city and walking to some museums, restaurants, and
shopping can be a great experience. Be careful to protect yourself from too much sun
exposure.
LOCAL
Phoenix, Arizona is a city built on the ruins of an ancient Indian civilization, and prides
itself today in having truly risen from these ashes to become the southwest’s greatest
city. Archaeological evidence indicates that people have been living in the area for more
than 8000 years. From the 8th century through the 14th century the Hohokam people, a
society of desert farmers inhabiting the region, used water from the Salt River in an ex-
tensive irrigation canal system. Phoenix was founded by farmers who used the same
canals of the ancient people to irrigate their crops. Many of the present canals that cross
the landscape are the re-dug canals of the ancient Indians, which serve the modern in-
habitants quite well. Unlike older cities that trace their heritage back centuries to Euro-
pean settlers, the Arizona capitol dates only to the late 1860s. There are no great antiqui-
ties, no old ethnic neighborhoods. The city is young, vibrant, and growing, with the metro
area home to almost 3 million people at the present time, and with more moving in every
month. Over the years, Phoenix has both enjoyed the benefits and suffered the problems
of rapid urban growth. It has gone from a tiny agricultural village to sprawling metropolis
in little more than a century. Along the way it has lost its past amid urban sprawl and
unchecked development; but at the same time, it has forged an environment that’s quin-
tessentially 20th-century American. Shopping malls, the new gathering places of America,
are raised to an art form in Phoenix. Luxurious resorts create fantasy worlds of water-
falls and swimming pools. Perhaps it’s this willingness to create a new world on top of an
old one that attracts people to the area. Then again, perhaps it’s just all that sunshine.
Many people have moved to the city for its combination of mild weather, beautiful
scenery, and relaxed lifestyle.
Called the “Valley of the Sun,” Phoenix averages 300 sunny days per year. The weather
is warm, sunny and usually dry. Many summer days average over 100°F but low humidity
makes the heat more comfortable than in other hot climates. For all those spending
much time outdoors, sunscreen is a necessity to avoid painful sunburn. Be careful to
drink plenty of water to avoid dehydration and wear adequate clothing such as a light,
long-sleeved shirt and loose-fitting cotton pants. A wide brimmed hat is also a good idea
for outdoor protection. Remember, very little clothing may seem cooler but protection
from the sun is very important if you will be under its rays for extended periods.
Phoenix is located in the northern end of the Sonoran Desert, an arid region covering
120,000 square miles in southwestern Arizona, southeastern California, and Mexico. The
desert probably takes its name from the Papago Indian term Sonota, which means “place
of plants”. The Sonoran is probably one of the world’s lushest deserts. The most con-
spicuous flora are cacti, including the saguaro, prickly pear, cholla, staghorn, organ-pipe,
and barrel cactus varieties. Many cacti can be seen within the city itself, being planted in
many public area and in private yards. The famous saguaro cactus, the “sentinel of the
desert” is found only in the Sonoran Desert and may live to be 200 years old, reach 50
feet tall and weigh as much as six tons. At 75 or so, when most humans are headed for
their last roundup, a saguaro will sprout its first arm. Many saguaros have two to five
arms and a grandpa saguaro may have 50. The region’s reptilian wildlife includes the
desert tortoise, Gila monster, chuckwalla, banded gecko, Colorado desert fringe-toed
lizard, desert horned lizard, and numerous species of rattlesnake. If you have the oppor-
tunity to view the desert up close, you will see a fascinating, haunting, rock-strewn place
filled with spectacular mountains and unusual plants which in some areas approaches a
65
fairy landscape. It is highly recommended that you take the time to do a desert tour of
some type in order to experience this beautiful and wild country first-hand.
Geographically, most of the city is built upon a flat plane with dramatic and jagged
mountain ranges to the north, south, and east. A flat-topped mountain range due east of
Phoenix is the famous Superstition Mountains, site of the “Lost Dutchman Gold Mine.”
Several smaller mountain ranges within the city limits are spectacular backdrops to the
many palm trees which grace the streets and highways of the city. Phoenix has a high-rise
downtown but not to the extent of older cities. Due to the ready availability of empty flat
land on which to build, the city has moved out rather than up. Because of the large dis-
tances within, Phoenix is best seen by car. Many excellent restaurants, shopping areas,
and cultural attractions exist for the visitor. Not to be missed is old-town Scottsdale
where many fine art galleries and quaint shops can be found. The local committee has
prepared a diverse guest program for those who wish to see Phoenix and various South-
west attractions. We hope you enjoy the desert and the city of Phoenix. There is some-
thing exhilarating about the dryness, warmth, brilliant light, and the Southwestern expe-
rience which we are sure you will not soon forget.
SOCIAL EVENTS
RFIC Symposium Reception: All RFIC Symposium attendees are invited to attend a reception
hosted by the RFIC Steering Committee and several leading RF/Wireless IC vendors on Sunday,
May 20 from 6:00 PM to 10:00 PM at the Crowne Plaza Hotel. Admission tickets for attendees and
one guest will be included in the registration packets.
Microwave Journal/MTT-S Reception: All Microwave Week attendees and exhibitors are
invited to attend a reception hosted by Microwave Journal and MTT-S on Monday, May 21 from
6:00 PM to 8:00 PM at the Heard Museum, 2301 North Central Ave., Phoenix. Transportation will
leave the Civic Plaza starting at 5:30 PM.
Industry Hosted Cocktail Reception: Symposium exhibitors will host a cocktail reception
on Wednesday, May 23 from 6:00 PM to 7:30 PM at the Hyatt Regency Hotel. Complementary bever-
age tickets will be included in the registration packages.
IEEE MTT-S Awards Banquet: The Annual Awards Banquet will be held on Wednesday, May
23rd from 7:30 PM to 10:00 PM at the Hyatt Regency. This evening will consist of an elegant dinner,
awards presentation and entertainment. The banquet will feature Native American dancers and
an after dinner performance by comedian Paula Poundstone.
Student Awards Banquet: Student paper awards will be presented at the Student Awards
Banquet on Thursday, May 24 at noon. The banquet is free of charge for all Symposium student
registrants and advisors.
IEEE Women in Engineering Reception: Meet and interact with a panel of distinguished
professionals from academia and industry who share common interests in promoting the
Women in Engineering Forum. Build connections with peers, share your background, thoughts
and experiences of common interest to women in engineering. Admission not restricted to
women. This event takes place on Wednesday, May 23, from 5:30–7:30 PM at the Hyatt Regency,
Cassidy Room.
MTT-S SPECIAL TUESDAY EVENING EVENT
CORONA RANCH & RODEO GROUNDS
TUESDAY, MAY 22, 2001
MTT-S 2001 will sponsor a unique southwestern event on Tuesday evening. We have
reserved a fleet of buses that will transport you to Corona Ranch and Rodeo Grounds, lo-
cated in the shadow of South Mountain. As you exit your bus, you will be greeted by Mari-
achis and Margaritas. Once inside the grounds, the reception will start with a variety of
hors d’hourves and libations to celebrate the spirit of the southwest. Walk around the
grounds and participate in several Cowboy events: See how long you can ride the bucking
barrel (er, we mean “bull”)! Our cowboys will provide roping lessons, after which you
will test your new found skills by roping a mechanical “calf.” And, of course, the activities
would not be complete without lessons in the quick draw – after which, you will get to try
out your fast draw against your fellow conference attendees! A Country & Western band
will keep you rockin’ throughout the night.
This special event will include a Rodeo Show that highlights the most exciting por-
tions of both Western Rodeo and Mexican Charreada. The Charreada will demonstrate
riding, roping, accuracy, and style. The Western Rodeo showcases wild bull riding and
western style wild bronco riding. Other activities will include precision high speed horse
maneuvers, trick roping, the women’s formation drill team and much more! We will also
have two very special Audience Participation rodeo events set aside for MTT-S atten-
dees! This is one of the best parts of the Rodeo and promises to be a hilarious event.
After the Rodeo, the feast begins…our Cowboy cuisine includes mesquite grilled top
sirloin paired with BBQ chicken and western ribs. Mixed greens, baked beans, corn-on-
the-cob, fabulous dessert and coffee will round out the dinner. Our buses will whisk you
back to your hotel at the end of the evening.
There will be plenty of fun, games and prizes. Tickets are limited. Get ‘em early or
miss out on one of the best events of this year’s Symposium! Transportation will begin
boarding at the Civic Plaza at 5:00 PM.
 GUEST PROGRAM
Sunday, May 20, 2001, 12:30 PM–4:30 PM Phoenix Valley Area Highlights
The tour will include the Phoenix, Paradise Valley and Scottsdale areas. As you drive through the
downtown Phoenix area, your guide will point out the Civic Center, America West Arena, Merca-
do, Arizona Center, Symphony Hall, Herberger Theater and other points of interest, as well as
the financial and historical areas including the State Capitol. Enjoy views of Mummy and Camel-
back Mountain. On your drive through Paradise Valley and Scottsdale, you will see such famous
homes as the Wrigley Mansion, the Hormel Mansion, Barry Goldwater’s home, as well as many of
our famous resorts. Enjoy an hour of shopping in Scottsdale’s famous “Old Town.”
Cost of Tour: $27 pp (advance registration); $32 pp (on-site registration) including gratuity
Children under 12: price of adult fare (on-site registration only)
Sunday, May 20, 2001, 8:30 AM–4:30 PM Boyce Thompson Arboretum
The Boyce Thompson Arboretum features more than 2,900 different desert plants. Exotic
species from around the world thrive alongside native Sonoran Desert plants in this setting. This
state park features short trails though Sonoran and Chihuahuan desert areas, a cactus garden,
greenhouses and other Southwest desert highlights. The Smith Interpretive Center, between the
display greenhouses, houses exhibits on plants and local history. The arboretum’s Demonstra-
tion Garden offers tips and examples of water-efficient landscaping design.
Cost of Tour: $58 pp (advance registration); $68 pp (on-site registration) including gratuity
Children under 12: price of adult fare (on-site registration only)
Monday, May 21, 2001, 9:00 AM–2:30 PM Native American Cultures Tour
Enjoy a five-hour tour featuring two of the Valley’s best-known attractions. First visit the Pueblo
Grande Museum. This excavation of an ancient Hohokam village is an ongoing archaeological dig,
with many items from the local Native American cultures on display in the museum. Next, visit
the Heard Museum with its outstanding collection of Native American primitive and modern arts
and cultural displays. An included audio tour will let you experience the lives of 15 Native Ameri-
cans as they share their stories with you. (Museum admissions and a Native American audio tape
tour of the Heard included.)
Cost of Tour: $38 pp (advance registration); $45 pp (on-site registration) including gratuity
Children under 12: price of adult fare (on-site registration only)
Monday, May 21, 2001, 8:30 AM–12:00 PM Desert Botanical Garden
The Desert Botanical Garden features a 1.5-mile loop Desert Discovery Trail winds past thou-
sands of plants including more than half of the cactus species in the world. Learn what the quali-
fications are to be classified as a “cactus.” While you are on the loop, short trails branch off to
allow you to learn about other aspects of desert life. Discover how early desert inhabitants met
their needs from the desert’s resources; how desert plants and animals interact and how Valley
of the Sun residents live in harmony with the desert.
Cost of Tour: $38 pp (advance registration); $45 pp (on-site registration) including gratuity
Children under 12: 1/2 price of adult fare (on-site registration only)
Tuesday, May 22, 2001, 8:00 AM–12:00 PM Taliesin West
Tour Taliesin West, the distinctive home of renowned American architect Frank Lloyd Wright.
Upon arrival at Taliesin West, you will join Panorama, the one-hour guided tour showcasing
Wright’s brilliant ability to integrate indoor and outdoor spaces through architecture. You will
also visit Taliesin West’s Cabaret Cinema, Music Pavilion, Seminar Theater and Wright’s private
office. The compound, linked by dramatic terraces, walkways and splashing fountains, overlooks
the Valley of the Sun and the beautiful Sonoran Desert from the base of the McDowell Moun-
tains. Taliesin West is now the home, studio, workshop and office of 70 architects, faculty and
students associated with the Frank Lloyd Wright Foundation.
Cost of Tour: $41 pp (advance registration); $49 pp (on-site registration) including gratuity
Children under 12: price of adult fare (on-site registration only)
Wednesday, May 23, 2001, 8:00 AM–12:00 PM Phoenix Art Museum
At over 160,000 square feet, the Phoenix Art Museum is one of the largest general visual arts in-
stitutions in the Southwest. Phoenix Art Museum offers something for everyone in the family! Its
collection of nearly 16,000 works spans the centuries and emphasizes American art, Asian art,
European art of the 14th-19th centuries, Spanish Colonial and Latin American art, 18-20th century
fashion design and the Thorne Miniature Rooms. In addition, the museum also features special
exhibits that change throughout the year. Recent exhibits include works by of Claude Monet, An-
nie Leibowitz and Norman Rockwell.
Cost of Tour: $34 pp (advance registration); $40 pp (on-site registration) including gratuity
Children under 12: 1/2 price of adult fare (on-site registration only)
66
Wednesday, May 23, 2001, 9:00 AM–6:30 PM Verde Canyon Train
Climb aboard for your panoramic rail experience to Perkinsville through the Verde River Canyon.
While on board this four-hour ride, you will have plenty of time to relax and enjoy the views. This
distinctive geographical area includes desert rock faces, crimson cliffs and towering bridges ac-
cessible only by rail. Don’t be surprised if you see bald eagle, coyote, antelope and other wildlife
that make their home in this rugged terrain! All passengers have access to fantastic open-air
viewing cars and the trip features strolling musicians and informative narration.
Cost of Tour: $88 pp; 1st class (advance registration) including gratuity
$72 pp; coach (advance registration) including gratuity
$105 pp; 1st class (on-site registration) including gratuity
$85 pp; coach (on-site registration) including gratuity
Children under 12: 1/2 price of adult fare (on-site registration only)
Thursday, May 24, 2001, 8:00 AM–5:30 PM Sedona/Montezuma Castle
Visit Montezuma Castle to view prehistoric Indian cliff dwellings dating back to 1200 A.D. Contin-
ue on to Sedona with views of the Chapel of the Holy Cross and a scenic tour of the dramatic red
rock areas, which have long been an inspiration to artists, filmmakers and visitors from all over
the world. Enjoy time for lunch and shopping in the many art galleries and shops before heading
up Oak Creek Canyon for a spectacular view before returning to Phoenix.
Cost of Tour: $56 pp (advance registration); $65 pp (on-site registration) including gratuity
Children under 12: 1/2 price of adult fare (on-site registration only)
Departs: Thursday, May 24, 2001 at 7:30 AM Sedona/Grand Canyon Combo (overnight in Sedona)
Returns: Friday, May 25, 2001 at 8:30 PM
Day One: Begin with a tour through the Sonoran Desert to Montezuma Castle National Monu-
ment then on to red rock country. Upon arrival in Sedona, your guide will familiarize you with the
many art galleries and shops, and will assist you with check-in to your hotel. You will have the af-
ternoon free to shop, take an optional jeep tour, a horseback or mountain bike ride or just take
in the local beauty. A trolley pass is included for transportation to galleries or other points of
interest.
Day Two: Arrive at Grand Canyon Village around lunchtime. Enjoy an IMAX theater presentation
prior to entering the Grand Canyon. Once at Grand Canyon Village, you will have approx. one-
hour for lunch, gift shops, or walk along the rim on your own. Then continue with a 23-mile tour
along the rim with stops at additional lookout points. Continue out of the Grand Canyon National
Park to an authentic trading post on the Navajo Indian Reservation to learn about the cultures of
the Navajo people and shop for arts and crafts.
Cost of Tour: $180 pp double; $212 single occ. (advance registration) including gratuity
$214.50 pp double; $254.50 single occ. (on-site registration) including gratuity
Children under 17 staying with parent: $143 pp (on-site registration only)
Departs: Friday, May 25, 2001 at 7:00 AM Grand Canyon (overnight stay)
Returns: Saturday, May 26, 2001 at 8:30 PM
Day One: This tour offers a perfect way for a visitor to spend extra time at the Grand Canyon.
Our overnight tour begins with a visit to the dramatic red rock country of Sedona where your
guide will point out some of the scenic highlights and include a coffee and photo stop. Arrive at
the Grand Canyon Village around lunchtime and the guide will assist with check-in at your Grand
Canyon area hotel. You will have the afternoon and following morning free to explore on your
own. (Optional air tours are available.)
Day Two: Your guide will meet you at your hotel about 12:30 PM to continue with a 22-mile after-
noon rim tour with stops at additional overlooks. You will return via the Painted Desert with a
visit to an authentic trading post on the Navajo Reservation for shopping before returning to
Phoenix.
Cost of Tour: $193 pp double; $240 single occ. (advance registration) including gratuity
$230 pp double; $290 single occ. (on-site registration) including gratuity
Children under 17 staying with parent: $160 pp (on-site registration only)
Friday, May 25, 2001, 7:00 AM–8:30 PM Grand Canyon via Sedona & Navajo Nation
Begin with a fully narrated tour of the Sonoran Desert en route to the beautiful red rock country
of Sedona for a coffee break and rest stop. Continue on the scenic 17-mile drive through Oak
Creek Canyon, through the pine forests of Flagstaff and arrive at the Grand Canyon at lunchtime.
Approximately 3–4 hours will be spent at the Canyon, allowing time to enjoy lunch at one of the
Grand Canyon Lodges or picnic and take a walk along the rim, as well as shop in the gift shops.
After the lunch hour there will be a 23-mile rim tour with stops at a few of our favorite view-
points. Your next stop will be at a trading post on the Navajo Reservation with the Painted Desert
as a backdrop. There, you may buy directly from the Navajo people and learn about their culture.
Cost of Tour: $83 pp (advance registration); $99 pp (on-site registration) including gratuity
Children under 12: 1/2 price of adult fare (on-site registration only)
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 2001 IEEE MTT-S INTERNATIONAL
MICROWAVE SYMPOSIUM
Phoenix, AZ • May 20–25, 2001

IMS 2001 Symposium Week at a Glance

SUN/20 MON/21 TUE/22 WED/23 THU/24 FRI/25
Activity Location
M N A E M N A E M N A E M N A E M N A E M N A E

IMS Technical Sessions Civic Plaza

Workshops & Short Courses Civic Plaza
Plenary Session Symphony Hall
Interactive Forum Civic Plaza
Panel Sessions Civic Plaza
Rump Session Hyatt

Exhibits µAPS Civic Plaza

RFIC Technical Sessions Civic Plaza

IMS Joint Session Civic Plaza
Plenary Session Civic Plaza
Interactive Forum Civic Plaza
Workshops Civic Plaza
Panel Session Civic Plaza

ARFTG Conference Crowne Plaza

Exhibits Crowne Plaza

Social Workshop Bkfst, Lunch Terrace

MTT Member Breakfast Terrace
RFIC Reception Crowne Plaza
MJ Reception Heard Museum
Industry Reception Hyatt
MTT Awards Banquet Hyatt
Students Awards Banquet Hyatt
Speakers Breakfast Hyatt
ARFTG Breakfast Crowne Plaza
ARFTG Awards Lunch Crowne Plaza

www.ims2001.org
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