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MODE
MODEL˖TOP-CA-1088BS
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 TECHNICAL DATA SHEET
TOP-CA-1088BS FOR 8*8 DOT MATRIX DIGITI 1/6

1. PRODUCT INTRODUCTION 

Ć Low power requirement,

Ć Solid state reliability.

Ć Wide viewing angle.

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Ć Easy mounting on P.C. boards.

Ć RHOS compliant.

2. FEATURES

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Ć TOP-CA-1088BS is a 8*8 DOT
OT MATR
MATRIX.

Ć This device is made with

th white dots
d andd black
blac surface.
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N
3. APPLICATION
TO

Ć Digital
al readout display
y.
display.

Ć Instrument
nstrument
strument panels.
panels.

Ć Elevator.
or

PART NO. SIZE CHIP EMITTED COLOR FACE COLOR

TOP-CA-1088BS 8*8 Super Red Black

A/2˖ TOP-CA-1088BS Revision issued in 2014.

 TECHNICAL DATA SHEET
TOP-CA-1088BS FOR 8*8 DOT MATRIX DIGITI 2/6

4. PACKAGE DIMENSIONS & CIRCUIT DIAGRAM

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723/,*+7 6
P
&$%6 &
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&2/        
3,112        
3,1
52: 12
 
 
 
 
 
 
 
 

A/2˖ TOP-CA-1088BS Revision issued in 2014.

 TECHNICAL DATA SHEET
TOP-CA-1088BS FOR 8*8 DOT MATRIX DIGITI 3/6

5. ELECTRICAL/OPTICAL CHARACTERISTIC

ć)
5-1. ABSOLUTE MAXIMUM RATINGS (Ta=25ć

PARAMETER SYMBOL VALUE

UE UNIT

Reverse Voltage VR 5 V/dot

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Forward Current IF 30 mA/dot

Peak Forward Current (1/10 Duty Cycle) IPEAK 120 mA/dot

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Power Dissipation PD 80 mW/dot

Operating Temperature Range TA - 25 ~ + 85 ć

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Storage Temperature Range TSTG - 30 ~ + 85 ć

Solder Temperature Tso

Tsol
oll 260/3 ćV
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5-2. ELECTRICAL-OPTICAL
L--OPTICAL
L OPTICAL C
CHARA
CHARACTERISTICS (Ta=25ć)

TEST
PARAMETER
ER SYMBOL MIN.
M TYP. MAX. UNIT
TO

CONDITIONS

R 13500 15524 17549

Luminous Intensity
tensity IV S 17550 21937 26325 ucd IF=10mA

T 26326 32907 39489

Forward Voltage VF 1.80 2.10 2.40 v/dot IF=20mA

Chromatographer ¬p - 635 - nm IF=20mA

Spectral Line
¬ - 20 - nm IF=20mA
Half-Width
Reverse Current IR - - 20 uA VR=5v

A/2˖ TOP-CA-1088BS Revision issued in 2014.

 TECHNICAL DATA SHEET
TOP-CA-1088BS FOR 8*8 DOT MATRIX DIGITI 4/6

5-3. OPTICAL CHARACTERISTIC CURVES



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T
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P
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°
°

A/2˖ TOP-CA-1088BS Revision issued in 2014.

 TECHNICAL DATA SHEET
TOP-CA-1088BS FOR 8*8 DOT MATRIX DIGITI 5/6

6. QUALITY CONTROL AND ASSURANCE

CLASSIFICATION TEST ITEM TEST CONDITION

DIT
DITION

Ta=under room temperature

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nt o
If=12mA-25mA per segment or Ip uty=
uty=1/8,P w=1
Ip=80mA/duty=1/8,Pw=1.25mS
OPERATION LIFE
Ip=160mA/duty=1/16,Pw=1.mS(DOT)
w=1
w=1.mS(DOT
Test time=1000HRS(-24HRS+72HRS)
((--24HRS+72HRS)
24HRS+7

T
MOISTURE ć RH=9
Ta=65ć±5ć R
RH=90-95% Test time=240HRS±2HRS
time=
me=

ENDUTRANCE HIGH TEMPERATURE

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Ta=65
T ć±
Ta=65ć±5ć 0--95%
0 95 VR=5V
RH=90-95%
TEST HIGH HUMIDITY
Test ttime=500hrs(-24HRS+48HRS)
time=500
REVERSE BIAS

uate device
To evaluate device's durability for long term storage in high
HIGH TEMPERATURE
RAT
RATURE
tem
temperature
RAGE
AGE
STORAGE
Ta=85
Ta=85ć±5ć Test time=1000HRS(-24HRS+72HRS)
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LOW
W TEMPERATURE
Ta
Ta=-35ć±5ć Test time=1000HRS(-24HRS+72HRS)
STORAGE
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TEMPERATURE Ta=85ć̚25ć̚-35ć time=30min 5min 30min 5min Cycle

CYCLING
YCLING test:10cycles

Ta=85ć±5ć̚-35ć±5ć time=10min 10min Cycle

THERMAL SHOCK
THE
test:10cycles
ENVIRONMENTAL
TEST

SOLOER RESISTANCE T.sol=260ć±5ć time=10±1sec

SOLOER ABILITY T.sol=230ć±5ć time=5±1sec

A/2˖ TOP-CA-1088BS Revision issued in 2014.

 TECHNICAL DATA SHEET
TOP-CA-1088BS FOR 8*8 DOT MATRIX DIGITI 6/6

7. SOLDERING CONDITIONS
The recommended conditions for soldering are as follows.
Because the component is made with epoxy resin, the units are susceptible to heat.
h Therefore,
ble to avoid damage.
the preheating and soldering temperatures should be kept as low as possible d
7-1. Manual Soldering Conditions(with 1.5mm Iron tip ) .

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Iron Tip Temperature: 350°C Max, Time: 3s Max.
Position: The iron should be situated at least 2mm away from
m the
th root of
o the leads.
ds.
ds.
7-2. Through the Wave Soldering Conditions Wave Soldering Profile For Fo Lead-free
Lead Through-hole LED.

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7-3. Soldering
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ng General
Gene Notes:
a. Recommend
commend manual solderisoldering to be used only for repair and rework purposes. The soldering
solderin
iron
ron should
shou not exceedxceed 30W in power. The tip of the soldering iron should not touch the reflector
case
se to avoid heat-damage.
void heat -dam
b. Maintain pre-heat
pre-he and peak temperatures with dip units as low as possible and the times as
tain thee pre
short as is feasible,
b since the products are susceptible to heat during flow soldering.
feasib
c. After soldering,
i least three minutes for the component to cool to room temperature before further
operations.
d. If components will undergo multiple soldering processes, or other processes where the
components may be subjected to intense heat, please check with toplight for compatibility.

A/2˖ TOP-CA-1088BS Revision issued in 2014.